CN219085965U - Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly - Google Patents
Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly Download PDFInfo
- Publication number
- CN219085965U CN219085965U CN202222816472.7U CN202222816472U CN219085965U CN 219085965 U CN219085965 U CN 219085965U CN 202222816472 U CN202222816472 U CN 202222816472U CN 219085965 U CN219085965 U CN 219085965U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- semiconductor circuit
- assembly
- heat
- module body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 69
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 48
- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 28
- 230000005855 radiation Effects 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- -1 1100 and 5052 Chemical compound 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222816472.7U CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222816472.7U CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219085965U true CN219085965U (en) | 2023-05-26 |
Family
ID=86394710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202222816472.7U Active CN219085965U (en) | 2022-10-25 | 2022-10-25 | Semiconductor circuit assembly with surface-mounted metal heat dissipation block and heat dissipation assembly |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219085965U (en) |
-
2022
- 2022-10-25 CN CN202222816472.7U patent/CN219085965U/en active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240513 Address after: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee after: Zhu Shiping Country or region after: China Patentee after: Yang Bailin Address before: 528000 one of No.10 Yangsheng Road, Xianhu resort, Danzao Town, Nanhai District, Foshan City, Guangdong Province Patentee before: Guangdong Huixin Semiconductor Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240619 Address after: 710000, Room 3205, Building A, Qujiang, Wangzuo, Yanxiang Road, Qujiang New District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongbaixin Investment Co.,Ltd. Country or region after: China Address before: 710000 No.1-5, Jinye Road, Yanta District, Xi'an City, Shaanxi Province Patentee before: Zhu Shiping Country or region before: China Patentee before: Yang Bailin |