JPS5916138U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5916138U JPS5916138U JP11181582U JP11181582U JPS5916138U JP S5916138 U JPS5916138 U JP S5916138U JP 11181582 U JP11181582 U JP 11181582U JP 11181582 U JP11181582 U JP 11181582U JP S5916138 U JPS5916138 U JP S5916138U
- Authority
- JP
- Japan
- Prior art keywords
- electrode wiring
- semiconductor equipment
- sealing resin
- wiring board
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bはそれぞれ従来の樹脂封止型半導体装
置の断面図および平面図、第2図a、 bはそれぞれ
本考案の一実施例の断面図および平面図である。
1・・・・・・金属ベース、2・・・・・・半導体素子
、3゜13・・・・・・リード端子、4・・・・・・金
属細線、5・・・・・・封止樹脂体、6・・・・・・電
極配線板、6a・・・・・・電極配線。1A and 1B are a sectional view and a plan view, respectively, of a conventional resin-sealed semiconductor device, and FIGS. 2A and 2B are a sectional view and a plan view, respectively, of an embodiment of the present invention. 1...Metal base, 2...Semiconductor element, 3゜13...Lead terminal, 4...Thin metal wire, 5...Sealing Resin stopper body, 6... Electrode wiring board, 6a... Electrode wiring.
Claims (1)
素子の電極と金属細線で接続された電極配線を有し一部
分が前記封止樹脂体の外部に露出された電極配線板と、
この電極配線板と前記露出部で接続されたリード端子と
を含むことを特徴とする半導体装置。a sealing resin body containing a semiconductor element therein; an electrode wiring board having electrode wiring connected to the electrodes of the semiconductor element with thin metal wires and having a portion exposed to the outside of the sealing resin body;
A semiconductor device comprising the electrode wiring board and a lead terminal connected at the exposed portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11181582U JPS5916138U (en) | 1982-07-23 | 1982-07-23 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11181582U JPS5916138U (en) | 1982-07-23 | 1982-07-23 | semiconductor equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5916138U true JPS5916138U (en) | 1984-01-31 |
Family
ID=30259459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11181582U Pending JPS5916138U (en) | 1982-07-23 | 1982-07-23 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5916138U (en) |
-
1982
- 1982-07-23 JP JP11181582U patent/JPS5916138U/en active Pending
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