JP2005113695A - Compressor with electronic circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compressor with an electronic circuit device preventing malfunction of the electronic circuit device caused by heat, noise or vibration while integrally attaching the electronic circuit device to the compressor. <P>SOLUTION: The electronic circuit device 10 is attached to the compressor 1 compressing a refrigerant through an interposing member 11 having functions for suppressing a heat flow, absorbing vibration and damping noise. Thereby, while the electronic circuit device 10 can be integrally attached to the compressor 1, malfunction of the electronic circuit device 10 caused by heat, noise or vibration is prevented by the interposing member 11. A means is provided which cools heat of a heating component 16 arranged in the electronic circuit device 10 by using the refrigerant absorbed to the compressor 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a compressor used in an air conditioner, a refrigerator, and the like, and more particularly to a compressor with an electronic circuit device to which an electronic circuit device such as an inverter for driving a motor of the compressor at a variable speed is attached.

  In recent years, with the advancement of power electronics, electronic circuit devices that move motors are used in all fields. For example, an inverter circuit is used for energy saving purposes in devices such as air conditioners and refrigerators, which greatly contributes to energy saving of the devices.

  In such an electronic circuit device, a switching semiconductor element of a power circuit such as an IGBT or a MOSFET is used particularly in order to drive a motor efficiently. This semiconductor device has a large amount of heat generation with the recent high performance and high functionality, and has a problem with heat.

  As a structure of a conventional electronic circuit device that generates heat as described above, for example, Patent Document 1 discloses an electronic circuit device for controlling a compressor motor that is integrated with the compressor.

Hereinafter, a conventional electronic circuit device will be described with reference to FIG. FIG. 8 shows a cross-sectional view of a conventional electronic circuit device.
As shown in FIG. 8, the electronic circuit device 50 includes a first circuit board 51 and a second circuit board 52. The first circuit board 51 is mounted with a semiconductor element 53 such as a transistor or a diode that supplies electric power to the motor of the compressor. The semiconductor element 53 generates a relatively large amount of heat. It is. Since the semiconductor element 53 as such a heat generating component becomes inoperable when heat is accumulated inside, it is necessary to dissipate the heat to the outside, and the back surface of the first circuit board 51 is a heat generating component. A heat sink 54 is provided for releasing heat generated from the semiconductor element 53 to the outside air.

  The second circuit board 52 is mounted with a microcomputer 55 and a smoothing capacitor 56 that require relatively little heat dissipation. The smoothing capacitor 56 is fixed to the second circuit board 52 by a fixing resin 59. Yes. The microcomputer 55 has a function of processing a signal for controlling the semiconductor element 53, and the smoothing capacitor 56 has a function of suppressing a voltage fluctuation generated when AC power is converted into DC power using a diode. .

  The first circuit board 51 and the second circuit board 53 are electrically connected by a connector 57, and the connector 57 also performs electrical connection with an external device. The first circuit board 51 on which these semiconductor elements 53 are mounted and the second circuit board 53 on which the microcomputer 55 and the smoothing capacitor 56 are mounted are housed in a case 58 in a posture in which only the heat sink 54 is exposed to the outside. Filling resin 61 that secures an insulation distance for physical protection and electrical protection is filled from the place where the first circuit board 51 is placed to the place where the second circuit board 52 is placed.

A fixing portion 60 provided with a locking projection 60a is attached to the surface on one end side of the case 58, and the fixing portion 60 is locked to a locked portion provided in a compressor (not shown), thereby The circuit device 50 is configured to be integrated and fixed to the compressor.
Japanese Unexamined Patent Publication No. 2000-357890 (FIG. 1 etc.)

  However, in the structure in which the electronic circuit device 50 having the above-described conventional structure is directly attached to the compressor as it is and integrated, the semiconductor element 53 exceeds the specified temperature due to the double action of the heat generated from the compressor and the heat generated from the semiconductor element 53. As a result, the semiconductor element 53 has a problem of becoming inoperable.

In addition, due to the vibration of the compressor, the electrical connection between the compressor and the electronic circuit device 50 is cracked and has a problem of disconnection.
Further, there is a problem that the electronic circuit device 50 malfunctions due to noise from a motor installed inside the compressor.

