JP5446302B2 - Heat sink and module - Google Patents

Description

  The present invention relates to a heat sink and a module used for a power supply circuit and a power circuit of an extremely thin consumer device such as a plasma television and a liquid crystal television, and a method for manufacturing the module.

  In recent years, consumer electronic devices such as plasma televisions and liquid crystal televisions have been desired to be reduced in size, thickness, and power consumption.

  An example of a heat sink used for such applications and a module using the heat sink will be described with reference to FIG. FIG. 26 is a perspective view showing an example of a module using a conventional heat sink.

  In FIG. 26, a heat generating component 2 such as a power semiconductor is fixed to a heat radiating plate 4 made of a metal plate or the like with screws 1 or the like. The lead wire 3 extending from the heat generating component 2 is fixed to the circuit board 6 or the like with solder or the like.

  In FIG. 26, a signal or the like sent from the circuit board 6 is transmitted to the heat generating component 2 through the lead wire 3. The heat generated from the heat generating component 2 is cooled by the metal heat sink 4 or the like. As such a heat generating component 2, for example, a semiconductor package called TO-247 or a full-pack semiconductor chip is known.

  However, in the conventional heat dissipation method, heat is only released from the main body of the heat generating component 2, and the heat dissipation is limited. Therefore, it has been required to radiate heat from the lead wire 3 of the heat radiating component 2.

FIG. 27 is a cross-sectional view illustrating a state in which the heat sink 4 is attached to the lead wire 3 of the heat generating component 2. In FIG. 27, a heat radiating plate 4 is attached to the lead wire 3 provided on the heat generating component 2, and the heat generating component 2 is cooled by the heat radiating plate 4. 7 is a hole. The heat sink 4 may be a metal plate or an insulating material such as ceramic. For example, Patent Document 1 is known as such a case.
Japanese Utility Model Publication No. 3-61386

  However, in the conventional module shown in FIGS. 26 and 27, there is a limit to the reduction in mounting height, and in order to dissipate heat in a state where a plurality of lead wires 3 are adjacent to each other, It was necessary to use an expensive member having insulating properties.

Therefore, in order to solve the above problems, the present invention comprises a metal plate having one or more flat portions and one or more step portions, and a thermosetting resin and an inorganic filler provided on the metal plate. and a sheet-like heat transfer layer containing the heat transfer layer is provided on the plane portion adjacent to the step portion, and a portion of the heat transfer layer covers also the step portion, provided in said flat portion Further, the heat transfer layer is a heat radiating plate in which a plurality of grooves are formed substantially parallel to each other .

According to the present invention as described above, the power semiconductor with the lead terminals of such full pack can heat dissipation through the Rutotomoni leads can be implemented in high density and high heat dissipation at low profile, plasma TVs In addition, various electric products such as liquid crystal televisions and EL televisions can be further reduced in thickness, height and power consumption.

  Note that the drawings shown in the embodiments of the present invention are schematic views and do not show the positional relationship correctly in terms of dimensions.

(Embodiment 1)
Hereinafter, Embodiment 1 of the present invention will be specifically described with reference to FIGS.

  FIGS. 1A to 1C are perspective views for explaining a state of attachment of the heat-generating component to the circuit board in the first embodiment. In FIG. 1, 11 is a heat generating component, 12 is a lead wire, 13 is a circuit board, 14 is a hole, 15 is an arrow, and 16 is a dotted line.

  The heat generating component 11 is a component that generates heat, such as a power semiconductor (including power EFT), LED, semiconductor laser, thin transformer, thin choke, and the like, and a lead wire 12 for external connection is formed in a part thereof. ing. As described above, the heat-generating component 11 with the lead wire 12 is inexpensive, but the lead wire 12 is a subject of the low-profile mounting, so that the low-profile mounting is difficult. The holes 14 formed in the circuit board 13 in FIGS. 1A to 1C are for inserting the lead wires 12 and the heat generating components 11. By inserting a part of the lead wire 12 and the heat generating component 11 into the hole 14, it is possible to reduce the thickness and to achieve high-density mounting. By providing a gap (for example, a gap between the circuit board 13 and the heat generating component 11) in the embedded portion, there is an effect of absorbing a dimensional error during assembly.

  As shown by an arrow 15 in FIG. 1A, the heat generating component 11 and the lead wire 12 are inserted into the hole 14 provided in the circuit board 13.

  In the present invention, the heat generating component 11 has a lead wire 12 in a part thereof. The heat generating component 11 having such a lead wire 12 is difficult to radiate heat during thin mounting (or low profile mounting) or thin mounting. However, thin mounting and high heat dissipation are possible by using the heat sink 18 of the present invention.

  In addition, when thinly mounted, when thinly mounted at high density, it becomes difficult to flow air for air cooling. In such a case, the heat generating component 11 can be cooled by using the heat transfer layer 17 or the heat radiating plate 18 of the present invention.

