JP2003153552A - Arrangement structure and arrangement method for inverter, and compressor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To curtail the cost up accompanying the connection between an inverter circuit and a compressor, and to mount the inverter circuit without depending upon the layout within a device by downsizing the inverter circuit. SOLUTION: In the arrangement structure of the inverter circuit which controls the motor 15 of a compressor 10 having the motor 15 inside, a casing 4 having accommodated a circuit board 3, where the inverter circuit is mounted, is attached to the outer shell 11 of the compressor 10 so as to reduce the cost. Besides, heat radiative face of a semiconductor 1 for power control mounted on the circuit board 3 is thermally connected to a heat radiator 7 provided at the casing 4. The heat radiator 7 of the casing 4 is thermally connected to a refrigerant introduced into the compressor 10. The heat generated from the semiconductor 1 for power control is conducted effectively to the refrigerant via the heat radiator 7 and the outer shell 11 of the compressor 10, thus downsizing the inverter circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an arrangement structure and an arrangement method of an inverter circuit for controlling a motor in a compressor having a built-in motor used in air conditioners and the like, and a compressor.

[0002]

2. Description of the Related Art In recent years, in an apparatus using a compressor such as an air conditioner or a refrigerator, an inverter system having a high power conversion efficiency is often used from the viewpoint of energy saving. In the inverter circuit, direct current is converted into high frequency power by performing switching by a power control semiconductor. By switching the frequency of this switching, the rotational speed of the motor built into the compressor is changed according to the required output, thereby realizing energy saving.

A conventional mounting structure of an inverter circuit will be described. In the inverter circuit, a transistor called an IGBT is generally used as a power control semiconductor. In this power control semiconductor, a slight loss occurs when switching is repeated, the heat is converted into heat energy, and heat is generated from the semiconductor. Therefore, it is necessary to attach a heat sink and keep the temperature below a certain temperature so that the characteristics of the semiconductor are not lost.

FIG. 8A shows a general mounting structure of a lead insertion type transistor. Here, since the heat radiation surface 41a of the semiconductor 41 is provided on the back surface of the package, the heat radiation plate 44 is attached so as to be in contact with the heat radiation surface 41a. At the time of attachment, in order to prevent deterioration of heat transfer at the interface between the heat dissipation surface 41a and the heat dissipation plate 44, generally, silicon grease having good heat conduction is applied to the interface or the heat dissipation plate 44 is screwed to the package. . In the lead-insertion type package, the heat sink 44 is arranged vertically to the printed board 43 because it is inserted vertically to the printed board 43. Further, by bending the leads 42 of the semiconductor 41, it is possible to dispose the heat dissipation plate 44 in parallel with the printed circuit board 43 with the heat dissipation surface side facing upward.

Further, FIG. 8B shows a general mounting structure of a surface mounting type transistor. In the surface mounting type semiconductor 45, the heat dissipation surface 45a also serves as an electrode, and is configured to be flush with other leads 60. Since all the electrodes are arranged to be bonded to the printed board 43, the heat dissipation surface 45 a comes into contact with the printed board 43. However, a general printed circuit board 43
A glass epoxy resin or a paper phenol resin is used for the above, but since these resins have low thermal conductivity, the heat generated from the semiconductor 45 cannot be sufficiently dissipated.

Therefore, in an inverter circuit using the surface-mounting type semiconductor 45, a metal substrate 46 constituted by an aluminum plate as a base is generally used. Metal substrate 46
An insulating layer 48 is provided on the surface of the aluminum plate 47, and a wiring pattern 49 is formed on the insulating layer 48.
Further, the wiring pattern 49 is formed by a resist so that only a necessary portion is exposed.

With this mounting structure, the heat generated from the semiconductor 45 is transferred to the opposite side through the aluminum plate 47. The aluminum plate itself not only has a high thermal conductivity but also has a large heat capacity, so that it can absorb general heat generation. Further, when the amount of heat generation becomes large, the temperature rise of the semiconductor 45 can be suppressed by attaching a heat dissipation plate to the aluminum surface of the metal substrate 46.

In addition to the power control semiconductors, the inverter circuit is generally provided with control circuit parts for controlling these semiconductors and a power supply circuit for driving the circuits.

Next, the configuration of the conventional compressor is shown in FIG.
Will be described with reference to. In a refrigeration cycle used in air conditioners and refrigerators, refrigerant vapor is first compressed by a compressor and converted into high pressure vapor. The heat of vaporization is then released in the condenser and liquefied. Next, the process is repeated in which the pressure is reduced by the expansion valve, the temperature becomes low, the heat is absorbed from the surroundings in the evaporator to evaporate, and the mixture is put in the compressor again. Here, cold air is generated by absorbing heat in the evaporator.

In order to realize this refrigeration cycle, the outer shell 51 of the compressor 50 is composed of a high-pressure container, and is provided with a suction port 52 for letting in the refrigerant vapor and a discharge port 55 for the high-pressure vapor. In addition, a motor 54 for driving the compression unit 53 that compresses the refrigerant is built in. The outer shell 51 is provided with electrodes 56 for controlling the driving of the motor 54. When operating this compressor, the temperature of the refrigerant flowing in is 10 to 20 ° C., and the compressed refrigerant is 80 to 9 ° C.
It has risen to around 0 ° C.

