JP2009232603A - Power conversion device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion device consisting of conductor patterns whose substrate can be miniaturized and whose heat dissipation efficiency is good without needing a driving element having high radiation. <P>SOLUTION: The power conversion device 1 includes a substrate 4 having a first surface 41 and a second surface 42; a plurality of switching elements 3 for power conversion each provided with an element body 32 and a terminal 31 arranged passing through the substrate 4; a plurality of driving elements, which drive each of the switching element 3; and a plurality of conductor patterns 5, which are formed on the substrate 4 and electrically connect the respective switching elements 3 to driving elements corresponding to the switching elements 3. In this device, at least one of the conductor patterns 5 is formed on the first surface 41 and not formed on the second surface 42, while the remaining conductor patterns 5 are formed on the second surface 42 and not formed on the first surface 41. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a power converter, and more particularly, to a power converter characterized by the arrangement of a conductor pattern that electrically connects a switching element for power conversion used in the power converter and a driving element for driving the element.

In a device using a power device such as a MOSFET or IGBT, for example, a power converter, in order for the power device (switching element for power conversion) to control the power appropriately, the design of the drive circuit that controls the drive of the power device is required. It becomes important. The drive circuit is designed in consideration of the use of the power device, the installation environment, the use conditions, and the like. The drive circuit includes a drive element connected to a terminal of the power device and a conductor pattern that electrically connects the drive element and the terminal of the power device. And it is common to arrange | position on the both surfaces of a board | substrate within the determined range on the board | substrate which the terminal of a power device penetrates. For example, in the drive circuit disclosed in Patent Document 1, a drive circuit for one power device is arranged on both surfaces of one substrate, and the substrate and the substrate are separated from each other by a predetermined interval. At present, it is a mainstream to integrate a plurality of power devices on a single substrate and secure a predetermined interval, and to dispose conductor patterns for each drive circuit with a predetermined interval.
JP 2006-81309 A

  As described above, the conductor pattern of each power device needs to be laid out with driving elements and conductor patterns after securing a predetermined interval. For this reason, the area for forming the conductor pattern on the substrate cannot be reduced, which is an impediment to downsizing the substrate.

  In addition, in order to prevent the temperature of the substrate from being raised due to heat generation of the driving element, a driving element with high heat dissipation is used, which increases the cost.

  The present invention has been made in view of the above problems, and solves the problem of providing a power conversion device including a conductive pattern that can reduce the size of a substrate and does not require a driving element with high heat dissipation, and has high heat dissipation efficiency. It should be a challenge.

The structural features of the invention according to claim 1 for solving the above-described problems are as follows:
A substrate having a first surface and a second surface that is opposite the first surface;
A plurality of power conversion switching elements each including a terminal disposed through the element body and the substrate;
A plurality of driving elements that respectively drive the power conversion switching elements;
A plurality of conductor patterns formed on the substrate and electrically connecting the switching elements for power conversion and the driving elements corresponding to the switching elements for power conversion;
In a power converter having
At least one of the plurality of conductor patterns is formed on the first surface and not formed on the second surface;
The remainder of the plurality of conductor patterns is formed on the second surface and not formed on the first surface.

  According to a second aspect of the present invention, at least a part of the conductor pattern formed on the first surface is the second surface in a normal direction of the first surface. It is formed so that it may overlap with the other conductor pattern formed on the substrate.

  According to a third aspect of the present invention, in the first or second aspect, the conductor pattern is spaced apart from a terminal of the power conversion switching element of the conductor pattern disposed on the opposite surface. Is mounted on the board.

  In addition, the structural features of the invention according to claim 4 are the high temperature side pattern of the conductor pattern that becomes high temperature, the low temperature side pattern that is lower temperature than the high temperature side conductor pattern, in any one of claims 1 to 3, The high temperature side pattern is disposed on the first surface side or the second surface side, and the low temperature side pattern is disposed on the opposite surface side of the surface on which the high temperature side pattern is disposed.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the substrate is formed on the first surface between the first surface and the second surface. And having an insulating layer with a predetermined thickness that insulates the conductive pattern formed on the second surface from the conductive pattern.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the substrate includes a multilayer substrate in which a plurality of single-layer substrates are stacked, and the power conversion device further includes: A first intermediate pattern comprising a plurality of layers formed between the first surface and the second surface and electrically connected to the conductor pattern formed on the first surface; and the first intermediate pattern And the substrate has a through hole through which the probe pin can be inserted through the second surface side to the first test land. .

