JPS59135645U - Mounting structure of heat sink and power transistor - Google Patents
Mounting structure of heat sink and power transistorInfo
- Publication number
- JPS59135645U JPS59135645U JP2844583U JP2844583U JPS59135645U JP S59135645 U JPS59135645 U JP S59135645U JP 2844583 U JP2844583 U JP 2844583U JP 2844583 U JP2844583 U JP 2844583U JP S59135645 U JPS59135645 U JP S59135645U
- Authority
- JP
- Japan
- Prior art keywords
- power transistor
- heat sink
- printed board
- mounting structure
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の直前の段階の構成の説明図、第２図お
よび第３図は本考案の一実施例の説明図、第４図は第３
図のリード端子部分の曲げ形状の説明図。
図中１はプリント板、２および２ａはパワートランジス
タ、３はヒートシンク、４は絶縁層、５は取付ネジ、６
は取付ネジ、１ａは半田付部。FIG. 1 is an explanatory diagram of the configuration at the stage immediately before the present invention, FIGS. 2 and 3 are explanatory diagrams of one embodiment of the present invention, and FIG.
An explanatory diagram of the bent shape of the lead terminal portion in the figure. In the figure, 1 is a printed board, 2 and 2a are power transistors, 3 is a heat sink, 4 is an insulating layer, 5 is a mounting screw, 6
1a is the mounting screw, and 1a is the soldering part.
Claims (1)
直角な対プリント板取付面を有するヒートシンク部材と
、該部材に取付られたパワートランジスタを有し、該パ
ワートランジスタがプリント板に対して垂直に実装され
各リード端子がプリント板の該当配線端に半田付され、
かつ上記ヒートシンクが上記対プリント板取付面で絶縁
層を介してプリント板に取付られる実装構造であって、
上記パワートランジスタのリード端子の途中に曲げＲ付
のＶ字型の折り曲げ折り戻し形状をそなえることを特徴
とするヒートシンク及びパワートランジスタの実装構造
。A heat sink member having a heat dissipation surface, a power transistor mounting surface, a printed board mounting surface perpendicular to the mounting surface, and a power transistor mounted on the member, the power transistor being perpendicular to the printed board. Once mounted, each lead terminal is soldered to the corresponding wiring end of the printed board,
and a mounting structure in which the heat sink is attached to the printed board via an insulating layer on the printed board mounting surface,
A mounting structure for a heat sink and a power transistor, characterized in that a lead terminal of the power transistor is provided with a V-shaped folded back shape with a bending radius in the middle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2844583U JPS59135645U (en) | 1983-02-28 | 1983-02-28 | Mounting structure of heat sink and power transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2844583U JPS59135645U (en) | 1983-02-28 | 1983-02-28 | Mounting structure of heat sink and power transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59135645U true JPS59135645U (en) | 1984-09-10 |
Family
ID=30159333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2844583U Pending JPS59135645U (en) | 1983-02-28 | 1983-02-28 | Mounting structure of heat sink and power transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59135645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016039291A (en) * | 2014-08-08 | 2016-03-22 | 株式会社デンソー | Electronic circuit component |
-
1983
- 1983-02-28 JP JP2844583U patent/JPS59135645U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016039291A (en) * | 2014-08-08 | 2016-03-22 | 株式会社デンソー | Electronic circuit component |
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