JP2010199431A - Electronic module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that, although an electronic module uses a pin with small electric resistance as a component for electrically connecting a substrate to the outside and uses resin having the pin insert-molded therein since large currents flow in a power circuit such as a power supply circuit and a motor drive circuit, and other circuits, large initial investment and cost are required to manufacture the electronic module. <P>SOLUTION: The electronic module can be manufactured with small initial investment and at a low cost by forming notches 2 at the inner wall of a module case 1 in which a substrate having an electronic component already mounted thereon can be stored, and arranging a fixing member for fixing an electrode terminal so that both ends thereof meet the notches. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic module in which a substrate on which an electronic component is mounted is installed in a frame, and electrode terminals for electrically connecting the substrate and an external circuit are arranged in the frame.

  A large current flows in an electronic circuit board on which a power circuit such as a power supply circuit and a motor drive circuit and other electronic components are mounted. For this reason, a pin header having a small electric resistance is used because a large current flows also to electrode terminals that electrically connect the electronic circuit board and the external circuit. As shown in FIG. 7, the pin header includes a straight type pin header, an L type pin header, a staggered type pin header, and the like, and a standoff (supporting member for preventing the pin header from falling down) on a fixing member for fixing the pin header. ) Is also available. By using these pin headers depending on the application, the electronic circuit board and the external circuit are electrically connected. However, in these pin headers, as shown in FIG. 8, the area occupied by the pin header on the substrate becomes large, and there is a problem with respect to costs such as miniaturization needs and member costs for the electronic module. In order to solve this problem, there is an electronic module that uses a resin in which pins are insert-molded, as disclosed in Japanese Patent Application Laid-Open No. 2000-340718. As shown in FIG. 9, the pins are integrally formed in the resin case, and one of the openings at both ends of the resin case is closed with an electronic circuit board on which electronic components are mounted. The substrates are electrically connected by bondin wires. Thereby, when the pins are mounted on the substrate, the area occupied by the pins on the substrate can be reduced. Therefore, the substrate can be made small, and the electronic module can be miniaturized.

Japanese Patent Laid-Open No. 2000-340718

  However, the insert mold resin is configured to insert pins into the module case as disclosed in the prior art, and in order to insert the pins into the module case when manufacturing, costs such as processing costs and labor of the work process are required. There was a problem that took.

  In order to solve the above problem, the present invention forms a notch part in the inner wall of a module case that can accommodate a substrate on which an electronic component is mounted, and arranges both ends of the pin header on the notch part. Thus, it is possible to reduce the size of the electronic module, and to reduce the cost such as processing costs and labor of the work process.

  In order to achieve the above object, the present invention includes a frame body that houses an electronic circuit board on which an electronic component is mounted, and a pin header that includes a conductive electrode terminal and a fixing member that holds the electrode terminal. Features.

  Such an inner wall facing the frame (module case) is formed with a concave notch at opposing positions on the inner wall, and disposed at the notch at both ends of the fixing member. By forming the installation part and arranging the installation part in accordance with the notch part, the electronic module can be reduced in size, and it is not necessary to insert a pin header into the module case, and can be manufactured at low cost.

It is a module case figure in this invention. It is a figure of the pin header and fixing member in the present invention. It is a figure which arrange | positions the printed circuit board in Example 1 in this invention to a case. It is a layout view of the pin header in the first embodiment of the present invention. It is a figure which arrange | positions the metal base board | substrate in Example 2 in this invention to a case. It is a layout view of the pin header in the second embodiment of the present invention. It is the figure which showed the kind of pin header. It is the figure which showed the problem at the time of connecting the pin header in the past. It is a conventional insert mold resin case figure.

  The present invention creates a partially notched portion on the inner wall of a module case that can accommodate a substrate on which an electronic component is mounted, and installs an installation portion provided on a fixing member on the notched portion, thereby inserting a mold. Reduced costs such as processing costs when manufacturing resin and labor of the work process, and realized a small module at low cost.

  Hereinafter, the structure of the electronic module according to the embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view, a cross-sectional view, and a top view of a module case 1 that fixes a substrate on which a SMD (electronic component that can be surface-mounted) or the like is mounted. The module case 1 includes an inner wall portion 8 formed in the opening, and a concave cutout portion 2 in a part of the inner wall portion 8, and is made of resin or metal. FIG. 2 is a structural diagram of a pin header fixed to the module case 1. The electrode terminal 3 is for connecting the electronic circuit board and an external device. The fixing member 4 is a member for fixing the electrode terminal 3. The fixing member 4 is provided with an installation part 5 for installation on the frame, and the installation part 5 is arranged in alignment with the notch part 2 of the module case 1. As shown in FIG. 2, the pin header is electrically connected to the substrate in a state where the electrode terminal 3 is fixed to the fixing member 4. In addition, you may provide a convex part so that the electrode terminal 3 may not come off from the fixing member 4, and this invention is not limited to this method. Further, the length of the fixing member 4 in the longitudinal direction may be the same as that between the cutout portions 2 of the module case.

