JP2010272637A - Mounting structure of electronic component and method for mounting the same - Google Patents

Mounting structure of electronic component and method for mounting the same Download PDF

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JP2010272637A
JP2010272637A JP2009122111A JP2009122111A JP2010272637A JP 2010272637 A JP2010272637 A JP 2010272637A JP 2009122111 A JP2009122111 A JP 2009122111A JP 2009122111 A JP2009122111 A JP 2009122111A JP 2010272637 A JP2010272637 A JP 2010272637A
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electronic component
mold
lead
attached
heat sink
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JP2009122111A
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JP4995866B2 (en
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Koji Takeshima
宏治 竹島
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Cosel Co Ltd
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Cosel Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component which has a simple structure of a mold, and holds down mold cost, and surely has insulation and prevents short circuit of lead, and to provide a method for mounting the electronic component. <P>SOLUTION: The mounting structure includes the electronic component 14 which is covered with a rectangular case 12 and has a lead 16 projected outside from the case 12. The mounting structure includes: a heat sink 18 which is attached on one side surface of the case 12 of the electronic component 14; and a mold part 28 which is attached on the heat sink 18 and is molded with insulating resin covering a part of the lead 16 on the side surface on which the electronic component 14 of the heat sink 18 is attached. The lead 16 of the electronic component 14 which is projected from the mold part 28 is connected to a printed board 24, and at the same time, the mold part 28 is made in contact with the printed board 24. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、電子部品の端子間に絶縁性樹脂を取り付けた電子部品の取付構造とその取付方法に関する。   The present invention relates to an electronic component mounting structure in which an insulating resin is mounted between terminals of an electronic component, and a mounting method thereof.

従来、パワートランジスタ等の電子部品に放熱板が取り付けられ、冷却用ファンによって外気を吹き付けて電子部品を放熱する電源装置等において、外気に含まれる塵埃等が、電子部品のリードや、リードがハンダ付けされたプリント基板上等に堆積し、湿気を吸収して導電性を有するに至ると、リード間で短絡事故を起こし故障の原因となるおそれがあった。また、金属くず等の導電性の埃が飛来して短絡するおそれもあった。   Conventionally, in a power supply device or the like in which a heat sink is attached to an electronic component such as a power transistor and the outside air is blown by a cooling fan to dissipate the electronic component, dust or the like contained in the outside air causes the electronic component lead or the lead to be soldered. If it accumulates on the attached printed circuit board or the like and absorbs moisture to become conductive, a short circuit accident may occur between the leads, which may cause a failure. In addition, conductive dust such as metal scrap may fly and cause a short circuit.

このような短絡を防止するため、従来、電子部品と放熱板が互いに取り付けられた状態で全体を絶縁性樹脂でモールドする構造がある。あるいは、電子部品を放熱板に取り付ける前に、電子部品のリードのみを絶縁性樹脂でモールドし、その後放熱板へ取り付ける方法もある。   In order to prevent such a short circuit, conventionally, there is a structure in which the whole is molded with an insulating resin while the electronic component and the heat sink are attached to each other. Alternatively, there is a method in which only the lead of the electronic component is molded with an insulating resin before the electronic component is attached to the heat sink and then attached to the heat sink.

例えば、特許文献１，２の複合半導体装置には、リードのみをモールドした後に半導体素子等の電子部品を放熱板へ取り付ける構造が開示されている。この構造は、導体パターン上に半導体チップなどの電子部品を搭載し、所定の電気回路を構成した絶縁基板と、この絶縁基板を搭載する放熱板と、この放熱板に絶縁基板を覆って被せられる絶縁ケースが設けられている。そして、絶縁ケースの側壁には、絶縁基板の導体パターンに下端が固着され、他端が絶縁ケースの外側に導出されるリードがインサートモールドされているものである。   For example, the composite semiconductor devices disclosed in Patent Documents 1 and 2 disclose a structure in which only a lead is molded and an electronic component such as a semiconductor element is attached to a heat sink. In this structure, an electronic component such as a semiconductor chip is mounted on a conductor pattern, and an insulating substrate that constitutes a predetermined electric circuit, a heat sink that mounts the insulating substrate, and the heat sink is covered with the insulating substrate. An insulating case is provided. The side wall of the insulating case is insert-molded with a lead whose lower end is fixed to the conductor pattern of the insulating substrate and whose other end is led out to the outside of the insulating case.