  A dotted line 16 in FIG. 1B indicates the heat generating component 11 and the lead wire 12 inserted into the hole 14 provided in the circuit board 13. As shown in FIG. 1B, by inserting a part of the heat generating component 11 into the hole 14 formed in the circuit board 13, the circuit board 13 can be made thinner.

  FIG. 1C shows a state in which the heat-generating component 11 is thinly mounted using the holes 14 provided in the circuit board 13. A certain gap is provided between the hole 14 formed in the circuit board 13 and the heat generating component 11 inserted into the hole 14. By doing so, the mounting property of the heat generating component 11 can be improved, and further, the air permeability between the front and back of the circuit board 13 can be enhanced.

  Next, how a heat sink is attached to the heat generating component 11 will be described with reference to FIGS.

  FIGS. 2A and 2B are perspective views showing a state in which a heat radiating plate is attached to a heat generating component mounted on the circuit board 13. 2A and 2B, 17 is a heat transfer layer, 18 is a heat radiating plate, 19 is a screw, and 20 is a metal plate. The heat radiating plate 18 is formed of a metal plate 20 and a heat transfer layer 17.

  FIG. 2A is a perspective view illustrating a state in which the heat radiating plate 18 is fixed using the holes 14 provided in the circuit board 13. For example, as shown by an arrow 15, a screw 19 is inserted and fixed.

  FIG. 2B is a perspective view illustrating a state in which the heat radiating plate 18 is fixed to the heat generating component 11 mounted on the circuit board 13. 2A and 2B, the heat radiating plate 18 is fixed to the circuit board 13, but it is also useful to fix the heat radiating board 18 to a housing or chassis (both not shown) of the device. . The fixing method is not necessarily limited to the screw 19.

  Next, it demonstrates in detail using FIGS. 3-4.

  3A to 3C are cross-sectional views illustrating an example of a method for manufacturing the heat sink 18. 3A to 3C, reference numeral 21 denotes a processed portion, and 22 denotes a heat transfer material.

  FIG. 3A is a cross-sectional view of the metal plate 20. As the metal plate 20, an aluminum plate or a copper plate can be used. Moreover, you may use the housing | casing (for example, metal chassis, a part of housing | casing, etc.) of an apparatus.

  FIG. 3B is a cross-sectional view illustrating a state in which a step is provided in part of the metal plate 20 and an insulating layer is further provided. The processing part 21 is a part obtained by bending a part of the metal plate 20 in a step shape. As the heat transfer material 22, ceramic powder having high thermal conductivity such as alumina is dispersed in a high concentration (for example, 70 to 95 wt%) in a thermosetting resin such as epoxy resin.

  FIG. 3C is a cross-sectional view of the heat sink 18. As shown in FIG. 3C, the sheet-like heat transfer layer 17 covers the processed portion 21 provided in a part of the metal plate 20 and a part or more of the planar portion provided adjacent to the front and back thereof. ing.

  4A to 4C are cross-sectional views for explaining a state in which the heat radiating plate 18 is attached to the heat generating component 11.

  An arrow 15 in FIG. 4A shows a state in which the heat radiating plate 18 is attached to the heat generating component 11.

  FIG. 4B shows a state in which the heat generating component 11 to which the heat radiating plate 18 is attached is fixed to the circuit board 13.

  FIG. 4C shows a state in which the heat generating component 11 to which the heat radiating plate 18 is attached is inserted into the hole 14 provided in the circuit board 13. In addition, by providing a gap between the hole 14 provided in the circuit board 13 and the heat generating component 11, the workability of inserting the lead wire 12 can be improved.

  5A and 5B are cross-sectional views illustrating the shape of the sheet-like heat transfer layer 17 formed on the heat radiating plate 18. As shown in FIG. 5, the sheet-like heat transfer layer 17 may be provided on the metal plate 20 so as to cover, for example, flat portions provided on both sides (or top and bottom) of the processed portion 21. Thus, by providing the heat transfer layer 17 between the heat generating component 11 and the metal plate 20, and further between the lead wire 12 and the metal plate 20, the insulation can be further enhanced. When reinforced insulation is used, the thickness of the heat transfer layer 17 is set to 0.4 mm or more (0.6 mm or more considering variation). Further, by providing the heat transfer layer 17 on the processed portion 21 of the metal plate 20, the insulation at this portion can be maintained. In FIG. 5B, the circuit board 13 is provided with a hole 14 for inserting the heat generating component 11, but this hole 14 may be provided as necessary.

  FIG. 6 is a cross-sectional view for explaining the cooling mechanism of the heat generating component 11. In FIG. 6, 23 is a mold part and 24 is an element. For example, the element 24 is a semiconductor chip, and the mold part 23 is a resin molded body that protects the semiconductor chip.

