JPS6037247U - Transistor heat dissipation mounting structure - Google Patents

Transistor heat dissipation mounting structure

Info

Publication number
JPS6037247U
JPS6037247U JP13026583U JP13026583U JPS6037247U JP S6037247 U JPS6037247 U JP S6037247U JP 13026583 U JP13026583 U JP 13026583U JP 13026583 U JP13026583 U JP 13026583U JP S6037247 U JPS6037247 U JP S6037247U
Authority
JP
Japan
Prior art keywords
transistor
heat dissipation
mounting structure
heatsink
mounting bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13026583U
Other languages
Japanese (ja)
Inventor
三田村　文男
良一 中川
宿谷　昌夫
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP13026583U priority Critical patent/JPS6037247U/en
Publication of JPS6037247U publication Critical patent/JPS6037247U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は何れも本考案の一実施例であり、第１図は平面視
、第２図は即断固視、第３図は分解状態斜視である。 図中、１はトランジスタ、２は基板、３は放熱器、５は
リード端子、６は脚部、７は基板部、８は取付金具、９
は取付ねじ、１８はプリント板を示す。The drawings all show one embodiment of the present invention, and FIG. 1 is a plan view, FIG. 2 is a close-up view, and FIG. 3 is an exploded perspective view. In the figure, 1 is a transistor, 2 is a board, 3 is a heat sink, 5 is a lead terminal, 6 is a leg part, 7 is a board part, 8 is a mounting bracket, 9
18 indicates a mounting screw, and 18 indicates a printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] トランジスタの基板に接して取着される放熱器と、該ト
ランジスタのリード端子方向に脚部が並行突設され該放
熱器並びにトランジスタの基板と並行して取着される基
板部とからなる取付金具よりなり、該トランジスタと放
熱器と取付金具を一体に取着しかつ放熱器と取付金具基
板部及びプリント板それぞれの間に間隙が設けられ取付
金具脚部によってプリント板に搭載実装されることを特
徴とするトランジスタ放熱実装構造。A mounting bracket consisting of a heatsink that is attached in contact with a substrate of a transistor, and a substrate portion that has legs projecting in parallel in the direction of the lead terminals of the transistor and that is attached in parallel with the heatsink and the substrate of the transistor. The transistor, the heatsink, and the mounting bracket are mounted integrally, and a gap is provided between the heatsink, the mounting bracket substrate, and the printed board, and the transistor is mounted on the printed board by the mounting bracket legs. Characteristic transistor heat dissipation mounting structure.
JP13026583U 1983-08-23 1983-08-23 Transistor heat dissipation mounting structure Pending JPS6037247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13026583U JPS6037247U (en) 1983-08-23 1983-08-23 Transistor heat dissipation mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13026583U JPS6037247U (en) 1983-08-23 1983-08-23 Transistor heat dissipation mounting structure

Publications (1)

Publication Number Publication Date
JPS6037247U true JPS6037247U (en) 1985-03-14

Family

ID=30294884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13026583U Pending JPS6037247U (en) 1983-08-23 1983-08-23 Transistor heat dissipation mounting structure

Country Status (1)

Country Link
JP (1) JPS6037247U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6293647U (en) * 1985-12-02 1987-06-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6293647U (en) * 1985-12-02 1987-06-15
JPH0426839Y2 (en) * 1985-12-02 1992-06-26

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