JP2007134572A - Power module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simply and inexpensively constitute a whole power module by downsizing an insulating metallic substrate and reducing the number of inter-substrate connection terminals in the power module. <P>SOLUTION: The power module is provided with: the insulating metallic substrate 50 wherein a main circuit wiring pattern 52 is formed on a metallic substrate via an insulation layer, and a power control semiconductor element 53 is mounted on the main circuit wiring pattern; an integrated circuit substrate 60 wherein a control element 63 for controlling the power control semiconductor element is mounted on a control circuit wiring pattern 62 formed on the insulation layer; and a case 70 with the upper and bottom faces open and fixed by embedding to connect the main circuit wiring pattern to the control circuit wiring pattern. The insulating metallic substrate and the integrated circuit substrate are arranged in a case by vertical superimposition with a space interval concerning the power module 1. The insulating metallic substrate 50 includes external connection terminals 76 for connecting the main circuit wiring pattern formed on the insulating metallic substrate to external circuits. The external connection terminals are fixed by embedding in the case 70. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a power module, and more particularly to a power module that can be applied to a compressor drive of a room air conditioner.

  FIG. 11 is a cross-sectional view of a power module incorporating a conventional integrated circuit board. The integrated circuit board 60 built in the power module has a wiring pattern 62 formed on the organic material substrate 61 and a control element 63 arranged on the wiring pattern 62. Then, signal connection pins are provided between the wiring pattern 62 formed on the organic material substrate 61 and the main circuit wiring pattern 52 formed on the insulating metal substrate 50 and between the wiring pattern 62 and the connector 54 connected to an external circuit. Connected at 64 and mounted on the insulating metal substrate 50.

  As a method for connecting the integrated circuit board 60 and the external circuit device, the wiring patterns formed on the integrated circuit board 60 and the insulating metal board 50 are connected, and the connector 54 and the connector housing 92 mounted on the insulating metal board 50 are connected. Connect to an external circuit device. Further, the main circuit wiring pattern 52 formed on the insulating metal substrate 50 is connected to an external circuit device via a faston terminal 75 formed integrally with the resin case material 71.

  FIG. 12 is a cross-sectional view of a conventional power module incorporating an integrated circuit board. As shown in FIG. 12, the insulating metal substrate 50 and the integrated circuit substrate 60 are arranged vertically using the connection terminal integrated case 70. Thereby, it can be set as the structure which does not require the space for mounting the integrated circuit board 60 on the insulated metal board | substrate 50. FIG. That is, it is shown that the dead space of both the insulating metal substrate 50 and the integrated circuit substrate 60 can be minimized, and the entire module can be reduced in size (see Patent Document 1).

FIG. 13 is a cross-sectional view of a conventional hybrid integrated circuit device 10. A lead wiring 30 extending from the external circuit device shown in FIG. 13 is connected to a lead terminal 14 formed on the metal substrate 11 shown in FIG. At this time, the first terminal portion 14A of the lead terminal 14 is connected to the lead wiring 30, and the second terminal portion 14B is connected to the printed circuit board 20. This indicates that the number of lead terminals for connection between the upper and lower substrates can be reduced, and the overall size of the hybrid integrated circuit device system can be reduced (see Patent Document 2).
JP 2004-63604 A JP-A-7-22577

  In the conventional power module shown in FIG. 11, the integrated circuit board 60 is mounted in the same process as other circuit elements on the insulating metal substrate 50, and is collectively soldered by an automatic soldering apparatus or the like. In this case, in consideration of the soldering appearance inspection for ensuring the reliability of the solder connection, the circuit element cannot be arranged on the insulating metal substrate 50 in the region overlapping with the integrated circuit substrate 60.

  Further, from the integrated circuit board 60, a connector component arranged as a part of the main circuit wiring pattern 52 is mounted on the insulating metal board 50 for connection to an external circuit device. As a result, the expensive insulating metal substrate 50 is unnecessarily used at least for the projected area of the integrated circuit substrate 60, and it is difficult to consolidate and reduce the size of the insulating metal substrate.

  In the conventional power module shown in FIG. 12, the insulating metal substrate 50 does not need a useless area, and the insulating metal substrate 50 and the integrated circuit substrate 60 can be arranged vertically with the same size, so that the size can be reduced. . However, since the external circuit board 95 is mounted, an external circuit board connection terminal or connector cannot be mounted on the integrated circuit board 60. For this reason, it is necessary to provide all of the external circuit connection terminals 72 and 73 in the connection terminal integrated case 70, and the number of terminals to be integrally formed cannot be reduced.

