JPS60149166U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS60149166U JPS60149166U JP3697684U JP3697684U JPS60149166U JP S60149166 U JPS60149166 U JP S60149166U JP 3697684 U JP3697684 U JP 3697684U JP 3697684 U JP3697684 U JP 3697684U JP S60149166 U JPS60149166 U JP S60149166U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- semiconductor chip
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは、従来の混成集積回路装置の外観図、同図す
はその断面図、第２図ａは、本考案の一実施例の外観図
、同図すはその断面図である。
１・・・・・・回路基板、２・・ｉ・・・半導体チップ
、３・・・・・・導電ペースト、４・・・・・・配線導
体、５・・・・・・ボンディングワイヤ、６・・・・・
・プリコート樹脂、７・・・・・・チップ部品、訃・・
・・・外部端子、９・・・・・・はんだ。FIG. 1A is an external view of a conventional hybrid integrated circuit device, and FIG. 2A is an external view and a cross-sectional view of an embodiment of the present invention. 1... Circuit board, 2... i... Semiconductor chip, 3... Conductive paste, 4... Wiring conductor, 5... Bonding wire, 6...
・Pre-coated resin, 7... Chip parts, Death...
...External terminal, 9...Solder.
Claims (1)
において、半導体チップのマウント材として導電ペース
トを使用し、さらに配線導体パターン上にも導電ペース
トが形成されたことを特徴とする混成集積回路装置。A hybrid integrated circuit device in which a semiconductor chip is mounted on a circuit board, characterized in that a conductive paste is used as a mounting material for the semiconductor chip, and the conductive paste is also formed on a wiring conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3697684U JPS60149166U (en) | 1984-03-15 | 1984-03-15 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3697684U JPS60149166U (en) | 1984-03-15 | 1984-03-15 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60149166U true JPS60149166U (en) | 1985-10-03 |
Family
ID=30542660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3697684U Pending JPS60149166U (en) | 1984-03-15 | 1984-03-15 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149166U (en) |
-
1984
- 1984-03-15 JP JP3697684U patent/JPS60149166U/en active Pending
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