  An arrow 15 in FIG. 6 indicates how heat generated in the element 24 spreads. As shown in FIG. 6, part of the heat generated in the element 24 is transmitted to the metal plate 20 via the mold part 23. Part of the heat generated in the element 24 is diffused through the lead wire 12 and is transmitted to the metal plate 20 through the heat transfer layer 17.

  As shown in FIG. 6, in the first embodiment, the heat generated in the heat generating component 11 is dissipated not only through the mold portion 23 but also through the lead wire 12, so that the heat dissipation effect is enhanced. Note that a part of the heat transfer layer 17 is also provided in the processed portion 21 provided in the metal plate 20, in order to take out the lead wire 12 extending from the heat generating component 11 without being bent from the mold portion 23. Thus, by removing the lead wire 12 from the mold portion 23 without being bent, the generation of stress on the element 24 is reduced. By providing the heat transfer layer 17 on the surface of the processed portion 21 of the metal plate 20, a short circuit between the lead wire 12 and the metal plate 20 is prevented.

  FIG. 7 is a perspective view illustrating a state in which the heat generating component 11 is fixed to the heat dissipation board 18. In FIG. 7, reference numeral 26 denotes a linear groove. For example, by providing the groove 26 in a pattern shape according to the application so that the lead wire 12 can be inserted into the heat transfer layer 17, heat dissipation from the side surface of the lead wire 12 can be enhanced.

  FIG. 8 is a perspective view for explaining a state in which the heat generating component 11 is fixed to the heat radiating plate 18 having the stepped processing portion 21. As shown in FIG. 8, a processed part 21 is provided in a part of the metal plate 20, and the side surface (or inclined surface or the like) of the processed part 21 is covered with a heat transfer layer 17. The heat transfer layer 17 can be brought close to the portion, and the heat dissipation property of the heat generating component 11 is improved.

  FIG. 9 is a perspective view of the heat generating component 11 attached to the heat radiating plate 18 and corresponds to, for example, FIG.

  FIGS. 10A and 10B are cross-sectional views illustrating a state in which the heat-generating component 11 is fixed to a heat radiating plate having a concave processed portion 21. 25 is a recess, and 27 is solder.

  In FIG. 10A, a recess 25 is provided in a part of the metal plate 20 constituting the heat radiating plate 18. And although the side surface of the recessed part 25 is made into the process part 21, the process shape does not need to be limited to this.

  In FIG. 10A, the heat transfer layer 17 is provided in a part of the recessed part 25 (although it becomes a convex part shape when viewed from the upper surface) or the processed part 21. The groove 26 provided in the heat transfer layer 17 is for inserting the lead wire 12. A plurality of lead wires 12 are inserted adjacent to each other and insulated by a bank (or a protruding portion) provided between the grooves 26.

  As shown by the arrow 15 in FIG. 10A, the heat generating component 11 is set on the heat radiating plate 18. If necessary, it is useful to use a high thermal conductive adhesive, a high thermal conductive grease, or the like.

  FIG. 10B shows a state in which the heat generating component 11 fixed to the heat radiating plate 18 is mounted on the circuit board 13. As shown in FIG. 10 (B), by inserting a part of the lead wire 12 into the groove 26 provided in the heat transfer layer 17, a heat radiation effect not only from the bottom surface from the lead wire 12 but also from the side surface can be obtained. can get. The groove 26 may also be filled with a high heat conductive adhesive, a high heat conductive grease, or the like (it is not necessary to be limited to an insulator, and a conductor paste or the like may be used depending on the application). Further, the circuit board 13 is provided with a hole 14 (for example, the hole 14 shown in FIG. 1 and FIG. 2 described above), and a part of the heat-generating component 11 is inserted, thereby further reducing the thickness of the mounting form.

  As described above, the metal plate 20 having one or more plane portions and a step portion including the one or more processed portions 21 (the step portion is generated by providing the metal plate 20 with the recess 25 or the like), A heat radiating plate 18 comprising a sheet-like heat transfer layer 17 including a thermosetting resin and an inorganic filler provided on the metal plate 20, and the heat transfer layer 17 is shown in FIG. 3 and FIG. As described above, the heat generating component 11 is formed by using the heat radiating plate 18 that is provided in the planar portion adjacent to the stepped portion formed of the processed portion 21 and that partially covers the stepped portion formed of the processed portion 21. Both low-profile mounting and high heat dissipation.

(Embodiment 2)
In the second embodiment, the case where the heat generating component 11 is inserted into the groove 26 provided in the metal plate 20 will be described with reference to FIGS.

  FIGS. 11A and 11B are cross-sectional views illustrating a state in which the heat-generating component 11 is set on the heat radiating plate 18 having the concave portions 25, the grooves 26, and the like. Reference numeral 28 denotes a sealing material.

