WO2023162029A1

WO2023162029A1 - Drive device and air-conditioning device

Info

Publication number: WO2023162029A1
Application number: PCT/JP2022/007354
Authority: WO
Inventors: 貴彦小林; 圭一朗志津
Original assignee: 三菱電機株式会社
Priority date: 2022-02-22
Filing date: 2022-02-22
Publication date: 2023-08-31
Also published as: JPWO2023162029A1

Abstract

A drive device (1) comprises: a substrate (2) having a conductor portion; a power module (3) spaced apart from the substrate (2) in a first direction that is the plate thickness direction of the substrate (2); and a metal member (4) that is disposed opposite the substrate (2) with the power module (3) therebetween, and that has a heat-dissipating property. The power module (3) is in thermal contact with the metal member (4). The power module (3) includes a pin (31) that extends in a second direction intersecting with the first direction and then extends toward the substrate (2), and that is electrically connected to the conductor portion of the substrate (2). A heat-dissipating member (5) having a heat-dissipating property and an electric insulating property is disposed between the pin (31) and the metal member (4). The heat-dissipating member (5) is in contact with at least one of the pin (31), the conductor portion, and the metal member (4).

Description

Drives and air conditioners

The present disclosure relates to a driving device that includes a power module and an air conditioner that includes this driving device.

Conventionally, a power device is installed in the drive device that controls the drive of the motor. Heat is generated from the power device when it is driven. Therefore, the driving device needs means for dissipating the heat generated from the power device.

Patent Document 1 discloses a substrate having a metal foil attached to the surface thereof, a power module which is arranged apart from the substrate in the thickness direction of the substrate and in which a power device is sealed with resin, and a substrate with the power module sandwiched therebetween. A driving device is disclosed which includes a metal member disposed on the opposite side and has heat dissipation properties, and a power module attached to the metal member. The power module disclosed in Patent Document 1 has metal pins that extend toward the substrate and are electrically connected to the substrate. In the technique disclosed in Patent Document 1, the heat generated from the power module can be transferred to the metal member and radiated from the metal member.

JP 2013-16606 A

However, in the technique disclosed in Patent Document 1, since the pins of the power module and the metal member are arranged with a space therebetween, there is a possibility that electrical insulation between the pins of the power module and the metal member cannot be ensured. .

The present disclosure has been made in view of the above, and an object of the present disclosure is to obtain a drive device that can improve heat dissipation performance compared to the conventional one while ensuring electrical insulation between the pins of the power module and the metal member. and

In order to solve the above-described problems and achieve the object, the drive device according to the present disclosure includes a substrate having a conductor portion, and a power module arranged apart from the substrate in a first direction that is the plate thickness direction of the substrate. and a metal member having a heat dissipation property disposed on the side opposite to the substrate with the power module interposed therebetween. The power module is in thermal contact with the metal member. The power module has pins that extend in a second direction that intersects the first direction and then toward the substrate and are electrically connected to conductor portions of the substrate. A heat dissipating member having heat dissipating properties and electrical insulation is arranged between the pin and the metal member. The heat dissipating member is in contact with at least one of the pin, conductor and metal member.

The driving device according to the present disclosure has the effect of ensuring electrical insulation between the pins of the power module and the metal member, while improving the heat dissipation performance compared to the conventional one.

Schematic diagram showing a drive device, an external power supply, and a motor according to the first embodiment. FIG. 2 is a cross-sectional view showing the driving device according to the first embodiment; Sectional drawing which showed the drive device concerning Embodiment 2 Sectional view showing a driving device according to Modification 1 of Embodiment 2 Sectional view showing a drive device according to Modification 2 of Embodiment 2 Sectional drawing which showed the drive device concerning Embodiment 3 The perspective view which showed typically the outdoor unit of the air conditioning apparatus concerning Embodiment 4. Schematic diagram showing an air conditioner according to a fourth embodiment

A drive device and an air conditioner according to embodiments will be described in detail below with reference to the drawings.

Embodiment 1.
FIG. 1 is a schematic diagram showing a driving device 1, an external power source 60, and a motor 70 according to the first embodiment. As shown in FIG. 1 , the driving device 1 is electrically connected to an external power source 60 and a motor 70 via electric wires 80 . In the following description, a drive device 1 is a device that receives power from an external power source 60 and outputs power to a motor 70 . A drive circuit 10 is a portion of the drive device 1 that functions as a converter and an inverter.

FIG. 2 is a cross-sectional view showing the driving device 1 according to the first embodiment. The drive device 1 includes a substrate 2 , a power module 3 , a metal member 4 and a heat dissipation member 5 . Hereinafter, when describing the direction of each component of the drive device 1, the thickness direction of the substrate 2 is defined as the first direction, and the direction crossing the first direction is defined as the second direction. In the following description, the direction from the end face of the power module 3 in the second direction to the center of the power module 3 in the second direction is defined as the inner side, and the side opposite to the inner side is defined as the outer side.

The board 2 has a function of controlling the driving of the power module 3. The substrate 2 is a flat member having a conductor portion. The cross-sectional shape of the substrate 2 is a rectangle that is longer in the second direction than in the first direction. The conductor portion is a metal foil 20 attached to the surface of the substrate 2 and a through-hole conductor 21 formed in the substrate 2 . The metal foil 20 is partially attached to both end surfaces of the surface of the substrate 2 in the first direction. The material of the metal foil 20 is copper in this embodiment, but may be, for example, copper alloy, aluminum, aluminum alloy, nickel, or nickel alloy.

