JPS59131166U - Hybrid integrated circuit with earth plate - Google Patents
Hybrid integrated circuit with earth plateInfo
- Publication number
- JPS59131166U JPS59131166U JP2467783U JP2467783U JPS59131166U JP S59131166 U JPS59131166 U JP S59131166U JP 2467783 U JP2467783 U JP 2467783U JP 2467783 U JP2467783 U JP 2467783U JP S59131166 U JPS59131166 U JP S59131166U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- earth plate
- grounding plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図a、 bは従来の高周波系混成集積
回路の例を示し、第3図a、 bは本考案第1実施例
の斜視図と側面図、第4図a、 bは本考案第2実施
例の斜視図と側面図を示す。 −11・・・基板
、12・・・リード端子、13.14・・・アース用プ
レート。Figures 1 and 2a and b show examples of conventional high-frequency hybrid integrated circuits, Figures 3a and b are perspective and side views of the first embodiment of the present invention, and Figures 4a and b are A perspective view and a side view of a second embodiment of the present invention are shown. -11... Board, 12... Lead terminal, 13.14... Grounding plate.
Claims (1)
品実装面にアース用プレートを取付けたことを特徴とす
るアースプレート付混成集積回路。A single-in-package hybrid integrated circuit with a grounding plate, characterized in that a grounding plate is attached to the non-component mounting surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2467783U JPS59131166U (en) | 1983-02-22 | 1983-02-22 | Hybrid integrated circuit with earth plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2467783U JPS59131166U (en) | 1983-02-22 | 1983-02-22 | Hybrid integrated circuit with earth plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59131166U true JPS59131166U (en) | 1984-09-03 |
Family
ID=30155706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2467783U Pending JPS59131166U (en) | 1983-02-22 | 1983-02-22 | Hybrid integrated circuit with earth plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59131166U (en) |
-
1983
- 1983-02-22 JP JP2467783U patent/JPS59131166U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59191761U (en) | printed board | |
JPS59131166U (en) | Hybrid integrated circuit with earth plate | |
JPS6039297U (en) | Mounting structure of electromagnetic shield plate | |
JPS6057154U (en) | flexible printed board | |
JPS60113667U (en) | Structure of electronic components for printed wiring | |
JPS6133451U (en) | Hybrid integrated circuit device | |
JPS59171350U (en) | Semiconductor element mounting structure | |
JPS5937742U (en) | Heat dissipation structure | |
JPS60172365U (en) | Printed circuit board wiring structure | |
JPS5869974U (en) | Shield structure of printed circuit board | |
JPS6133469U (en) | Through-hole tube of circuit board | |
JPS6081683U (en) | Metal case for hybrid integrated circuit | |
JPS5936232U (en) | Electrical component | |
JPS5961570U (en) | printed wiring board | |
JPS6013749U (en) | Heat dissipation structure of high frequency studless transistor | |
JPS5869983U (en) | Circuit board pattern structure | |
JPS60127001U (en) | microwave integrated circuit | |
JPS60109347U (en) | Microwave circuit board | |
JPS5998583U (en) | Ground connection structure of high frequency component case | |
JPS6123182U (en) | clip terminal | |
JPS58118676U (en) | Sub printed circuit board | |
JPS606226U (en) | Monolithic microwave integrated circuit substrate | |
JPS59195791U (en) | Wiring board mounting device | |
JPS59103469U (en) | circuit board | |
JPS60151162U (en) | printed wiring board |