また、別の構造としてはリードにチューブ状のスペーサを装着する構造もある。さらに特許文献３に開示された電子部品の短絡防止スペーサは、電子部品を嵌合する空間である被着部が形成され、被着部の底面には電子部品の各リードを挿通する複数の挿通口が設けられている。この短絡防止スペーサの使用方法は、電子部品をスペーサ本体の被着部に入れ、挿通口からリードを突出させる。そして電子部品を実装する基板に、スペーサから突出したリードを、ハンダ付けするものである。   As another structure, there is a structure in which a tubular spacer is attached to the lead. Further, the electronic component short-circuit prevention spacer disclosed in Patent Document 3 is formed with an attachment portion which is a space for fitting the electronic component, and a plurality of insertions for inserting each lead of the electronic component into the bottom surface of the attachment portion. Mouth is provided. In the method of using this short-circuit prevention spacer, an electronic component is put in the adherend portion of the spacer body, and the lead is projected from the insertion opening. Then, the lead protruding from the spacer is soldered to the substrate on which the electronic component is mounted.

その他に、電子部品全体を絶縁キャップで覆ったり、コーティング処理したりする方法もあった。   Other methods include covering the entire electronic component with an insulating cap or coating the electronic component.

特開平１１−１７７０１７号公報JP-A-11-177017 特開２００３−１６８７６６号公報JP 2003-168766 A 特開２００７−２２０９６３号公報JP 2007-220963 A

上記背景技術の、電子部品と放熱板の全体を絶縁性樹脂でモールドする場合は、成型のための金型が少なくとも一対必要とし、全体構造も大きくなりコストがかかるという問題がある。さらに、モールド材の体積も大きくなるため、モールド材料費が増え、重量が増すことによる余分な固定機能を付ける必要がある。また、放熱板の放熱性が悪くなり別の放熱構造が必要となる。   In the case of molding the entire electronic component and the heat sink with the insulating resin according to the above background art, there is a problem that at least a pair of molds for molding is required, and the entire structure becomes large and costs increase. Furthermore, since the volume of the molding material is increased, the molding material cost is increased, and it is necessary to provide an extra fixing function due to an increase in weight. Moreover, the heat dissipation of a heat sink will worsen and another heat dissipation structure will be needed.

特許文献１，２のようにリードをモールドした後に放熱板へ取り付ける方法も、成型のための金型が複雑であり、工程も多くなるものである。さらに、リード周辺も成形する場合、そのための金型も必要であり、コストアップの原因となっている。また電子部品はモールドされた後に放熱板へ取り付けられるため、放熱板に接触する取付面に絶縁性樹脂が付着しないような精度の良い金型が必要であった。   As in Patent Documents 1 and 2, the method of attaching the leads to the heat sink after molding the leads also requires a complicated mold for molding and increases the number of processes. Further, when molding the periphery of the lead, a die for that purpose is also required, which causes an increase in cost. In addition, since the electronic component is mounted on the heat sink after being molded, a highly accurate mold is required so that the insulating resin does not adhere to the mounting surface in contact with the heat sink.

また、絶縁性樹脂がプリント基板に密着していると、電子部品のリードをプリント基板のリード挿入穴に挿通して裏面にハンダ付けする際に、発生するガスがリード挿通穴とリードの隙間を通過することができず、プリント基板の電子部品側に抜けず、ハンダに穴あきが発生し信頼性が損なわれるという問題がある。   Also, if the insulating resin is in close contact with the printed circuit board, when the lead of the electronic component is inserted into the lead insertion hole of the printed circuit board and soldered to the back surface, the generated gas will clear the gap between the lead insertion hole and the lead. There is a problem that it cannot pass through, does not come out to the electronic component side of the printed circuit board, and a hole is formed in the solder, thereby impairing reliability.

また、チューブ状のスペーサを装着する構造、また絶縁紙等を用いる構造では、プリント基板とスペーサまたは絶縁紙に隙間ができ、隙間をふさぐ効果が低下することが考えられる。   In addition, in a structure in which a tube-shaped spacer is mounted or a structure using insulating paper or the like, a gap is formed between the printed circuit board and the spacer or insulating paper, and the effect of closing the gap may be reduced.