  The present invention has been made to solve the above-described problems, and an electronic circuit that can prevent an electronic circuit device from malfunctioning due to heat, noise, or vibration while being able to integrally attach the electronic circuit device to a compressor. An object is to provide a compressor with a device.

  In order to solve the above-mentioned problems, the compressor with an electronic circuit device of the present invention has a function of suppressing the flow of heat, absorbing vibration, and attenuating noise in the compressor that compresses the refrigerant. It was attached through the interposed member which has.

Thereby, while the electronic circuit device can be integrally attached to the compressor, malfunction of the electronic circuit device due to heat, noise, or vibration is prevented by the interposed member.
In addition, the compressor with an electronic circuit device of the present invention is provided with a heat sink that is attached to a compressor that compresses a refrigerant and that cools the heat generating component through the refrigerant sucked by the compressor in the electronic circuit device having the heat generating component. To do.

  Thereby, the heat-emitting component of the electronic circuit device can be cooled well.

  As described above, according to the present invention, the structure in which the heat generated from the compressor is insulated, the vibration is absorbed, and the noise is shielded by the interposed member interposed between the compressor and the electronic circuit device. Therefore, it is possible to provide a structure that ensures the operation quality while integrating the compressor and the electronic circuit device, and the reliability is improved. In addition, by providing the electronic circuit device with a heat sink that cools the heat generating parts through the refrigerant sucked by the compressor, it is possible to realize a structure that cools the electronic circuit device satisfactorily, thereby further improving the operation quality. Can do.

  The compressor with an electronic circuit device according to claim 1 of the present invention is such that the electronic circuit device is attached to a compressor that compresses a refrigerant via an interposed member that suppresses the flow of heat. In other words, in a structure in which the electronic circuit device that operates the motor of the compressor and the compressor are integrated, the compressor and the electronic circuit device are such that heat from the compressor is difficult to transfer to electronic components such as a smoothing capacitor and semiconductor elements that are vulnerable to heat. In the meantime, an interposing member made of a sheet-like material or the like that suppresses the flow of heat is interposed except for an electrically connected portion. With this configuration, in the compressor in which the electronic circuit device is integrated and attached, it becomes difficult for the heat of the compressor to be transmitted to the electronic circuit device by the interposition member, and malfunction of the electronic circuit device due to heat is prevented, including the electronic circuit device. This makes it easy to design the thermal structure of the compressor.

  A compressor with an electronic circuit device according to claim 2 of the present invention is such that an electronic circuit device is attached to a compressor that compresses a refrigerant via an interposed member that absorbs vibration. Here, as the interposed member, for example, an elastic material that absorbs vibration is used. With this configuration, the vibration of the compressor is absorbed by the interposition member and is not easily transmitted to the electronic circuit device. As a result, malfunction of the electronic circuit device due to the vibration is prevented.

  According to a third aspect of the present invention, there is provided a compressor with an electronic circuit device, wherein the electronic circuit device is attached to a compressor that compresses a refrigerant through an interposition member that attenuates noise transmitted from a motor inside the compressor. is there. Here, as the intervening member, a member having a function of shielding an electromagnetic wave by installing a metal-deposited film and electrically connecting the metal part to the ground is used. With this configuration, noise transmitted from the motor inside the compressor is attenuated via the interposing member, and as a result, malfunction of the electronic circuit device due to noise is prevented.

  According to a fourth aspect of the present invention, there is provided a compressor with an electronic circuit device, wherein the electronic circuit device is applied to the compressor that compresses the refrigerant, and the noise transmitted from the motor inside the compressor is suppressed while suppressing the flow of heat and absorbing vibration. It is attached via an interposed member to be attenuated. This configuration makes it difficult for heat and vibration of the compressor to be transmitted to the electronic circuit device by the interposed member, and noise transmitted from the motor inside the compressor is attenuated via the interposed member. Malfunction is prevented.

  According to a fifth aspect of the present invention, in the compressor with an electronic circuit device according to any one of the first to fourth aspects, the interposing member seals the heat insulating material with a film, and the inside of the film is made a decompressed space. Therefore, it is a structure with improved heat insulation. Further, the structure is made of a fibrous material, and a fibrous material formed with a plurality of gaps is covered with a film, and the inside of the film is sealed by crimping one side of the film after decompression, and the fibrous material It is good to use what maintained the state which pressure-reduced the space | gap which exists in between. Thereby, while having an effect | action which raises the heat insulation effect as an interposed member, it has the effect | action which can absorb a vibration and can attenuate a noise. In addition, it is good to select the thickness and shape of an interposed member according to the calorific value of a compressor.