  In the hybrid integrated circuit device shown in FIGS. 13 and 14, the insulating metal substrate 11 on which the power circuit element is mounted can be disposed on the lower surface region of the wired circuit board 20. For this reason, size reduction of a power module can be achieved. However, the case material 15, the signal lead terminal 13, and the power lead terminal 14 are independent, and it is difficult to be independent when mounting the lead terminals 13, 14 on the insulating metal substrate 11. Further, the printed circuit board 20 is fixed and held only by soldering to the lead terminals, and has a disadvantageous structure against the load and stress when the external circuit connecting connector or the like is arranged on the printed circuit board 20. .

  The present invention has been made in view of these problems, and a power module that can reduce the number of inter-substrate connection terminals in a miniaturized power module of an insulating metal substrate, and can configure the entire apparatus easily and inexpensively. Is to provide.

  In order to solve the above problems, the present invention employs the following means.

  A main circuit wiring pattern is formed on a metal plate via an insulating layer, and an electric power control semiconductor element is mounted on the main circuit wiring pattern, and the power control is performed on the control circuit wiring pattern formed on the insulating substrate. An integrated circuit board on which a control element for controlling a semiconductor element is mounted, and a case in which a top surface and a bottom surface are released and a connection terminal for connecting the main circuit wiring pattern and the control circuit wiring pattern is embedded and fixed, A power module in which the integrated circuit board and an insulating metal substrate are arranged one above the other with a space therebetween, wherein the insulating metal substrate is an external connection for connecting a main circuit wiring pattern formed on the insulating metal substrate to an external circuit. The external connection terminal is embedded and fixed in the case.

  Since this invention is provided with the above structure, the power module which can comprise the whole apparatus easily and cheaply can be provided.

  Hereinafter, the best embodiment will be described with reference to the accompanying drawings. FIG. 1 is a diagram (structure sectional view) for explaining a first embodiment of the present invention. As shown in FIG. 1, the insulating metal substrate 50 includes a main circuit wiring pattern 52 disposed on a metal base 51 via an insulating layer, and a power control semiconductor element 53 mounted on the main circuit wiring pattern 52. The integrated circuit board 60 includes a control circuit wiring pattern 62 disposed on the organic material substrate 61, a control element 63 disposed on the control circuit wiring pattern 62, and a signal connection terminal 65 to an external circuit device.

  The insulated metal substrate 50 includes an external connection terminal 76 for connecting the main circuit wiring pattern 52 formed on the insulated metal substrate to an external circuit. The external connection terminal 76 is embedded in a resin case 71 to constitute a connection terminal integrated case 70. To do. Note that the connection terminal integrated case 70 has an open upper surface and a bottom surface, and is embedded and fixed with a connection terminal 74 that connects the main circuit wiring pattern and the control circuit wiring pattern. Further, the integrated circuit substrate 60 and the insulating metal substrate 50 are arranged in the connection terminal integrated case 70 so as to be vertically stacked with a space therebetween.

  For mounting and fixing the power control semiconductor element 53 on the insulating metal substrate 50 and the control element 63 on the organic material substrate 61 and connecting each substrate to the connection terminal, solder or a conductive adhesive can be used. The organic material substrate 61 constituting the integrated circuit substrate 60 can be a multilayer substrate using a glass epoxy base material, a composite base material or the like in order to improve the degree of integration. In the example shown in the figure, the control circuit wiring pattern 62 is arranged on both surfaces of the multilayer substrate and the control element 63 is mounted and fixed. However, depending on the circuit scale to be mounted, the control circuit wiring pattern 62 is arranged only on one surface. An inexpensive organic material substrate on which the control element 63 is mounted and fixed only on one side, such as a paper phenol substrate, can be used.

  Further, unlike the case where the conventional substrate 60 is directly mounted on the insulating metal substrate 50, the integrated circuit substrate 60 is positioned and fixed so as to overlap with the insulating metal substrate 50 via the connection terminal integrated case 70. Can be connected. For this reason, the expensive insulated metal substrate 50 can be made to have the same or smaller dimensions as the integrated circuit substrate 60 without being affected by the area of the integrated circuit substrate 60. For this reason, the entire power module including the case 70 can be reduced in size and the parts cost can be reduced.

  FIG. 2 is a view for explaining an example of bonding between the external connection terminal 76 and the integrated circuit board 60. As shown in the figure, the external connection terminal 76 is a Faston type terminal, and has a terminal 76a connected to a connector housing 91 connected to an external lead wire and a branch portion 76b connected to the control circuit wiring pattern. Further, the terminal 76a and the branching portion 76b are fixed to the organic material substrate 61 via solder 81 or the like. Thereby, the integrated circuit board 60 can be firmly fixed to the case 70.

