JPS5851469U - Structure of electronic circuit board - Google Patents

Structure of electronic circuit board

Info

Publication number
JPS5851469U
JPS5851469U JP14703581U JP14703581U JPS5851469U JP S5851469 U JPS5851469 U JP S5851469U JP 14703581 U JP14703581 U JP 14703581U JP 14703581 U JP14703581 U JP 14703581U JP S5851469 U JPS5851469 U JP S5851469U
Authority
JP
Japan
Prior art keywords
circuit board
electronic circuit
base material
dry film
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14703581U
Other languages
Japanese (ja)
Inventor
古川　静夫
Original Assignee
セイコーインスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーインスツルメンツ株式会社 filed Critical セイコーインスツルメンツ株式会社
Priority to JP14703581U priority Critical patent/JPS5851469U/en
Publication of JPS5851469U publication Critical patent/JPS5851469U/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案に基づく電子回路基板構造の断面図′　　を
示している。 １１・・・絶縁基材、１２・・・ドライフィルムソルダ
）　　−レジスト、１３・・・溝部、１４・・・導体ペ
ースト。The figure shows a cross-sectional view of an electronic circuit board structure based on the present invention. DESCRIPTION OF SYMBOLS 11... Insulating base material, 12... Dry film solder) - Resist, 13... Groove part, 14... Conductor paste.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路用基板の構造において、絶縁基材の法面に直接
ラミネートされパターニングされたドライフィルムソル
ダーレジストの間に導体ペーストが充填された構造を特
徴とする電子回路用基板Ｃ構造。In the structure of an electronic circuit board, an electronic circuit board C structure is characterized in that a conductive paste is filled between dry film solder resists that are laminated directly onto the slope of an insulating base material and patterned.
JP14703581U 1981-10-01 1981-10-01 Structure of electronic circuit board Pending JPS5851469U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14703581U JPS5851469U (en) 1981-10-01 1981-10-01 Structure of electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14703581U JPS5851469U (en) 1981-10-01 1981-10-01 Structure of electronic circuit board

Publications (1)

Publication Number Publication Date
JPS5851469U true JPS5851469U (en) 1983-04-07

Family

ID=29939908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14703581U Pending JPS5851469U (en) 1981-10-01 1981-10-01 Structure of electronic circuit board

Country Status (1)

Country Link
JP (1) JPS5851469U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6432293U (en) * 1987-08-21 1989-02-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6432293U (en) * 1987-08-21 1989-02-28

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