  According to a sixth aspect of the present invention, there is provided a compressor with an electronic circuit device, wherein the electronic circuit device is provided with a heat sink that cools a heat-generating component through a refrigerant sucked by the compressor. According to this, the compressor is compressed by the compressor. The refrigerant can also be used for cooling the heat generating component, and heat generated from the heat generating component is absorbed by the refrigerant passing through the heat sink. Moreover, since the low-temperature refrigerant before passing through the compressor is passed through the heat sink, the heat-generating component is cooled well.

  The electronic circuit device includes a rectifier circuit that rectifies an AC voltage and an inverter circuit that converts the DC voltage of the rectifier circuit into an AC circuit again, and a fixing unit that fixes the electronic circuit device to the compressor. The compressor and the electronic circuit device are electrically connected to each other and the connector portion having a function of fixing the electronic circuit device to the compressor is used. Further, as a semiconductor element of the inverter circuit, SiC (silicon carbide) having a high operation guarantee temperature may be used instead of Si (silicon) having a low operation guarantee temperature conventionally using a semiconductor element. It has the effect | action which can select few intervention members.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 is a partially cutaway front view of a compressor with an electronic circuit device according to an embodiment of the present invention, FIG. 2 (a) is a plan view of the electronic circuit device, and FIG. 2 (b) is an A- in FIG. 2 (a). It is front sectional drawing cut | disconnected by A 'line. 2 (a) and 2 (b) show the electronic circuit device in a state before the inside is filled with the filling resin, and finally the electronic circuit device shown in FIGS. 2 (a) and 2 (b). Is filled with a filling resin, and thereafter, is attached in a posture in which the vertical direction is reversed.

  In FIG. 1, 1 is a compressor that compresses refrigerant, 2 is an accumulator that completely vaporizes refrigerant introduced into the compressor, and 10 is an electronic circuit provided with an inverter circuit that drives a motor built in the compressor 1 at a variable speed. Device. As shown in FIG. 1, the electronic circuit device 10 is attached in a state of being integrated with the compressor 1 via an interposed member 11 formed of a heat insulator.

  As shown in FIGS. 1 and 2 (a) and 2 (b), in this embodiment, the compressor 1 has a substantially cylindrical shape, and the electronic circuit device 10 and the interposition member are used. 11 also has a planar circular shape similar to that of the compressor 1 in plan view, and the electronic circuit device 10 is configured in a cylindrical shape with a posture placed on the disk-like portion 11a of the interposing member 11. ing. Further, the compressor 1, the electronic circuit device 10, and the interposition member 11 are not limited to a cylindrical shape or a disc shape, and may be a square shape or other shapes.

  The compressor 1 has an outer shell made of metal, and the compressor 1 has a single refrigerant discharge port 3 for discharging the refrigerant compressed by the compressor 1 and an electronic circuit device 10 integrated with the compressor 1. A plurality of fixing projecting legs 4 are integrally formed in a posture projecting upward from the housing upper surface 1a of the compressor 1, and the refrigerant discharge port 3 is provided at the center of the upper surface of the main body. 2 (a) and 2 (b), the fixing projecting legs 4 are arranged at equal angular intervals (in this embodiment, from the positions near the outer periphery of the upper surface of the main body). Are arranged at every 120 degrees (three in this embodiment). Correspondingly, the electronic circuit device 10 is provided with through holes 12a and 12b through which the refrigerant discharge port 3 and the fixing protruding legs 4 pass, and the inside of these through holes 12a and 12b is also provided with heat resistance. The intervening member 11 (the cylindrical portions 11b and 11c of the intervening member 11) is interposed. The through hole 12a through which the refrigerant discharge port 3 passes is formed by a wall surface portion by an inner cylinder portion 15a provided in the inner peripheral portion of the case 15 of the electronic circuit device 10, and the through hole through which the fixing protruding leg 4 passes. 12b is the cylindrical body 14 and the wall surface part is formed. A screw portion is formed at the tip of the fixing projection leg 4, and a fixing nut 13 is attached to the tip of the fixing projection leg 4 in a state where the electronic circuit device 10 is assembled to the compressor 1 via the interposition member 11. The electronic circuit device 10 is fixed by screwing. As described above, the fixing portion that fixes the electronic circuit device 10 to the compressor 1 via the interposing member 11 is constituted by the fixing protruding leg 4 and the fixing nut 13.

