JPS6039252U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS6039252U JPS6039252U JP13208083U JP13208083U JPS6039252U JP S6039252 U JPS6039252 U JP S6039252U JP 13208083 U JP13208083 U JP 13208083U JP 13208083 U JP13208083 U JP 13208083U JP S6039252 U JPS6039252 U JP S6039252U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- leads
- view
- component
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は集積回路装置の一例を示す一部断面平面図、第
２図及び第３図は第１図装置に用いられた電子部品の一
部側面図及び正面図、第４図及び第５図は第１図装置に
用いられた電子部品の変形例を示す一部側面図及び正面
図、第６図及び第７図は第２図及び第４図に示した電子
部品の基板への実装状態を示す要部断面側面図、第８図
は本考案による電子部品の斜視図、第９図は第８図装置
を実装した基板の一部を示す側断面図、第１０図乃至第
１３図は本考案の他の実施例を示す斜視図、第１４図は
本考案を適用可能な電子部品の側面図を示す。
８．８’ 、８″ ６ ｔｒｙ・・・・・・電子部品、
１０・・・・・・部品本体（半導体ペレット）、１１．
ｌｌ’、１１′、１１”・・・中リード、１ｌｃｔ
ｌｌｃ’ｔ １１ｃ″、１１ｃ″′・・・・・・折曲
部、１３・・・・・・外装部。
−＼ １０
！ 鬼 ゞ
第７図
３
イFIG. 1 is a partially sectional plan view showing an example of an integrated circuit device, FIGS. 2 and 3 are partial side views and front views of electronic components used in the device shown in FIG. 1, and FIGS. The figure shows a partial side view and front view of a modified example of the electronic component used in the device shown in FIG. 1, and FIGS. 6 and 7 show the mounting of the electronic component shown in FIGS. 8 is a perspective view of the electronic component according to the present invention; FIG. 9 is a side sectional view showing a part of the board on which the device of FIG. 8 is mounted; FIGS. 10 to 13; 14 is a perspective view showing another embodiment of the present invention, and FIG. 14 is a side view of an electronic component to which the present invention can be applied. 8.8', 8'' 6 try...Electronic parts,
10... Part body (semiconductor pellet), 11.
ll', 11', 11"...Medium lead, 1lct
llc't 11c'', 11c'''...bent part, 13...exterior part. -\10! Oni ゞFigure 7 3 I
Claims (1)
部品本体を含む主要部分を外装すると共にリードを同一
方向に導出したものにおいて、上記リードの内、選択さ
れたり一ド遊端をリード中間部に対して略直交方向に折
曲したことを特徴とする電子部品。Electrically connect the component body and multiple leads,
A device in which the main parts including the main part of the component are sheathed and the leads are led out in the same direction, characterized in that the free end of one of the leads is bent in a direction substantially perpendicular to the middle part of the lead. electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13208083U JPS6039252U (en) | 1983-08-25 | 1983-08-25 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13208083U JPS6039252U (en) | 1983-08-25 | 1983-08-25 | electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6039252U true JPS6039252U (en) | 1985-03-19 |
Family
ID=30298391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13208083U Pending JPS6039252U (en) | 1983-08-25 | 1983-08-25 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039252U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05220858A (en) * | 1992-02-17 | 1993-08-31 | Takao Hane | Apparatus for treating foamed resin molded product |
| JP2020035947A (en) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | Soldering component |
-
1983
- 1983-08-25 JP JP13208083U patent/JPS6039252U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05220858A (en) * | 1992-02-17 | 1993-08-31 | Takao Hane | Apparatus for treating foamed resin molded product |
| JP2020035947A (en) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | Soldering component |
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