さらに、コーティング処理をする方法は、塗布管理が難しく、塗りむらなどが発生するおそれがある。また、コーティング処理をした部品を空冷ファン近傍に配置する場合は、風速が速いため吸い込まれた空気とともに細かい粒子あるいは水分等の影響が強く、コーティング膜が禿げてしまい、効果がなくなるという問題がある。   Furthermore, the coating method is difficult to apply and may cause uneven coating. In addition, when the parts subjected to the coating treatment are arranged in the vicinity of the air cooling fan, there is a problem that the effect of fine particles or moisture is strong together with the sucked air because the wind speed is high, and the coating film is boiled and the effect is lost. .

この発明は、上記背景技術の問題点に鑑みてなされたものであり、金型の構造が簡易であり、金型コストを抑えることができ、確実に絶縁性を有しリードの短絡を防止することができる電子部品の取付構造とその取付方法を提供することを目的とする。   The present invention has been made in view of the above-mentioned problems of the background art. The mold structure is simple, the mold cost can be suppressed, and it is surely insulative and prevents shorting of leads. It is an object of the present invention to provide an electronic component mounting structure and a mounting method thereof.

本発明は、矩形のケースで覆われ前記ケースからリードが外側に突出した電子部品と、前記電子部品の前記ケースの一側面に取り付けられた放熱板と、前記放熱板を成形用金型の一部として成形されたモールド部であって、前記放熱板に取り付けられ前記放熱板の前記電子部品が取り付けられた側面に、前記リードの一部を覆う絶縁性樹脂で成形されたモールド部とを備え、前記モールド部から突出した前記電子部品の前記リードがプリント基板に接続されるとともに、前記モールド部が前記プリント基板に当接して成る電子部品の取付構造である。   The present invention relates to an electronic component covered with a rectangular case and having a lead protruding outward from the case, a heat sink attached to one side of the case of the electronic component, and the heat sink as a molding die. A mold part molded as a part, the mold part being attached to the heat sink and having a mold part formed of an insulating resin covering a part of the lead on a side surface of the heat sink to which the electronic component is attached The electronic component mounting structure is configured such that the lead of the electronic component protruding from the mold portion is connected to a printed circuit board, and the mold portion is in contact with the printed circuit board.

前記電子部品の前記リードは前記モールド部の底面から外側に突出し、前記電子部品の前記リードは前記プリント基板の前記リード挿入穴に挿通されて反対側に突出しハンダ付けされ、前記モールド部の前記底面は前記プリント基板に当接し、前記モールド部の前記底面には、前記リード部が突出する部分を通過する溝部が設けられ、前記溝部は、前記モールド部の、前記放熱板及び前記プリント基板と接しないいずれかの側面に連通して、外気に開口されているものである。   The lead of the electronic component protrudes outward from the bottom surface of the mold part, the lead of the electronic component is inserted into the lead insertion hole of the printed circuit board and protrudes to the opposite side and soldered, and the bottom surface of the mold part Is in contact with the printed circuit board, and the bottom surface of the mold part is provided with a groove part through which the lead part protrudes, and the groove part is in contact with the heat sink and the printed circuit board of the mold part. It communicates with either side and is open to the outside air.

前記放熱板の、前記電子部品と当接する側面には、前記金型を前記放熱板に取り付けたときに前記金型の前記絶縁性樹脂が充填される空間部に連通する貫通穴が設けられ、前記絶縁性樹脂が前記貫通穴にも充填されて成るものである。   A side surface of the heat radiating plate that comes into contact with the electronic component is provided with a through hole that communicates with a space filled with the insulating resin of the mold when the mold is attached to the heat radiating plate. The insulating resin is also filled in the through hole.

また本発明は、矩形のケースで覆われ前記ケースからリードが外側に突出する電子部品を放熱板の一方の側面に固定し、前記放熱板の側面に、前記リードの一部を覆うとともに前記電子部品の少なくとも一部を覆う金型を密閉して取り付け、前記金型に絶縁性樹脂を注入してモールド部を成形し、この後前記放熱板と前記モールド部が取り付けられた前記電子部品のリードをプリント基板に接続する電子部品の取付方法
である。 According to the present invention, an electronic component covered with a rectangular case and having a lead projecting outward from the case is fixed to one side surface of the heat radiating plate, and a part of the lead is covered on the side surface of the heat radiating plate. A mold that covers at least a part of the component is sealed and attached, an insulating resin is injected into the mold to mold a mold part, and then the lead of the electronic component to which the heat sink and the mold part are attached This is a method for attaching an electronic component to connect the circuit board to the printed circuit board.