  The electronic circuit device 10 has a configuration in which an outer wall portion is covered with an outer cylindrical portion 15b of a case 15 to protect the inside mechanically and electrically. The electronic circuit device 10 includes a heat generating component 16, a smoothing capacitor 17a, and a connection terminal. The first substrate 18 on which electronic components 17b and the like of the type to be inserted into the substrate are mounted, and the second substrate 20 on which electronic components such as a microcomputer 19a, a resistor 19b, a capacitor 19c and the like that generate a relatively small amount of heat are mounted. Are built-in, and these electronic components (heat generating component 16, smoothing capacitor 17a, insertion-type electronic component 17b, microcomputer 19a, resistor 19b, capacitor 19c) and first and second substrates 18 and 20 are used for alternating current. A rectifier circuit that rectifies the voltage and an inverter circuit that converts the DC voltage of the rectifier circuit into an AC circuit again. That.

  Here, the heat generating component 16 is a power circuit switching semiconductor element using Si (silicon). The heat generating component 16 includes a heat sink 21 that cools the heat generating component 16 through the refrigerant sucked by the compressor 1. Are attached in a posture in which the screws 22 are in close contact with each other (a thermally joined posture). Reference numeral 21a denotes a refrigerant passage through which a refrigerant flows, and is connected to a refrigerant inlet 21b for introducing the refrigerant and a refrigerant outlet 21c for discharging the refrigerant. The heat sink 21 is also provided with through holes 21d and 21e through which the refrigerant discharge port 3 and the fixing protruding legs 4 pass. Moreover, you may provide an electrical insulator on the surface of the heat sink 21 as needed.

  Further, since the smoothing capacitor 17a and the insertion-type electronic component 17b are preferably disposed close to the semiconductor element as the heat generating component 16 in terms of electrical wiring, the same as the heat generating component 16, the first substrate 18 is provided. Although mounted, the smoothing capacitor 17a and the insertion type electronic component 17b are relatively weak against heat. Therefore, the surface of the first substrate 18 opposite to the surface on which the semiconductor element as the heat generating component 16 is mounted. Has been implemented.

  Further, inter-board connectors 23a and 23b for connecting the boards to each other are mounted on the first and second boards 18 and 20, and the first board 18 is further connected to a connector 23c for connection to an external device or the compressor 1. A connection connector 23d is also mounted. The connection connector 23 d with the compressor 1 is electrically connected to an input terminal 24 a of an internal connector 24 provided inside the compressor 1. The input terminal 24a of the internal connector 24 is usually formed with three wiring connection terminals of U phase, V phase, and W phase, and a glass encapsulating portion 25 is provided at the root of the input terminal 24a. The refrigerant does not leak out from the periphery of the input terminal 24a. The internal connector 24 is made of a resin that can withstand high temperature and high pressure inside the compressor, and is connected to a motor inside the compressor 1 via a connection wiring 26. The connection connector 23d of the electronic circuit device 10 and the input terminal 24a of the internal connector 24 also have a function of physically fixing the electronic circuit device 10 and the interposition member 11 to the compressor 1 by being coupled to each other. Have.

  As described above, the interposition member 11 is provided between the disk-shaped portion 11 a interposed between the compressor 1 and the electronic circuit device 10, and the refrigerant discharge port 3 of the electronic circuit device 10 and the compressor 1. It is comprised from the cylindrical part 11b interposed, and the cylindrical part 11c interposed between the electronic circuit apparatus 10 and the protrusion leg 4 for fixation, but each of these interposed members 11 is comprised. The part is formed into a structure in which fibrous glass wool is formed into a sheet shape, a film is formed by depositing a metal film so as to cover the glass wool, the air inside the film is extracted, and the film is sealed while maintaining the reduced pressure state. It has become. With this structure, there is no air in the gap between the fibrous glass wool, and high heat insulation can be obtained. Further, since the gap between the glass wool is held even under reduced pressure due to the fiber shape, this heat insulating material becomes an elastic body and can absorb the vibration of the compressor 1. In addition, the deposited metal film is electrically connected to the ground, so that the interposition member 11 also has an action of shielding electromagnetic waves.