The through-hole conductor 21 is produced, for example, by forming a plating film on the inner wall surface of a through-hole penetrating through the substrate 2 in the first direction. Metal foil 20 and through-hole conductor 21 are electrically connected. Electronic components (not shown) are mounted on the substrate 2 . Electronic parts are, for example, noise filters, smoothing capacitors, sensors for detecting current and voltage, microcomputers, and peripheral circuits of microcomputers. Electronic components are soldered to metal foil 20 or through-hole conductors 21 .

The power module 3 is an electronic component in which a power device 35 is sealed with a resin 36. The power module 3 is arranged apart from the substrate 2 in the first direction. The power module 3 has at least one of a rectifying function of rectifying the voltage of the power supplied from the external power supply 60 and a converting function of converting the rectified power into power for driving the motor 70. . Electric power converted by the power module 3 is supplied to the motor 70 . The power module 3 is, for example, a discrete semiconductor element used in parallel, a power module in which a plurality of semiconductor elements are housed in one package, or a composite module in which a rectifying function and a conversion function are integrated and housed in one package. be. In this embodiment, the case where the power module 3 is a DIP (Dual Inline Package) type will be described as an example, but the type of the power module 3 is not limited.

The power module 3 is in thermal contact with the metal member 4. In this specification, “thermal contact” means that the power module 3 and the metal member 4 are in direct contact, and that the heat generated from the power module 3 is transferred between the power module 3 and the metal member 4. It means that the power module 3 and the metal member 4 are indirectly in contact with each other through a medium that is transmitted to the power module 3 . The power module 3 is in direct contact with the metal member 4 in this embodiment.

The power module 3 has a power module body 30 and two pins 31 . The power module body 30 includes a power device 35 and a resin 36 sealing the power device 35 . The power device 35 is an electronic component that controls the rectification function or conversion function of the power module 3 . Heat is generated from the power device 35 when the power device 35 is driven. Although not shown, the power device 35 is directly mounted on the pin 31 by soldering or the like, or electrically connected to the pin 31 via a conductive wire. The power module body 30 is in thermal contact with the metal member 4 . The power module body portion 30 is arranged on the metal member 4 . The cross-sectional shape of the power module body portion 30 is a rectangle that is longer in the second direction than in the first direction.

The pin 31 is a conductive metal member. The pins 31 are portions corresponding to terminals of the power module 3 . The pin 31 extends in the second direction from the power module body 30 and then extends toward the substrate 2 and is electrically connected to the conductor of the substrate 2 . One pin 31 is provided on each end surface of the power module main body 30 in the second direction. The pin 31 has a first straight portion 32 , a second straight portion 33 , and a curved portion 34 formed between the first straight portion 32 and the second straight portion 33 .

The first linear portion 32 extends linearly in the second direction from the end surface of the power module main body portion 30 in the second direction, and serves as a separation portion separated from the metal member 4 in the first direction. The first linear portion 32 is parallel to a mounting surface 40 of the metal member 4, which will be described later. The curved portion 34 extends in a curved shape so as to approach the substrate 2 as the distance from the tip of the first straight portion 32 increases. The second linear portion 33 linearly extends in the first direction from the tip of the curved portion 34 .

A second straight portion 33 of each pin 31 is electrically connected to the through-hole conductor 21 . A second straight portion 33 of each pin 31 is soldered to the through-hole conductor 21 . The power module 3 is fixed to the substrate 2 by soldering the second straight portion 33 of each pin 31 to the through-hole conductor 21 . The power module 3 electrically communicates with electronic components mounted on the substrate 2 via the through-hole conductors 21 and the metal foil 20, and the substrate shown in FIG. 2 via terminals and connectors (not shown). 2 and electrically exchange with a board different from that of 2. Electrical exchange is, for example, power supply, power reception, and electrical signal transmission.

The metal member 4 is arranged on the side opposite to the substrate 2 with the power module 3 interposed therebetween, and is a member having conductivity and heat dissipation. The metal member 4 plays a role of dissipating heat generated from the power module 3 to the outside of the driving device 1 . The metal member 4 is, for example, a sheet-metal housing that forms an outer shell of a device in which the heat sink and the driving device 1 are mounted. When the metal member 4 is a sheet metal housing, the heat is transferred to the entire sheet metal housing and the heat radiation area is increased. The metal member 4 is in thermal contact with the surface of the power module body 30 opposite to the surface facing the substrate 2 . The surface of the metal member 4 that faces the power module 3 serves as a planar installation surface 40 along the second direction. Metal member 4 is grounded.

Between each pin 31 and the metal member 4, one heat dissipating member 5 having heat dissipation and electrical insulation is arranged. Hereinafter, when distinguishing between the two heat dissipating members 5, the heat dissipating member 5 on the left side of the paper surface is referred to as the heat dissipating member 5a, and the heat dissipating member 5 on the right side of the paper surface is referred to as the heat dissipating member 5b. The heat dissipation member 5 has a role of dissipating heat generated from the power module 3 and a role of electrically insulating between the pin 31 and the metal member 4 . As the heat radiating member 5, a heat radiating sheet, gel, or the like having both heat radiating properties and electrical insulating properties is used.

