JPS58118769U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58118769U JPS58118769U JP1615082U JP1615082U JPS58118769U JP S58118769 U JPS58118769 U JP S58118769U JP 1615082 U JP1615082 U JP 1615082U JP 1615082 U JP1615082 U JP 1615082U JP S58118769 U JPS58118769 U JP S58118769U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- recess
- semiconductor chip
- provided around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の印刷配線板に半導体チップをマウントし
た平面図、第２図は従来の印刷配線板に半導体チップを
マウントした平面図、第３図は本考案の一実施例による
印刷配線板に半導体チップをマウントした平面図、第４
図は本考案の一実施例による印刷配線板に半導体チップ
をマウントした断面図である。
１１・・・導体配線、２・・・半導体チップ、３・・・
ボンディング・パターン、４・・・印刷配線板基材、５
・・・導電性接着剤、６・・・リード・パターン、７・
・・リード・パターン端子、８・・・凹部。FIG. 1 is a plan view of a semiconductor chip mounted on a conventional printed wiring board, FIG. 2 is a plan view of a semiconductor chip mounted on a conventional printed wiring board, and FIG. 3 is a printed wiring board according to an embodiment of the present invention. A top view of the semiconductor chip mounted on the 4th
The figure is a sectional view of a semiconductor chip mounted on a printed wiring board according to an embodiment of the present invention. 11... Conductor wiring, 2... Semiconductor chip, 3...
Bonding pattern, 4... Printed wiring board base material, 5
... Conductive adhesive, 6... Lead pattern, 7.
...Lead pattern terminal, 8...recess.
Claims (2)
分が凹形状になっている印刷配線板において、半導体チ
ップ底面と電気的に接続するため′ に、導体配線
を凹部周辺に設けたことを特徴とする印刷配線板。(1) In a printed wiring board in which the part where the semiconductor chip is directly mounted on the printed wiring board is recessed, conductor wiring is provided around the recess for electrical connection with the bottom surface of the semiconductor chip. Printed wiring board.
、０．１〜０． ５ｍｍの範囲である実用新案登録請求
の範囲第１項記載の印刷配線板。(2) The width of the conductor wiring provided around the recess from the end face of the recess is 0.1 to 0. The printed wiring board according to claim 1, which is within the range of 5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615082U JPS58118769U (en) | 1982-02-08 | 1982-02-08 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615082U JPS58118769U (en) | 1982-02-08 | 1982-02-08 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58118769U true JPS58118769U (en) | 1983-08-13 |
Family
ID=30028529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1615082U Pending JPS58118769U (en) | 1982-02-08 | 1982-02-08 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118769U (en) |
-
1982
- 1982-02-08 JP JP1615082U patent/JPS58118769U/en active Pending
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