  As shown by the arrow 15 in FIG. 11A, the heat generating component 11 is inserted into the groove 26 provided in the heat radiating plate 18. Thereafter, as shown in FIG. 11B, the heat dissipation and reliability of the heat generating component 11 can be improved by covering the heat generating component 11 and the lead wire 12 with a sealing material 28.

  12A and 12B are cross-sectional views illustrating a case where the thickness of the metal plate 20 of the recess 25 provided in the heat radiating plate 18 is partially reduced. As shown in FIGS. 12A and 12B, the thickness of the metal plate 20 is partially reduced, so that the mounting form can be further reduced in thickness.

  As shown in FIG. 12B, a part of the metal plate 20 can be further thinned by providing a hole 14 in the metal plate 20 with the heat generating component 11 inserted therein. Further, as shown in FIG. 12B, it is also useful to allow a part of the heat transfer layer 17 to ooze out (or ooze out) on the metal plate 20. By doing so, the contact area between the metal plate 20 and the heat transfer layer 17 increases, so that the effect of increasing the peel strength of the heat transfer layer 17 and increasing the creepage distance can be obtained. Note that a part of the heat transfer layer 17 may be actively protruded from the surface (particularly a flat portion) of the metal plate 20. In this case, the protrusion amount can be stabilized by providing a recess or a recess (not shown) in a part of the metal plate 20. In this case, for example, a part of the metal plate 20 serving as the protruding portion of the heat transfer layer 17 is recessed, and the heat transfer layer 17 is actively protruded from this portion (not shown).

  FIGS. 13A and 13B are perspective views illustrating the heat radiating plate 18 provided with grooves. FIG. 13A is an enlarged perspective view of the recess 25, and FIG. 13B is an overall perspective view of the heat sink 18. FIG. 13A corresponds to an enlarged view of the vicinity of the recess 25 in FIG. As shown in FIG. 13A, it is desirable to provide a groove 26 for insertion of the lead wire 12 or the like in a part of the heat transfer layer 17 formed on one side or more of the recess 25.

  FIGS. 14A and 14B are perspective views showing how the heat generating component 11 is inserted into the heat radiating plate 18. As shown by the arrow 15 in FIG. 14A, the heat generating component 11 is inserted into the recess 25 or the groove 26 (numbering is omitted). Thereafter, sealing is performed with a sealing material 28 or the like.

  FIG. 15 is a perspective view showing a state in which the heat generating component 11 embedded in the heat radiating plate 18 is mounted on the circuit board 13. As shown by the arrow 15 and the dotted line 16 in FIG. 15, the lead wire 12 is mounted using the hole 14 provided in the circuit board 13. Note that it is not necessary that all portions of the heat generating component 11 are embedded in the sealing material 28. A part of the heat generating component 11 may be exposed from the sealing material 28, and a part of the heat generating component 11 may be inserted into a hole (a hole is not shown) formed in the circuit board 13.

  As described above, a sheet-like heat transfer including the metal plate 20 having one or more plane portions and one or more recesses 25 and the thermosetting resin and the inorganic filler provided on the metal plate 20. The heat transfer layer 17 is provided on the flat portion adjacent to the recess 25, and a part of the heat transfer layer 17 also covers the side surface of the recess 25. By using the heat radiating plate 18, both the thin mounting of the heat generating component 11 mounted in the recess 25 and high heat dissipation can be achieved.

  As shown in FIGS. 7 and 8, it is useful to form a plurality of grooves 26 substantially parallel to each other in the heat transfer layer 17 provided on the planar portion of the metal plate 20. By providing a plurality of grooves 26 in a pattern, they are made independent from each other via wall portions that separate the grooves 26, thereby increasing the creepage distance between the lead wires 12 that are individually inserted into the grooves 26 one by one.

  It is useful that the grooves 26 are formed not only on the flat surface portion of the metal plate 20 but also on the side surface of the stepped portion made of the processed portion 21 so that the grooves 26 are substantially parallel to each other. The plurality of grooves 26 are made independent from each other at the wall portions separating the grooves 26, thereby increasing the creepage distance between the lead wires 12 inserted into the grooves 26 one by one.

(Embodiment 3)
In the third embodiment, a heat sink 18 in which a lead frame is attached to a part of the heat sink 18 will be described. Although the heat dissipation plate 18 described in the first and second embodiments does not have a lead frame, the heat dissipation substrate 18 described in the third embodiment includes a lead frame. Note that the heat dissipation substrate described in the third embodiment is a heat dissipation attachment for convenience, but may be referred to as the heat dissipation plate 18 as in the first and second embodiments. This is because both the heat radiating plate 18 described in the first and second embodiments and the heat radiating substrate 18 referred to as a heat radiating attachment in the third embodiment for the purpose of high heat dissipation when the heat generating component 11 is thinly mounted. .