The two heat radiating members 5 are separated from each other in the second direction with the power module 3 interposed therebetween. The heat dissipation member 5 is arranged outside the power module 3 . The heat dissipation member 5 shields between the pin 31 and the metal member 4 . Heat dissipation member 5 only needs to be in contact with at least one of pin 31 , metal foil 20 and metal member 4 . there is It is preferable that the heat radiation member 5 is in contact with the metal member 4 and at least one of the pin 31 and the metal foil 20 .

The heat radiating member 5 has a first heat radiating portion 50 and a second heat radiating portion 51 . Actually, the first heat radiating portion 50 and the second heat radiating portion 51 are integrally formed, but for convenience of explanation, FIG. Line L is shown. The first heat radiation portion 50 is a portion extending in the first direction from the installation surface 40 of the metal member 4 over the metal foil 20 of the substrate 2 . The first heat dissipation portion 50 is in contact with the second linear portion 33 , the metal foil 20 and the metal member 4 . The cross-sectional shape of the first heat radiation part 50 is a rectangle with no curved surface.

The second heat radiation portion 51 is a portion of the first heat radiation portion 50 that extends in the second direction toward the power module body portion 30 from the end face facing the power module body portion 30 . The second heat radiation portion 51 is in contact with the first straight portion 32 , the curved portion 34 , the metal member 4 and the power module body portion 30 . The second heat radiation portion 51 is arranged between the first straight portion 32 and the metal member 4 in contact with the first straight portion 32 and the metal member 4 . That is, the second heat radiating portion 51 is sandwiched between the first linear portion 32 and the metal member 4 .

The second heat radiation part 51 is arranged between the curved part 34 and the metal member 4 in contact with the curved part 34 and the metal member 4 . That is, the second heat radiating portion 51 is sandwiched between the curved portion 34 and the metal member 4 . The second heat radiating portion 51 is in contact with the end surface of the power module body portion 30 in the second direction. The second heat radiation portion 51 of the heat radiation member 5a and the second heat radiation portion 51 of the heat radiation member 5b sandwich the power module main body portion 30 from the outside in the second direction. The second heat radiation portion 51 fills the space formed by the first straight portion 32 , the curved portion 34 , the metal member 4 and the power module body portion 30 . The cross-sectional shape of the second heat radiating portion 51 is a shape having a curved surface along the curved portion 34 .

Next, the effect of the driving device 1 according to the first embodiment will be explained.

In the present embodiment, as shown in FIG. 2, a heat radiation member 5 having electrical insulation is arranged between the pins 31 of the power module 3 and the metal member 4, so that the pins of the power module 3 Electrical insulation between 31 and metal member 4 can be ensured. Further, in the present embodiment, the heat dissipation member 5 having heat dissipation is arranged between the pin 31 of the power module 3 and the metal member 4 . By contacting at least one of them, the heat transmitted from the power module main body 30 to the pin 31 , the metal foil 20 and the metal member 4 can be radiated by the heat radiating member 5 . Further, in the present embodiment, since the power module 3 is in thermal contact with the metal member 4 , the heat generated from the power module main body 30 is transmitted to the metal member 4 , thereby causing the metal member 4 to heat the driving device 1 . can dissipate heat to the outside. That is, in the present embodiment, it is possible to improve the heat radiation performance while ensuring electrical insulation between the pins 31 of the power module 3 and the metal member 4 .

In the present embodiment, heat dissipation member 5 is in contact with all of pin 31 , metal foil 20 and metal member 4 , so that heat transferred from power module main body 30 to pin 31 passes through heat dissipation member 5 . The heat transmitted to the metal member 4 and transmitted from the pin 31 to the metal foil 20 is transmitted to the metal member 4 via the heat radiation member 5 . Therefore, heat generated from the power module body 30 can be efficiently radiated. Furthermore, since the heat radiation member 5 is in contact with the metal foil 20 and the metal member 4, the heat generated from the electronic component mounted on the substrate 2 is transmitted to the metal member 4 through the heat radiation member 5, so that the heat from the electronic component The generated heat can also be efficiently dissipated.

In the present embodiment, since the metal member 4 is grounded, there is no short circuit between the pin 31 and the ground potential portion, so the short-circuit current from the pin 31 to the ground potential portion is It is possible to suppress the malfunction of the power module 3 due to

In the present embodiment, the pin 31 has a first linear portion 32 extending in the second direction and separated from the metal member 4 in the first direction. 51 is sandwiched between the first straight portion 32 and the metal member 4 . As a result, when the substrate 2 and the metal member 4 vibrate when the driving device 1 is transported or when the driving device 1 is energized, the vibration to the pin 31 is damped by the heat radiation member 5 . Therefore, the movable range of the pin 31 is suppressed, and breakage of the pin 31 can be suppressed. Further, in the present embodiment, the heat dissipation member 5 is also in contact with the power module main body 30, so that the vibration to the pin 31 is further damped. Note that the heat dissipation member 5 may be separated from the power module body 30 .

Embodiment 2.
Next, a driving device 1A according to the second embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a driving device 1A according to the second embodiment. This embodiment differs from the first embodiment in that a heat transfer grease 6 is provided between the power module 3 and the metal member 4 . In addition, in Embodiment 2, the same code|symbol is attached|subjected about the part which overlaps with above-mentioned Embodiment 1, and description is abbreviate|omitted.