The inverter circuit for driving the compressor 50 is arranged so as to be electrically connected to the electrode 56 via an electric wire (not shown). Furthermore, since the current applied to drive the compressor 50 is a large current of about 20 A, it is generally connected using an electric wire having a large current capacity. Further, since the compressor 50 is installed in the outdoor unit in the room air conditioner and is installed in the lower part of the main body in the refrigerator, the temperature and humidity environment is not good. Therefore, the printed circuit board including the inverter circuit is separated from the compressor 50 and the protective container is installed. It is installed in a place where environmental measures such as

Further, in the case of a conventional general vehicle air conditioner, the rotation shaft of the engine and the rotation shaft of the compressor are connected by a belt, and there is a method of driving the compressor by utilizing the rotation of the engine. It is taken. Therefore, electric control is not performed in the circulation of the refrigeration cycle. This is a method adopted because the drive source of the compressor will not be lost because the rotating shaft of the engine always rotates as long as the engine is running. The occupied space can be reduced compared to a home air conditioner.

However, in a hybrid vehicle that uses both a motor and an engine, the engine is stopped when the vehicle is idling while the vehicle is stopped. Therefore, in the conventional mechanical air conditioner, the rotation of the compressor can be maintained. I can not do it. Further, in an electric vehicle that is driven only by a motor, the traveling motor rotates only when it is necessary for traveling, so there is no rotating shaft that can be used to drive the compressor. Therefore, hybrid vehicles and electric vehicles require an electrically controlled air conditioner similar to a home air conditioner.

At this time, when the inverter circuit is arranged in the engine room, since the ambient temperature changes greatly and the humidity changes greatly, the inverter circuit is housed in a special case as a measure for protecting the circuit. At this time,
It is generally housed in a strong metal case for waterproofing and dustproofing. Further, in the engine room of an automobile, it is not allowed to generate noise from the inverter circuit of the air conditioner because it is the highest priority to ensure the driving stability of the engine and the traveling motor. Therefore, it is necessary to use a dedicated shield wire for connecting the inverter circuit and the electrodes of the compressor.

[0015]

However, in the above-mentioned arrangement structure of the inverter circuit, the circuit portion and the compressor body are separated from each other, and a wire is required for electrical connection. Therefore, it is necessary to consider the required wire length and wiring method, and it is necessary to use an expensive shielded wire that does not diffuse noise as the wire, which requires the material cost of the wire and the man-hours for connection. However, there is a problem that not only the cost becomes high, but also the assembly becomes complicated.

Further, in the mounting structure of the inverter circuit as described above, there is a problem that the space for accommodating the inverter circuit is restricted by the arrangement of the heat dissipation plate and the occupied volume becomes large, which makes it difficult to downsize the device.

More specifically, since the heat dissipation plate attached to the lead insertion type power control semiconductor is arranged vertically to the printed circuit board, the volume occupied by the space increases in addition to the area of the printed circuit board. . An inverter circuit generally uses a pair of transistors to control one phase, and the motor used in the compressor is generally a three-phase motor, so six transistors are required. Since a heat sink is required for each of the plurality of transistors, a circuit using a lead insertion type semiconductor cannot be miniaturized.

On the other hand, when a surface mount type semiconductor is used, heat can be radiated through the metal substrate as described above, but the metal substrate has a higher material cost than the resin substrate. However, a dedicated mold is required to obtain a uniform shape, which results in an expensive substrate. Therefore, there is a problem in that the cost is high in the mounting structure of the inverter circuit using the combination of the surface mounting type semiconductor and the metal substrate.

Further, since the aluminum surface is exposed on one surface of the metal substrate as described above, the surface on which electronic components are mounted is only on one side. Therefore, if the inverter circuit and the accompanying control circuit and power supply circuit are included, occupying a large area if it is composed of only a metal substrate, and the part that needs heat dissipation is directly under the power control semiconductor, but the entire circuit Would have to be constructed from expensive metal substrates. Further, since the metal substrate has no through hole, the lead insertion part cannot be used. For this reason, when a metal substrate is usually used, the heat generating part, the control circuit, and the power supply circuit are separate printed circuit boards, but in that case, a connector for connecting a plurality of boards is required, and the connector is connected. It also requires man-hours.

Further, since the heat radiating surface of the metal substrate needs to be arranged so as to come into contact with the outside air, there is a problem that the arrangement of the substrate is restricted, the manufacturing cost becomes high and the size cannot be reduced.

Further, the heat generated from the power control semiconductor needs to be radiated through the heat radiating plate to suppress the temperature rise of the semiconductor. However, in order to ensure the heat radiating from the heat radiating plate, air cooling is performed. In this case, it is necessary to arrange the fan so that the wind hits the heat radiating plate well, and there is a problem that the arrangement of the inverter circuit is restricted and the miniaturization cannot be performed because the fan forcing the wind is arranged.