  FIGS. 16A and 16B are cross-sectional views of the heat dissipating attachment. 16A and 16B, 29 is a heat dissipation attachment, and 30 is a lead frame. The heat dissipating attachment 29 is a kind of heat dissipating plate in which a lead frame 30 is incorporated in a part of the heat dissipating plate 18. The heat dissipating attachment 29 has effects such as a heat dissipating effect, an increase in strength of the terminal portion, and a reduction in wiring resistance due to the lead frame 30 incorporated in a part thereof.

  In FIG. 16A, a part of the lead frame 30 is bent substantially vertically by the processed portion 21. A part of the lead frame 30 is fixed to the heat transfer layer 17 (or may be embedded).

  As described above, the metal plate 20, the sheet-like heat transfer layer 17 including the thermosetting resin and the inorganic filler provided on the metal plate 20, and a part of the heat transfer layer 17 embedded in the heat transfer layer 17. A heat dissipating attachment 29 which is a kind of heat dissipating plate comprising a plurality of lead frames 30 projecting from the heat transfer layer 17, wherein the lead frames 30 are linearly parallel to each other, and the heat transfer layer By mounting the heat generating component 11 with the lead wire 12 on the surface of the metal plate 20 not provided with 17, low-profile mounting of the heat generating component 11 and high heat dissipation are realized.

  FIG. 16B is a cross-sectional view illustrating the heat dissipation mechanism of the heat-generating component 11 attached to the heat dissipation attachment 29. An arrow 15 in FIG. 16B indicates the direction of propagation of heat generated in the heat generating component 11. FIG. 16B shows that a part of the heat generated in the heat generating component 11 spreads directly to the metal plate 20. A part of the heat generated in the heat generating component 11 spreads through the lead wire 12 and is transmitted to the lead frame 30.

  As shown in FIG. 16B, both the lead wire 12 and the lead frame 30 are bent into an L shape and brought into close contact with each other, thereby enhancing the heat conduction effect from the lead wire 12 to the lead frame 30. Further, the reduction of the electrical resistance of the lead wire 12 has an effect of improving the mechanical strength of the lead wire 12.

  In addition, as shown by the dotted line 16 in FIG. 16 (A), a part of the heat transfer layer 17 protrudes (or covers the side surface portion) of the metal plate 20 or the lead frame 30 so that the insulating property is improved. The effect which raises is acquired.

  17A to 17C are cross-sectional views illustrating an example of a method for manufacturing the heat dissipation attachment 29.

  FIG. 17A shows a state in which the lead frame 30 is fixed to the end portion (or peripheral portion) of the metal plate 20 using the heat transfer material 22.

  FIG. 17B is a cross-sectional view of the heat dissipation attachment 29 in a state before the lead frame 30 is bent. If necessary, a part of the lead frame 30 of the heat dissipation attachment 29 may be bent as shown in FIG.

  In this way, the end portion and the peripheral portion of the metal plate 20 are used as the heat dissipating attachment 29 to facilitate the bending process of the lead frame 30.

  FIG. 17C is a cross-sectional view of the heat dissipation attachment 29 in which a part of the lead frame 30 is bent. As shown by the arrow 15b, a part of the lead frame 30 is bent substantially vertically, thereby improving the adhesion with the lead wire 12 which is a part of the heat generating component 11. When the lead frame 30 is fixed with the heat transfer material 22, it is desirable to use the end portion of the metal plate 20. By using the end portion, as shown in FIG. 17C, the workability of bending a part of the lead frame 30 is enhanced. Note that a dotted line 16 in FIG. 17C indicates the lead frame 30 before being bent. Note that the lead frame 30 and a part of the metal plate 20 may be bent or not bent depending on the application to be used.

  18A and 18B are cross-sectional views illustrating a case where a creepage distance is provided at the end of the lead frame 30, and a cross-sectional view illustrating a state in which the lead frame 30 is embedded in the heat transfer layer 17. FIGS.

  An arrow 15 a illustrated in FIG. 18A indicates a creepage distance between the metal plate 20 and the lead frame 30. The creepage distance is 4 mm or more, preferably 6 mm or more. Although the creeping distance portion is not shown in the processed portion 21 of the lead frame 30 shown in FIG. 18A, for example, a creeping distance indicated by an arrow 15b in FIG. 18B may be provided. The groove 26 in FIG. 18B is a portion where a part of the lead frame 30 embedded in the heat transfer layer 17 is peeled off. As shown in FIG. 18B, by embedding part of the lead frame 30 in the heat transfer layer 17, the contact area between the heat transfer layer 17 and the lead frame 30 is increased, and the heat dissipation effect and adhesion strength are increased. It is done.

