JPS6078172U - Flexible board connection structure - Google Patents

Flexible board connection structure

Info

Publication number
JPS6078172U
JPS6078172U JP17064983U JP17064983U JPS6078172U JP S6078172 U JPS6078172 U JP S6078172U JP 17064983 U JP17064983 U JP 17064983U JP 17064983 U JP17064983 U JP 17064983U JP S6078172 U JPS6078172 U JP S6078172U
Authority
JP
Japan
Prior art keywords
copper foil
connection structure
board connection
flexible board
foil part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17064983U
Other languages
Japanese (ja)
Inventor
山口　儀典
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP17064983U priority Critical patent/JPS6078172U/en
Publication of JPS6078172U publication Critical patent/JPS6078172U/en
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例を示す図、第２図は本願考案の一実施例
を示す図である。 ３・・・・・・フレキシブル基板、５”、　　６・・・
・・・可撓性フィルム、７・・・・・・フレキシブル基
板の銅箔パターン、訃・・・・・屈曲部。FIG. 1 is a diagram showing a conventional example, and FIG. 2 is a diagram showing an embodiment of the present invention. 3...Flexible board, 5", 6...
...Flexible film, 7...Copper foil pattern of flexible board, and...Bending portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅箔部と前記銅箔部の両側に形成された可撓性フィルム
部とを有するフレキシブル基板の接続構造において、前
記銅箔部と銅箔部の一側に形成された可撓性フィルムと
によって前記銅箔部が外周面に露出するように折り曲げ
られた屈曲部と、前−配属曲部と被接続基板の間に間隙
を形成する他側の可撓性フィルムとからなり、前記屈曲
部に半田付けすることにより電気的結合をなすことを特
徴とするフレキシブル基板の接続構造。In a flexible board connection structure having a copper foil part and a flexible film part formed on both sides of the copper foil part, the copper foil part and the flexible film formed on one side of the copper foil part It consists of a bent part that is bent so that the copper foil part is exposed on the outer peripheral surface, and a flexible film on the other side that forms a gap between the front-assigned bent part and the connected board, and A flexible circuit board connection structure characterized by electrical connection made by soldering.
JP17064983U 1983-11-01 1983-11-01 Flexible board connection structure Pending JPS6078172U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17064983U JPS6078172U (en) 1983-11-01 1983-11-01 Flexible board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17064983U JPS6078172U (en) 1983-11-01 1983-11-01 Flexible board connection structure

Publications (1)

Publication Number Publication Date
JPS6078172U true JPS6078172U (en) 1985-05-31

Family

ID=30372482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17064983U Pending JPS6078172U (en) 1983-11-01 1983-11-01 Flexible board connection structure

Country Status (1)

Country Link
JP (1) JPS6078172U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100302A (en) * 2004-09-28 2006-04-13 Sharp Corp Radio frequency module and manufacturing method therefor
JP2007096054A (en) * 2005-09-29 2007-04-12 Casio Comput Co Ltd Conductive bond structure of flexible wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796593A (en) * 1980-12-08 1982-06-15 Matsushita Electric Ind Co Ltd Printed circuit assemble

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796593A (en) * 1980-12-08 1982-06-15 Matsushita Electric Ind Co Ltd Printed circuit assemble

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100302A (en) * 2004-09-28 2006-04-13 Sharp Corp Radio frequency module and manufacturing method therefor
JP2007096054A (en) * 2005-09-29 2007-04-12 Casio Comput Co Ltd Conductive bond structure of flexible wiring board

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