  Furthermore, in the electronic circuit device 10, a space surrounded by the case 15, the interposition member 11, and the heat sink 21 is filled with a filling resin 30 made of silicon resin or epoxy resin.

  The refrigerant discharge port 21c of the heat sink 21 and the accumulator 2 are connected via a connection pipe 27. The refrigerant is first introduced into the heat sink 21, and then introduced into the accumulator 2 via the connection pipe 27. The refrigerant completely vaporized by the accumulator 2 is introduced into the compressor 1. Reference numerals 28a and 28b denote welded connections of the refrigerant pipe.

Next, the assembly process of the electronic circuit device 10 and the assembly process to the compressor 1 will be described.
3 (a) to 3 (c) each show a mounting process which is a first process. As shown in FIG. 3 (a), an electronic component such as a microcomputer 19a or the like on the second substrate 20, The board-to-board connector 23b and the connection connectors 23c and 23d are mounted by a surface mounting method (SMT). As shown in FIG. 3B, electronic components such as a smoothing capacitor 17a and an insertion type electronic component 17b and an inter-board connector 23a are mounted on the first substrate 18 by an insertion mounting method. Further, as shown in FIG. 3C, the heat generating component 16 is fixed with screws 22 to the heat sink 21 having a space through which the refrigerant flows. In this embodiment, a TO220 package in which a metal plate with a screw hole for heat dissipation is integrally provided is used as the heat generating component 16. At this time, if necessary, an electrical insulating layer made of resin is provided on the package or the heat sink 21 in order to electrically insulate it from the heat sink 21. Further, in order to improve heat transfer, a pressure welding with silicon grease interposed between the heat generating component 16 and the heat sink 21 or a structure in which metal and metal are joined may be employed. The lead 16 a drawn from the semiconductor inside the package in the heat generating component 16 is formed in a shape bent in the opposite direction to the heat sink 21.

  FIG. 4 shows the assembly process which is the second process. As shown in this figure, the assembly is performed so that the lead 16 a of the heat generating component 16 is inserted into a predetermined hole of the first substrate 18. Next, in order to electrically join between the lead 16a of the heat generating component 16 and the electrode on the first substrate 18, soldering is performed. This process is performed manually with a soldering iron. Through this process, the heat sink 21 and the first substrate 18 are physically fixed. Next, the board-to-board connector 23a of the first board 18 and the board-to-board connector 23b of the second board 20 are aligned and pressed together, thereby realizing electrical connection and physical fixing simultaneously. . Through this process, the heat sink 21, the first substrate 18, and the second substrate 20 are physically fixed.

FIG. 2 shows a third step of attaching the case 15, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a front sectional view cut along the line AA ′ in FIG. 2 (a). .
As shown in FIG. 2A, in the present embodiment, the electronic circuit device 10 has a circular shape in accordance with the outer shape of the compressor 1, and the central portion of the refrigerant discharge port 3 that discharges the refrigerant of the compressor 1. It is hollow for piping. On the second substrate 20, electronic parts such as the microcomputer 19a, inter-board connector 23b, connection connectors 23c, 23d, and the like are mounted on the front and back surfaces by a mounting and mounting method (SMT).

  FIG. 2B shows the shape after the case 15 is attached. The outer cylindrical portion 15 b and the outer cylindrical portion 15 b of the case 15 form an outer peripheral portion and an inner peripheral portion of the electronic circuit device 10, and are in close contact with the heat sink 21. Moreover, while forming the through-hole 12b which lets the fixing protrusion leg 4 for physically fixing with the compressor 1 pass, the cylindrical body which makes the wall surface of this through-hole 12b is attached. Thereafter, electrical inspection is performed, and only non-defective products are transferred to the next process.

  FIG. 5 shows a step of filling the filling resin 30 as the fourth step. As shown in this figure, the filling resin 30 is poured into a portion surrounded by the heat sink 21 and the case 15. In this embodiment, after the filling resin 30 is poured, the electronic circuit device 10 is put into the heating furnace, the air inside the heating furnace is decompressed, and no bubbles remain after the filling resin 30 is cured. To do.