Further, in the case of a vehicle air conditioner, the atmospheric temperature in the engine room is expected to reach 100 ° C. or higher, so that it cannot be cooled by air cooling, and the temperature rise is prevented by water cooling. However, not only does it have to provide water pipes for cooling, which increases cost,
When the layout flexibility is lost and the car engine room is laid out mainly for the drive motor, the space allocated to the air conditioner equivalent to accessories is limited, and the volume occupied by the inverter circuit is large. There is a problem that it can not be installed in.

In view of the above-mentioned conventional problems, the present invention can suppress an increase in cost associated with connection, can miniaturize an inverter circuit, and can be mounted without being restricted by layout. And to provide a compressor.

[0024]

The arrangement structure of an inverter circuit according to the present invention is an arrangement structure of an inverter circuit for controlling a motor of a compressor having a built-in motor, and a circuit board having the inverter circuit mounted thereon is provided. The housing that is housed is attached to the outer shell of the compressor, and the inverter circuit is integrated with the compressor to achieve downsizing, and the connecting cables and work steps for connecting can be reduced. Since it is not necessary to use a shield wire for noise prevention, the cost for connection can be reduced and the cost can be reduced.

Further, the heat radiation surface of the power control semiconductor mounted on the circuit board is thermally connected to the heat radiation body provided in the casing, and the heat radiation body of the casing is combined with the refrigerant introduced into the compressor. Connection, the heat generating portion of the inverter circuit can be cooled by the refrigerant of the compressor via the heat radiator provided in the housing, so that it is not necessary to dispose a large number of heat radiating means. No extra parts or space is needed, and you can reduce the size of the inverter circuit without increasing its cost.
It can be mounted without being restricted by the layout.

When a plurality of lead frames made of metal are embedded in the housing and connected to the inverter circuit through the through holes provided in the circuit board, a connector for connecting the circuit board to the outside is provided. Can be electrically connected without doing so, the inverter circuit can be downsized, and the cost can be reduced.

Further, the lead frame is mechanically coupled to the electrodes attached to the compressor, the external power source, and the connector of the signal control circuit on the side opposite to the side where the lead frame is connected to the circuit board. It is not necessary to provide a connector or wiring for connecting to a power source or a control unit, and the cost of the inverter circuit can be reduced.

Further, a plurality of lead frames made of metal are embedded in a housing, a first circuit board on which a power control semiconductor is mounted, and a second circuit board on which electronic parts mainly for signal processing are mounted. , And the lead frame through through holes respectively, the power control semiconductor, which is mainly the heat generating part of the inverter circuit, the control circuit, and the power supply circuit are separated and divided into a plurality of circuit boards to improve cooling performance. The inverter circuit can be miniaturized while maintaining it,
Both can be electrically connected without arranging a connector,
It is possible to reduce the size and cost of the inverter circuit.

Further, a plurality of lead frames made of metal are embedded in the housing, a part of the lead frame is exposed on the surface of the housing at a desired position to form an electrode, an electronic component is mounted, and a radiator is provided. When the power control semiconductor is mounted on the surface on which the power control semiconductor is mounted, a part of the lead frame is used as a circuit board, so that the width of the circuit pattern is reduced in the power control semiconductor peripheral circuit to which a large current is applied. Therefore, the inverter circuit can be downsized.

Further, in the power control semiconductor, at least one IC chip is connected upward on the heat spreader made of metal, the electrodes for electrical connection are collectively arranged on one surface, and the other surface is a heat dissipation surface. With this configuration, the heat dissipation surface and the electrical connection surface can be separated via the semiconductor, and the inverter circuit can be downsized.

If the lead frame is made of copper or brass, the inverter circuit and the case wiring can be easily formed.

Further, it is preferable that the housing is made of a thermoplastic resin or a thermosetting resin, so that a housing having a desired function can be easily formed.

Further, the method of arranging the inverter circuit of the present invention is a method of arranging an inverter circuit for controlling a motor of a compressor having a built-in motor, wherein the heat dissipation surface of the power control semiconductor is the surface of the circuit board. And the circuit board is arranged in the housing so that the heat radiation surface of the power control semiconductor is thermally connected to the heat radiator provided in the housing housing the circuit board. And a step of attaching the housing to the outer shell of the compressor so that the radiator is thermally connected to the refrigerant introduced into the compressor, and the inverter circuit is integrated with the compressor. The size can be reduced, the cost for connection can be reduced and the cost can be reduced, and the heat generating part of the inverter circuit can be cooled by the refrigerant of the compressor through the radiator provided in the housing. Extra parts and spaces for cooling Becomes unnecessary, arrangement structure of the inverter circuit can be downsized without increasing the cost of the inverter circuit can be rationally configure.

Further, as a process of manufacturing the housing, a process of processing a metal plate by etching or pressing to obtain a lead frame having a desired pattern, and a process of placing the lead frame in a mold and injection molding the lead frame into a resin. By including the step of burying in, the housing in which the electrical connection wiring is embedded can be easily manufactured without increasing the product cost, and the miniaturized inverter circuit can be easily manufactured.

