JPS5937742U - Heat dissipation structure - Google Patents

Heat dissipation structure

Info

Publication number
JPS5937742U
JPS5937742U JP13443182U JP13443182U JPS5937742U JP S5937742 U JPS5937742 U JP S5937742U JP 13443182 U JP13443182 U JP 13443182U JP 13443182 U JP13443182 U JP 13443182U JP S5937742 U JPS5937742 U JP S5937742U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation structure
component
protrusion
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13443182U
Other languages
Japanese (ja)
Inventor
真之 長谷川
佐藤　喜久男
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP13443182U priority Critical patent/JPS5937742U/en
Publication of JPS5937742U publication Critical patent/JPS5937742U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の放熱構造を示す断面図であり、第２図は
本考案の放熱構造を示す断面図である。 １・・・発熱部品、２・・・基板、３・・・配線電極、
４・・・放熱板、６・・・孔、７・・・突部。FIG. 1 is a cross-sectional view showing a conventional heat dissipation structure, and FIG. 2 is a cross-sectional view showing the heat dissipation structure of the present invention. 1... Heat generating component, 2... Board, 3... Wiring electrode,
4... Heat sink, 6... Hole, 7... Protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の一方の面に回路配線を形成すると共に、その配線
の電極に部品の電極が接続されるように部品を取り付け
、前記基板の他面に放熱板を取り付けるようにした放熱
構造において、前記基板に孔を設け、一方前記放熱板に
突部を設けて、前記孔に突部を挿通し突部が前記部品と
近接するようにしたことを特徴とする放熱構造。In the heat dissipation structure, a circuit wiring is formed on one surface of the substrate, a component is attached so that an electrode of the component is connected to an electrode of the wiring, and a heat sink is attached to the other surface of the substrate. A heat dissipation structure characterized in that a hole is provided in the heat dissipation plate, and a protrusion is provided in the heat dissipation plate, and the protrusion is inserted into the hole so that the protrusion comes close to the component.
JP13443182U 1982-09-03 1982-09-03 Heat dissipation structure Pending JPS5937742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13443182U JPS5937742U (en) 1982-09-03 1982-09-03 Heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13443182U JPS5937742U (en) 1982-09-03 1982-09-03 Heat dissipation structure

Publications (1)

Publication Number Publication Date
JPS5937742U true JPS5937742U (en) 1984-03-09

Family

ID=30302905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13443182U Pending JPS5937742U (en) 1982-09-03 1982-09-03 Heat dissipation structure

Country Status (1)

Country Link
JP (1) JPS5937742U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134783U (en) * 1984-08-03 1986-03-03 株式会社東芝 Mounting structure for high-frequency heat-generating electronic components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827649U (en) * 1971-08-04 1973-04-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827649U (en) * 1971-08-04 1973-04-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134783U (en) * 1984-08-03 1986-03-03 株式会社東芝 Mounting structure for high-frequency heat-generating electronic components

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