  FIGS. 19A and 19B are perspective views of the heat dissipating attachment.

  A heat dissipation attachment 29 a shown in FIG. 19A is obtained by embedding a lead frame 30 that is partially bent vertically (or bent into an L shape) in the heat transfer layer 17 and fixed to the metal plate 20. .

  A heat dissipation attachment 29 b shown in FIG. 19B is created by embedding the lead frame 30 in the heat transfer layer 17 and then peeling a part of the lead frame 30 from the heat transfer layer 17. In order to peel off a part of the lead frame 30 embedded in the heat transfer layer 17, it is desirable to provide a gap between the side surface portion of the lead frame 30 and the heat transfer layer 17. By providing a gap in a part (particularly the side surface) of the lead frame 30 embedded in the heat transfer layer 17, the adhesion between the heat transfer layer 17 and the lead frame 30 can be lowered, and the lead frame 30 is peeled off. It becomes easy. As the lead frame 30, a commercially available metal member (for example, copper plate, tough pitch copper is relatively inexpensive and excellent in workability) may be used.

  FIGS. 20A and 20B are cross-sectional views illustrating an example of a method for manufacturing the heat dissipation attachment 29 having the processed portion 21 in a part of the metal plate 20.

  As shown in FIG. 20A, the metal plate 20 and the lead frame 30 are integrated using a heat transfer material 22.

  Thereafter, a part of the lead frame 30 is bent as shown by an arrow 15b in FIG.

  As described above, a sheet-like heat transfer layer 17 containing a thermosetting resin and an inorganic filler is used on the metal plate 20, and a plurality of lead frames are so protruded from the heat transfer layer 17. 30, a step of bending a part of the lead frame 30, and a state in which the lead wire 12 and the lead frame 30 of the heat generating component 11 with the lead wire 12 face each other (that is, the lead wire 12 Soldering (including lead-free soldering, welding, and brazing) in a state where one surface and one surface of the lead frame 30 are in close contact and fixed so as to be substantially parallel to each other, and the lead wire 12 And at least one of the lead frame 30 (including at least one of the lead wire 12 and the lead frame 30) on a circuit board 13 provided substantially parallel to the metal plate 20. (It is possible to increase the strength of the soldered portion by mounting so that one or more of the lead wire 12 and the lead frame 30 is inserted into the hole 14 provided in the circuit board 13). According to the method for manufacturing the module 31, the noise resistance characteristics of the module 31 can be improved by increasing the strength, reducing the height, and reducing the wiring resistance.

  FIGS. 21A and 21B are cross-sectional views showing a state in which the heat generating component 11 is attached to the heat dissipation attachment 29b.

  An arrow 15a in FIG. 21A shows a state in which the heat generating component 11 is attached to the heat dissipation attachment 29b.

  FIG. 21B is a cross-sectional view showing an example of the heat generating component 11 to which the heat dissipation attachment 29b is attached. As shown in FIG. 21B, the heat radiation effect is enhanced by attaching not only the mold part which is the main body part of the heat generating component 11 but also the lead wire 12 to the heat radiation attachment 29b. Both arrows 15 b indicate the creepage distance between the metal plate 20 and the lead frame 30.

  FIGS. 22A and 22B are cross-sectional views illustrating a state in which the heat generating component 11 to which the heat dissipation attachment 29 is attached is mounted on the circuit board 13. Reference numeral 31 denotes a module. The module 31 includes a heat dissipating attachment 29 that is one form of the heat dissipating plate, the heat generating component 11, and the circuit board 13.

  An arrow 15 in FIG. 22A is a cross-sectional view showing a state in which both the lead wire 12 and the lead frame 30 are inserted into the hole 14 provided in the circuit board 13.

  FIG. 22B is a cross-sectional view showing a state where at least one of the lead wire 12 and the lead frame 30 (including both of the lead wire 12 and the lead frame 30) is mounted on the circuit board 13 with the solder 27. is there. As shown in FIGS. 22A and 22B, the lead wire 12 and the lead frame 30 are mounted on the circuit board 13 in an integrated state (may be integrated by soldering each other). Thus, the mechanical strength of the lead wire 12 can be increased and the electrical resistance can be lowered.