A heat transfer grease 6 that transfers heat from the power module 3 to the metal member 4 is sandwiched between the power module 3 and the metal member 4 . Heat transfer grease 6 is applied to at least one of power module 3 and metal member 4 . The heat transfer grease 6 is mainly composed of, for example, modified silicon whose viscosity changes little from room temperature to high temperature, and metal with high thermal conductivity or metal oxide particles with high thermal conductivity are mixed into this main component. Grease is used. The power module 3 is in thermal contact with the metal member 4 via heat transfer grease 6 .

The second heat radiating portion 51 of the heat radiating member 5a and the second heat radiating portion 51 of the heat radiating member 5b sandwich the power module main body 30 and the heat transfer grease 6 from the outside in the second direction. The second heat radiating portion 51 is in contact with the end surface of the power module main body portion 30 in the second direction and the end portion of the heat transfer grease 6 in the second direction. The second heat radiating portion 51 fills the space formed by the first straight portion 32 , the curved portion 34 , the metal member 4 , the power module body portion 30 and the heat transfer grease 6 .

When the power module 3 and the metal member 4 are brought into direct contact, there is a possibility that a minute gap will occur between them. In the present embodiment, a heat transfer grease 6 that transfers heat from the power module 3 to the metal member 4 is sandwiched between the power module 3 and the metal member 4, and the power module 3 is connected to the power module 3 via the heat transfer grease 6. Since the power module 3 and the metal member 4 are in thermal contact with each other, it is possible to prevent the occurrence of a minute gap between the power module 3 and the metal member 4 . Therefore, an increase in thermal resistance due to the gap is prevented, and the heat generated from the power module 3 is more easily transferred to the metal member 4, thereby improving the heat dissipation performance.

In the present embodiment, the second heat radiating portions 51 of the heat radiating members 5a and 5b are in contact with the ends of the heat transfer grease 6 in the second direction. As a result, when vibration occurs in the substrate 2 and the metal member 4 during transportation of the drive device 1A, power supply to the drive device 1A, etc., the movable range of the heat transfer grease 6 is suppressed by the heat dissipation members 5a and 5b. be. Therefore, leakage of the heat transfer grease 6 from between the power module 3 and the metal member 4 can be suppressed, and the heat dissipation effect of the heat transfer grease 6 can be maintained. In addition, the second heat radiating portion 51 of the heat radiating member 5 may be separated from the heat transfer grease 6 .

Next, referring to FIG. 4, a driving device 1B according to Modification 1 of Embodiment 2 will be described. FIG. 4 is a cross-sectional view showing a driving device 1B according to Modification 1 of Embodiment 2. As shown in FIG. A drive device 1B according to Modification 1 differs from the drive device 1A of the second embodiment in that a heat radiation member 5c is provided between the power module 3 and the metal member 4. FIG. In the modified example 1, the same reference numerals are given to the parts that overlap with the drive device 1A of the second embodiment, and the description thereof is omitted.

Between the power module 3 and the metal member 4, a heat dissipation member 5c that transfers heat from the power module 3 to the metal member 4 is sandwiched. The cross-sectional shape of the heat radiating member 5c is a rectangle that is longer in the second direction than in the first direction. A heat radiation sheet, gel, or the like having both heat radiation and electrical insulation is used for the heat radiation member 5c. The power module 3 is in thermal contact with the metal member 4 via the heat radiating member 5c.

The second heat radiating portion 51 of the heat radiating member 5a and the second heat radiating portion 51 of the heat radiating member 5b sandwich the power module body portion 30 and the heat radiating member 5c from the outside in the second direction. The second heat radiating portion 51 is in contact with the end surface of the power module body portion 30 in the second direction and the end surface of the heat radiating member 5c in the second direction. The second heat dissipation portion 51 fills the space formed by the first straight portion 32, the curved portion 34, the metal member 4, the power module body portion 30, and the heat dissipation member 5c. In this modification, the three adjacent heat radiating members 5a, 5b, 5c are formed separately, but the three adjacent heat radiating members 5a, 5b, 5c may be integrally formed. Hereinafter, the heat radiating members 5a, 5b, and 5c may be collectively referred to as the heat radiating member 5 in some cases.

In this modification, a heat radiation member 5c is sandwiched between the power module 3 and the metal member 4, and the power module 3 is in thermal contact with the metal member 4 via the heat radiation member 5c. , the generation of minute gaps between the power module 3 and the metal member 4 can be prevented. Therefore, an increase in thermal resistance due to the gap is prevented, and the heat generated from the power module 3 is more easily transferred to the metal member 4, thereby improving the heat dissipation performance.

In this modified example, the second heat radiating portions 51 of the heat radiating members 5a and 5b are in contact with the end face of the heat radiating member 5c in the second direction. As a result, when vibration occurs in the substrate 2 and the metal member 4 during transport of the drive device 1B, power supply to the drive device 1B, etc., the movable range of the heat dissipation member 5c is suppressed by the heat dissipation members 5a and 5b. . Therefore, the heat dissipation member 5c is fixed between the power module 3 and the metal member 4, and the heat dissipation effect of the heat dissipation member 5c can be maintained. The second heat radiation portion 51 of the heat radiation members 5a and 5b may be separated from the heat radiation member 5c. Further, when the three adjacent heat dissipating members 5a, 5b, and 5c are integrally formed, the movement of the heat dissipating member 5c due to the vibration of the substrate 2 and the metal member 4 does not occur.

