JPS5970347U - integrated circuit device - Google Patents

integrated circuit device

Info

Publication number
JPS5970347U
JPS5970347U JP16634082U JP16634082U JPS5970347U JP S5970347 U JPS5970347 U JP S5970347U JP 16634082 U JP16634082 U JP 16634082U JP 16634082 U JP16634082 U JP 16634082U JP S5970347 U JPS5970347 U JP S5970347U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
conductive metal
highly conductive
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16634082U
Other languages
Japanese (ja)
Inventor
今野　忠重
工藤　兼勝
斉藤　睦
Original Assignee
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティーディーケイ株式会社 filed Critical ティーディーケイ株式会社
Priority to JP16634082U priority Critical patent/JPS5970347U/en
Publication of JPS5970347U publication Critical patent/JPS5970347U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示す集積回路装置の断面斜視
図である。 １・・・ＩＣチップ、２・・・ＩＣパッケージ、３・・
・良導電性の金属、４・・・シール部材、５・・・リー
ド端子。The drawing is a cross-sectional perspective view of an integrated circuit device showing an embodiment of the present invention. 1...IC chip, 2...IC package, 3...
・Good conductive metal, 4...Sealing member, 5...Lead terminal.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　集積回路を良導電性の金属でシールドしたこ
とを特徴とする集積回路装置。(1) An integrated circuit device characterized in that an integrated circuit is shielded with a highly conductive metal. （２）前記良導電性の金属は鉛であることを特徴とする
実用新案登録請求の範囲第１項に記載の集積回路装置。(2) The integrated circuit device according to claim 1, wherein the highly conductive metal is lead.
JP16634082U 1982-11-02 1982-11-02 integrated circuit device Pending JPS5970347U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16634082U JPS5970347U (en) 1982-11-02 1982-11-02 integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16634082U JPS5970347U (en) 1982-11-02 1982-11-02 integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5970347U true JPS5970347U (en) 1984-05-12

Family

ID=30364181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16634082U Pending JPS5970347U (en) 1982-11-02 1982-11-02 integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5970347U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106150A (en) * 1983-11-15 1985-06-11 Nippon Telegr & Teleph Corp <Ntt> Radiation proof package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415663A (en) * 1974-01-10 1979-02-05 Nec Corp Semiconductor device
JPS5593239A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415663A (en) * 1974-01-10 1979-02-05 Nec Corp Semiconductor device
JPS5593239A (en) * 1979-01-04 1980-07-15 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106150A (en) * 1983-11-15 1985-06-11 Nippon Telegr & Teleph Corp <Ntt> Radiation proof package

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