JPS59180468U - Printed wiring board equipment - Google Patents

Printed wiring board equipment

Info

Publication number
JPS59180468U
JPS59180468U JP7488483U JP7488483U JPS59180468U JP S59180468 U JPS59180468 U JP S59180468U JP 7488483 U JP7488483 U JP 7488483U JP 7488483 U JP7488483 U JP 7488483U JP S59180468 U JPS59180468 U JP S59180468U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conductive pattern
board equipment
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7488483U
Other languages
Japanese (ja)
Inventor
小森　裕次
池内　康博
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP7488483U priority Critical patent/JPS59180468U/en
Publication of JPS59180468U publication Critical patent/JPS59180468U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の印刷配線板装置を示す平面図、第２図は
この考案に係る印刷配線板装置の一実施例を示す平面図
、第３図は同実施例の変形例を示す平面図である。 １１・・・印刷配線板本体、１２・・・導電パターン、
１３．１４・・・リード足挿通孔、１５・・・絶縁膜、
１６．１７・・・ランド。Fig. 1 is a plan view showing a conventional printed wiring board device, Fig. 2 is a plan view showing an embodiment of the printed wiring board device according to this invention, and Fig. 3 is a plan view showing a modification of the same embodiment. It is. 11... Printed wiring board main body, 12... Conductive pattern,
13.14... Lead foot insertion hole, 15... Insulating film,
16.17...Rand.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 同一導電パターン中に第１及び第２の部品挿入用孔が近
接して形成されるとともに、前記導電パターンのうち前
記第１及び第２の部品挿入用孔の周縁部分をそれぞれ半
田付は可能な第１及び第２のランドとして残して絶縁膜
で覆ってなる印刷配線板装置において、前記導電パター
ンのうち前記第１のランドと第２のランドとの中間部分
を所定の幅で裁断するようにしてなることを特徴とする
印刷配線板装置。First and second component insertion holes are formed close to each other in the same conductive pattern, and it is possible to solder peripheral portions of the first and second component insertion holes in the conductive pattern, respectively. In the printed wiring board device in which the conductive pattern is left as first and second lands and covered with an insulating film, an intermediate portion between the first land and the second land of the conductive pattern is cut to a predetermined width. A printed wiring board device characterized by:
JP7488483U 1983-05-19 1983-05-19 Printed wiring board equipment Pending JPS59180468U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7488483U JPS59180468U (en) 1983-05-19 1983-05-19 Printed wiring board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7488483U JPS59180468U (en) 1983-05-19 1983-05-19 Printed wiring board equipment

Publications (1)

Publication Number Publication Date
JPS59180468U true JPS59180468U (en) 1984-12-01

Family

ID=30204966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7488483U Pending JPS59180468U (en) 1983-05-19 1983-05-19 Printed wiring board equipment

Country Status (1)

Country Link
JP (1) JPS59180468U (en)

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