CN219085965U - Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly - Google Patents
Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly Download PDFInfo
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- CN219085965U CN219085965U CN202222816472.7U CN202222816472U CN219085965U CN 219085965 U CN219085965 U CN 219085965U CN 202222816472 U CN202222816472 U CN 202222816472U CN 219085965 U CN219085965 U CN 219085965U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 69
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- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 32
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
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- 229920005989 resin Polymers 0.000 description 3
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- 238000005538 encapsulation Methods 0.000 description 2
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- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- -1 1100 and 5052 Chemical compound 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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- 238000001721 transfer moulding Methods 0.000 description 1
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Abstract
The utility model relates to a semiconductor circuit assembly with a metal heat dissipation block attached to the surface and a heat dissipation assembly. The metal heat dissipation block comprises a heat dissipation body and a heat dissipation bending part which are connected with each other, wherein the heat dissipation body is in contact with the surface of the module body so as to conduct heat to the heat dissipation body, and the heat dissipation bending part is arranged on the other side surface of the module body, which is opposite to the pin. Therefore, heat conduction is realized on both surfaces of the semiconductor circuit, so that the heat dissipation efficiency of the semiconductor circuit is improved, and the requirement of higher heat dissipation efficiency of the semiconductor circuit with high integration and high-frequency operation at present is met.
Description
Technical Field
The utility model relates to a semiconductor circuit assembly with a metal radiating block attached to the surface and a radiating assembly, and belongs to the technical field of semiconductor circuit application.
Background
Semiconductor circuits are a type of power driven product that combine power electronics and integrated circuit technology. In order to improve the heat dissipation capacity of the semiconductor circuit, the plastic package of the surface adopts a semi-encapsulation design, and the back surface adopts a bare metal substrate to conduct heat transfer. Along with the upgrade of application scenes, as the switching frequency of the semiconductor circuit is improved and the integration degree is higher, the heat dissipation performance of the semiconductor circuit also provides higher requirements, and the conventional mode of only installing the radiator on the metal substrate is difficult to meet the heat dissipation requirements.
Disclosure of Invention
The utility model solves the technical problem that the heat dissipation requirement of the traditional semiconductor circuit is difficult to be met by only arranging the radiator on the back metal substrate of the traditional semiconductor circuit.
Specifically, the utility model discloses a semiconductor circuit assembly with a metal heat dissipation block attached on the surface, which comprises the following components:
the semiconductor module comprises a module body of a semiconductor circuit, wherein the module body comprises a circuit substrate assembly and a sealing layer covering the surface and four sides of the circuit substrate assembly, the metal surface of the circuit substrate assembly is exposed from the sealing layer to form the back surface of the module body, and one side of the module body is provided with a plurality of pins extending from the opposite side;
the metal heat dissipation block comprises a heat dissipation body and a heat dissipation bending part which are connected with each other, wherein the heat dissipation body is in contact with the surface of the module body so as to conduct heat to the heat dissipation body, and the heat dissipation bending part is arranged on the other side surface of the module body, opposite to the pins.
Optionally, the circuit substrate assembly includes:
a circuit substrate including a heat radiation surface and a mounting surface;
an insulating layer, which is arranged on the mounting surface;
the circuit wiring layer is arranged on the surface of the sealing layer, and a plurality of element mounting positions are arranged on the surface of the circuit wiring layer;
the electronic components are arranged at the component mounting positions.
Optionally, mounting grooves penetrating through the thickness of the sealing layer are formed in two sides of the sealing layer, and notch openings consistent with the end face openings of the mounting grooves are formed in two sides of the metal radiating block opposite to the mounting grooves.
Optionally, a gap is arranged between the opposite side surfaces of the heat dissipation bending part, and the gap ranges from 0.7 mm to 3 mm.
Optionally, the two sides of the sealing layer are further provided with a step part thinned in the thickness direction at a position close to the mounting groove.
Optionally, the step portion is disposed at an outer periphery of the sealing layer covering the circuit substrate assembly region.
