JPS60169901U - Adhesive structure of microwave integrated circuit board - Google Patents
Adhesive structure of microwave integrated circuit boardInfo
- Publication number
- JPS60169901U JPS60169901U JP5817584U JP5817584U JPS60169901U JP S60169901 U JPS60169901 U JP S60169901U JP 5817584 U JP5817584 U JP 5817584U JP 5817584 U JP5817584 U JP 5817584U JP S60169901 U JPS60169901 U JP S60169901U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- microwave integrated
- adhesive structure
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来のマイクロ波集積回路基板の接着構造を
説明するためのａはキャリアを用いた断面図、ｂはキャ
リアを用いない断面図、第２図は本考案に係るマイクロ
波集積回路基板の接着構造の一実施例を説明するための
ａは平面図、ｂは断面図である。
図において、１は筐体、２はコネクタ、３はトランジス
タ、４，４１〜４６はＭＩＣ基板、５はキャリア、６は
蓋、７は凹部をそれぞれ示す。FIG. 1 is a cross-sectional view using a carrier, b is a cross-sectional view without a carrier, and FIG. 2 is a microwave integrated circuit according to the present invention, for explaining the bonding structure of a conventional microwave integrated circuit board. A is a plan view and b is a cross-sectional view for explaining one embodiment of the bonding structure of the substrate. In the figure, 1 is a housing, 2 is a connector, 3 is a transistor, 4, 41 to 46 are MIC boards, 5 is a carrier, 6 is a lid, and 7 is a recess.
Claims (1)
する構造を、前記マイクロ波集積回路基板を突合せた接
続部の対応する筐体当接面に、前記導電接着剤が入り込
むための凹部を設けたことを特徴とするマイクロ波集積
回路基板の接着構造。A structure in which a microwave integrated circuit board is directly bonded to a casing with a conductive adhesive is provided, in which a recess for the conductive adhesive to enter is provided on the corresponding casing contact surface of the connecting portion where the microwave integrated circuit board is butted. An adhesive structure for a microwave integrated circuit board, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5817584U JPS60169901U (en) | 1984-04-19 | 1984-04-19 | Adhesive structure of microwave integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5817584U JPS60169901U (en) | 1984-04-19 | 1984-04-19 | Adhesive structure of microwave integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60169901U true JPS60169901U (en) | 1985-11-11 |
Family
ID=30583429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5817584U Pending JPS60169901U (en) | 1984-04-19 | 1984-04-19 | Adhesive structure of microwave integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60169901U (en) |
-
1984
- 1984-04-19 JP JP5817584U patent/JPS60169901U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5936268U (en) | printed wiring board | |
| JPS60169901U (en) | Adhesive structure of microwave integrated circuit board | |
| JPS58120662U (en) | Chippukiyariya | |
| JPS6117751U (en) | Tape carrier semiconductor device | |
| JPS601091U (en) | electroacoustic transducer | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS59146975U (en) | flexible wiring board | |
| JPS606242U (en) | hybrid integrated circuit | |
| JPS5939930U (en) | Semiconductor device assembly board | |
| JPS59159975U (en) | hybrid integrated circuit board | |
| JPS5852699U (en) | Substrate for magnetic bubble memory module | |
| JPS5952662U (en) | printed wiring board | |
| JPS58118769U (en) | printed wiring board | |
| JPS5860967U (en) | Bonding structure between wiring board and electronic components | |
| JPS5918459U (en) | Electrical element mounting structure | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS59143093U (en) | Electronic component mounting board | |
| JPS6078161U (en) | Mounting structure of electronic components | |
| JPS6078139U (en) | Hybrid integrated circuit device | |
| JPS5860969U (en) | Bonding structure between wiring board and electronic components | |
| JPS5952647U (en) | hybrid integrated circuit | |
| JPS58138275U (en) | Structure of board bonding terminal | |
| JPS59123361U (en) | Oscillator with circuit | |
| JPS6123182U (en) | clip terminal | |
| JPS5881949U (en) | integrated circuit board |