  FIG. 23 is a cross-sectional view illustrating a case where the heat transfer layer 17 is provided on both sides of the processed portion 21. As shown in FIG. 23, by providing the heat transfer layer 17 between the metal plate 20 and the heat generating component 11 and also between the lead wire 12 and the metal plate 20, the insulation can be improved. Further, the insulating property is enhanced by providing the heat transfer layer 17 on the surface of the processed portion 21. In addition, what is necessary is just to increase / decrease the thickness of the heat-transfer layer 17 provided in each site | part according to a use. For example, the thickness of the portion of the heat transfer layer 17 in contact with the heat generating component 11 (particularly the mold portion 23) may be made thinner than the thickness of the portion of the heat transfer layer 17 in contact with the lead wire 12 (or the lead frame 30). This is because the insulating effect by the mold part 23 can be taken into consideration. The heat transfer layer 17 may be formed separately (for example, a plurality of portions or a plurality of layers) or may be formed at a time, but this may be used depending on the application. In addition, when performing insulation inspection (reinforced insulation, etc.) of the completed heat dissipation attachment 29 (not numbered in FIG. 23), the heat dissipation attachment 29 alone can be subjected to insulation inspection, and therefore mounted on this. The electrical characteristics and reliability of the heat generating component 11 are not affected. In addition, a high heat conductive adhesive may be used for attachment to the heat dissipation attachment 29. In addition, an adhesive having electrical insulation is used as a high thermal conductive adhesive used for mounting.

  Depending on the application, a high thermal conductive adhesive (electrically conductive) may be used to connect the attachment 29 or the like (or the adhesive between the heat generating component 11 and the metal plate 20 or the adhesive between the heat generating component 11 and the heat transfer layer 17). For example, a conductive paste to which a conductive material such as metal powder or graphite is added may be used. For example, by using a conductive paste such as silver paste or carbon paste for the connection between the heat generating component 11 and the heat transfer layer 17 shown in FIG. 23, the thermal conductivity between these members can be increased and the heat dissipation effect can be improved. A conductor paste (or a metal plate or the like) may be provided on the surface of the heat transfer layer 17 in advance (not shown). In this case, since the insulation inspection can be performed in advance between the conductor paste or the metal plate and the metal plate 20, even when the conductor paste is used later, the insulation can be improved.

  As described above, the metal plate 20, the sheet-like heat transfer layer 17 including the thermosetting resin and the inorganic filler provided on the metal plate 20, and a part of the heat transfer layer 17 embedded in the heat transfer layer 17. A plurality of lead frames 30 protruding from the heat transfer layer 17; a heat dissipating attachment 29 which is a kind of heat dissipating plate; a heat generating component 11 with lead wires 12 fixed to the metal plate 20; A module 31 comprising a circuit board 13 provided substantially in parallel with a heat dissipating attachment 29, which is a kind of heat dissipation attachment 29, wherein the lead frame 30 and the lead wire 12 are soldered to each other and bent substantially vertically. By using the module 31 connected to the circuit board 13, high heat dissipation, low resistance, and improved terminal strength in the lead wire 12 portion can be achieved.

  As shown in FIG. 16B, the lead frame 30 and the lead wire 12 are bent and soldered to each other (the solder 27 is not shown in FIG. 16B), and both are substantially vertical. By bending, the lead wire 12 can be increased in strength and resistance.

  As shown in FIGS. 22A and 22B, the circuit board 13 is provided with a hole 14, and the lead frame 30 and the lead wire 12 are inserted into the same hole 14 together. By using 31, it is possible to increase the heat dissipation, lower the resistance, improve the terminal strength, and the like of the module 31.

  FIG. 24 is a perspective view showing how the heat generating component 11 is fixed to the heat dissipation attachment 29. In the heat dissipation attachment 29 shown in FIG. 24, the grooves 26 are provided in a plurality of substantially parallel patterns. However, the grooves 26 facilitate alignment of the lead wires 12 and the lead frame 30 (note that the wiring pattern). Depending on the design of the wiring pattern, this may be a divergent pattern or a rake-like pattern.

  FIG. 25 is a cross-sectional view illustrating a heat dissipation mechanism of the heat generating component 11 fixed to the heat dissipation attachment 29. An arrow 15 shown in FIG. 25 indicates a direction in which heat generated in the element 24 is diffused. As shown in FIG. 25, a part of the heat generated in the element 24 spreads to the metal 20 through the mold part 23, so that the heat dissipation effect is enhanced. Part of the heat generated in the element 24 is transmitted to the lead wire 12 and spreads through the lead frame 30. It goes without saying that the heat dissipation effect can be further enhanced by fixing the metal plate 20 to a casing or chassis (both not shown) of the device.

As described above, the heat sink and module according to the present invention enable further efficiency and thinning of a power circuit (including a consumer power supply, a car power supply, a DCDC converter, etc.). Further, it becomes possible to make an EL TV or the like thinner or wall-mounted.