Optionally, a thermal paste is applied between the surfaces of the heat dissipating body and the module body.
Optionally, a mounting hole penetrating through the thickness of the heat dissipation bending part is further formed in the middle of the heat dissipation bending part.
The application also provides a semiconductor circuit's radiator unit, radiator unit include foretell surface mount metal radiator block's semiconductor circuit unit, still include the radiator of installation semiconductor circuit unit, the radiator includes radiator body and sets up the radiator fin at radiator body a surface, the back-mounting of module body is in radiator body and the another surface of setting up radiator fin's surface.
The semiconductor circuit assembly comprises a module body of a semiconductor circuit and a metal heat dissipation block, wherein the module body comprises a circuit substrate assembly and a sealing layer covering the surface and four sides of the circuit substrate assembly, the metal surface of the circuit substrate assembly is exposed from the sealing layer to form the back surface of the module body, and a plurality of pins extending from opposite sides are arranged on one side of the module body. The metal heat dissipation block comprises a heat dissipation body and a heat dissipation bending part which are connected with each other, wherein the heat dissipation body is in contact with the surface of the module body so as to conduct heat to the heat dissipation body, and the heat dissipation bending part is arranged on the other side surface of the module body, which is opposite to the pin. The metal heat dissipation block is arranged on the other surface of the semiconductor circuit, which is opposite to the mounting radiator, so that heat conduction is realized on both surfaces of the semiconductor circuit, the heat dissipation efficiency of the semiconductor circuit is improved, and the requirements of higher heat dissipation efficiency of the semiconductor circuit with high integration and high frequency operation at present are met.
Description of the drawings:
fig. 1 is a perspective view of a semiconductor circuit assembly according to an embodiment of the present utility model;
FIG. 2 is a rear-up perspective view of a module body in a semiconductor circuit assembly according to an embodiment of the present utility model;
FIG. 3 is a perspective view of another view of a semiconductor circuit assembly according to an embodiment of the present utility model
FIG. 4 is a perspective view of a heat dissipating assembly according to an embodiment of the present utility model;
fig. 5 is a perspective view of a module body of a semiconductor circuit according to an embodiment of the present utility model;
fig. 6 is a front view of a module body of a semiconductor circuit according to an embodiment of the present utility model;
FIG. 7 is a cross-sectional view taken along the X-X' direction of FIG. 6;
fig. 8 is a schematic view of the module body of fig. 6 with the sealing layer removed.
Reference numerals:
the semiconductor module includes a module body 100, a sealing layer 10, an insulating layer 20, a circuit substrate 30, a bonding wire 40, a circuit wiring layer 50, a driving chip 61, an igbt tube 62, a flywheel diode 63, an auxiliary heat sink 70, a mounting groove 101, a pin 102, a step 103, a metal heat sink 200, a heat dissipation body 210, a heat dissipation bent portion 220, a gap 230, a mounting hole 201, a notch 202, a heat sink 300, a heat sink body 310, and a heat dissipation fin 320.
Detailed Description
In addition, in the case where the structure or the function is not conflicting, the embodiments of the present utility model and the features in the embodiments may be combined with each other. The utility model is described in detail below with reference to examples.
The semiconductor circuit is a circuit module which integrates a power switch device, a high-voltage driving circuit and the like and performs sealing and encapsulation on the appearance, and is widely applied to the power electronics field, such as the fields of frequency converters of driving motors, various inversion voltages, variable-frequency speed regulation, metallurgical machinery, electric traction, variable-frequency household appliances and the like. The semiconductor circuits herein have a variety of other names such as modular smart power systems (Modular Intelligent Power System, MIPS), smart power modules (Intelligent Power Module, IPM), or names known as hybrid integrated circuits, power semiconductor modules, power modules, etc.