Next, referring to FIG. 5, a driving device 1C according to Modification 2 of Embodiment 2 will be described. FIG. 5 is a cross-sectional view showing a driving device 1C according to Modification 2 of Embodiment 2. As shown in FIG. In the driving device 1C according to Modification 2, the second heat radiation part 51 of the heat radiation members 5a and 5b is omitted, and the heat radiation member 5c is provided between the power module 3 and the metal member 4. It is different from the driving device 1A of the second embodiment. In the modified example 1, the same reference numerals are given to the parts that overlap with the drive device 1A of the second embodiment, and the description thereof is omitted.

The heat radiating members 5a and 5b have only the first heat radiating portion 50. The heat dissipation members 5 a and 5 b extend in the first direction from the installation surface 40 of the metal member 4 over the metal foil 20 of the substrate 2 . The heat dissipation members 5 a and 5 b are in contact with the second straight portion 33 , the metal foil 20 and the metal member 4 . The heat dissipation members 5a and 5b are not in contact with the first linear portion 32 and the curved portion 34. As shown in FIG. The heat dissipation members 5 a and 5 b are not arranged between the first straight portion 32 and the curved portion 34 and the metal member 4 . The cross-sectional shape of the heat radiating members 5a and 5b is a rectangle longer in the first direction than in the second direction.

Both ends of the heat radiating member 5c in the second direction protrude outward from the end face of the power module body 30 in the second direction. The protruding portion 52 of the heat radiating member 5 c is arranged between the first straight portion 32 and the curved portion 34 and the metal member 4 . The projecting portion 52 of the heat radiating member 5c is in contact with the metal member 4, but is separated from the first linear portion 32 and the curved portion 34 in the first direction. None of the heat radiating members 5a, 5b, 5c has a portion extending along the curved portion 34. As shown in FIG. That is, the cross-sectional shapes of the heat radiating members 5a, 5b, 5c are rectangular without curved surfaces.

The first heat radiating portion 50 of the heat radiating member 5a and the first heat radiating portion 50 of the heat radiating member 5b sandwich the heat radiating member 5c from the outside in the second direction. The first heat radiation portion 50 is in contact with the end surface of the heat radiation member 5c in the second direction. That is, the first heat radiating portion 50 of the heat radiating member 5a is in contact with the tip end surface of one projecting portion 52 of the heat radiating member 5c. The first heat radiating portion 50 of the heat radiating member 5b is in contact with the tip end surface of the other projecting portion 52 of the heat radiating member 5c. In this modification, the three adjacent heat radiating members 5a, 5b, 5c are formed separately, but the three adjacent heat radiating members 5a, 5b, 5c may be integrally formed.

In this modification, the heat dissipation member 5c is sandwiched between the power module 3 and the metal member 4, so that the pin 31 and the metal member 4 are separated by the thickness of the heat dissipation member 5c along the first direction. can be separated by a distance along a first direction. Therefore, electrical insulation between the pins 31 of the power module 3 and the metal member 4 can be ensured. This eliminates the need to dispose the heat radiating member 5 along the curved portion 34 of the pin 31, and allows the use of a heat radiating member 5 whose surfaces are processed to be planar. Therefore, compared with the case of using the heat radiating member 5 having a curved surface, the manufacturing process of the heat radiating member 5 is simplified, and the manufacturing cost of the heat radiating member 5 can be reduced.

In this modification, a heat radiation member 5c is sandwiched between the power module 3 and the metal member 4, and the power module 3 is in thermal contact with the metal member 4 via the heat radiation member 5c. , the generation of minute gaps between the power module 3 and the metal member 4 can be prevented. Therefore, an increase in thermal resistance due to the gap is prevented, and the heat generated from the power module 3 is more easily transferred to the metal member 4, thereby improving the heat dissipation performance. That is, in this modification, the heat dissipation performance can be improved while reducing the manufacturing cost of the heat dissipation member 5 .

In this modified example, the first heat dissipating portions 50 of the heat dissipating members 5a and 5b are in contact with the end surface of the heat dissipating member 5c in the second direction. As a result, when vibration occurs in the substrate 2 and the metal member 4 during transport of the drive device 1C, power supply to the drive device 1C, etc., the movable range of the heat dissipation member 5c is suppressed by the heat dissipation members 5a and 5b. . Therefore, the heat dissipation member 5c is fixed between the power module 3 and the metal member 4, and the heat dissipation effect of the heat dissipation member 5c can be maintained. In addition, the first heat radiation portion 50 of the heat radiation members 5a and 5b may be separated from the heat radiation member 5c. Further, when the three adjacent heat dissipating members 5a, 5b, and 5c are integrally formed, the movement of the heat dissipating member 5c due to the vibration of the substrate 2 and the metal member 4 does not occur.

Embodiment 3.
Next, a drive device 1D according to the third embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view showing a driving device 1D according to the third embodiment. This embodiment is different from the first embodiment in that a plurality of power modules 3 having different sizes are provided. In addition, in Embodiment 3, the same code|symbol is attached|subjected about the part which overlaps with above-mentioned Embodiment 1, and description is abbreviate|omitted.

In this embodiment, a plurality of power modules 3 are arranged side by side in the second direction. The size of some of the plurality of power modules 3 and the size of the remaining portion of the plurality of power modules 3 are different from each other. Although the number of power modules 3 is two in this embodiment, it may be three or more. Hereinafter, when distinguishing between the two power modules 3, the power module 3 on the left side of the page will be referred to as the power module 3a, and the power module 3 on the right side of the page will be referred to as the power module 3b.

