JPS6057194U - Metal case sealed electronic equipment - Google Patents

Metal case sealed electronic equipment

Info

Publication number
JPS6057194U
JPS6057194U JP14879183U JP14879183U JPS6057194U JP S6057194 U JPS6057194 U JP S6057194U JP 14879183 U JP14879183 U JP 14879183U JP 14879183 U JP14879183 U JP 14879183U JP S6057194 U JPS6057194 U JP S6057194U
Authority
JP
Japan
Prior art keywords
metal case
electronic equipment
circuit board
sealed electronic
case sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14879183U
Other languages
Japanese (ja)
Inventor
威 佐藤
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP14879183U priority Critical patent/JPS6057194U/en
Publication of JPS6057194U publication Critical patent/JPS6057194U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来の金属封止型電子機器の構造
を示し、第１図はその斜視図、第２図はその横断面図、
第３図および第４図は本考案の金属ケース封止型電子機
器の構造を示し、第３図はその第１の実施例を示す側面
図、第４図は同じくその第２の実施料例を示す側面図で
ある。 １・・・金属ベース、２・・・外部導出リード、４・・
・電子回路基板、６ｔ　６ａｔ　６ｂ・・・放熱板。 第３図 第４図1 and 2 show the structure of a conventional metal-sealed electronic device, with FIG. 1 being a perspective view thereof, and FIG. 2 being a cross-sectional view thereof;
3 and 4 show the structure of the metal case sealed electronic device of the present invention, FIG. 3 is a side view showing the first embodiment thereof, and FIG. 4 is a second embodiment example thereof. FIG. 1... Metal base, 2... External lead, 4...
・Electronic circuit board, 6t 6at 6b...heat sink. Figure 3 Figure 4

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャップ状金属ケースが被冠される金属ベースにこのベ
ースと絶縁分離されて直線状に植立された複数の外部導
出リードを有し、この導出リードの一端に電子回路基板
が直立的に固着され、この−回路基板を前記金属ケース
によって気密封止する金属ケース掛止型電子機器におい
て、前記回路基板の裏面側に放熱板を密着固定し、この
放熱板の一端を前記金属ベースに固着させたことを特徴
とする金属ケース封止型電子機器。A metal base covered with a cap-shaped metal case has a plurality of external lead-out leads installed in a straight line and insulated from the base, and an electronic circuit board is fixed upright to one end of the lead-out leads. In this metal case hanging type electronic device in which a circuit board is hermetically sealed by the metal case, a heat sink is closely fixed to the back side of the circuit board, and one end of the heat sink is fixed to the metal base. A metal case-sealed electronic device characterized by:
JP14879183U 1983-09-28 1983-09-28 Metal case sealed electronic equipment Pending JPS6057194U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14879183U JPS6057194U (en) 1983-09-28 1983-09-28 Metal case sealed electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14879183U JPS6057194U (en) 1983-09-28 1983-09-28 Metal case sealed electronic equipment

Publications (1)

Publication Number Publication Date
JPS6057194U true JPS6057194U (en) 1985-04-20

Family

ID=30330473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14879183U Pending JPS6057194U (en) 1983-09-28 1983-09-28 Metal case sealed electronic equipment

Country Status (1)

Country Link
JP (1) JPS6057194U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267682U (en) * 1988-11-10 1990-05-22

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522455Y1 (en) * 1967-05-27 1970-09-05
JPS5827997B2 (en) * 1976-03-30 1983-06-13 株式会社東芝 Slime removal method using ozone aqueous solution

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522455Y1 (en) * 1967-05-27 1970-09-05
JPS5827997B2 (en) * 1976-03-30 1983-06-13 株式会社東芝 Slime removal method using ozone aqueous solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267682U (en) * 1988-11-10 1990-05-22

Similar Documents

Publication Publication Date Title
JPS6057194U (en) Metal case sealed electronic equipment
JPS6025159U (en) lead frame
JPS6027453U (en) semiconductor equipment
JPS6018550U (en) Heat dissipation structure
JPS59195553U (en) Detection part structure of gas detection device
JPS59127247U (en) Glass sealed semiconductor device
JPS59161803U (en) Electrode lead wire fixing device for electrocardiograph
JPS59149626U (en) Electrolytic capacitor
JPS599553U (en) semiconductor equipment
JPS58189561U (en) Electrical component mounting equipment
JPS59127270U (en) printed circuit board equipment
JPS611834U (en) solid electrolytic capacitor
JPS587350U (en) Cooling structure for lead type semiconductor devices
JPS5844842U (en) semiconductor equipment
JPS59107146U (en) Insulated semiconductor device
JPS58148959U (en) semiconductor laser equipment
JPS58173263U (en) Printed board
JPS606257U (en) LED display
JPS605112U (en) Electrolytic capacitor
JPS6088560U (en) semiconductor equipment
JPS606229U (en) Semiconductor integrated circuit package
JPS6065957U (en) terminal device
JPS59180451U (en) Electronic component mounting equipment
JPS58120661U (en) semiconductor equipment
JPS60153542U (en) semiconductor package