本発明の電子部品の取付構造とその取付方法は、金型の構造が簡易であり、金型コストを抑えることができ、確実に絶縁性を有しリード間の短絡を防止することができる。また、リードを確実にプリント基板にハンダ付けすることができるものである。   The electronic component mounting structure and the mounting method according to the present invention have a simple mold structure, can reduce the cost of the mold, can reliably have insulation, and can prevent a short circuit between leads. Further, the lead can be surely soldered to the printed circuit board.

この発明の一実施形態の電子部品の取付構造の正面図（ａ）と右側面図（ｂ）である。It is the front view (a) and right view (b) of the attachment structure of the electronic component of one Embodiment of this invention. この実施形態の電子部品の取付構造の部分拡大正面図である。It is a partial expanded front view of the attachment structure of the electronic component of this embodiment. この実施形態の電子部品の取付構造を示す右側面図である。It is a right view which shows the attachment structure of the electronic component of this embodiment.

以下、この発明の実施形態について図面に基づいて説明する。図１〜図３はこの発明の一実施形態を示すもので、この実施形態の電子部品の取付構造１０は、矩形のケース１２で覆われた電子部品１４を有し、ケース１２の底面１２ａには、複数本のリード１６が底面１２ａに対してほぼ直角に突出して設けられている。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 3 show an embodiment of the present invention. An electronic component mounting structure 10 according to this embodiment includes an electronic component 14 covered with a rectangular case 12, and is provided on a bottom surface 12 a of the case 12. A plurality of leads 16 are provided so as to protrude substantially perpendicular to the bottom surface 12a.

電子部品１４の、ケース１２の底面１２ａと交差する側面１２ｂには、金属板で作られた放熱板１８が、ネジ２０で固定されている。放熱板１８は、放熱性の良い材料が使用され、例えば熱伝導性の良いアルミニウム等で作られている。放熱板１８の、電子部品１４と当接する側面１８ａには、後述する金型３６を放熱板１８に取り付けたときに、金型３６の空間部３７に連通する位置に貫通穴２２が設けられている。貫通穴２２は、放熱板１８の側面１８ａとその反対側の側面１８ｂを貫通している。   A heat radiating plate 18 made of a metal plate is fixed to the side surface 12 b of the electronic component 14 that intersects the bottom surface 12 a of the case 12 with screws 20. The heat radiating plate 18 is made of a material with good heat dissipation, and is made of, for example, aluminum with good heat conductivity. A through hole 22 is provided on a side surface 18 a of the heat radiating plate 18 that is in contact with the electronic component 14 at a position that communicates with the space 37 of the mold 36 when a mold 36 described later is attached to the heat radiating plate 18. Yes. The through hole 22 passes through the side surface 18a of the heat radiating plate 18 and the side surface 18b on the opposite side.

放熱板１８の、電子部品１４が取り付けられた側面１８ａには、矩形のモールド部２８が設けられている。モールド部２８は絶縁性樹脂で作られた矩形のブロック体であり、ポリアミド、ポリエステル等の熱可塑性樹脂で成形されている。モールド部２８は、電子部品１４のリード１６側の端部付近からリードの一部を覆って取り付けられ、モールド部２８の上面２８ａから電子部品１４のケース１２の一部が突出し、モールド部２８の上面２８ａと反対側の底面２８ｂからは、リード１６が下方に突出している。底面２８ｂには、リード１６が突出する部分を通過する溝部３０が設けられている。溝部３０は、モールド部２８の、放熱板１８と接していないいずれかの側面に連通して、外気に開口されている。モールド部２８の、放熱板１８と接する側面２８ｃには放熱板１８の貫通穴２２が対向し、絶縁性樹脂が貫通穴２２に連続して充填されて放熱板１８の側面１８ｂに達し、側面１８ｂに沿ってわずかに広がり、フランジ部３２が形成されている。   A rectangular mold portion 28 is provided on a side surface 18a of the heat radiating plate 18 to which the electronic component 14 is attached. The mold part 28 is a rectangular block body made of an insulating resin, and is molded of a thermoplastic resin such as polyamide or polyester. The mold part 28 is attached so as to cover a part of the lead from the vicinity of the end of the electronic component 14 on the lead 16 side, and a part of the case 12 of the electronic part 14 protrudes from the upper surface 28 a of the mold part 28. The lead 16 protrudes downward from the bottom surface 28b opposite to the top surface 28a. The bottom surface 28b is provided with a groove 30 that passes through a portion where the lead 16 protrudes. The groove portion 30 communicates with any side surface of the mold portion 28 that is not in contact with the heat radiating plate 18 and is opened to the outside air. The through hole 22 of the heat sink 18 is opposed to the side surface 28c of the mold portion 28 that contacts the heat sink 18 and the insulating resin is continuously filled in the through hole 22 to reach the side surface 18b of the heat sink 18 and the side surface 18b. And a flange portion 32 is formed.

