JPS59191794U - Printed board - Google Patents

Printed board

Info

Publication number
JPS59191794U
JPS59191794U JP8574683U JP8574683U JPS59191794U JP S59191794 U JPS59191794 U JP S59191794U JP 8574683 U JP8574683 U JP 8574683U JP 8574683 U JP8574683 U JP 8574683U JP S59191794 U JPS59191794 U JP S59191794U
Authority
JP
Japan
Prior art keywords
printed board
circuit board
printed circuit
copper foil
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8574683U
Other languages
Japanese (ja)
Inventor
顕彦 林
Original Assignee
株式会社　マツクエイト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　マツクエイト filed Critical 株式会社　マツクエイト
Priority to JP8574683U priority Critical patent/JPS59191794U/en
Publication of JPS59191794U publication Critical patent/JPS59191794U/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のプリント基板の平面図、第２図、第３図
は同フレキシブルプリント基板の平面図と断面図、第４
図は本考案の一実施例の一部を切除した平面図、第５図
は他の実施例の一部を切除した千面薗、第６図は他の実
施例の斜視断面図である。 Ａ、　　Ｂ・・・プリント基板、２．　６．　７・・・
ライブパターン、３．８・・・アースパターン、Ｃ・・
・絶縁層、Ｄ・・・導電箔。Figure 1 is a plan view of a conventional printed circuit board, Figures 2 and 3 are a plan view and cross-sectional view of the same flexible printed circuit board, and Figure 4 is a plan view of a conventional printed circuit board.
5 is a partially cut away plan view of one embodiment of the present invention, FIG. 5 is a partially cut away plan view of another embodiment, and FIG. 6 is a perspective sectional view of another embodiment. A, B...Printed circuit board, 2. 6. 7...
Live pattern, 3.8...Earth pattern, C...
- Insulating layer, D... conductive foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板のライブパターンの銅箔上に、絶縁層を介
して銅箔等の導電箔を接着したことを特徴とするプリン
ト基板。A printed circuit board characterized in that a conductive foil such as copper foil is bonded to the copper foil of the live pattern of the printed circuit board via an insulating layer.
JP8574683U 1983-06-07 1983-06-07 Printed board Pending JPS59191794U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8574683U JPS59191794U (en) 1983-06-07 1983-06-07 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8574683U JPS59191794U (en) 1983-06-07 1983-06-07 Printed board

Publications (1)

Publication Number Publication Date
JPS59191794U true JPS59191794U (en) 1984-12-19

Family

ID=30215706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8574683U Pending JPS59191794U (en) 1983-06-07 1983-06-07 Printed board

Country Status (1)

Country Link
JP (1) JPS59191794U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155697U (en) * 1987-03-31 1988-10-12
JPH0423490A (en) * 1990-05-18 1992-01-27 Nec Corp Multilayer wiring board
JP2005175097A (en) * 2003-12-10 2005-06-30 Kyocera Corp Wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529276U (en) * 1978-08-16 1980-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529276U (en) * 1978-08-16 1980-02-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155697U (en) * 1987-03-31 1988-10-12
JPH0423490A (en) * 1990-05-18 1992-01-27 Nec Corp Multilayer wiring board
JP2005175097A (en) * 2003-12-10 2005-06-30 Kyocera Corp Wiring board

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