  FIG. 6 shows a step of integrating the electronic circuit device 10 and the compressor 1 as the fifth step. As shown in this figure, an interposing member 11, which is a heat insulator covered with a film on which metal is deposited, is placed on the compressor 1. The interposed member 11 is elastic and absorbs the vibration of the compressor 1. Next, the electronic circuit device 10 whose electrical operation is guaranteed is reversed, and the input terminal 24a of the internal connector 24 of the compressor 1 and the connection connector 23d of the electronic circuit device 10 are aligned and pressed so as to be fitted. . Thereby, the electronic circuit device 10 and the compressor 1 are electrically joined.

  At this time, only when there is a need to shield noise from the compressor 1, GND is added to the U phase, V phase, and W phase, which are the input terminals 24a to the compressor 1, to form four terminals. The input terminal of the GND and the metal vapor deposition film of the interposed member 11 are held and electrically connected by pressing the interposed member 11 by the electronic circuit device 10 and the compressor 1. If there is no need to shield noise from the compressor, GND may not be provided.

FIG. 7 shows a final sixth step, which is a step of fixing the electronic circuit device 10 and the compressor 1 so that they can be electrically driven.
The electric circuit device 10 electrically connected in the above process is physically fixed by the fixing protruding leg 4 and the fixing nut 13. In this embodiment, three places are fixed. At this time, it is necessary to manage the tightening torque in order to stabilize the vibration absorbing effect of the interposed member 11. Next, a motor from the compressor 1 can be rotated by connecting a connector from an external device to the connection connector 23c and supplying power and signals.

  According to the above configuration, in the structure in which the electronic circuit device 10 that operates the motor of the compressor 1 and the compressor 1 are integrated, heat from the compressor 1 is transmitted to electronic components such as the smoothing capacitor 17a and the semiconductor element 17b that are vulnerable to heat. Since it is difficult to heat, an interposition member 11 made of a sheet-like material that suppresses the flow of heat is interposed between the compressor 1 and the electronic circuit device 10 except for an electrically connected portion. The heat of the compressor 1 is hardly transmitted to the electronic circuit device 10 by the interposition member 11, and malfunction of the electronic circuit device 10 due to heat is prevented, and the thermal structural design of the compressor 1 including the electronic circuit device 10 is easy. Can be.

  Further, since the interposing member 11 also has a function of absorbing vibration, the vibration of the compressor 1 is absorbed by the interposing member 11 and is difficult to be transmitted to the electronic circuit device 10. As a result, the electronic circuit device 10 malfunctions due to vibration. Is blocked. Furthermore, since the interposed member 11 also has a function of attenuating noise transmitted from the motor inside the compressor 1, malfunction of the electronic circuit device 10 due to noise is also prevented. Thus, since the electronic circuit device 10 is prevented from malfunctioning due to heat, vibration, and noise, the reliability is improved. In addition, since the interposition member 11 has a function of preventing heat transmission and absorbing vibration and noise, the arrangement space can be reduced and the number of parts can be reduced as compared with the case where three parts having the respective functions are provided. Can be reduced and the time and labor required for assembly can be saved. In addition, it is good to select the thickness and shape of the interposed member 11 according to the calorific value of the compressor 1.

  Further, since the electronic circuit device 10 is provided with the heat sink 21 for cooling the heat generating component 16 through the refrigerant sucked by the compressor 1, the refrigerant compressed by the compressor 1 can be used for cooling the heat generating component 16. The heat generated from the heat generating component 16 is absorbed by the refrigerant passing through the heat sink 21. Further, since the low-temperature refrigerant before passing through the compressor 1 is passed through the heat sink 21, the heat generating component 16 is cooled well.

  Here, as a result of operating the compressor 1 in the conventional structure, when the temperature of the compressor 1 is 115 ° C., the temperature of the heat generating component becomes 175 ° C. or higher, and the electron made of Si semiconductor disposed in the vicinity of the heat generating component A component has become inoperable.

  On the other hand, in the case of the present embodiment using the cooling method by the refrigerant, when the temperature of the compressor 1 is 115 ° C., the temperature of the heat generating component 16 is 125 ° C. due to the action of cooling using the refrigerant. It was suppressed, and it was confirmed that the electronic component 17b made of the Si semiconductor and the microcomputer 19a arranged near the heat generating component 16 operate without problems. Moreover, even when the vibration of the compressor 1 was 3G, it was confirmed that there was no problem at all.