The utility model provides a semiconductor circuit assembly with a surface-mounted metal heat dissipation block 200, as shown in fig. 1 to 3, the semiconductor circuit assembly comprises the metal heat dissipation block 200 and a module body 100 of a semiconductor circuit, wherein the module body 100 comprises a circuit substrate assembly and a sealing layer 10 covering the surface and four sides of the circuit substrate assembly, the metal surface of the circuit substrate assembly is exposed from the sealing layer 10 to form the back surface of the module body 100, and a plurality of pins 102 extending from opposite sides are arranged on one side of the module body 100. The metal heat dissipation block 200 includes a heat dissipation body 210 and a heat dissipation bending portion 220 that are connected to each other, wherein the heat dissipation body 210 contacts with a surface of the module body 100 to conduct heat to the heat dissipation body 210, and the heat dissipation bending portion 220 is disposed on another side of the module body 100 opposite to the side on which the pins 102 are disposed.
Compared with the prior art, the semiconductor circuit is provided with the radiator on one exposed metal surface so as to radiate heat in the working process of the semiconductor circuit, the semiconductor circuit component of the application is also provided with the metal radiating block 200 on the other surface of the semiconductor circuit opposite to the metal surface, and the metal radiating block 200 is contacted with the surface so as to radiate heat simultaneously, thereby realizing heat conduction on both surfaces of the semiconductor circuit, improving the radiating efficiency of the semiconductor circuit, and being beneficial to meeting the requirement of higher radiating efficiency of the semiconductor circuit which is highly integrated and works at present. And the metal heat dissipation block 200 is further provided with a heat dissipation bending part 220 installed opposite to one side surface of the module body 100, which can play a role in protecting the side surface of the module body 100 from being damaged due to external force collision in the installation and working processes, thereby playing a role in protecting the module body 100.
Specifically, in some embodiments of the application, as shown in fig. 6 to 8, the circuit substrate assembly includes a circuit substrate 30, an insulating layer 20, a circuit wiring layer 50, and a plurality of electronic components. The circuit board 30 may be a rectangular plate made of aluminum such as 1100 and 5052, and the circuit board 30 includes a heat radiation surface and a mounting surface, the mounting surface is used for connecting the insulating layer 20, and the heat radiation surface is exposed to the sealing layer 10 or is covered by the sealing layer 10. The insulating layer 20 is made of a resin material such as epoxy resin, and is filled with a filler such as alumina and aluminum carbide inside the resin material to improve thermal conductivity. The filler may be angular in shape to increase thermal conductivity, and spherical or a mixture of angular and spherical in shape to avoid the risk of damaging the surface of the electronic component by the filler. The circuit wiring layer 50 may be formed by copper foil etching or by printing a paste-like conductive medium, and the conductive medium may be a conductive material such as graphene, solder paste, or silver paste. The surface of the circuit wiring layer 50 is provided with a plurality of element mounting sites for mounting a plurality of electronic elements including a power device including a switching transistor such as an IGBT (Insulated Gate Bipolar Transistor ) or a MOS (metal oxide semiconductor, metal oxide semiconductor), in this embodiment, an IGBT tube 62, and a flywheel diode 63, and a driving chip 61. In order to further improve the heat transfer efficiency between the power device and the heat dissipation substrate, an auxiliary heat sink 70 made of a metal material may be mounted between the power device and the circuit wiring layer 50. The leads 102 are typically made of a metal such as copper, and the copper surface is formed into a nickel-tin alloy layer by electroless plating and electroplating, the thickness of the alloy layer is typically 5 μm, and the plating layer can protect the copper from corrosion and oxidation and can improve solderability. One end of the pin 102 is fixed near both sides or one long side of the circuit substrate 30. The sealing layer 10 may be molded using thermosetting resin by a transfer molding method or thermoplastic resin by an injection molding method, and the sealing layer 10 seals only one surface of the circuit board 30 on which electronic components are mounted, and the other surface of the circuit board is exposed to be mated with an external heat sink for heat dissipation.