One of the power modules 3a and 3b has a rectifying function of rectifying the voltage of the power supplied from the external power supply 60 shown in FIG. The other of the power modules 3a and 3b has a conversion function of converting the rectified voltage into power for driving the motor 70 shown in FIG. The power modules 3a, 3b are in thermal contact with the metal member 4. As shown in FIG.

The power module 3a has two pins 31a. Each pin 31a is joined to the through-hole conductor 21 by soldering. The power module 3a is fixed to the substrate 2 by soldering the pins 31a to the through-hole conductors 21. FIG.

The power module 3b has two pins 31b. Each pin 31b is joined to the through-hole conductor 21 by soldering. The power module 3b is fixed to the substrate 2 by soldering the pins 31b to the through-hole conductors 21. FIG.

Between each pin 31a and the metal member 4, one heat dissipating member 5 having heat dissipation and electrical insulation is arranged. Hereinafter, when distinguishing between the two heat dissipating members 5, the heat dissipating member 5 on the left side of the power module 3a is referred to as the heat dissipating member 5a, and the heat dissipating member 5 on the right side of the power module 3a is referred to as the heat dissipating member 5b. The heat dissipation members 5a and 5b only need to be in contact with at least one of the pin 31a, the metal foil 20 and the metal member 4. are doing.

Between each pin 31b and the metal member 4, one heat dissipating member 5 having heat dissipation and electrical insulation is arranged. Hereinafter, when distinguishing between the two heat radiating members 5, the heat radiating member 5 on the left side of the power module 3b on the page will be referred to as a heat radiating member 5d, and the heat radiating member 5 on the right side of the power module 3b on the page will be referred to as a heat radiating member 5e. The heat dissipation members 5d and 5e only need to be in contact with at least one of the pin 31b, the metal foil 20 and the metal member 4. are doing.

The size of the power module 3b is smaller than the size of the power module 3a. The thickness of the power module body portion 30 of the power module 3b along the first direction is thinner than the thickness of the power module body portion 30 of the power module 3a along the first direction. The height of the pins 31b of the power module 3b along the first direction is lower than the height of the pins 31a of the power module 3a along the first direction. Between the smaller power module 3b and the metal member 4, a heat radiating member 5f is sandwiched. The second heat radiating portion 51 of the heat radiating member 5d and the second heat radiating portion 51 of the heat radiating member 5e sandwich the heat radiating member 5f from the outside in the second direction. The heat dissipation members 5b, 5d, 5e, and 5f are arranged side by side in the second direction. The heat dissipation member 5b and the heat dissipation member 5d are adjacent to each other. In this modification, the four adjacent heat dissipating members 5b, 5d, 5e, and 5f are formed separately, but the four adjacent heat dissipating members 5b, 5d, 5e, and 5f may be integrally formed.

In the power module 3a having a larger size, the height of the pin 31a along the first direction is higher, and even if the power module main body 30 is arranged close to the metal member 4, the pin 31a and the substrate 2 are not easily separated from each other. Can connect. As a result, in the power module 3 a having the larger size, the power module main body 30 is brought into direct contact with the metal member 4 , or the power module main body 30 is heated to the metal member 4 via the heat transfer grease 6 or the heat dissipation member 5 . can be brought into direct contact with each other.

On the other hand, in the smaller power module 3b, the pin 31b has a lower height along the first direction. cannot connect. As a result, the distance along the first direction between the power module main body 30 of the power module 3b and the metal member 4 increases, causing the power module main body 30 to come into direct contact with the metal member 4. The portion 30 cannot be brought into thermal contact with the metal member 4 via the heat transfer grease 6 . Therefore, it is conceivable to raise part of the installation surface 40 of the metal member 4 so as to approach the substrate 2 and arrange the power module 3b on this raised portion. Since processing for partially changing the thickness is required, the manufacturing cost of the metal member 4 increases.

In this regard, in the present embodiment, the heat dissipation member 5f is sandwiched between the smaller power module 3b and the metal member 4, so that the thickness of the heat dissipation member 5f along the first direction is reduced. By changing the height, the position of the power module 3b in the first direction can be adjusted. As a result, since a plurality of power modules 3a and 3b having different sizes can be arranged on the same flat installation surface 40 of the metal member 4, it is not necessary to partially change the height of the installation surface 40 of the metal member 4. The manufacturing cost of the metal member 4 can be reduced.

In the present embodiment, since the metal member 4 is grounded, there is no short circuit between the pins 31a and 31b and the portion of potential to be grounded. It is possible to suppress malfunction of the power modules 3a and 3b due to a short-circuit current to.

Embodiment 4.
Next, an air conditioner 100 according to Embodiment 4 will be described with reference to FIGS. 7 and 8. FIG. FIG. 7 is a perspective view schematically showing the outdoor unit 110 of the air conditioner 100 according to the fourth embodiment. FIG. 8 is a schematic diagram showing the air conditioner 100 according to the fourth embodiment. In the present embodiment, a case where the driving device 1 according to the first embodiment is applied to the outdoor unit 110 of the air conditioner 100 will be illustrated. In addition, in Embodiment 4, the same code|symbol is attached|subjected about the part which overlaps with above-described Embodiment 1, and description is abbreviate|omitted.