Further, the method includes the step of fitting and arranging the lead frame exposed in the housing into the through hole provided in the circuit board, and the step of electrically connecting the through hole and the lead frame by soldering. The case and the circuit board can be easily connected, and a miniaturized inverter circuit can be easily manufactured.

Further, the compressor of the present invention is a compressor having a built-in motor and having an inverter circuit for controlling the motor, wherein a casing housing a circuit board on which the inverter circuit is mounted is used as the compressor. Since it is attached to the outer shell, the inverter circuit can be integrated with the compressor to achieve downsizing, and the connecting cables and work steps for connecting can be reduced. Since it is not necessary to use it, the cost for connection can be reduced and the cost can be reduced.

Further, a circuit board on which the power control semiconductor is mounted with its heat radiation surface facing away from the substrate surface and a heat radiator are provided, and the heat radiation body and the heat radiation surface of the power control semiconductor are thermally connected. When the housing is attached to the outer shell of the compressor so that the radiator is thermally connected to the refrigerant introduced into the compressor, Since the heat generating part can be cooled by the refrigerant of the compressor via the heat radiator provided in the housing, it is not necessary to arrange many large heat radiating means, and no extra parts or space for cooling is required. Therefore, the size of the inverter circuit can be reduced without increasing the cost, and the inverter circuit can be mounted without being restricted by the layout.

When a plurality of lead frames made of metal are embedded in the case and connected to the inverter circuit through the through holes provided in the circuit board, a connector for connecting the circuit board to the outside is provided. Can be electrically connected without doing so, the inverter circuit can be downsized, and the cost can be reduced.

Further, the lead frame is mechanically coupled to the electrodes attached to the compressor, the external power source, and the connector of the signal control circuit on the side opposite to the side where the lead frame is connected to the circuit board. It is not necessary to provide a connector or wiring for connecting to a power source or a control unit, and the cost of the inverter circuit can be reduced.

Further, a plurality of lead frames made of metal are embedded in a housing, a first circuit board on which a power control semiconductor is mounted, and a second circuit board on which electronic parts mainly for signal processing are mounted. , And the lead frame through through holes respectively, the power control semiconductor, which is mainly the heat generating part of the inverter circuit, the control circuit, and the power supply circuit are separated and divided into a plurality of circuit boards to improve cooling performance. The inverter circuit can be miniaturized while maintaining it,
Both can be electrically connected without arranging a connector,
It is possible to reduce the size and cost of the inverter circuit.

Further, a plurality of lead frames made of metal are embedded in the housing, a part of the lead frame is exposed on the surface of the housing at a desired position to form an electrode, an electronic component is mounted, and a radiator is provided. When the power control semiconductor is mounted on the surface on which the power control semiconductor is mounted, a part of the lead frame is used as a circuit board, so that the width of the circuit pattern is reduced in the power control semiconductor peripheral circuit to which a large current is applied. Therefore, the inverter circuit can be downsized.

Further, in the power control semiconductor, at least one IC chip is connected upward on the heat spreader made of metal, the electrodes for electrical connection are collectively arranged on one surface, and the other surface is a heat dissipation surface. With this configuration, the heat dissipation surface and the electrical connection surface can be separated via the semiconductor, and the inverter circuit can be downsized.

[0043]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A first embodiment in which the arrangement structure of an inverter circuit according to the present invention is applied to a compressor used in an outdoor unit of a home air conditioner will be described below with reference to FIG. 2 will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes a power control semiconductor forming an inverter circuit. In this embodiment, a plurality of I's are provided.
IPM combining C chips into one package
(Intelligent Power Module) is adopted and two of them are used. Reference numeral 2 is another electronic component that constitutes the inverter circuit. These electronic components are mounted on the circuit board 3 made of glass epoxy resin. The circuit board 3 has a thickness of 1.6 mm and is a double-sided wiring having a size of 130 × 100 mm. In the IPM1, the heat dissipation plate is arranged on one side,
All the bonding leads are arranged on the other surface side. This IP
M1 is mounted on the lower surface of the circuit board 3 with its heat dissipation plate facing downward, and the electronic component 2 has other electronic components 2 mounted on the upper surface and the lower surface of the circuit board 3.

In the mounting process of these electronic components, the electronic component 2 arranged on the upper surface of the circuit board 3 is first joined by reflow soldering, and the electronic component 2 arranged on the lower surface.
After reflow soldering, the IPM1 is inserted from the lower surface and the lead portion is soldered. This soldering was performed by manually supplying thread solder and applying a soldering iron.