In some embodiments of the present application, as shown in fig. 8, the semiconductor circuit further includes a plurality of bonding wires 40, and the bonding wires 40 are connected between the plurality of electronic components, the circuit wiring layer 50, and the plurality of leads 102. For example, the bonding wire 40 may connect the electronic component and the electronic component, may connect the electronic component and the circuit wiring layer 50, and may connect the electronic component and the lead 102, and may connect the circuit wiring layer 50 and the lead 102. The electronic components are the power devices mentioned in the above embodiments, such as the IGBT62, the flywheel diode 63, and the driving chip 61, and others, such as resistors, capacitors, and the like. Bond wire 40 is typically gold wire, copper wire, gold-copper hybrid wire, 38 μm or less thin bond wire, 100 μm or more thick bond wire.
In some embodiments of the present application, as shown in fig. 1 to 5, both sides of the sealing layer 10 are provided with mounting grooves 101 penetrating through the thickness thereof, and both sides of the metal heat sink 200 are provided with notches 202 corresponding to end surface openings of the mounting grooves 101 at positions opposite to the mounting grooves 101. Specifically, openings are formed on two opposite short sides of the sealing layer 10 to form mounting grooves 101 for mounting fixing members such as screws to fix the semiconductor circuit, and notches 202 having the same size as the openings of the mounting grooves 101 are formed on two sides of the metal heat sink 200 opposite to the mounting grooves 101, so that the metal heat sink 200 is fixed by the fixing members, and the metal heat sink 200 is crimped on the surface of the sealing layer 10, thereby fixing the semiconductor circuit on other components such as the heat sink 300. The metal heat dissipation block 200 is tightly contacted with the surface of the sealing layer 10, and heat conduction between the metal heat dissipation block and the sealing layer is facilitated. Further, a heat dissipating paste such as heat conductive silicone grease may be coated on the surfaces of the metal heat dissipating block 200 and the sealing layer 10, so as to further promote heat conduction therebetween and improve heat dissipation efficiency of the semiconductor circuit.
In some embodiments of the present application, as shown in fig. 3, a gap 230 is provided between the heat dissipation bent portion 220 and the side surface of the module body 100 of the heat dissipation body 210, and the gap 230 ranges from about 0.7 mm to 3 mm, and may further preferably be 1-1.5mm, such as 1.2mm. By providing the gap 230, the situation that the fixing piece cannot be mounted due to the fact that the notch 202 of the metal heat sink 200 cannot be aligned with the mounting grooves 101 on two sides of the semiconductor circuit due to the deviation of manufacturing sizes of the semiconductor circuit and the metal heat sink 200 is avoided.
In some embodiments of the present application, as shown in fig. 1 to 5, both sides of the sealing layer 10 are further provided with a step 103 thinned in the thickness direction at a position close to the mounting groove 101. The step portion 103 extends out relative to the metal heat dissipation block 200, and the portion of the step portion 103 does not cover the circuit substrate assembly, that is, the step portion 103 is disposed at the periphery of the circuit substrate assembly region. By providing the thinned step 103, the material of the sealing layer 10 can be saved.
In some embodiments of the present application, as shown in fig. 1 to 4, a middle portion of the heat dissipation bent portion 220 is further provided with a mounting hole 201 penetrating through the thickness thereof. The fixing member such as a screw fixes the metal heat sink 200 through the mounting hole 201, thereby realizing more reliable fixing of the metal heat sink 200 in combination with the fixing member of the both side notches 202.