  A structural feature of the invention according to claim 7 is that, in claim 6, a second test land is formed on the conductor pattern formed on the second surface.

  The structural feature of the invention according to claim 8 is that, in claim 6 or 7, the power converter is formed between the first intermediate pattern and the second surface, and is formed on the second surface. A second intermediate pattern consisting of a plurality of layers electrically connected to the conductor pattern, wherein a boundary of the conductor pattern of a layer close to the first intermediate pattern among the second intermediate patterns is the second intermediate pattern The distance from the through hole is set longer than the boundary of the conductor pattern of the layer far from the first intermediate pattern.

  In the invention which concerns on Claim 1, the conductor pattern for one switching element for power conversion is formed in a 1st surface or a 2nd surface, and a board | substrate is utilized for the insulation of conductor patterns. By doing so, the insulating gap can be reduced, so that the substrate can be miniaturized. Moreover, since the mounting area on the same surface of one conductor pattern can be expanded, heat dissipation is improved. In addition, in a case where a part of the conductor pattern becomes hot, the heat transfer coefficient of the conductor pattern formed on the same surface is higher than the heat transferred from the first surface to the second surface and radiated, Heat can be radiated efficiently without the need for highly heat-dissipating driving elements.

  In the invention which concerns on Claim 2, the conductor pattern for one switching element for power conversion is formed in a 1st surface or a 2nd surface, and a board | substrate is utilized for insulation. Therefore, even if the conductor pattern is formed so as to overlap at least part of the normal direction of the first surface, the conductor pattern arranged on the first surface side and the conductor pattern arranged on the second surface side are surely Insulated with a substrate. Therefore, the substrate can be reduced by the amount of overlapping of the conductor patterns.

  In the invention according to claim 3, in a certain conductor pattern, a conductor pattern is formed on the substrate at a predetermined interval from the terminal of the power conversion switching element of another conductor pattern arranged on the opposite surface of the conductor pattern. Therefore, the substrate can be reduced while securing the insulating gap.

  In the invention which concerns on Claim 4, since heat can be radiated using heat transfer from the surface where a high temperature side pattern is arrange | positioned to the surface where a low temperature side pattern is arrange | positioned, heat dissipation improves. Since heat is made uniform by heat transfer from the high temperature side pattern to the low temperature side pattern, and heat radiation is also made uniform, variations in circuit characteristics due to heat can be improved.

  In the invention which concerns on Claim 5, since it has the insulating layer of predetermined thickness between the 1st surface and the 2nd surface, the conductor pattern formed in the 1st surface and the 2nd surface ensures insulation. Can do.

  In the invention which concerns on Claim 6, when a board | substrate is a multilayer structure, a 1st test land is formed in the 1st intermediate pattern electrically connected to the conductor pattern formed in the 1st surface, A through hole into which the probe pin can be inserted up to the test land is formed from the second surface side. By doing in this way, even if it is a conductor pattern in which the conductor pattern is not formed in the 2nd surface side, a probe pin can be inserted from the 2nd surface side.

  In the invention according to claim 7, the substrate has a through hole into which the probe pin can be inserted from the second surface side into the first test land of the conductor pattern formed on the first surface, Since the second test land is formed for the conductor pattern formed on the surface, the probe pins can be applied to all the test lands from the second surface, that is, the same surface side.

  In the invention which concerns on Claim 8, the boundary of the conductor pattern of the layer close | similar to a 1st intermediate pattern is the 2nd intermediate pattern among the 2nd intermediate patterns formed between a 1st intermediate pattern and a 2nd surface. Is set so that the distance from the through-hole is longer than the boundary of the conductor pattern of the layer far from the first intermediate pattern, the conductor pattern on the first surface side and the conductor pattern on the second surface side Since the area of the conductor pattern can be increased while ensuring the insulation gap, the heat dissipation is improved.

  Hereinafter, the present invention will be specifically described using embodiments.