Reference numeral 4 denotes a housing for accommodating the inverter circuit, and a supporting step portion 4a is provided at a height position where the circuit board 3 is arranged. A lead frame 5 is embedded in the housing 4. The lead frame 5 is made of tin plated 0.44 mm square brass and has one end 5a.
Is exposed about 10 mm from the support step 4a in the housing 4. The exposed one end portion 5a is inserted into the through hole 3a provided at the end portion of the circuit board 3 and connected by soldering. The other end 5b of the lead frame 5
Is exposed to the outside of the housing 4 and the connector terminal 6 is welded thereto, and the connector terminal 6 is connected to the electrode 17 which is provided so as to be exposed on the outer surface of the outer shell 11 of the compressor 10. Also,
A part of the lead frame 5 is arranged so as to be exposed toward the upper side, and is configured to be connected to a circuit that supplies power to the inverter circuit.

An opening is provided in a portion of the housing 4 where the heat radiation plate of the IPM 1 is arranged, and a heat sink 7 made of aluminum is arranged therein. Heat sink 7 and IPM1
A heat radiating sheet 8 made of silicon rubber is attached to the interface of the above to efficiently transfer the heat generated from the IPM 1 to the heat sink 7 and absorb variations in the position of the heat radiating surface of the IPM 1 when the housing 4 is arranged. Is configured. Further, the upper surface opening of the housing 4 is closed by a lid 9 made of the same resin as the housing 4, so that the circuit board 3 does not come into direct contact with the outside air.

The housing 4 is formed by insert molding in which the lead frame 5 is placed in a mold and injection molding is performed. The housing 4 has good fluidity, can be easily molded into a molded body having a complicated shape, and is made of a thermoplastic resin such as PPS having relatively high strength.

As shown in FIG. 2, the housing 4 has a fixed portion 4
b is provided and is attached to the outer shell 11 of the compressor 10 by screws. A refrigerant suction port 12 is provided in a low pressure portion of the compressor 10, and the refrigerant is introduced into a part of an outer shell 11 of the compressor 10 through a refrigerant introduction passage 13 from the suction port 12 and then the compression unit 1
4 is made to flow in. The heat sink 7 of the housing 4 that houses the inverter circuit is arranged so as to be in contact with the portion of the outer shell 11 of the compressor 10 where the refrigerant introduction passage 13 is arranged.

The compressor 10 includes a motor 15 and a compressor 14
The refrigerant introduced from the suction port 12 to drive the compressor 14
The high-pressure refrigerant gas is discharged from the discharge port 16 after being compressed by. Further, electric power is supplied to the motor 15 by connecting a connector terminal 6 provided on the housing 4 to an electrode 17 arranged on the outer surface of the outer shell 11.

With the above configuration, it is not necessary to newly provide a heat dissipation plate for the IPM 1 which is a power control semiconductor in the circuit board 3, and the housing 4 accommodating the circuit board 3 is provided in the outer shell 11 of the compressor 10. By integrally fixing, only the power supply line and the electric wire for controlling the inverter circuit are connected to the compressor 10 and the outside, and the volume can be reduced to 2/3 as compared with the conventional inverter circuit. be able to. In addition, the number of connecting members can be reduced, and the effect of cost reduction is great.

(Second Embodiment) Next, a second embodiment in which the arrangement structure of the inverter circuit of the present invention is applied to a compressor of an on-vehicle car air conditioner will be described with reference to FIGS. 3 to 5. To do. In the following description of the embodiments, components that are the same as the preceding components will be assigned the same reference numerals and descriptions thereof will be omitted, and only the differences will be described.

In the present embodiment, the circuit board constituting the inverter circuit is the first circuit board 22 on which the power control semiconductor 21 is mounted and the second circuit board 23 on which the control circuit and the power supply circuit are mounted. It is composed of. The first circuit board 22 has a thickness of 1.6 mm, is made of a double-sided glass epoxy board having a size of 100 × 90 mm, and has through holes for electrical connection provided at both ends. The second circuit board 23 has a thickness of 1.6 mm and is made of a double-sided glass epoxy board having a size of 120 × 110 mm, and through holes are provided at both ends.

Two supporting step portions 4c and 4d are provided in a portion of the housing 4 for accommodating the circuit boards 22 and 23. A lead frame 5 is embedded on one end side (left side in FIG. 3) of the housing 4 as in the first embodiment. The first circuit board 22 and the second circuit board 22 are provided on the other end side (left side in FIG. 3) of the housing 4.
A U-shaped lead frame 24 is embedded so that the circuit board 23 can be electrically connected. Both ends of the lead frame 24 exposed in the housing 4 are inserted into through holes formed at the other ends of the circuit boards 22 and 23, respectively, and are joined by soldering.

The power control semiconductor 21 used in the present embodiment is mounted on the lower surface side of the first circuit board 22 with the electrode surface upward, and is arranged so that the heat radiation surface is on the lower side. There is. Further, as shown in FIG. 4, six power control semiconductors 21 are mounted on the first circuit board 22 so as to be aligned so that the heat radiation surfaces thereof are located on one plane.
The heat dissipation surface of the power control semiconductor 21 is fixed in contact with the heat sink 7 arranged in the housing 4 via a heat dissipation sheet 8 made of silicon rubber.