The application further provides a heat dissipating assembly of a semiconductor circuit, as shown in fig. 4, where the heat dissipating assembly includes the semiconductor circuit assembly with the surface-mounted metal heat dissipating block 200 according to the above embodiment, and further includes a heat sink 300 for mounting the semiconductor circuit assembly, the heat sink 300 includes a heat sink body 310 and heat dissipating fins 320 disposed on one surface of the heat sink body 310, and the back surface of the module body 100 is mounted on the other surface of the heat sink body 310, where the heat dissipating fins 320 are disposed. The fixing members, such as screws, are fixed in the corresponding mounting holes on the surface of the heat sink body 310 through the notches 202 disposed on both sides of the metal heat sink 200 and the mounting holes 201 disposed in the middle of the heat dissipation bent portion 220, so as to fix the metal heat sink 200 and the semiconductor circuit on the surface of the heat sink body 310.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (9)
1. A semiconductor circuit assembly having a surface mount metal heat sink, comprising:
a module body of a semiconductor circuit, the module body comprising a circuit substrate assembly and a sealing layer covering a surface and four sides of the circuit substrate assembly, a metal surface of the circuit substrate assembly being exposed from the sealing layer to form a back surface of the module body, wherein one side of the module body is provided with a plurality of pins extending out relative to the side;
the metal heat dissipation block comprises a heat dissipation body and a heat dissipation bending part which are connected with each other, wherein the heat dissipation body is in contact with the surface of the module body so as to conduct heat on the heat dissipation body, and the heat dissipation bending part is arranged on the other side face of the module body, opposite to the pin.
2. The semiconductor circuit assembly of claim 1, wherein the circuit substrate assembly comprises:
a circuit substrate including a heat radiation surface and a mounting surface;
an insulating layer disposed with the mounting surface;
a circuit wiring layer provided on a surface of the sealing layer, the surface of the circuit wiring layer being provided with a plurality of element mounting positions;
and the plurality of electronic components are arranged at the component mounting positions.
3. The semiconductor circuit assembly of claim 2, wherein the sealing layer is provided with mounting grooves extending through its thickness on both sides, and the metal heat sink is provided with notches corresponding to the end surface openings of the mounting grooves on both sides thereof at positions opposite to the mounting grooves.
4. A semiconductor circuit assembly according to claim 3, wherein a gap is provided between the heat dissipation bent portion and the other side face, the gap being in a range of 0.7 mm to 3 mm.
5. A semiconductor circuit assembly according to claim 3, wherein both sides of the sealing layer are further provided with a step portion thinned in a thickness direction at a position close to the mounting groove.
6. The semiconductor circuit assembly of claim 5, wherein the step is disposed on an outer periphery of the sealing layer that encapsulates the circuit substrate assembly region.
7. The semiconductor circuit assembly of claim 1, wherein a thermal paste is applied between the heat dissipating body and a surface of the module body.
8. The semiconductor circuit assembly of claim 1, wherein the middle portion of the heat dissipation bend portion is further provided with a mounting hole extending through a thickness thereof.
9. A heat dissipating assembly for a semiconductor circuit, wherein the heat dissipating assembly comprises the semiconductor circuit assembly having a surface-mounted metal heat dissipating block as set forth in any one of claims 1 to 8, and further comprises a heat sink to which the semiconductor circuit assembly is mounted, the heat sink comprising a heat sink body and heat dissipating fins provided on one surface of the heat sink body, and the back surface of the module body being mounted on the other surface of the heat sink body opposite to the surface on which the heat dissipating fins are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222816472.7U CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222816472.7U CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
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| Publication Number | Publication Date |
|---|---|
| CN219085965U true CN219085965U (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222816472.7U Active CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
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| Country | Link |
|---|---|
| CN (1) | CN219085965U (en) |
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- 2022-10-25 CN CN202222816472.7U patent/CN219085965U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20240513 Address after: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee after: Zhu Shiping Country or region after: China Patentee after: Yang Bailin Address before: 528000 one of No.10 Yangsheng Road, Xianhu resort, Danzao Town, Nanhai District, Foshan City, Guangdong Province Patentee before: Guangdong Huixin Semiconductor Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240619 Address after: 710000, Room 3205, Building A, Qujiang, Wangzuo, Yanxiang Road, Qujiang New District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongbaixin Investment Co.,Ltd. Country or region after: China Address before: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee before: Zhu Shiping Country or region before: China Patentee before: Yang Bailin |