As shown in FIG. 7, the air conditioner 100 includes an outdoor unit 110. The outdoor unit 110 includes a sheet metal housing 111 , an outdoor fan 112 , an outdoor heat exchanger 113 , a compressor 114 and a driving device 1 . An arrow Y shown in FIG. 7 represents the blowing direction of the airflow generated by the outdoor fan 112 . In the present embodiment, the side of the outdoor unit 110 from which the air flow generated by the outdoor fan 112 is discharged to the outside is the front side, and the opposite side of the front side is the rear side. 7 shows a state in which the front panel of the sheet metal housing 111 is removed so that the inside of the outdoor unit 110 can be seen. Also, in FIG. 7, illustration of electrical wiring, refrigerant piping, etc. is omitted.

The sheet metal housing 111 is a box-shaped member that forms the outer shell of the outdoor unit 110 . Metal is used as the material of the sheet metal housing 111 . The sheet metal housing 111 has a separator 115 . The separator 115 divides the inside of the sheet metal housing 111 into a fan room 116 and a machine room 117 . The fan room 116 and the machine room 117 are formed side by side in the width direction of the outdoor unit 110 .

An outdoor fan 112 and an outdoor heat exchanger 113 are arranged in the fan room 116 . The outdoor fan 112 is a device that generates an airflow. The outdoor heat exchanger 113 is a member for exchanging heat between the refrigerant and the outdoor air. Outdoor air to be taken in by the outdoor fan 112 passes through the outdoor heat exchanger 113 .

A compressor 114 and a drive device 1 are arranged in the machine room 117 . The compressor 114 is a device that uses the motor 70 as a drive source to compress refrigerant in a refrigeration cycle 120, which will be described later.

Although the driving device 1 shown in FIG. 7 is the driving device 1 according to the first embodiment, it may be any of the driving devices 1 to 1D according to the first to third embodiments. The driving device 1 is installed on the surface of the separator 115 facing the machine room 117 . The driving device 1 is installed on the separator 115 so that the first direction matches the width direction of the outdoor unit 110 and the second direction matches the height direction of the outdoor unit 110 .

A plurality of

electronic components

22a, 22b, and 22c are mounted on the substrate 2. The metal member 4 is the sheet metal housing 111 of the outdoor unit 110 of the air conditioner 100 in this embodiment. Specifically, the metal member 4 is the separator 115 of the sheet metal housing 111 . The separator 115 is in thermal contact with the surface of the power module body 30 opposite to the surface facing the substrate 2 . Separator 115 faces fan chamber 116 . The metal member 4 is arranged at a position where the air flow generated by the outdoor fan 112 hits. The metal member 4 is cooled by the airflow generated by the outdoor fan 112 .

Next, the refrigeration cycle 120 of the air conditioner 100 will be described with reference to FIG.

As shown in FIG. 8, the refrigeration cycle equipment of the air conditioner 100 includes a compressor 114, a four-way valve 130, an outdoor heat exchanger 113, an expansion device 140, and an indoor heat exchanger 150. In the air conditioner 100, a refrigeration cycle 120 is performed in which refrigerant circulates through the compressor 114, the four-way valve 130, the outdoor heat exchanger 113, the expansion device 140, the indoor heat exchanger 150, the four-way valve 130, and the compressor 114 in this order. Devices constituting the refrigeration cycle device are connected to each other via refrigerant pipes 160 . Compressor 114 , four-way valve 130 , outdoor heat exchanger 113 and expansion device 140 are provided in outdoor unit 110 of air conditioner 100 . The indoor heat exchanger 150 is provided in the indoor unit of the air conditioner 100 .

Next, the refrigeration cycle 120 of the air conditioner 100 will be described using the cooling operation of the air conditioner 100 as an example. Although not described here, the same refrigeration cycle 120 can also perform the heating operation of the air conditioner 100 . When performing the cooling operation of the air conditioner 100, the four-way valve 130 directs the refrigerant discharged from the compressor 114 to the outdoor heat exchanger 113, The flow path is switched in advance so that the refrigerant flowing out of heat exchanger 150 goes to compressor 114 .

When the drive device 1 outputs electric power supplied from the external power source 60 to the motor 70 of the compressor 114, the motor 70 is driven and the compressor 114 compresses the refrigerant. The refrigerant compressed by the compressor 114 becomes a high-temperature, high-pressure refrigerant gas. The high-temperature, high-pressure refrigerant gas is sent to the outdoor heat exchanger 113 via the four-way valve 130 . The high-temperature and high-pressure refrigerant gas radiates heat in the outdoor heat exchanger 113, condenses, and becomes a high-pressure, normal-temperature liquid refrigerant. That is, the high-temperature, high-pressure refrigerant gas discharged from the compressor 114 is heat-exchanged with the outdoor air in the outdoor heat exchanger 113 to become a high-pressure, normal-temperature liquid refrigerant. The high pressure room temperature liquid refrigerant is sent to the expansion device 140 .

The high-pressure, normal-temperature liquid refrigerant is expanded and decompressed by the expansion device 140 to become a low-pressure, low-temperature gas-liquid two-phase refrigerant. The low-pressure low-temperature gas-liquid two-phase refrigerant is sent to the indoor heat exchanger 150 . The low-pressure low-temperature gas-liquid two-phase refrigerant evaporates in the indoor heat exchanger 150 to become a low-pressure low-temperature gas refrigerant. That is, the low-pressure, low-temperature gas-liquid two-phase refrigerant flowing out of the expansion device 140 undergoes heat exchange with the air in the air-conditioned space in the indoor heat exchanger 150, and becomes low-pressure, low-temperature gas refrigerant. The low-pressure low-temperature gas refrigerant is sent to compressor 114 via four-way valve 130 and compressed again in compressor 114 . Thereafter, the same operation is repeated until the air conditioner 100 stops. It should be noted that not only the outdoor unit 110 but also the indoor unit may be provided with an expansion device so that the refrigerant can be more finely controlled.