電子部品１４と放熱板１８、モールド部２８は、互いに取り付けられた状態でプリント基板２４に取り付けられている。プリント基板２４の所定位置には、電子部品１４のリード１６が挿通されるリード挿入穴２６が形成されている。放熱板１８の、電子部品１４のリード１６に近い端面１８ｃがプリント基板２４に当接し、電子部品１４のリード１６は、プリント基板２４のリード挿入穴２６に挿通されてプリント基板２４の反対側に突出し、ハンダ３４で接続されている。   The electronic component 14, the heat dissipation plate 18, and the mold part 28 are attached to the printed circuit board 24 in a state of being attached to each other. A lead insertion hole 26 through which the lead 16 of the electronic component 14 is inserted is formed at a predetermined position of the printed circuit board 24. An end face 18 c of the heat sink 18 near the lead 16 of the electronic component 14 abuts on the printed circuit board 24, and the lead 16 of the electronic component 14 is inserted into the lead insertion hole 26 of the printed circuit board 24 and on the opposite side of the printed circuit board 24. It protrudes and is connected by solder 34.

次に、電子部品の組み立て及び取付方法について、図３に基づいて説明する。まず、電子部品１４を放熱板１８の側面１８ａに当接し、ネジ２０で固定する。この後、放熱板１８の側面１８ａに、モールド部２８を成形する金型３６を取り付ける。   Next, a method for assembling and attaching the electronic component will be described with reference to FIG. First, the electronic component 14 is brought into contact with the side surface 18 a of the heat radiating plate 18 and fixed with screws 20. Thereafter, a mold 36 for forming the mold portion 28 is attached to the side surface 18 a of the heat radiating plate 18.

ここで、金型３６について説明する。金型３６は、熱伝導性が良く放熱性の良いアルミニウム製であり、放熱板１８の側面１８ａを水平方向にコの字形に囲む３つの側面３６ａと、上方部を覆う上面３６ｂと、下方部を覆う底面３６ｃで形成されている。３つの側面３６ａと、上面３６ｂ、底面３６ｃで囲まれた内側は、絶縁性樹脂が充填されてモールド部２８を成形する空間部３７となる。また、側面１８ａに対面する部分は開口されている。金型３６の上面３６ｂには、電子部品１４のケース１２が嵌合される凹部３８が、側面１８ａに当接する開口に連通して形成されている。金型３６の底面３６ｃには、電子部品１４のリード１６が挿通される挿通口４０が形成されている。底面３６ｃの、上面３６ｂに対向する面、つまり空間部３７の内周面には、挿通口４０を含む位置に突部４２が一体に形成されている。突部４２は、モールド部２８の凹部３８のネガ形状であり、金型３６の底面３６ｃを、他のいずれかの側面間を横断するように形成される。ここでは、開口部と反対側に位置する側面３６ａに達している。   Here, the mold 36 will be described. The mold 36 is made of aluminum having good heat conductivity and good heat dissipation, and includes three side surfaces 36a that horizontally surround the side surface 18a of the heat radiating plate 18 in a U shape, an upper surface 36b that covers the upper portion, and a lower portion. It is formed with the bottom face 36c which covers. The inner side surrounded by the three side surfaces 36a, the upper surface 36b, and the bottom surface 36c becomes a space portion 37 that is filled with an insulating resin and molds the mold portion 28. Moreover, the part facing the side surface 18a is opened. A recess 38 into which the case 12 of the electronic component 14 is fitted is formed on the upper surface 36b of the mold 36 so as to communicate with the opening that contacts the side surface 18a. An insertion port 40 through which the lead 16 of the electronic component 14 is inserted is formed in the bottom surface 36 c of the mold 36. On the surface of the bottom surface 36 c facing the top surface 36 b, that is, on the inner peripheral surface of the space portion 37, a protrusion 42 is integrally formed at a position including the insertion port 40. The protrusion 42 is a negative shape of the recess 38 of the mold portion 28 and is formed so as to cross the bottom surface 36c of the mold 36 between any other side surfaces. Here, it has reached the side surface 36a located on the opposite side to the opening.

