JPS58175642U - Integrated circuit component mounting equipment - Google Patents
Integrated circuit component mounting equipmentInfo
- Publication number
- JPS58175642U JPS58175642U JP7405282U JP7405282U JPS58175642U JP S58175642 U JPS58175642 U JP S58175642U JP 7405282 U JP7405282 U JP 7405282U JP 7405282 U JP7405282 U JP 7405282U JP S58175642 U JPS58175642 U JP S58175642U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit component
- component mounting
- mounting equipment
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の集積回路部品取付装置の正面図、第2図
は同装置の側面図、第3図は他の取付装置の断側面図、
第4図は本考案の集積回路部品取付装置における一実施
例の正面図、第5図は同装置の断側面図である。
1・・・・・・集積回路部品、2・・・・・・印刷配線
板、3・・・・・・導体層、4・・・・・・リード端子
、6・・・・・・凹部。Fig. 1 is a front view of a conventional integrated circuit component mounting device, Fig. 2 is a side view of the same device, and Fig. 3 is a cross-sectional side view of another mounting device.
FIG. 4 is a front view of one embodiment of the integrated circuit component mounting apparatus of the present invention, and FIG. 5 is a sectional side view of the same apparatus. DESCRIPTION OF SYMBOLS 1...Integrated circuit component, 2...Printed wiring board, 3...Conductor layer, 4...Lead terminal, 6...Recessed part .
Claims (1)
集積回路部品の外装寸法に対応した有底の凹部を形成し
、この凹部に上記集積回路部品を挿入し、集積回路部品
の側面より引出されたリード端子を上記印刷配線基板の
表面に形成された導体層に電気機械的に接続して成る集
積回路部品の取付装置。A recess with a bottom corresponding to the exterior dimensions of the integrated circuit component is formed at the position where the integrated circuit component is to be mounted on the printed wiring board, the integrated circuit component is inserted into this recess, and the integrated circuit component is pulled out from the side of the integrated circuit component. A mounting device for integrated circuit components, comprising lead terminals electromechanically connected to a conductor layer formed on the surface of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405282U JPS58175642U (en) | 1982-05-19 | 1982-05-19 | Integrated circuit component mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7405282U JPS58175642U (en) | 1982-05-19 | 1982-05-19 | Integrated circuit component mounting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58175642U true JPS58175642U (en) | 1983-11-24 |
Family
ID=30083516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7405282U Pending JPS58175642U (en) | 1982-05-19 | 1982-05-19 | Integrated circuit component mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006254600A (en) * | 2005-03-10 | 2006-09-21 | Asmo Co Ltd | Circuit component |
-
1982
- 1982-05-19 JP JP7405282U patent/JPS58175642U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006254600A (en) * | 2005-03-10 | 2006-09-21 | Asmo Co Ltd | Circuit component |
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