  3 to 7 are diagrams for explaining the second embodiment, and FIG. 3 is a diagram for explaining the details of the external connection terminal 76. The conventional external connection terminal shown in FIG. 14 can integrally form a connection portion 14A to the external circuit and a connection portion 14B to the wired circuit board in the power module. However, since they are not on the same plane, when they are formed from a metal plate, at least three bent shapes are required, which complicates the process. On the other hand, in the example shown in FIG. 3, the connection part 76a to the external circuit and the connection part (branch part) 76b to the integrated circuit board in the power module are on the same plane, and the bending shape is to the insulating metal substrate 50. There is only one place of the connecting portion 76c. For this reason, a processing process can be simplified.

  FIG. 4 is an external view of the terminal integrated case 70. In this figure, neither the insulating metal substrate 50 nor the integrated circuit substrate 60 is mounted. As shown in the figure, the external connection terminals 76 embedded in the case 70 and integrated with the terminals 74 (connecting the main circuit wiring pattern 52 on the insulating metal substrate 50 and the control circuit wiring pattern 62 on the integrated circuit substrate 60). Each terminal) has the same shape, and the necessary number of terminals are arranged in a straight line at equal intervals. Thereby, the manufacturing cost of case 70 can be reduced. Note that the shape, arrangement, and interval may be changed by giving priority to the insulation distance and wiring position of the main circuit wiring pattern on the insulating metal substrate.

  FIG. 5 is a diagram illustrating an example in which the insulating metal substrate 50 and the integrated circuit substrate 60 are mounted on the terminal integrated case 70. As shown in FIG. 5, for example, a Faston type terminal 66 is provided on the integrated circuit board 60, and the terminal 74 is connected to the terminal 74 (terminal for connecting the main circuit wiring pattern 52 and the control circuit wiring pattern 62 on the integrated circuit board 60). To do. Thus, the connector 54 shown in FIG. 11 can be omitted. Moreover, the shape of the terminal integrated molding case 70 can be simplified. Furthermore, the module can be designed giving priority to the insulation distance and wiring position of the main circuit wiring pattern 52 on the insulating metal substrate 50.

  6 is a perspective view of a module in which the insulating metal substrate 50 and the integrated circuit board 60 are mounted on the terminal integrated case 70 shown in FIG. 5, and FIG. 7 is an exploded perspective view of the module.

  In manufacturing the module, first, the power control semiconductor element 53 is mounted on the insulating metal substrate 50, and the insulating metal substrate 50 mounted with the power control semiconductor element 53 is attached to the terminal integrated molding case 70. Next, the main circuit wiring pattern and the terminals embedded in the case are connected.

  Further, a control element 63 and a connection terminal 65 (or a Faston terminal 66) to an external circuit are mounted on an organic material substrate 61 constituting the integrated circuit substrate 60, and are electrically joined to the control circuit wiring pattern. Next, external connection terminals 76 and terminals 74 (terminals connecting the main circuit wiring pattern 52 and the control circuit wiring pattern 62 on the integrated circuit board 60) embedded in the case 70 are formed on the integrated circuit board 60. By engaging with the hole or the fitting groove, the electrical connection between the control circuit wiring pattern and the external connection terminal 76 and the terminal 74 is completed.

  FIG. 8 is a diagram for explaining the third embodiment. As shown in the figure, the power control semiconductor element 53 on the insulating metal substrate 50 and the control element 63 on the integrated circuit substrate 60 are sealed with a sealing material 80 such as silicon. Thereby, it is possible to compensate for the shortage of the space insulation distance between the power control semiconductor element and the lead wire of the control element or the pattern electrode accompanying the downsizing of the power module. Accordingly, whether or not the sealing material 80 is applied may be determined according to the operating voltage / current level. Further, when the sealing material 80 is applied, the entire space inside the power module may be filled. However, it can also be applied only to locations where sufficient space insulation distances such as pattern electrode spacing and component lead spacing cannot be secured.

  In the example of FIG. 8, the control elements 63 that require the sealing material 80 are concentrated on a surface in the same direction as the power control semiconductor elements 53 on the insulating metal substrate 50 and mounted on the integrated circuit board 60. . As the sealing material 80, an epoxy resin, a silicon resin or the like excellent in insulating performance can be used.