次に、モールド部２８を成型する際、金型３６を、他方の金型に兼用した放熱板１８の側面１８ａに当接させる。金型３６の上面３６ｂの凹部３８には電子部品１４のケース１２を嵌合させ、底面３６ｃの挿通口４０には電子部品１４のリード１６を差し込む。底面３６ｃの、上面３６ｂに対向する面が、放熱板１８の端面１８ｃとほぼ面一で且つ隙間がないようにセットする。この状態で、放熱板１８の貫通穴２２は、金型３６の空間部３７に連通する。   Next, when the mold part 28 is molded, the mold 36 is brought into contact with the side surface 18a of the heat radiating plate 18 also used as the other mold. The case 12 of the electronic component 14 is fitted into the recess 38 of the upper surface 36b of the mold 36, and the lead 16 of the electronic component 14 is inserted into the insertion port 40 of the bottom surface 36c. The bottom surface 36c is set so that the surface facing the top surface 36b is substantially flush with the end surface 18c of the heat radiating plate 18 and there is no gap. In this state, the through hole 22 of the heat radiating plate 18 communicates with the space 37 of the mold 36.

そして、放熱板１８の貫通穴２２に、側面１８ｂ側から加熱溶融した絶縁性樹脂を圧入し、空間部３７に充填し、冷却し成形する。加熱溶融した絶縁性樹脂を圧入する方法は、低圧の射出成型等である。次に、所定温度まで冷却して空間部３７の内側にモールド部２８が成形された後、金型３６を外す。電子部品１４と放熱板１８、モールド部２８は、互いに取り付けられた状態で、プリント基板２４のリード挿入穴２６に電子部品１４のリード１６を挿通し、プリント基板２４の反対側から突出したリード１６をハンダ３４で固定する。このとき、ハンダ３４の熱で発生するガスはリード挿入穴２６とリード１６の隙間を通過して反対側面に抜けて溝部３０から逃がすことができる。これにより、ハンダに穴あきが発生するのを防止することができる。   Then, the insulating resin heated and melted from the side surface 18b side is press-fitted into the through hole 22 of the heat radiating plate 18, filled in the space 37, cooled and molded. A method of press-fitting the heat-insulated insulating resin is low-pressure injection molding or the like. Next, after cooling to a predetermined temperature and forming the mold part 28 inside the space part 37, the mold 36 is removed. The electronic component 14, the heat sink 18, and the mold portion 28 are attached to each other, and the lead 16 of the electronic component 14 is inserted into the lead insertion hole 26 of the printed circuit board 24 and protrudes from the opposite side of the printed circuit board 24. Is fixed with solder 34. At this time, the gas generated by the heat of the solder 34 can pass through the gap between the lead insertion hole 26 and the lead 16, escape to the opposite side surface, and escape from the groove 30. Thereby, it is possible to prevent the solder from being perforated.

この実施形態の電子部品の取付構造１０によれば、放熱板１８を金型の一方に兼用しているので、１部材の金型３６で絶縁性が高いモールド部２８を成形することができ、金型コストを抑え、確実にリード１６の短絡を防止することができる。モールド部２８の底面２８ｂには、溝部３０が設けられているため、ハンダ３４の熱で発生するガスが、リード挿入穴２６とリード１６の隙間を通過して溝部３０から逃がすことができ、ハンダの穴あきを防止し、信頼性を高めることができる。そして、隣接するリード１６間は、モールド部２８の底面２８ｂがプリント基板２４に当接して電子部品１４を実装するため、確実にリード１６間の短絡を防ぐことができる。   According to the electronic component mounting structure 10 of this embodiment, since the heat radiating plate 18 is also used as one of the molds, the mold part 28 having a high insulating property can be formed with the one-piece mold 36. The die cost can be reduced, and the short circuit of the lead 16 can be surely prevented. Since the groove portion 30 is provided on the bottom surface 28 b of the mold portion 28, the gas generated by the heat of the solder 34 can pass through the gap between the lead insertion hole 26 and the lead 16 and escape from the groove portion 30. Can prevent perforation and improve reliability. And between the adjacent leads 16, since the bottom face 28b of the mold part 28 contacts the printed circuit board 24 and the electronic component 14 is mounted, a short circuit between the leads 16 can be surely prevented.

