JPS59180451U - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment

Info

Publication number
JPS59180451U
JPS59180451U JP7583783U JP7583783U JPS59180451U JP S59180451 U JPS59180451 U JP S59180451U JP 7583783 U JP7583783 U JP 7583783U JP 7583783 U JP7583783 U JP 7583783U JP S59180451 U JPS59180451 U JP S59180451U
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
container
lead
mounting equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7583783U
Other languages
Japanese (ja)
Inventor
哲夫 林
大里　雅敏
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP7583783U priority Critical patent/JPS59180451U/en
Publication of JPS59180451U publication Critical patent/JPS59180451U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の電子部品の実装装置の断面図、第２図は
本考案の一実施例である電子部品の実装装置の断面図で
ある。− １・・・第１の容器、２・・・電子部品、３・・・第２
の容器、４・・・突起、５・・・リード、６・・・電子
部品の電気接続部。FIG. 1 is a sectional view of a conventional electronic component mounting apparatus, and FIG. 2 is a sectional view of an electronic component mounting apparatus which is an embodiment of the present invention. - 1...first container, 2...electronic component, 3...second
container, 4... protrusion, 5... lead, 6... electrical connection part of electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 箱型の第１の容器内に装着され〃集積回路素子等の電子
部品と外部のリードとを電気的に接続し、−該第１の容
器を箱型の第２の容器で施蓋してこれを封止した電子部
品の実装装置において、第１の容器内に前記リードを延
長させ、該リードを弾性変形させて前記電子部品に圧接
し、リードと電子部品とを電気的に接続したことを特徴
とする電子部品の実装装置。It is installed in a box-shaped first container and electrically connects an electronic component such as an integrated circuit element to an external lead, and - the first container is covered with a box-shaped second container. In the sealed electronic component mounting apparatus, the lead is extended into a first container, the lead is elastically deformed and pressed against the electronic component, and the lead and the electronic component are electrically connected. An electronic component mounting device characterized by:
JP7583783U 1983-05-20 1983-05-20 Electronic component mounting equipment Pending JPS59180451U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7583783U JPS59180451U (en) 1983-05-20 1983-05-20 Electronic component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7583783U JPS59180451U (en) 1983-05-20 1983-05-20 Electronic component mounting equipment

Publications (1)

Publication Number Publication Date
JPS59180451U true JPS59180451U (en) 1984-12-01

Family

ID=30205896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7583783U Pending JPS59180451U (en) 1983-05-20 1983-05-20 Electronic component mounting equipment

Country Status (1)

Country Link
JP (1) JPS59180451U (en)

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