  9 and 10 are diagrams for explaining the fourth embodiment. As shown in FIG. 9, a screwing hole 71 a for fixing the radiation fin is formed in a part of the connection terminal integrated case 70. As the insulating metal substrate, aluminum having good thermal conductivity is used as a base material in order to dissipate heat generated by the power control semiconductor element disposed on the substrate. Moreover, as shown in FIG. 14, in order to further improve the heat dissipation performance, heat dissipation fins as separate parts are attached. In this case, as shown in FIG. 14, the screw holes formed in the connection terminal integrated case 70 are formed by bringing the flat surface portion of the radiation fin 85 into close contact with the insulating metal substrate 50 arranged at the bottom of the connection terminal integrated case 70 of the power module. The heat radiating fins 85 are fixed using 71a.

  As described above, according to the embodiment of the present invention, the integrated circuit substrate on which the control element is mounted is provided separately from the insulating metal substrate, and is further stacked on top and bottom with a space therebetween. The size of the insulating metal substrate can be reduced. In addition, an external connection terminal for connecting the main circuit wiring pattern formed on the insulating metal substrate to the external circuit and a connection terminal for connecting the main circuit wiring pattern and the control circuit wiring pattern are respectively embedded and fixed in the connection terminal integrated case. Furthermore, the external connection terminal includes a branch portion connected to the control circuit wiring pattern. For this reason, the number of inter-substrate connection terminals in the power module can be reduced, and the cost of the entire module can be reduced.

It is a figure explaining 1st Embodiment. It is a figure explaining the example of joining of an external connection terminal and an integrated circuit board. It is a figure explaining the detail of the external connection terminal in 1st Embodiment. 3 is an external view of a terminal integrated case 70. FIG. It is a figure explaining the example which attached the insulated metal substrate and the integrated circuit board to the terminal integrated case. FIG. 6 is a perspective view of a module in which an insulating metal substrate and an integrated circuit substrate are mounted on the terminal integrated case shown in FIG. 5. It is a disassembled perspective view of a module. It is a figure explaining 3rd Embodiment. It is a figure explaining 4th Embodiment. It is a figure explaining 4th Embodiment. It is sectional drawing of the conventional power module incorporating an integrated circuit board. It is sectional drawing of the conventional power module incorporating an integrated circuit board. It is sectional drawing of the conventional hybrid integrated circuit device. It is a figure which shows the conventional lead terminal.

Explanation of symbols

1 Power Module 50 Insulating Metal Board 51 Metal Base 52 Main Circuit Wiring Pattern 53 Power Control Semiconductor Element 54 Connector 60 Integrated Circuit Board 61 Organic Material Board 62 Control Circuit Wiring Pattern 63 Control Element 64 Signal Connection Pin 70 Connection Terminal Integrated Case 71 Resin Case material 71a Screw hole 72 Connection terminal between main circuit pattern and external circuit device 73 Connection terminal between control circuit pattern and external circuit device 74 Connection terminal between main circuit pattern and external circuit device 75 Faston type connection terminal 80 Sealing material 85 Heat dissipation Fin 86 Radiation fin fixing screw 91 Connector housing

Claims (7)

Forming a main circuit wiring pattern on the metal plate via an insulating layer, and an insulating metal substrate having a power control semiconductor element mounted on the main circuit wiring pattern;
An integrated circuit board on which a control element for controlling the power control semiconductor element is mounted on a control circuit wiring pattern formed on an insulating substrate;
The case is provided with a case in which a top surface and a bottom surface are opened and a connection terminal for connecting the main circuit wiring pattern and the control circuit wiring pattern is embedded and fixed, and the integrated circuit substrate and the insulating metal substrate are vertically separated with a space in the case. A power module placed on top of
The power module, wherein the insulating metal substrate includes an external connection terminal for connecting a main circuit wiring pattern formed on the insulating metal substrate to an external circuit, and the external connection terminal is embedded and fixed in the case. The power module according to claim 1,
The power module according to claim 1, wherein the external connection terminal is a Faston type terminal. The power module according to claim 1,
The power module according to claim 1, wherein the external connection terminal includes a branch portion connected to the control circuit wiring pattern. The power module according to claim 1,
The power module according to claim 1, wherein the external connection terminals are linearly arranged on the case. The power module according to claim 1,
A power module, wherein the power control semiconductor element and the control element are filled with resin. The power module according to claim 3, wherein
A power module, wherein the control circuit wiring pattern and the external connection terminals and the branch portions of the external connection terminals are solder-connected. The power module according to claim 1,
The power module, wherein the external connection terminal is connected to a compressor drive circuit of a room air conditioner.

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