(A)-(C) are perspective views explaining the mode of attachment to the circuit board of the heat-emitting component in Embodiment 1 together. (A) (B) is a perspective view which shows a mode that a heat sink is attached to the heat-emitting component mounted in the circuit board together. (A)-(C) is sectional drawing explaining an example of the manufacturing method of a heat sink, all (A)-(C) is sectional drawing explaining a mode that a heat sink is attached to a heat-emitting component together. (A) (B) is sectional drawing explaining the shape of the sheet-like heat-transfer layer formed in the heat sink together Cross-sectional view explaining the cooling mechanism of heat-generating parts A perspective view explaining how heat-generating components are fixed to a heat dissipation board The perspective view explaining a mode that heat generating parts are fixed to the heat sink which has a stair-like processed part. The perspective view of the heat-emitting component attached to the heat sink 18 (A) (B) is sectional drawing explaining a mode that the heat-emitting component was fixed to the heat sink which has a concave processed part. (A) (B) is sectional drawing explaining a mode that a heat-emitting component is set to the heat sink which has a recessed part, a groove | channel, etc. both. (A) (B) is sectional drawing explaining the case where the thickness of the metal plate of the recessed part provided in the heat sink is reduced. (A) (B) is a perspective view explaining the heat sink which both provided the groove | channel. (A) (B) is a perspective view which shows a mode that a heat-emitting component is inserted in a heat sink, both. The perspective view which shows a mode that the heat-emitting component embedded in the heat sink 18 is mounted in a circuit board. (A) and (B) are cross-sectional views of the heat dissipation attachment. (A)-(C) are sectional drawings explaining an example of the manufacturing method of a heat dissipation attachment. (A) is sectional drawing explaining the case where a creeping distance is provided in the edge part of a lead frame, (B) is sectional drawing which shows a mode that the lead frame was embedded in the heat-transfer layer. (A) (B) is a perspective view of a heat dissipation attachment. (A) (B) is sectional drawing which shows an example of the manufacturing method of the heat dissipation attachment which has a process part in some metal plates. (A) (B) is sectional drawing which shows a mode that a heat-emitting component is attached to a heat dissipation attachment. (A) (B) is sectional drawing explaining a mode that the heat-emitting component with which the heat dissipation attachment was attached is mounted in a circuit board. Sectional drawing explaining the case where the heat-transfer layer is provided also on both sides of the processing part The perspective view which shows a mode that heat-emitting components are fixed to a heat dissipation attachment Sectional drawing explaining the heat dissipation mechanism of the heat generating component fixed to the heat dissipation attachment The perspective view which shows an example of the module using the conventional heat sink Sectional drawing explaining how a conventional heat sink is attached to the lead wire of a heat-generating component

DESCRIPTION OF SYMBOLS 11 Heat-generating component 12 Lead wire 13 Circuit board 14 Hole 15 Arrow 16 Dotted line 17 Heat-transfer layer 18 Heat sink 19 Screw 20 Metal plate 21 Processing part 22 Heat-transfer material 23 Mold part 24 Element 25 Concave part 26 Groove 27 Solder 28 Sealing material 29 , 29a, 29b Heat dissipation attachment 30 Lead frame 31 Module

Claims (4)

Provided with one or more flat portions, and one or more stepped portions, and a metal plate having, disposed on the metal plate, and a sheet-like heat transfer layer containing a thermosetting resin and an inorganic filler, the heat transfer The thermal layer is provided in the planar portion adjacent to the stepped portion, and a part of the heat transfer layer also covers the stepped portion , and a plurality of grooves are formed in the heat conductive layer provided in the planar portion. A heat sink formed substantially in parallel. A sheet-like heat transfer layer including a metal plate having one or more plane portions and one or more step portions, a thermosetting resin and an inorganic filler provided on the metal plate, and the heat transfer layer The heat transfer layer is provided on the planar portion adjacent to the stepped portion, and a part of the heat transfer layer also covers the stepped portion, and the heat transfer layer provided on the planar portion is provided. A heat sink in which a plurality of grooves are formed substantially parallel to each other in the thermal layer, and the lead frame is embedded in the plurality of grooves. A metal plate having one or more plane portions and one or more step portions, and a sheet-like heat transfer layer provided on the metal plate and including a thermosetting resin and an inorganic filler, The heat transfer layer is provided in the flat surface portion adjacent to the step portion, and a part of the heat transfer layer also covers the step portion, and the heat transfer layer provided in the flat portion includes a plurality of grooves. Are formed substantially parallel to each other, and an electronic component mounted on the surface of the metal plate having a lead wire portion and not provided with the heat transfer layer, and the lead wires in the plurality of grooves The module that was inserted. A metal plate having one or more plane portions and one or more step portions, and a sheet-like heat transfer layer provided on the metal plate and including a thermosetting resin and an inorganic filler, The heat transfer layer is provided in the flat surface portion adjacent to the step portion, and a part of the heat transfer layer also covers the step portion, and the heat transfer layer provided in the flat portion includes a plurality of grooves. Of the metal plate having a heat sink formed substantially parallel to each other, a plurality of lead frames partially embedded in the plurality of grooves, and a lead wire portion and not provided with the heat transfer layer And a module in which the lead wire portion and the lead frame are joined by solder.

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