JPS5846456U - Mounting structure of heat sink - Google Patents

Mounting structure of heat sink

Info

Publication number
JPS5846456U
JPS5846456U JP14094981U JP14094981U JPS5846456U JP S5846456 U JPS5846456 U JP S5846456U JP 14094981 U JP14094981 U JP 14094981U JP 14094981 U JP14094981 U JP 14094981U JP S5846456 U JPS5846456 U JP S5846456U
Authority
JP
Japan
Prior art keywords
heat sink
mounting structure
shield case
wiring board
heat radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14094981U
Other languages
Japanese (ja)
Other versions
JPS6144444Y2 (en
Inventor
本巣　秀秋
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP14094981U priority Critical patent/JPS5846456U/en
Publication of JPS5846456U publication Critical patent/JPS5846456U/en
Application granted granted Critical
Publication of JPS6144444Y2 publication Critical patent/JPS6144444Y2/ja
Granted legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の放熱体の取付構造の説明に用いる斜視図
、第２図はこの考案の一実施例の断面図、第３図はこの
考案の一実施例の分解斜視図である。 １、　１Ａ、　　ＩＢ・・・放熱体、３・・・シールド
ケース、５、　５Ａ、　　５Ｂ・・・半導体部品、１４
・・・配線基板。FIG. 1 is a perspective view used to explain a conventional heat sink mounting structure, FIG. 2 is a sectional view of an embodiment of this invention, and FIG. 3 is an exploded perspective view of an embodiment of this invention. 1, 1A, IB... Heat sink, 3... Shield case, 5, 5A, 5B... Semiconductor component, 14
...Wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 不要な高周波信号を発生する回路装置が設けられた配線
基板と、この配線基板に固定されると共に、、電子部品
が取付けられた第１の放熱体と、これらの配線基板及び
第１の放熱体が収納されるシールドケースと、このシー
ルドケースの一部の面を挾んで上記第１の放熱体と対向
するように上記シールドケースに取付けられた第２の放
熱体とからなる放熱体の取付構造。A wiring board provided with a circuit device that generates unnecessary high-frequency signals, a first heat sink fixed to the wiring board and having electronic components attached thereto, and these wiring boards and the first heat sink. and a second heat radiator attached to the shield case so as to sandwich a part of the surface of the shield case and face the first heat radiator. .
JP14094981U 1981-09-22 1981-09-22 Mounting structure of heat sink Granted JPS5846456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14094981U JPS5846456U (en) 1981-09-22 1981-09-22 Mounting structure of heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14094981U JPS5846456U (en) 1981-09-22 1981-09-22 Mounting structure of heat sink

Publications (2)

Publication Number Publication Date
JPS5846456U true JPS5846456U (en) 1983-03-29
JPS6144444Y2 JPS6144444Y2 (en) 1986-12-15

Family

ID=29934088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14094981U Granted JPS5846456U (en) 1981-09-22 1981-09-22 Mounting structure of heat sink

Country Status (1)

Country Link
JP (1) JPS5846456U (en)

Also Published As

Publication number Publication date
JPS6144444Y2 (en) 1986-12-15

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