In the present embodiment, air conditioner 100 includes compressor 114 that compresses refrigerant in refrigerating cycle 120 using motor 70 as a drive source, drive device 1 that controls the drive of motor 70, motor 70, compressor 114 and A sheet metal housing 111 that accommodates the driving device 1 and constitutes an outer shell of the outdoor unit 110 of the air conditioner 100 is provided, and the metal member 4 is the sheet metal housing 111 . As a result, the heat transferred from the power module 3 to the sheet metal housing 111 can be dissipated from the sheet metal housing 111 into the air. Since the sheet metal housing 111 has a large area in contact with the outdoor air, the heat radiation area is increased, and the heat generated from the power module 3 can be efficiently radiated.

In this embodiment, the outdoor unit 110 has an outdoor fan 112 that is housed in a sheet metal housing 111 and generates an air flow. The generated airflow impinges. As a result, the separator 115 is cooled by the airflow generated by the outdoor fan 112, so that the heat transferred from the power module 3 to the separator 115 can be easily dissipated.

The arrangement of the driving device 1 is not limited to the illustrated example. The driving device 1 may be arranged, for example, on the ceiling wall, the rear wall, or the like of the sheet metal housing 111 . In the case of such an arrangement, the metal member becomes the ceiling wall, back wall, etc. of the sheet metal housing 111 .

Further, in the present embodiment, a case where the driving devices 1 to 1D according to the first to third embodiments are applied to the outdoor unit 110 of the air conditioner 100 is exemplified. It may be applied to the device. Examples of refrigeration cycle devices other than the air conditioner 100 include a heat pump device and a refrigeration device.

The configurations shown in the above embodiments are only examples, and can be combined with other known techniques, or can be combined with other embodiments, without departing from the scope of the invention. It is also possible to omit or change part of the configuration.

For example, in each of the above-described embodiments, the power module 3 is of the DIP type, but the power module 3 may be of the SOP (Small Outline Package) type having gull-wing pins, for example. If the power module 3 is of the SOP type, the pins 31 are soldered to the metal foil 20 .

1, 1A, 1B, 1C, 1D drive unit, 2 substrate, 3, 3a, 3b power module, 4 metal member, 5, 5a, 5b, 5c, 5d, 5e, 5f heat dissipation member, 6 heat transfer grease, 10 drive circuit, 20 metal foil, 21 through-hole conductors, 22a, 22b, 22c electronic components, 30 power module body, 31, 31a, 31b pins, 32 first straight portion, 33 second straight portion, 34 curved portion, 35 power device, 36 resin, 40 installation surface, 50 first heat dissipation part, 51 second heat dissipation part, 52 projecting part, 60 external power supply, 70 motor, 80 electric wire, 100 air conditioner, 110 outdoor unit, 111 Sheet metal housing, 112 outdoor fan, 113 outdoor heat exchanger, 114 compressor, 115 separator, 116 fan room, 117 machine room, 120 refrigeration cycle, 130 four-way valve, 140 expansion device, 150 indoor heat exchanger, 160 refrigerant piping .

Claims

a substrate having a conductor;
a power module spaced apart from the substrate in a first direction that is the thickness direction of the substrate;
a metal member having heat dissipation disposed on the opposite side of the substrate with the power module interposed therebetween;
The power module is in thermal contact with the metal member,
The power module has a pin that extends in a second direction that intersects with the first direction and then extends toward the substrate and is electrically connected to the conductor portion of the substrate;
A heat dissipating member having heat dissipating properties and electrical insulation is arranged between the pin and the metal member,
The driving device, wherein the heat radiating member is in contact with at least one of the pin, the conductor and the metal member.
The driving device according to claim 1, wherein the heat radiating member is in contact with the metal member and at least one of the pin and the conductor.
The driving device according to claim 1 or 2, wherein the metal member is grounded.
the pin has a spaced portion extending in the second direction and separated from the metal member in the first direction;
The driving device according to any one of claims 1 to 3, wherein the heat radiating member is sandwiched between the separating portion and the metal member.
heat transfer grease is sandwiched between the power module and the metal member for transferring heat from the power module to the metal member,
The driving device according to any one of claims 1 to 4, wherein the power module is in thermal contact with the metal member via the heat transfer grease.
The heat dissipation member is sandwiched between the power module and the metal member,
The driving device according to any one of claims 1 to 4, wherein the power module is in thermal contact with the metal member via the heat dissipation member.
a plurality of the power modules are arranged side by side in the second direction;
the size of some of the plurality of power modules and the size of the remaining portion of the plurality of power modules are different from each other,
The driving device according to any one of claims 1 to 4, wherein the heat radiating member is sandwiched between the smaller power module and the metal member.
a motor;
a compressor that uses the motor as a drive source to compress refrigerant in a refrigeration cycle;
The driving device according to any one of claims 1 to 7, which controls driving of the motor;
a sheet metal housing that houses the motor, the compressor, and the driving device and constitutes an outer shell of an outdoor unit of an air conditioner;
The air conditioner, wherein the metal member is the sheet metal housing.
An outdoor fan that is housed in the sheet metal housing and generates an air flow,
The air conditioner according to claim 8, wherein an air flow generated by the outdoor fan hits the metal member.