JPS58138394U - Mounting structure of heat sink on printed circuit board - Google Patents
Mounting structure of heat sink on printed circuit boardInfo
- Publication number
- JPS58138394U JPS58138394U JP3323082U JP3323082U JPS58138394U JP S58138394 U JPS58138394 U JP S58138394U JP 3323082 U JP3323082 U JP 3323082U JP 3323082 U JP3323082 U JP 3323082U JP S58138394 U JPS58138394 U JP S58138394U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- mounting structure
- screws
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板への放熱板の組立図、第２
図は第１図の側面図、第３図は本考案の一実施例の分解
図、第４図は第３図の組立図、第５図は第４図の側面図
である。
１１・・・プリント基板、１２． １５． １８． １
９・・・孔、１２ａ、 １２ｂ−・・係合孔、１４ａ
、 １４ｂ−・・突出部、１６・・・押え板、１７・
・・突起、２４・・・トランジスタ、２５・・・ビス。Figure 1 is an assembly diagram of a heat sink on a conventional printed circuit board, Figure 2
1, FIG. 3 is an exploded view of an embodiment of the present invention, FIG. 4 is an assembled view of FIG. 3, and FIG. 5 is a side view of FIG. 4. 11... Printed circuit board, 12. 15. 18. 1
9...hole, 12a, 12b-...engaging hole, 14a
, 14b--protruding portion, 16--pressing plate, 17-
...protrusion, 24...transistor, 25...screw.
Claims (1)
したトランジスタと共に、放熱板をプリント基板にビス
により固定するようにしたプリント基板への放熱板の取
付構造において、前記ビスを１個とし、放熱板の少なく
とも１箇所にプリント基板に向かって突出する突出部を
形成すると共に、プリント基板に前記突出部が係合する
係合孔を形成したことを特徴とするプリント基板への放
熱板の取付構造。In a structure for attaching a heat sink to a printed circuit board, in which a heat sink is placed on a printed circuit board, and the heat sink is fixed to the printed circuit board together with a transistor placed on the heat sink using screws, the screws are heat dissipation to a printed circuit board, characterized in that a protrusion protruding toward the printed circuit board is formed at at least one location on the heat dissipation plate, and an engagement hole in which the protrusion engages is formed in the printed circuit board. Board mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3323082U JPS58138394U (en) | 1982-03-11 | 1982-03-11 | Mounting structure of heat sink on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3323082U JPS58138394U (en) | 1982-03-11 | 1982-03-11 | Mounting structure of heat sink on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138394U true JPS58138394U (en) | 1983-09-17 |
Family
ID=30044786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3323082U Pending JPS58138394U (en) | 1982-03-11 | 1982-03-11 | Mounting structure of heat sink on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138394U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717197B2 (en) * | 1977-03-31 | 1982-04-09 |
-
1982
- 1982-03-11 JP JP3323082U patent/JPS58138394U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717197B2 (en) * | 1977-03-31 | 1982-04-09 |
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