JPS5963445U - Heat sink mounting device - Google Patents

Heat sink mounting device

Info

Publication number
JPS5963445U
JPS5963445U JP15946682U JP15946682U JPS5963445U JP S5963445 U JPS5963445 U JP S5963445U JP 15946682 U JP15946682 U JP 15946682U JP 15946682 U JP15946682 U JP 15946682U JP S5963445 U JPS5963445 U JP S5963445U
Authority
JP
Japan
Prior art keywords
heat sink
mounting bracket
guide pieces
mounting device
sink mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15946682U
Other languages
Japanese (ja)
Inventor
白坂　進
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP15946682U priority Critical patent/JPS5963445U/en
Publication of JPS5963445U publication Critical patent/JPS5963445U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の放熱板取付装置を示し、第１図は同装置
の斜視図、第２図は同装置を取付ネジ部で切断した断面
図である。 １・・・放熱板、４・・・プリント基板、６・・・半導
体素子、７・・・取付金具、９・・・取付ネジ、１３・
・・鍔、１４．１４’・・・Ｌ字状ガイド片。The drawings show a heat dissipation plate mounting device of the present invention; FIG. 1 is a perspective view of the device, and FIG. 2 is a sectional view of the device taken at a mounting screw portion. DESCRIPTION OF SYMBOLS 1... Heat sink, 4... Printed circuit board, 6... Semiconductor element, 7... Mounting bracket, 9... Mounting screw, 13...
...Tsuba, 14.14'...L-shaped guide piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 所定間隔を隔てて２個のＬ字状ガイド片が設けられた放
熱板と、該ガイド片に嵌合される２個の鍔片が設けられ
た取付金具と、プリント基板に固定された半導体素子と
を備え、前記放熱板のガイド片間と前記取付金具の鍔片
間で前記半導体素子を挾持するよう前記放熱板と前記取
付金具とを締付ネジにて締付固定してなる放熱板取付装
置。A heat dissipation plate provided with two L-shaped guide pieces spaced apart from each other by a predetermined distance, a mounting bracket provided with two flange pieces fitted to the guide pieces, and a semiconductor element fixed to a printed circuit board. and a heat sink mounting comprising tightening and fixing the heat sink and the mounting bracket with tightening screws so as to sandwich the semiconductor element between the guide pieces of the heat sink and the collar piece of the mounting bracket. Device.
JP15946682U 1982-10-20 1982-10-20 Heat sink mounting device Pending JPS5963445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15946682U JPS5963445U (en) 1982-10-20 1982-10-20 Heat sink mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15946682U JPS5963445U (en) 1982-10-20 1982-10-20 Heat sink mounting device

Publications (1)

Publication Number Publication Date
JPS5963445U true JPS5963445U (en) 1984-04-26

Family

ID=30351027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15946682U Pending JPS5963445U (en) 1982-10-20 1982-10-20 Heat sink mounting device

Country Status (1)

Country Link
JP (1) JPS5963445U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014020806A1 (en) * 2012-08-03 2016-07-21 富士電機株式会社 Cooling structure and power conversion device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS421464Y1 (en) * 1965-05-20 1967-01-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS421464Y1 (en) * 1965-05-20 1967-01-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014020806A1 (en) * 2012-08-03 2016-07-21 富士電機株式会社 Cooling structure and power conversion device

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