(Embodiment 1)
FIG. 1 shows a circuit diagram of the power conversion device 1 according to the first embodiment. The power conversion device 1 according to the first embodiment includes a battery 11, a buck-boost converter 12, a motor generator MG1, a motor generator MG2, an MG1 inverter 13, an MG2 inverter 14, and a surge voltage absorbing capacitor 17.

  The battery 11 is connected to the buck-boost converter 12, supplies DC power to the buck-boost converter 12, and stores DC power regenerated from the buck-boost converter 12.

  The step-up / step-down converter 12 boosts the DC power supplied from the battery 11 and outputs the boosted DC power to inverters 13 and 14 described later, and steps down the DC power output from the inverters 13 and 14 and outputs it to the battery 11. The step-up / down converter 12 includes a capacitor 123, a reactor 124, an upper arm switching element (power conversion switching element) 121 which is a high voltage side semiconductor element, and a lower arm switching element (power conversion element) which is a semiconductor element on the high voltage GND side. Switching element) 122 and diodes D1 and D2. One end of the capacitor 123 and the reactor 124 is connected to the positive electrode side of the battery 11, and the other end of the capacitor 123 and the emitter terminal of the lower arm switching element 122 are connected to the negative electrode side. The upper arm switching element 121 and the lower arm switching element 122 are connected in series, and the other end of the reactor 124 is between them, that is, the emitter terminal of the upper arm switching element 121 and the collector of the lower arm switching element 122. Connected to the terminal. The collector terminal of the switching element for the upper arm is connected to one end side of an MG1 inverter 13 and an MG2 inverter 14 which will be described later. The emitter terminal of the lower arm switching element 122 is connected to the other ends of the MG1 inverter 13 and the MG2 inverter 14. Between the collectors and emitters of the switching elements 121 and 122, diodes D1 and D2 that flow current from the emitter side to the collector side are arranged. Then, driving circuits 201 and 202 for controlling the driving of the switching elements are connected to the gate terminals of the switching elements 121 and 122, respectively.

  Motor generator MG1 and motor generator MG2 are connected to MG1 inverter 13 and MG2 inverter 14, respectively, and are driven by electric power supplied from battery 11. When working as a generator, AC power is output to inverters 13 and 14 connected to each.

  The MG1 inverter 13 and the MG2 inverter 14 are connected in parallel, convert the DC power boosted by the buck-boost converter 12 into a three-phase AC, and output it to the motor generators MG1 and MG2. When motor generators MG1 and MG2 function as generators, AC power output from motor generators MG1 and MG2 is converted to DC and output to step-up / down converter 12.

  The MG1 inverter 13 includes a U phase 131, a V phase 132, and a W phase 133, and the U phase 131, the V phase 132, and the W phase 133 are connected to the step-up / down converter 12 in parallel. In the U-phase 131, a switching element 134 for the upper arm of the semiconductor element on the high voltage side and a switching element 135 for the lower arm of the semiconductor element on the high voltage GND side are connected in series. Similarly, an upper arm switching element 136 and a lower arm switching element 137 are connected in series in the V phase, and an upper arm switching element 138 and a lower arm switching element 139 are connected in series in the W phase. And between the collector-emitter of each switching element 134-139, the diodes D3-8 which flow an electric current from the emitter side to the collector side are each connected. Drive circuits 203 to 208 for controlling the driving of the switching elements are connected to gate terminals of the switching elements 134 to 139. An intermediate point of each phase is connected to each phase end of each phase coil (not shown) of motor generator MG1.

  The MG2 inverter 14 includes a U phase 141, a V phase 142, and a W phase 143, and the U phase 141, the V phase 142, and the W phase 143 are connected in parallel to the step-up / down converter 12 and the MG1 inverter 14. . In the U-phase 141, a switching element 144 for the upper arm of the semiconductor element on the high voltage side and a switching element 145 for the lower arm of the semiconductor element on the high voltage GND side are connected in series. Similarly, the upper arm switching element 146 and the lower arm switching element 147 are connected in series in the V phase, and the upper arm switching element 148 and the lower arm switching element 149 are connected in series in the W phase. And between the collector-emitter of each switching element 144-149, the diodes D9-14 which flow an electric current from the emitter side to the collector side are each connected. Drive circuits 209 to 214 for controlling the driving of the switching elements are connected to gate terminals of the switching elements 144 to 149. An intermediate point of each phase is connected to each phase end of each phase coil (not shown) of motor generator MG2. Here, the switching elements included in the buck-boost converter 12 and the inverters 13 and 14 use power devices such as IGBTs and MOSFETs.

