JPS6157562U - - Google Patents
Info
- Publication number
- JPS6157562U JPS6157562U JP14301484U JP14301484U JPS6157562U JP S6157562 U JPS6157562 U JP S6157562U JP 14301484 U JP14301484 U JP 14301484U JP 14301484 U JP14301484 U JP 14301484U JP S6157562 U JPS6157562 U JP S6157562U
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- board
- electronic component
- dissipation plate
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品の取付構造を示
す側面図、第２図ａは同取付構造で用いる台座の
斜視図、第２図ｂは同取付構造で用いる放熱板の
一例を示す一部抽出斜視図、第３図は別の実施例
に係る電子部品の取付構造を示す斜視図、第４図
は従来例の一例に係る電子部品の取付構造を示す
説明図である。
１０：電子部品、１０ａ：リード線、１１：放
熱板、１２：基板、１３：台座、１３ｃ：立上り
部。
Figure 1 is a side view showing a mounting structure for electronic components according to the present invention, Figure 2a is a perspective view of a pedestal used in the mounting structure, and Figure 2b is an example of a heat sink used in the mounting structure. FIG. 3 is a perspective view showing an electronic component mounting structure according to another embodiment, and FIG. 4 is an explanatory diagram showing an electronic component mounting structure according to an example of a conventional example. 10: electronic component, 10a: lead wire, 11: heat sink, 12: board, 13: pedestal, 13c: rising portion.
補正 昭５９．１２．２７
図面の簡単な説明を次のように補正する。
明細書第６頁第１９行記載の「斜視図、」の後
に「第４図ａは同取付構造で用いる台座の別の実
施例を示す一部正面図、第４図ｂは同台座の基板
に対する取付状態を示す説明図、」を挿入し、ま
た、同行記載の「第４図」の「４」を「５」と訂
正する。Amendment December 27, 1982 The brief description of the drawing is amended as follows. After "perspective view," written in page 6, line 19 of the specification, "Figure 4a is a partial front view showing another embodiment of the pedestal used in the same mounting structure, and Figure 4b is a substrate of the same pedestal. Insert ``An explanatory diagram showing the state of attachment to the holder'' and correct ``4'' in ``Figure 4'' to ``5'' in the accompanying description.
Claims (1)
た台座に放熱板を植立固定し、その放熱板と台座
の立上り部との間にトランジスタ等の帯熱する電
子部品を挾込み支持し、この台座を基板の板面上
に載置すると共に、台座より下方に突出する電子
部品のリード線を基板に挿入して半田付け固定し
たことを特徴とする基板に対する電子部品の取付
構造。 A heat dissipation plate is planted and fixed on a pedestal made of electrically insulating resin with good heat deformation resistance, and electronic components that heat up, such as transistors, are inserted and supported between the heat dissipation plate and the rising part of the pedestal. A structure for mounting an electronic component to a board, characterized in that a pedestal is placed on the board surface of the board, and lead wires of the electronic component protruding downward from the pedestal are inserted into the board and fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14301484U JPH0314051Y2 (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14301484U JPH0314051Y2 (en) | 1984-09-21 | 1984-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157562U true JPS6157562U (en) | 1986-04-17 |
| JPH0314051Y2 JPH0314051Y2 (en) | 1991-03-28 |
Family
ID=30701327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14301484U Expired JPH0314051Y2 (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314051Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220963A (en) * | 2006-02-17 | 2007-08-30 | Cosel Co Ltd | Short circuit prevention spacer of electronic component |
| JP2010272637A (en) * | 2009-05-20 | 2010-12-02 | Cosel Co Ltd | Mounting structure of electronic component and method for mounting the same |
| JP2011199018A (en) * | 2010-03-19 | 2011-10-06 | Yaskawa Electric Corp | Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component |
-
1984
- 1984-09-21 JP JP14301484U patent/JPH0314051Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220963A (en) * | 2006-02-17 | 2007-08-30 | Cosel Co Ltd | Short circuit prevention spacer of electronic component |
| JP2010272637A (en) * | 2009-05-20 | 2010-12-02 | Cosel Co Ltd | Mounting structure of electronic component and method for mounting the same |
| JP2011199018A (en) * | 2010-03-19 | 2011-10-06 | Yaskawa Electric Corp | Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0314051Y2 (en) | 1991-03-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6157562U (en) | ||
| JPS619851U (en) | Power transistor fixing device | |
| JPS59135645U (en) | Mounting structure of heat sink and power transistor | |
| JPS5815385U (en) | circuit unit | |
| JPS6377353U (en) | ||
| JPS5822742U (en) | semiconductor equipment | |
| JPS59127270U (en) | printed circuit board equipment | |
| JPS6454383U (en) | ||
| JPS605141U (en) | Insulating sheet with shield for transistors | |
| JPS6052629U (en) | Hybrid integrated circuit device | |
| JPS58155848U (en) | transistor mounting device | |
| JPS62120397U (en) | ||
| JPS5937742U (en) | Heat dissipation structure | |
| JPS5964249U (en) | thermal head | |
| JPS59185846U (en) | transistor heat sink | |
| JPS58127780U (en) | speaker holder | |
| JPS6230351U (en) | ||
| JPS59155746U (en) | Heat sink with wiring board | |
| JPS606267U (en) | connection device | |
| JPS6073278U (en) | printed wiring board equipment | |
| JPS59146981U (en) | small circuit module | |
| JPS58166048U (en) | IC package | |
| JPS60153592U (en) | Heat dissipation device for heating element | |
| JPS59123387U (en) | Mounting device for heat generating parts | |
| JPS60192454U (en) | transistor mounting bracket |