JPS60194344U - Thick film hybrid integrated circuit lead terminal connection structure - Google Patents

Thick film hybrid integrated circuit lead terminal connection structure

Info

Publication number
JPS60194344U
JPS60194344U JP1984080508U JP8050884U JPS60194344U JP S60194344 U JPS60194344 U JP S60194344U JP 1984080508 U JP1984080508 U JP 1984080508U JP 8050884 U JP8050884 U JP 8050884U JP S60194344 U JPS60194344 U JP S60194344U
Authority
JP
Japan
Prior art keywords
thick film
hybrid integrated
integrated circuit
connection structure
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984080508U
Other languages
Japanese (ja)
Other versions
JPH0125491Y2 (en
Inventor
杉森　弘昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1984080508U priority Critical patent/JPS60194344U/en
Publication of JPS60194344U publication Critical patent/JPS60194344U/en
Application granted granted Critical
Publication of JPH0125491Y2 publication Critical patent/JPH0125491Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２図は従来
例の斜視図、第３図は同断面図、第４図　　−は本考案
の一実施例を示す断面図である。 ７・・・厚膜基板、８・・・導体パッド、９・・・導体
パターン、１０・・・接続部、１１・・・オーバ・ガラ
ス、１　．２・・・リード端子、１３・・・半田。Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a perspective view of a conventional example, Fig. 3 is a cross-sectional view of the same, and Fig. 4 - is a cross-sectional view showing an embodiment of the present invention. . 7... Thick film substrate, 8... Conductor pad, 9... Conductor pattern, 10... Connection portion, 11... Over glass, 1. 2...Lead terminal, 13...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体パターン上にオーバガラスを塗布した厚膜基板の導
体パッドに印刷配線板からのリード端子を装着して半田
接続する厚膜混成集積回路において、導体パターンと導
体パッドの接続部を覆うようにオーバ・ガラスを導体パ
ッドの端部におよばせて塗布したことを特徴とする厚膜
混成集積回路リード端子の接続構造。In thick film hybrid integrated circuits in which lead terminals from a printed wiring board are attached and soldered to the conductor pads of a thick film substrate with overglass applied to the conductor pattern, an overglass is applied to cover the connection between the conductor pattern and the conductor pad. - A thick film hybrid integrated circuit lead terminal connection structure characterized by coating glass along the ends of the conductor pads.
JP1984080508U 1984-06-01 1984-06-01 Thick film hybrid integrated circuit lead terminal connection structure Granted JPS60194344U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984080508U JPS60194344U (en) 1984-06-01 1984-06-01 Thick film hybrid integrated circuit lead terminal connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984080508U JPS60194344U (en) 1984-06-01 1984-06-01 Thick film hybrid integrated circuit lead terminal connection structure

Publications (2)

Publication Number Publication Date
JPS60194344U true JPS60194344U (en) 1985-12-24
JPH0125491Y2 JPH0125491Y2 (en) 1989-07-31

Family

ID=30626421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984080508U Granted JPS60194344U (en) 1984-06-01 1984-06-01 Thick film hybrid integrated circuit lead terminal connection structure

Country Status (1)

Country Link
JP (1) JPS60194344U (en)

Also Published As

Publication number Publication date
JPH0125491Y2 (en) 1989-07-31

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