JPS5944051U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5944051U JPS5944051U JP14018982U JP14018982U JPS5944051U JP S5944051 U JPS5944051 U JP S5944051U JP 14018982 U JP14018982 U JP 14018982U JP 14018982 U JP14018982 U JP 14018982U JP S5944051 U JPS5944051 U JP S5944051U
- Authority
- JP
- Japan
- Prior art keywords
- holder
- laminate
- semiconductor equipment
- wiring board
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図及び第３図はそれぞれ従来の半導体装置
の側面図、正面図及び分解斜視図、第４図、第５図及び
第６図は本考案による半導体装置の一実施例の側面図、
正面図及び分解斜視図である。
１は半導体素子、１ａはそのピン、２は放熱器、３は配
線基板、４はホルダ、４ｂはホルダ４の突起、６はねじ
である。
第３図
第６図1, 2, and 3 are a side view, a front view, and an exploded perspective view of a conventional semiconductor device, respectively, and FIGS. 4, 5, and 6 are an embodiment of a semiconductor device according to the present invention. Side view,
They are a front view and an exploded perspective view. 1 is a semiconductor element, 1a is a pin thereof, 2 is a heat sink, 3 is a wiring board, 4 is a holder, 4b is a protrusion of the holder 4, and 6 is a screw. Figure 3 Figure 6
Claims (1)
り付けられたホルダと、該ホルダに設けられた半田付は
可能な突起と、配線基板とを有し、上記積層体の取り付
けられた上記ホルダの上記突起及び上記半導体素子のピ
ンが上記配線基板の透孔を通じてその上の導電層に半田
付けされて成る半導体装置。A laminate including a semiconductor element and a heat sink, a holder to which the laminate is attached, a solderable protrusion provided on the holder, and a wiring board, the holder to which the laminate is attached. A semiconductor device, wherein the protrusion of the holder and the pin of the semiconductor element are soldered to a conductive layer thereon through a through hole of the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14018982U JPS5944051U (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14018982U JPS5944051U (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5944051U true JPS5944051U (en) | 1984-03-23 |
Family
ID=30313966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14018982U Pending JPS5944051U (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944051U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218531A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Inductor and method of manufacturing the same, and circuit module using inductor |
-
1982
- 1982-09-16 JP JP14018982U patent/JPS5944051U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218531A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Inductor and method of manufacturing the same, and circuit module using inductor |
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