  The power converter 1 of the present invention boosts DC power of the battery 11 with a step-up / down converter 12 and converts it into three-phase AC with inverters 13 and 14 to drive motor generators MG1 and MG2. When motor generators MG 1 and MG 2 function as generators, AC power output from motor generators MG 1 and MG 2 is converted into DC power by inverters 13 and 14, stepped down by step-up / down converter 12, and regenerated in battery 11. Is done.

  As shown in FIG. 2, each switching element 121, 122, 134-139, 144-149 (hereinafter referred to as “switching element 3” when described using one switching element for explanation). The terminal 31 passes through the substrate 4 having the first surface 41 and the second surface 42 and is held by the substrate 4. The substrate 4 is provided with driving circuits 201 to 214 (hereinafter referred to as “driving circuit 2” when described using one driving circuit) for driving the switching elements 3, respectively, and is a conductor of a conductive substance. The pattern 5 is electrically connected to the terminal 31 of the switching element 3. That is, the conductor pattern 5 is a wiring that electrically connects the terminal 31 and the drive circuit 2. A land 43 through which the terminal 31 penetrates from the second surface 42 to the first surface 41 is formed on the substrate 4. The terminal 31 penetrates the land 43, and the main bodies 32 of all the switching elements 3 are located on the second surface 42 side of the substrate 4. The main body 32 of the switching element 3 includes a diode 6 for detecting the temperature of the switching element 3 in addition to the switching element 3 as shown in FIG. The terminal 6 is also described as the terminal 31 of the switching element 3.

  The drive circuit 2 connected to the terminal 31 of the switching element 3 includes various drive elements. Of the plurality of terminals 31 of the switching element 3, the gate terminal is connected to the gate drive IC 21, the sense emitter terminal is connected to the short-circuit protection and overcurrent protection device 22, the emitter terminal is connected to the reference potential, and the anode terminal of the diode 6 is connected to the temperature detection device 23. The cathode terminal is connected to a reference potential. These connections are made by the conductor pattern 5. The gate driving IC 21 applies a gate voltage for controlling the operation of the switching element 3. The short circuit protection and overcurrent protection device 22 is a device that detects an abnormality before the switching element 3 malfunctions or is destroyed due to a current exceeding the allowable amount of the switching element 3 flowing. The temperature detection device 23 is a device that detects the temperature based on the output value of the diode 6. Further, the drive circuit 2 receives a signal output from a central control device (MG ECU) for controlling MG1 and MG2, and outputs a signal.

  Returning to FIG. 2, for example, the three switching elements 3 in FIG. 2 are referred to as switching elements 134, 135, and 136 from the left. The drive circuit 2 and the conductor pattern 5 for the switching element 134 are on the first surface 41, the drive circuit 2 and the conductor pattern 5 for the switching element 135 are on the second surface 42, and the drive circuit 2 and the conductor pattern 5 for the switching element 136 The conductor pattern 5 is disposed on the first surface 42. Therefore, when the substrate 4 is viewed from the first surface 41 side, the conductor pattern 5 of the switching elements 134 and 136 can be seen.

  The substrate 4 has a thickness sufficient to insulate the conductive pattern 5 on the first surface 41 side from the conductive pattern 5 on the second surface side. The switching element 3 and the conductor pattern 5 are arranged on the substrate 4 with a predetermined interval of an insulation gap d for each switching element 3. Therefore, the conductor patterns 5 of the switching elements 134 and 136 arranged on the same surface are arranged with an insulation gap d apart, and the conductor pattern 5 of the switching element 135 arranged on the second surface 42 on the back surface is also the same. The conductor pattern 5 arranged on the surface and the insulating gap d are arranged apart from each other. The conductor pattern 5 is disposed on the second surface 42, but the terminal 31 of the switching element 135 penetrates to the first surface 41 side. Therefore, the switching element 134 and the conductor pattern 5 of the switching element 136 that are arranged on the first surface 41 and are located on the left and right of the switching element 135 are arranged with the insulating gap d from the terminal 31 of the switching element 135. The conductor pattern 5 arranged on the first surface 41 side and the conductor pattern 5 arranged on the second surface 42 side are part of the conductor pattern 5 in the normal direction of the first surface 41 or the second surface 42. Overlap. The conductor pattern 5 of each switching element 3 has an inverted T shape centered on the terminal 31. In the case of the switching element 135, both ends of the conductor pattern 5 overlap the conductor patterns 5 of the switching elements 134 and 135. The drive circuit 2 is arranged on a straight line of the terminal 31 on the conductor pattern 5 for one switching element 3. The drive circuit 2 may be disposed anywhere on the conductor pattern 5.