さらに、電子部品１４を放熱板１８に取り付けた後に、モールド部２８を形成するため、電子部品１４のケース１２の、放熱板１８に取り付ける側面１２ｂに絶縁性樹脂が付着しないような管理が不要となり、作業工程が容易となり、金型の精度が高くなくてもよい。モールド部２８は、放熱板１８の貫通穴２２とフランジ部３２に絶縁性樹脂が連続して一体となり、放熱板１８に確実に取り付けられ、外れることがない。   Further, since the mold portion 28 is formed after the electronic component 14 is attached to the heat sink 18, it is not necessary to manage such that the insulating resin does not adhere to the side surface 12 b of the case 12 of the electronic component 14 attached to the heat sink 18. The work process becomes easy and the accuracy of the mold does not have to be high. In the mold part 28, the insulating resin is continuously integrated with the through hole 22 and the flange part 32 of the heat radiating plate 18, and is securely attached to the heat radiating plate 18, and does not come off.

なお、この発明の電子部品の取付構造とその取付方法は、上記実施の形態に限定されるものではなく、放熱板に貫通穴を設けず、金型側から樹脂を注入しても良い。さらに、使用する金型は、複数に分かれているものでも良い。また、モールド部等の形状や素材等適宜変更可能である。溝部の断面形状は半円形以外のいろいろな形状でもよく、溝部が通過する方向も確実に外気に開口されていればよい。絶縁性樹脂が注入される貫通穴の形状や位置も自由に変更可能であり、切り欠き状のものでもよい。   In addition, the electronic component mounting structure and the mounting method thereof according to the present invention are not limited to the above embodiment, and the resin may be injected from the mold side without providing a through hole in the heat sink. Further, the mold used may be divided into a plurality of molds. Further, the shape and material of the mold part and the like can be appropriately changed. The cross-sectional shape of the groove portion may be various shapes other than the semicircular shape, and it is only necessary that the direction in which the groove portion passes is reliably opened to the outside air. The shape and position of the through hole into which the insulating resin is injected can be freely changed, and may be a notch.

１０ 電子部品の取付構造
１２ ケース
１４ 電子部品
１６ リード
１８ 放熱板
２０ ネジ
２２ 貫通穴
２４ プリント基板
２６ リード挿入穴
２８ モールド部
３０ 溝部
３２ フランジ部
３４ ハンダ
３６ 金型
３７ 空間部
３８ 凹部
４０ 挿通口
４２ 突部
DESCRIPTION OF SYMBOLS 10 Electronic component mounting structure 12 Case 14 Electronic component 16 Lead 18 Heat sink 20 Screw 22 Through hole 24 Printed circuit board 26 Lead insertion hole 28 Mold part 30 Groove part 32 Flange part 34 Solder 36 Mold 37 Space part 38 Recess 40 Insertion hole 42 Protrusion

Claims (4)