  As a result, the heat generated from the semiconductor of the heat generating component 16 is smoothly transferred to the refrigerant, and the heat is conveyed by the refrigerant. Finally, the heat is radiated to the air by the outdoor unit of the air conditioner or the radiation fins on the back of the refrigerator. It becomes possible to do.

  Further, the heat generating component 16 for switching the electrodes inside the electronic circuit device 10 and the microcomputer 19a do not malfunction, and a highly reliable electronic circuit device integrated compressor can be obtained.

  In the above-described embodiment, the case where Si (silicon) having a low operation guaranteed temperature is used as the semiconductor element (electronic component 17b or the like) of the inverter circuit has been described. However, the present invention is not limited to this. SiC (silicon carbide) may be used, and according to this, it is possible to select the interposed member 11 having a small heat insulating effect.

  The present invention is particularly suitable for a compressor with an electronic circuit device in which an electronic circuit device such as an inverter is attached to a compressor such as an air conditioner or a refrigerator. However, like the compressor, the refrigerant is generated while generating heat, vibration, and noise. Any device that can be used is applicable.

1 is a partially cutaway front view of a compressor with an electronic circuit device according to an embodiment of the present invention. FIG. 2A is a plan view of the electronic circuit device, and FIG. 2B is a front cross-sectional view taken along line A-A ′ in FIG. (A)-(c) is a figure which shows the mounting process of the compressor with an electronic circuit device which concerns on embodiment of this invention, respectively. The figure which shows the assembly process of the compressor with an electronic circuit apparatus which concerns on embodiment of this invention. The figure which shows the process of filling resin for filling of the compressor with an electronic circuit device which concerns on embodiment of this invention. The figure which shows the process of integrating the electronic circuit device and compressor of the compressor with an electronic circuit device which concerns on embodiment of this invention. The figure which shows the process of making the compressor with an electronic circuit device which concerns on embodiment of this invention into an electrically drivable state Sectional view of a conventional electronic circuit device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Compressor 3 Refrigerant discharge port 4 Protruding leg for fixing 10 Electronic circuit device 11 Interposing member 13 Fixing nut 15 Case 16 Heating component 17a Smoothing capacitor (electronic component)
17b Insertion-type electronic components (electronic components)
18 First substrate 19a Microcomputer (electronic component)
19b Resistance (electronic parts)
19c Capacitor (electronic component)
20 Second board 21 Heat sink 23a, 23b Inter-board connector 23c, 23d Connection connector 24 Internal connector 30 Filling resin

Claims (9)

  A compressor with an electronic circuit device, wherein the electronic circuit device is attached to a compressor that compresses a refrigerant via an interposed member that suppresses the flow of heat.   A compressor with an electronic circuit device, wherein the electronic circuit device is attached to a compressor that compresses a refrigerant via an interposed member that absorbs vibration.   A compressor with an electronic circuit device, wherein the electronic circuit device is attached to a compressor that compresses a refrigerant via an interposition member that attenuates noise transmitted from a motor inside the compressor.   An electronic circuit device, wherein an electronic circuit device is attached to a compressor that compresses refrigerant through an interposed member that suppresses heat flow, absorbs vibration, and attenuates noise transmitted from a motor inside the compressor. Compressor with circuit device.   5. The structure according to claim 1, wherein the intervening member is a structure that has improved heat insulation properties by sealing the heat insulating material with a film and forming a reduced-pressure space inside the film. Compressor with electronic circuit device.   A compressor with an electronic circuit device comprising a compressor for compressing a refrigerant and an electronic circuit device attached to the compressor and having a heat generating component, wherein the heat sink for cooling the heat generating component through the refrigerant sucked by the compressor A compressor with an electronic circuit device, wherein the compressor is provided in a device.   The electronic circuit device includes a rectifier circuit that rectifies an AC voltage, and an inverter circuit that converts a DC voltage of the rectifier circuit into an AC circuit again. Compressor with electronic circuit device.   The compressor with an electronic circuit device according to claim 7, wherein a SiC semiconductor element is used in the inverter circuit.   The fixing unit for fixing the electronic circuit device to the compressor, and the connector unit for electrically connecting the compressor and the electronic circuit device and also having a function of fixing the electronic circuit device to the compressor. The compressor with an electronic circuit device of any one of 1-8.

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