  As a conventional example, as shown in FIG. 4B, when the conductor pattern 5 is formed on both surfaces 41 and 42 of the substrate 4 for one switching element 3, an insulation gap d must be ensured. Therefore, the conductor patterns 5 of the other switching elements 3 cannot be overlapped. And in the power converter device 1 of this Embodiment 1, as shown to Fig.4 (a), in order to form the conductor pattern 5 in the single side | surface of the board | substrate 4 about one switching element 3, and to utilize the board | substrate 4 for insulation The conductor pattern 5 can be overlapped. Thereby, the mounting area of the conductor pattern 5 is increased and the substrate 4 can be downsized. And since the area of the conductor pattern 5 increases, even if the conductor pattern 5, the drive circuit 2, etc. generate high heat, heat can be released over a wide area, so that the heat dissipation efficiency is improved. Further, in the conventional arrangement, when only the first surface 41 side becomes hot, the heat is transferred to the second surface 42 side through the substrate 4. However, when the conductor pattern 5 is formed on one side as in the first embodiment, heat is transmitted to the entire conductor pattern 5 faster than the substrate 4, so that the heat dissipation efficiency is high.

(Embodiment 2)
Embodiment 2 of the present invention will be specifically described. The second embodiment has basically the same configuration and the same function and effect as the first embodiment. The following description will focus on the different parts.

  As shown in FIG. 5, the power conversion device 1 according to the second embodiment is a high-temperature side pattern 51 in which the conductor pattern 5 formed on the first surface 41 becomes a high temperature, and the conductor pattern formed on the second surface 42. 5 is a low-temperature side pattern 52 that does not easily reach a high temperature. By doing so, heat can be dissipated using heat transfer from the first surface 41 side, which is hot, to the second surface 42 side, which is relatively difficult to reach high temperature, and thus heat dissipation is improved. And by transferring heat and making heat radiation uniform, variation in circuit characteristics due to heat can be improved.

(Embodiment 3)
Embodiment 3 of the present invention will be specifically described. The third embodiment basically has the same configuration and the same function and effect as the first or second embodiment. The following description will focus on the different parts.

  As shown in FIG. 6, the power conversion device 1 according to the third embodiment includes a multilayer substrate in which a substrate 4 is formed by stacking a plurality of single-phase substrates. Therefore, the power conversion device 1 according to the third embodiment includes a first intermediate pattern 53 that is formed between the first surface 41 and the second surface 42 and is electrically connected to the conductor pattern 5 on the first surface 41. And a second intermediate pattern 54 formed between the first intermediate pattern 53 and the second surface 42 and electrically connected to the conductor pattern 5 on the second surface 42. The power conversion device 1 further includes a first test land 71 formed on the first intermediate pattern 53 and a second test land 72 on the conductor pattern 5 formed on the second surface 42. The substrate 4 has a through hole 44 that penetrates from the second surface 42 side to the first test land 71 and into which the probe pin 8 can be inserted. The first test land 71 and the through hole 44 extend in the direction of extension of the terminal 31 of the switching element 3 in which the conductor pattern 5 is formed on the first surface 41, and the conductor pattern 5 and the second intermediate pattern 54 on the second surface 42. It is formed in a place where an insulation gap d located between them is provided. This location can also be provided in the conductor pattern 5 and the second intermediate pattern 54 on the second surface 42, but in this case, the first intermediate pattern 53 provided with the first test land 71 to the second surface 42. It is necessary that the conductor pattern 5 and the second intermediate pattern 54 be separated from each other so that the boundary between the conductor pattern 5 and the second intermediate pattern 54 can be separated.

