JPS5834765U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS5834765U
JPS5834765U JP12922081U JP12922081U JPS5834765U JP S5834765 U JPS5834765 U JP S5834765U JP 12922081 U JP12922081 U JP 12922081U JP 12922081 U JP12922081 U JP 12922081U JP S5834765 U JPS5834765 U JP S5834765U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
electronic component
conductive path
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12922081U
Other languages
Japanese (ja)
Inventor
鳴海　雄二
Original Assignee
株式会社リコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社リコー filed Critical 株式会社リコー
Priority to JP12922081U priority Critical patent/JPS5834765U/en
Publication of JPS5834765U publication Critical patent/JPS5834765U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の混成集積回路を示す図、第２図はこの考
案の実施例を示す説明図である。 １０・・・セラミック基体、１１・・・金属端子、１２
・・・電子部品、１３・・・パッケージ、１４・・・フ
レキシブル導電路、１５・・・プリント基板。FIG. 1 is a diagram showing a conventional hybrid integrated circuit, and FIG. 2 is an explanatory diagram showing an embodiment of this invention. 10...Ceramic base, 11...Metal terminal, 12
...Electronic component, 13... Package, 14... Flexible conductive path, 15... Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】 １　セラミック基体と、この基体に搭載した電子部品と
、この電子部品と外部回路との電気的接続を可能とすべ
く前記セラミック基体に設けた金属端子及びフレキシブ
ル導電路とを具えて成る混成集積回路。 ２　実用新案登録請求の範囲第１項記載の回路において
、前記フレキシブル導電路はフレキシブルプリント基板
及びビニル電線の一方又は双方であるようにして成る混
成集積回路。[Claims for Utility Model Registration] 1. A ceramic base, an electronic component mounted on the base, and a metal terminal and flexible conductive path provided on the ceramic base to enable electrical connection between the electronic component and an external circuit. A hybrid integrated circuit comprising: 2 Utility Model Registration The circuit according to claim 1, wherein the flexible conductive path is one or both of a flexible printed circuit board and a vinyl electric wire.
JP12922081U 1981-08-31 1981-08-31 hybrid integrated circuit Pending JPS5834765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12922081U JPS5834765U (en) 1981-08-31 1981-08-31 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12922081U JPS5834765U (en) 1981-08-31 1981-08-31 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5834765U true JPS5834765U (en) 1983-03-07

Family

ID=29922894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12922081U Pending JPS5834765U (en) 1981-08-31 1981-08-31 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5834765U (en)

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