JPS6133469U - Through-hole tube of circuit board - Google Patents

Through-hole tube of circuit board

Info

Publication number
JPS6133469U
JPS6133469U JP11819984U JP11819984U JPS6133469U JP S6133469 U JPS6133469 U JP S6133469U JP 11819984 U JP11819984 U JP 11819984U JP 11819984 U JP11819984 U JP 11819984U JP S6133469 U JPS6133469 U JP S6133469U
Authority
JP
Japan
Prior art keywords
circuit board
hole tube
hole
tube
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11819984U
Other languages
Japanese (ja)
Inventor
光司 大川
秀明 白井
道彦 吉岡
昭弘 石井
Original Assignee
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電線工業株式会社 filed Critical 三菱電線工業株式会社
Priority to JP11819984U priority Critical patent/JPS6133469U/en
Publication of JPS6133469U publication Critical patent/JPS6133469U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第1図は実施例の部分断面斜視図、第2図はその適用状
態を表わした断面図、第3図は他の実施例の断面図であ
る。 1:スルーホール管、2:導電性の管、3:絶縁層、4
:回路基板。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially sectional perspective view of an embodiment, FIG. 2 is a sectional view showing its applied state, and FIG. 3 is a sectional view of another embodiment. 1: Through-hole tube, 2: Conductive tube, 3: Insulating layer, 4
: Circuit board.

Claims (1)

【実用新案登録請求の範囲】 1 導電性の管の外周に絶縁層を設けてなり、回路基板
のスルーホールに挿入して適用されるスルーホール管。 2 回路基板が金属ベース基板である実用新案登録請求
の範囲第1項記載のスルーホール管。
[Claims for Utility Model Registration] 1. A through-hole tube that is formed by providing an insulating layer around the outer periphery of a conductive tube and is applied by being inserted into a through-hole in a circuit board. 2. The through-hole tube according to claim 1, wherein the circuit board is a metal base board.
JP11819984U 1984-07-30 1984-07-30 Through-hole tube of circuit board Pending JPS6133469U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11819984U JPS6133469U (en) 1984-07-30 1984-07-30 Through-hole tube of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11819984U JPS6133469U (en) 1984-07-30 1984-07-30 Through-hole tube of circuit board

Publications (1)

Publication Number Publication Date
JPS6133469U true JPS6133469U (en) 1986-02-28

Family

ID=30677087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11819984U Pending JPS6133469U (en) 1984-07-30 1984-07-30 Through-hole tube of circuit board

Country Status (1)

Country Link
JP (1) JPS6133469U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153400A (en) * 2006-12-15 2008-07-03 Fujitsu Ltd Circuit board, its manufacturing method, and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153400A (en) * 2006-12-15 2008-07-03 Fujitsu Ltd Circuit board, its manufacturing method, and semiconductor device

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