  When the conductor pattern 5 is on the first surface 41 side, the first test land 71 is provided on the second surface 42 side, and through holes 44 up to that are provided in the substrate 4, thereby providing the conductor pattern on the first surface 41 side. The probe pin 8 can also be inserted from the second surface 42 side into the conductor pattern 5 in which 5 is formed. And the probe pin 8 can also be inserted from the 2nd surface 42 side also in the conductor pattern 5 in which the conductor pattern 5 is formed in the 2nd surface 42 side. That is, the probe 4 can be inserted only from the second surface 42 side to inspect the substrate 4 and the like.

(Embodiment 4)
Embodiment 4 of the present invention will be specifically described. The fourth embodiment basically has the same configuration and the same function and effect as the third embodiment. The following description will focus on the different parts.

  As shown in FIG. 7, in the power conversion device 1 of the fourth embodiment, the boundary of the pattern 541 in the layer close to the first intermediate pattern 53 in the second intermediate pattern 54 is the first in the second intermediate pattern 54. The distance from the through hole 44 is longer than the boundary of the layer pattern 542 far from the intermediate pattern 53. That is, the boundary of the conductor pattern is formed in a staircase pattern from the conductor pattern 5 on the second surface 41 toward the first intermediate pattern 53.

  By doing in this way, the 1st intermediate pattern 53 in which the 1st test land 71 was formed and opened to the 2nd surface 42 side is the conductor pattern 5 and the 2nd intermediate pattern 54 by the 2nd surface 42 side. The area of the conductor pattern increases while securing the insulation gap d therebetween.

(Modification)
The modification of this invention is demonstrated concretely. This modification basically has the same configuration and the same function and effect as the first, second, third, or fourth embodiment. The following description will focus on the different parts.

  As shown in FIG. 8, the power conversion device 1 of this modification is different from the shape shown in the first embodiment in the shape of the conductor pattern 5 formed on the substrate 4. In the conductor pattern 5 according to this modification, only one of the conductor patterns 5 of the switching element 3 in which the conductor pattern 5 of one switching element 3 is located on the opposite surface is in the normal direction of the first surface 41 or the second surface 42. It overlaps and does not overlap with the conductor pattern 5 of the other switching element 3. For example, the conductor pattern 5 of the switching element 134 and the swing element 135 overlaps in the normal direction of the first surface 41 or the second surface 42, the conductor pattern 5 of the switching elements 136 and 137 overlaps, and the conductor of the switching elements 138 and 139 Pattern 5 overlaps. That is, the conductor pattern 5 of the switching element 136 does not overlap the conductor pattern 5 of the switching element 135 or the switching element 139. The conductor pattern 5 of the switching element 136 is L-shaped, the conductor pattern 5 of the switching element 137 is inverted L-shaped, and the two overlapping conductor patterns 5 have a quadrilateral shape when viewed from one side. The conductive pattern 5 of the switching element 136 is separated from the terminal 31 of the switching element 137 by the insulation gap d, and is separated from the conductive pattern 5 of the switching element 134 on the left side in the first surface 41 direction, so that the switching on the right side is performed. The insulation gap d is separated from the conductor pattern 5 of the element 138. The conductive pattern 5 of the switching element 137 is separated from the terminal 31 of the switching element 136 by the insulation gap d, is separated from the conductive pattern 5 of the switching element 135 on the left by the insulation pattern d, and is conductive from the switching element 139 on the right. 5 away from the insulation gap d.

  By doing in this way, compared with the conventional case where the insulation gap d of only (number of switching elements 3 −1) is required, the insulation gap d between the conductor patterns 5 does not overlap (number of switching elements 3 ÷ 2−2). Only 1) needs to be secured, and the substrate 4 can be downsized. In addition, since the conductor patterns 5 with which the insulation gap d overlaps need only secure the insulation gap d from the terminal 31 of the switching element 3 of the conductor pattern 5 on the opposite surface, the area of the conductor pattern 5 while securing the insulation gap d. Can be enlarged.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, the shape of the conductor pattern 5 is not limited to a T shape or an L shape.