The circuit boards 22 and 23 are fixed to the housing 4 with screws at a plurality of points, and the circuit boards 22 and 23 freely vibrate in the housing 4 when vibration is applied to the compressor 10. It is configured not to. Further, a portion of the housing 4 in which the circuit boards 22 and 23 are housed is filled with a silicon gel 25 in order to reduce vibration acting on the housing 4.

The power control semiconductor 21 is, as shown in FIG. 5, an IGB which is a type of IC chip type transistor.
It is composed of T27 and FRD28 which is one type of diode. These IC chips 27 and 28 are die-bonded on the heat spreader 26 with the electrode surface facing upward by soldering. The heat spreader 26 has a configuration in which nickel is plated on copper, has a size of 10 × 10 mm and a thickness of 2.0 mm. Further, four protrusions 29 that form the collector electrode are provided. The protrusion 29 has a diameter of 0.
It has a cylindrical shape of 6 mm and a height of 1.2 mm. Protrusion 29
Was punched out from a copper plate forming the heat spreader 26. Aluminum balls 0.7 mm in diameter are ultrasonically bonded to the electrodes of the IC chips 27 and 28, and the ball electrodes 30
Are configured. Further, although not shown, an epoxy resin is sealed on the entire IC chip so that the IC chips 27, 28 on the heat spreader 26 themselves are not directly exposed.

With the above configuration, the power control semiconductor 21
The electrode surface can be separated on the upper side and the heat dissipation surface can be separated on the lower side, and the wirings of the circuit boards 22 and 23 can be formed without considering the heat dissipation structure. In addition, the heat dissipation surface is a heat sink 7.
Since it is only necessary to form the heat dissipation structure by, it is possible to realize a thinner and smaller inverter circuit as a whole.

Furthermore, by downsizing the inverter circuit and integrating it with the compressor 10, it is possible to easily mount the inverter circuit while keeping the constraints of the layout in the engine room. Further, the silicon gel 25 in the housing 4 can operate without abnormality even when vibration is applied. Further, the shielded wire connecting the compressor 10 and the inverter circuit in the related art can be deleted, and the configuration can be achieved without increasing the cost.

(Third Embodiment) Next, a third embodiment in which the arrangement structure of the inverter circuit of the present invention is applied to a compressor of a car air conditioner for an electric vehicle having a battery voltage of about 42 V will be described with reference to FIG. This will be described with reference to FIG.

In the present embodiment, in the inverter circuit, the circuit pattern for mounting the power control semiconductor 21 is constituted by the lead frame 31 instead of the first circuit board 22, and the resin pattern on the bottom surface side of the housing 4 is formed. It is buried in. The lead frame 31 is connected to the electrode 17 disposed on the outer shell 11 of the compressor 10 and the second circuit board 23 at a portion of 0.6.
Although it is 4 × 0.64 mm, the thickness of the pattern forming portion is 0.64 mm, and the pattern width is formed by pressing a copper plate to about 2 to 3 mm.

The resin forming the housing 4 is thermosetting resin such as epoxy resin. In forming the housing 4, transfer molding is used in which a tablet of epoxy resin is heated and then injected into a mold with a piston. Epoxy resin is used in this embodiment because it has excellent strength and environmental resistance after being cured.

The power control semiconductor 21 is disposed in the recess 32 provided on the lower surface side of the housing 4 so that the heat radiation surface faces downward. As shown in FIG. 7, a part of the lead frame 31 is exposed in the recess 32 and an electrode 33 for mounting the power control semiconductor 21 is provided. FIG. 7 shows a state in which only some of the power control semiconductors 21 are mounted. The heat sink 7 is fitted in the recess 32 and is in contact with the heat dissipation surface of the power control semiconductor 21 via the heat dissipation sheet 8.

Power control semiconductor 2 of lead frame 31
A part of the surface opposite to the surface on which 1 is mounted is exposed inside the housing 4 to form an electrode, and another electronic component 2 is mounted. Further, a circuit including a control circuit and a power supply circuit is mounted on the second circuit board 23 arranged in the housing 4. Both ends of the circuit board 23 are connected to the lead frame 31 exposed from the upper surface of the support step portion 4a provided in the housing 4 through through holes.

Further, the case 4 is filled with silicon gel 34. As the silicon gel 34, a two-liquid thermosetting type is used. After the circuit board 23 is attached, the silicon gel 34 is injected into the housing 4, and the air bubbles existing inside are removed by a vacuum defoaming machine, and then the temperature is 50 ° C. The gel was cured by placing it in an oven maintained at 2.5 hours for 2.5 hours.

In the above configuration, when the voltage supplied to the inverter circuit becomes small, the applied current becomes inversely large. In this embodiment, the battery voltage is as small as 42V, so that the current of 50 to 80A is generated. It will always be applied. In a circuit board composed of a normal printed circuit board, the thickness of the copper foil on which the pattern is formed is at most about 35 μm, so that the pattern width must be made large in order to flow a large current. On the other hand, in the inverter circuit of the present embodiment, the wiring pattern is provided around the lead frame 3 around the power control semiconductor 21 to which a large current is applied.
Since it is composed of 1, the thickness is 0.64 mm, and the pattern width can be reduced. Further, since the lead frame 31 is embedded in the resin forming the housing 4, the insulation distance can be shortened and the wiring distance in the high voltage portion can be shortened. Therefore, the inverter circuit can be downsized.