矩形のケースで覆われ前記ケースからリードが外側に突出した電子部品と、前記電子部品の前記ケースの一側面に取り付けられた放熱板と、前記放熱板を成形用金型の一部として成形されたモールド部であって、前記放熱板に取り付けられ前記放熱板の前記電子部品が取り付けられた側面に前記リードの一部を覆う絶縁性樹脂で成形されたモールド部とを備え、前記モールド部から突出した前記電子部品の前記リードがプリント基板に接続されるとともに、前記モールド部が前記プリント基板に当接して成ることを特徴とする電子部品の取付構造。   An electronic component covered with a rectangular case and having a lead projecting outward from the case, a heat sink attached to one side of the case of the electronic component, and the heat sink formed as a part of a molding die A mold part that is attached to the heat dissipation plate and is formed of an insulating resin that covers a part of the lead on a side surface of the heat dissipation plate on which the electronic component is attached, and from the mold part A mounting structure for an electronic component, wherein the lead of the protruding electronic component is connected to a printed circuit board, and the mold portion is in contact with the printed circuit board. 前記電子部品の前記リードは前記モールド部の底面から外側に突出し、前記電子部品の前記リードは前記プリント基板の前記リード挿入穴に挿通されて反対側に突出しハンダ付けされ、前記モールド部の前記底面は前記プリント基板に当接し、前記モールド部の前記底面には、前記リード部が突出する部分を通過する溝部が設けられ、前記溝部は、前記モールド部の、前記放熱板及び前記プリント基板と接しないいずれかの側面に連通して、外気に開口されている請求項１記載の電子部品の取付構造。   The lead of the electronic component protrudes outward from the bottom surface of the mold part, the lead of the electronic component is inserted into the lead insertion hole of the printed circuit board and protrudes to the opposite side and soldered, and the bottom surface of the mold part Is in contact with the printed circuit board, and the bottom surface of the mold part is provided with a groove part through which the lead part protrudes, and the groove part is in contact with the heat sink and the printed circuit board of the mold part. The electronic component mounting structure according to claim 1, wherein the electronic component mounting structure is open to the outside air in communication with any one of the side surfaces. 前記放熱板の、前記電子部品と当接する側面には、前記金型を前記放熱板に取り付けたときに前記金型の前記絶縁性樹脂が充填される空間部に連通する貫通穴が設けられ、前記絶縁性樹脂が前記貫通穴にも充填されて成る請求項１記載の電子部品の取付構造。   A side surface of the heat radiating plate that comes into contact with the electronic component is provided with a through hole that communicates with a space filled with the insulating resin of the mold when the mold is attached to the heat radiating plate. The electronic component mounting structure according to claim 1, wherein the insulating resin is also filled in the through hole. 矩形のケースで覆われ前記ケースからリードが外側に突出する電子部品を放熱板の一方の側面に固定し、前記放熱板の側面に、前記リードの一部を覆うとともに前記電子部品の少なくとも一部を覆う金型を密閉して取り付け、前記金型に絶縁性樹脂を注入してモールド部を成形し、この後前記放熱板と前記モールド部が取り付けられた前記電子部品のリードを、プリント基板に接続することを特徴とする電子部品の取付構造の取付方法。
An electronic component covered with a rectangular case and having a lead projecting outward from the case is fixed to one side surface of the heat radiating plate, and the side surface of the heat radiating plate covers a part of the lead and at least a part of the electronic component. A mold that covers the mold is sealed and attached, an insulating resin is injected into the mold to mold a mold part, and then the lead of the electronic component to which the heat sink and the mold part are attached is attached to a printed circuit board. A mounting method for an electronic component mounting structure, characterized by connecting.
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JP2011199018A (en) * 2010-03-19 2011-10-06 Yaskawa Electric Corp Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component
JP2013115408A (en) * 2011-12-01 2013-06-10 Mitsubishi Electric Corp Electronic component, electronic device, electronic apparatus, and manufacturing method of electronic device
JP2016134492A (en) * 2015-01-19 2016-07-25 新電元工業株式会社 Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting method
JP2018133525A (en) * 2017-02-17 2018-08-23 太陽誘電株式会社 Cover and module using the same

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JPH11307900A (en) * 1998-04-20 1999-11-05 Fujitsu Denso Ltd Structure for supporting 3-terminal transistor on printed wiring board
JP2007220963A (en) * 2006-02-17 2007-08-30 Cosel Co Ltd Short circuit prevention spacer of electronic component
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011199018A (en) * 2010-03-19 2011-10-06 Yaskawa Electric Corp Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component
JP2013115408A (en) * 2011-12-01 2013-06-10 Mitsubishi Electric Corp Electronic component, electronic device, electronic apparatus, and manufacturing method of electronic device
JP2016134492A (en) * 2015-01-19 2016-07-25 新電元工業株式会社 Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting method
JP2018133525A (en) * 2017-02-17 2018-08-23 太陽誘電株式会社 Cover and module using the same
US10504664B2 (en) 2017-02-17 2019-12-10 Taiyo Yuden Co., Ltd. Cover and module using the same

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