1 is a circuit diagram of a power conversion device 1 according to a first embodiment. It is the upper side figure and side view of the board | substrate 4 which are used for the power converter device 1 of this Embodiment 1. FIG. 2 is a configuration diagram of one switching element 3 and its driving circuit 2 used in the power conversion device 1 of Embodiment 1. (A) The top view and side view of the board | substrate 4 used for the power converter device 1 of this Embodiment 1, (b) The top view and side view of the conventional board | substrate 4. It is the upper side figure and side view of the board | substrate 4 which are used for the power converter device 1 of this Embodiment 2. It is the upper side figure and side view of the board | substrate 4 which are used for the power converter device 1 of this Embodiment 3. It is the upper side figure and side view of the board | substrate 4 which are used for the power converter device 1 of this Embodiment 4. It is the upper side figure and side view of the board | substrate 4 which are used for the power converter device 1 of this modification.

Explanation of symbols

1: power converter, 11: battery, 12: buck-boost converter,
13: MG1 inverter, 14: MG2 inverter,
17: Surge voltage absorbing capacitor,
121, 122, 134 to 139, 144 to 149: switching elements,
123: Capacitor, 124: Reactor,
2: drive circuit, 21: gate drive IC, 22: short circuit protection and overcurrent protection device, 23: temperature detection device, 201-214: drive circuit,
3, 121, 122, 134-139, 144-149: switching element, 31: terminal, 32: main body,
4: substrate, 41: first surface, 42: second surface, 43: land, 44: through hole,
5: Conductor pattern, 51: High temperature side pattern, 52: Low temperature side pattern, 53: First intermediate pattern, 54: Second intermediate pattern,
6: Diode,
71: First test land, 72: Second test land,
8: Probe pin,
D1 to D14: Diode, MG1, MG2: Motor generator.

Claims (8)

A substrate having a first surface and a second surface that is opposite the first surface;
A plurality of power conversion switching elements each including a terminal disposed through the element body and the substrate;
A plurality of driving elements that respectively drive the power conversion switching elements;
A plurality of conductor patterns formed on the substrate and electrically connecting the switching elements for power conversion and the driving elements corresponding to the switching elements for power conversion;
In a power converter having
At least one of the plurality of conductor patterns is formed on the first surface and not formed on the second surface;
The remainder of the plurality of conductor patterns is formed on the second surface and is not formed on the first surface.   The at least one part of the said conductor pattern formed in the said 1st surface is formed so that it may overlap with the said other conductor pattern formed in the said 2nd surface in the normal line direction of the said 1st surface. The power converter device described in 1.   3. The power conversion device according to claim 1, wherein the conductor pattern is formed on a substrate at a predetermined interval from a terminal of the power conversion switching element of the conductor pattern disposed on the opposite surface. A high-temperature side conductor pattern of a conductor pattern that becomes high temperature, and a low-temperature side conductor pattern that is lower in temperature than the high-temperature side conductor pattern,
The high temperature side conductor pattern is disposed on the first surface side or the second surface side,
The power converter according to any one of claims 1 to 3, wherein the low-temperature side conductor pattern is disposed on a surface opposite to a surface on which the high-temperature side conductor pattern is disposed.   The substrate has an insulation having a predetermined thickness between the first surface and the second surface so that the conductor pattern formed on the first surface is insulated from the conductor pattern formed on the second surface. The power converter device of any one of Claims 1-4 which has a layer. The substrate is a multilayer substrate in which a plurality of single-layer substrates are stacked,
The power converter is
Further, a first intermediate pattern formed between the first surface and the second surface and made of a plurality of layers electrically connected to the conductor pattern formed on the first surface;
A first test land formed in the first intermediate pattern;
With
6. The power conversion device according to claim 1, wherein the substrate has a through hole that penetrates from the second surface side to the first test land and into which a probe pin can be inserted.   The power conversion device according to claim 6, wherein a second test land is formed on the conductor pattern formed on the second surface. The power conversion device includes a second intermediate pattern that is formed between the first intermediate pattern and the second surface, and includes a plurality of layers that are electrically connected to the conductor pattern formed on the second surface. Prepared,
Of the second intermediate pattern, the boundary of the conductor pattern of the layer close to the first intermediate pattern is closer to the through hole than the boundary of the conductor pattern of the layer farther from the first intermediate pattern of the second intermediate pattern. The power converter according to claim 6 or 7, wherein the distance is set to be long.

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