[0067]

According to the present invention, since the casing housing the circuit board on which the inverter circuit is mounted as described above is attached to the outer shell of the compressor, the inverter circuit can be integrated with the compressor. Miniaturization can be achieved, the number of connection cables and the number of man-hours required for connection can be reduced, and since it is not necessary to use shielded wires to prevent noise, the cost for connection can be reduced and the cost can be reduced. You can

Further, the heat radiation surface of the power control semiconductor mounted on the circuit board is thermally connected to the heat radiator provided in the case, and the heat radiator of the case is combined with the refrigerant introduced into the compressor. By electrically connecting the inverter circuit, the heat generating portion of the inverter circuit can be cooled by the refrigerant of the compressor via the radiator provided in the housing, so that it is not necessary to provide a large number of large heat radiating means and the cooling No extra parts or space for
The size of the inverter circuit can be reduced without increasing the cost, and the inverter circuit can be mounted without being restricted by the layout.

Further, a plurality of lead frames made of metal are embedded in the housing and connected to the inverter circuit through the through holes provided in the circuit board, so that a connector for connecting the circuit board to the outside is provided. It can be electrically connected without disposing, and the inverter circuit can be downsized and the cost can be reduced.

Further, the lead frame is mechanically coupled to the electrodes attached to the compressor, the external power source, and the connector of the signal control circuit on the side opposite to the side connected to the circuit board, thereby forming the inverter circuit. You do not have to provide a connector or wiring to connect to the compressor, power supply or control unit,
The cost of the inverter circuit can be reduced.

Further, a plurality of lead frames made of metal are embedded in a housing, a first circuit board on which a power control semiconductor is mounted, and a second circuit board on which electronic parts mainly for signal processing are mounted. And the lead frame are connected to the lead frame through through holes, respectively, so that the power control semiconductor and the control circuit, which are mainly the heat generating portion of the inverter circuit,
By separating the power supply circuit and dividing it into multiple circuit boards,
The inverter circuit can be miniaturized while maintaining the cooling performance, and both can be electrically connected without disposing a connector, so that the inverter circuit can be miniaturized and the cost can be reduced.

Further, a plurality of lead frames made of metal are embedded in the casing, a part of the lead frame is exposed on the surface of the casing at a desired position to form an electrode, an electronic component is mounted, and a radiator is provided. Since a part of the lead frame is used as a circuit board by mounting the power control semiconductor on the side where the power control semiconductor is mounted, the width of the circuit pattern can be reduced in the power control semiconductor peripheral circuit to which a large current is applied. The size of the inverter circuit can be reduced and the size of the inverter circuit can be reduced.

In addition, at least one IC chip of the power control semiconductor is connected upward on a heat spreader made of metal, the electrodes for electrical connection are collectively arranged on one surface, and the other surface serves as a heat dissipation surface. With this configuration, the heat dissipation surface and the electrical connection surface can be separated via the semiconductor, and the inverter circuit can be downsized.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a schematic configuration of a first embodiment of an arrangement structure of an inverter circuit of the present invention.

FIG. 2 is a partially cutaway perspective view showing a housing and its internal structure in the same embodiment.

FIG. 3 is a vertical sectional view showing a schematic configuration of a second embodiment of the arrangement structure of the inverter circuit of the present invention.

FIG. 4 is a perspective view of a printed board on which a power control semiconductor is mounted according to the first embodiment, as viewed from below.

FIG. 5 is a perspective view showing a structure of a power control semiconductor according to the same embodiment.

FIG. 6 is a vertical cross-sectional view showing a schematic configuration of a third embodiment of an arrangement structure of an inverter circuit of the present invention.

FIG. 7 is a perspective view of the housing according to the same embodiment as viewed from below.

FIG. 8 shows a configuration of an inverter circuit of a conventional example, (a)
FIG. 4A is a cross-sectional view of a printed circuit board using a lead insertion type power control semiconductor, and FIG. 9B is a cross-sectional view of a printed circuit board using a surface mount type power control semiconductor.

FIG. 9 is a vertical cross-sectional view showing a schematic configuration of a conventional compressor.