(First Embodiment) The case where a printed circuit board on which SMD is mounted is fixed to a cylindrical module case 1 having openings on the top and bottom surfaces will be described with reference to FIGS. FIG. 3 is a diagram in which a printed circuit board on which SMD is mounted is installed in the module case 1. The base portion 6 in FIG. 3 is for fixing the printed circuit board to the module case 1. FIG. 4 is a diagram illustrating a procedure for installing a straight type pin header in the module case 1 after the printed circuit board is installed in the module case, and a cross-sectional view after the installation. First, as shown in FIG. 3, the four corners of the printed circuit board on which SMD is mounted are placed on the base portion 6 of the module case 1. The base portion 6 and the four corners of the printed circuit board are screwed to fix the printed circuit board to the module case 1. Next, as shown in FIG. 4, the fixing member 4 is installed such that the installation parts 5 at both ends in the longitudinal direction of the fixing member 4 shown in FIG. 2 are on the notch part 2 of the module case 1. Thereby, the fixing member 4 can be fixed to the module case 1, and the pin header can be connected to the electronic circuit board. A state in which the installation portion 5 is arranged on the notch portion 2 is as shown in a cross-sectional view of FIG. 4, and the electrode terminal 3 is inserted into the printed board. Therefore, since the electrode terminal 3 penetrates to the back of the printed board, the electrode terminal 3 and the printed board can be soldered from the back of the printed board. With this pin header, the printed circuit board can be electrically connected to an external device.

(Second Embodiment) A case where a metal base substrate on which an SMD, a bare chip or the like is mounted is fixed to a container-like module case 1 having a bottom surface will be described with reference to FIGS. FIG. 5 is a view in which a metal base substrate in which a circuit is formed on a metal plate on which an SMD, a bare chip or the like is mounted with an insulating layer interposed therebetween is installed in the module case 1. FIG. 6 is a top view and a cross-sectional view after the metal base substrate is installed in the module case 1. Regarding the fixing procedure, first, as shown in FIG. 5, in order to dissipate the heat of the metal base substrate, a heat dissipating sheet is placed on the bottom 7 inside the module case 1 made of aluminum or the like having good heat dissipating, A metal base substrate on which SMD, bare chips, etc. are mounted is placed. Next, as shown in the top view of FIG. 6, the pin header is installed so that the installation part 5 shown in FIG. 2 is on the notch part 2 of the module case 1. When the installation portion 5 is arranged on the cutout portion 2, the L-shaped electrode terminal 3 fixed to the fixing member 4 is electrically connected to the metal base substrate as shown in the cross-sectional view of FIG. The With this pin header, the metal base substrate can be electrically connected to an external device.

  Conventionally, a staggered type pin header as shown in FIG. 7 is electrically connected to a metal base substrate into which a straight type pin header cannot be inserted. In the present invention, by using the fixing member 4, even a straight type pin header can be electrically connected to the substrate. Thereby, compared with the staggered type pin header, the straight type pin header in the present invention can reduce the board occupied area, and the electronic module can be downsized.

  In addition, although the present Example demonstrated the Example which installs a printed circuit board and a metal base board in the module case 1, this invention is not limited to this, You may install another board | substrate. Similarly, the module case 1 is not limited to the resin or metal of the embodiment, but may be made of other materials. Further, when the electronic circuit board is installed, the center of the inner wall portion 8 of the module case 1 may be recessed as shown in FIG.

  The present invention is not limited to these embodiments. For example, the installation portion 5 may be manufactured separately from the fixing member 4 and bonded to both ends of the fixing member 4, or the fixing member as shown in FIG. The electrode terminal 3 fixed to both ends of the electrode 4 may be extracted and the fixing member 4 may be used as the installation portion 5. Further, an adhesive or the like may be used when the installation portion 5 is disposed in the cutout portion 2.

DESCRIPTION OF SYMBOLS 1 Module case 2 Notch part 3 Electrode terminal 4 Fixing member 5 Installation part 6 Base part 7 Bottom part 8 Inner wall part

Claims (2)

A frame that houses an electronic circuit board on which electronic components are mounted;
An electronic module comprising a conductive electrode terminal and a pin header made of a fixing member that holds the electrode terminal,
An inner wall facing the frame body, forming a concave notch at an opposing position on the inner wall;
Forming an installation portion for disposing the cutout at both ends of the fixing member;
The electronic module is characterized in that the installation part is arranged in alignment with the notch part. The electronic module according to claim 1, wherein the electronic circuit board on which the electronic component is mounted is a metal base board.

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