[Explanation of symbols]

1 Power control semiconductor (IPM) 2 electronic components 3 circuit board 4 housing 5 lead frame 7 Heat sink 10 compressor 11 outer shell 13 Refrigerant introduction passage 15 motor 21 Semiconductors for power control 22 First circuit board 23 Second circuit board 24 lead frame 26 heat spreader 27 IC chip 28 IC chips 29 Protrusion 30 ball electrode 31 lead frame 33 electrodes

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Nobuyuki Nishii             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 3H003 AA02 AC03 BE09 CF02                 5H007 AA06 BB06 CA01 CB02 CB04                       HA03 HA05

Claims (20)

[Claims] 1. An arrangement structure of an inverter circuit for controlling a motor of a compressor having a built-in motor, wherein a casing accommodating a circuit board on which the inverter circuit is mounted is attached to an outer shell of the compressor. Disposition structure of the characteristic inverter circuit. 2. A heat dissipation surface of a power control semiconductor mounted on a circuit board is thermally connected to a heat dissipation member provided in a housing,
The arrangement structure of the inverter circuit according to claim 1, wherein the radiator of the housing is thermally connected to a refrigerant introduced into the compressor. 3. A plurality of lead frames made of metal are embedded in a casing and connected to an inverter circuit through through holes provided in a circuit board.
Alternatively, the arrangement structure of the inverter circuit described in 2. 4. The lead frame is mechanically coupled to an electrode attached to the compressor, an external power supply, and a connector of a signal control circuit on the side opposite to the side connected to the circuit board. The arrangement structure of the inverter circuit according to Item 3. 5. A first circuit board in which a plurality of lead frames made of metal are embedded in a housing, and a power control semiconductor is mounted, and a second circuit board in which electronic components mainly for signal processing are mounted. 5. The arrangement structure of the inverter circuit according to claim 1, wherein and are connected to the lead frame through through holes, respectively. 6. A plurality of lead frames made of metal are embedded in a housing, a part of the lead frame is exposed on the surface of the housing at a desired position to form an electrode, an electronic component is mounted, and a radiator is provided. The arrangement structure of the inverter circuit according to claim 2, wherein a power control semiconductor is mounted on the surface on the side where the inverter circuit is arranged. 7. A power control semiconductor has at least one IC chip connected upward on a heat spreader made of metal, electrodes for electrical connection are collectively arranged on one surface, and the other surface serves as a heat dissipation surface. The arrangement structure of the inverter circuit according to any one of claims 2 to 6, which is configured as follows. 8. The arrangement structure for an inverter circuit according to claim 3, wherein the lead frame is made of copper or brass. 9. The arrangement structure of an inverter circuit according to claim 1, wherein the casing is made of a thermoplastic resin. 10. The arrangement structure of an inverter circuit according to claim 1, wherein the housing is made of a thermosetting resin. 11. A method of arranging an inverter circuit for controlling a motor of a compressor having a built-in motor, the method comprising mounting a power control semiconductor so that its heat radiation surface faces the side opposite to the surface of the circuit board. , A step of arranging the circuit board in the housing so that the heat radiation surface of the power control semiconductor is thermally connected to the heat radiator provided in the housing housing the circuit board, and the radiator compresses the housing. And a step of attaching to the outer shell of the compressor so as to be thermally connected to the refrigerant introduced into the machine. 12. A step of manufacturing a housing, a step of processing a metal plate by etching or pressing to obtain a lead frame having a desired pattern, and a step of arranging the lead frame in a mold and injection-molding the lead frame. 12. The method of arranging an inverter circuit according to claim 11, further comprising a step of burying the inverter circuit in the inverter circuit. 13. The lead frame exposed in the housing,
13. The inverter circuit arrangement according to claim 11 or 12, further comprising a step of fitting and arranging the through hole provided in the circuit board and a step of electrically connecting the through hole and the lead frame by soldering. Setting method. 14. A compressor having a built-in motor and an inverter circuit for controlling the motor, wherein a casing accommodating a circuit board on which the inverter circuit is mounted is attached to an outer shell of the compressor. Characteristic compressor. 15. A circuit board on which a power control semiconductor is mounted with its heat radiating surface facing away from the substrate surface, and a heat radiator, wherein the heat radiating body and the heat radiating surface of the power control semiconductor are thermally connected. And a case in which the circuit board is housed and arranged,
15. The compressor according to claim 14, wherein the housing is attached to the outer shell of the compressor so that its heat radiator is thermally connected to the refrigerant introduced into the compressor. 16. The compressor according to claim 15, wherein a plurality of lead frames made of metal are embedded in the housing and connected to the inverter circuit through through holes provided in the circuit board. 17. The lead frame comprises an electrode mounted on the compressor on the side opposite to the side connected to the circuit board,
17. The compressor according to claim 16, which is mechanically coupled to an external power source and a connector of a signal control circuit. 18. A first circuit board on which a plurality of lead frames made of metal are embedded in a housing, and a power control semiconductor is mounted, and a second circuit board on which electronic components mainly for signal processing are mounted. And are connected to a lead frame through through holes, respectively.
The compressor according to any one of 17. 19. A plurality of lead frames made of metal are embedded in a housing, a part of the lead frame is exposed on the surface of the housing at a desired position to form an electrode, an electronic component is mounted, and a radiator is provided. The compressor according to any one of claims 15 to 17, characterized in that a power control semiconductor is mounted on the surface on the side where the power control semiconductor is arranged. 20. In a power control semiconductor, at least one IC chip is connected upward on a heat spreader made of metal, electrodes for electrical connection are collectively arranged on one surface, and the other surface is a heat dissipation surface. The compressor according to any one of claims 15 to 19, which is configured as follows.