JP6471417B2 - Cooling jacket - Google Patents

Description

  The present invention relates to a cooling jacket that cools electrical components.

  In cooling electrical components, high heat-generating parts such as power modules are directly cooled by a cooling jacket, whereas small capacitors (chip ceramic capacitors), resistors (shunt resistors), and microcomputers (chip type) The low heat generating component is cooled mainly by natural air cooling and heat conduction to the substrate. For this reason, cooling may be insufficient when the current is high or the ambient temperature is high.

  For some parts, such as a ceramic capacitor, lowering the temperature as much as possible is advantageous for downsizing, cost reduction, and reliability improvement. 2009-88344) and Patent Document 2 (Japanese Patent Laid-Open No. 2008-258495), heat is radiated to the housing through a heat-dissipating sheet, air-cooled with a heat sink, and a high heat-dissipating substrate is used. A method of providing a cooling structure is adopted.

  In Patent Document 3 (Japanese Patent Laid-Open No. 5-259370), a proposal has been made such as cooling the power system and other components together on a heat sink.

  However, even if any of the above methods is adopted, the number of steps is basically increased at a high cost.

  An object of the present invention is to provide a cooling jacket that realizes cooling of a small, low heat-generating component while suppressing an increase in cost.

A cooling jacket according to a first aspect of the present invention is a cooling jacket that receives cold from a cold source in order to cool a high heat generation component and a low heat generation component mounted on a board, and includes a main plane portion and a leg portion. And a protruding portion. The main plane portion is in close contact with the high heat generating component. The leg portion is a member that attaches the main plane portion to the substrate. The protruding portion protrudes from the plane of the main plane portion to the substrate side separately from the leg portion . The substrate and the cooling jacket are arranged in a vertical posture, and the high heat generation component is positioned above the low heat generation component.

  In this cooling jacket, the distance between the low heat-generating component on the substrate and the cooling jacket is reduced by the presence of the protruding portion, so that the cooling performance of the cooling jacket for the low heat-generating component is improved.

  The cooling jacket according to the second aspect of the present invention is the cooling jacket according to the first aspect, and the main plane portion is flat. The protruding portion protrudes in the thickness direction of the main plane portion.

  In this cooling jacket, the distance between the low heat-generating component on the substrate and the cooling jacket is reduced by the presence of the protruding portion, so that the cooling performance of the cooling jacket for the low heat-generating component is improved.

  The cooling jacket according to the third aspect of the present invention is the cooling jacket according to the first aspect or the second aspect, and the main flat surface portion and the protruding portion are integrally formed.

  Since this cooling jacket employs an integral structure in which the protruding portion protrudes directly from the flat plate-shaped main plane portion, it can be manufactured by extrusion, and an increase in processing cost is suppressed.

A cooling jacket according to a fourth aspect of the present invention is a cooling jacket that receives cold from a cold source in order to cool a high heat-generating component and a low heat-generating component that are mounted on a board, and includes a main plane portion and a protruding portion. It has. The main plane portion is in close contact with the high heat generating component. The protruding portion protrudes from the plane of the main plane portion toward the substrate side. The substrate and the cooling jacket are arranged in a vertical posture, and the high heat generation component is positioned above the low heat generation component. The protrusion has a tip surface that is a flat surface at the tip. The tip surface is close to the low heat generating component up to a position where the shortest distance between the low heat generating component and the tip surface is less than 3 mm.

  In this cooling jacket, the distance between the low heat-generating component on the substrate and the cooling jacket is reduced by the presence of the protruding portion, so that the cooling performance of the cooling jacket for the low heat-generating component is improved.

  A cooling jacket according to a fifth aspect of the present invention is the cooling jacket according to any one of the first to fourth aspects, further comprising an insulating member disposed between the low heat generating component and the protruding portion. ing.

  In this cooling jacket, by interposing the insulating member, the cooling performance can be improved while maintaining the insulating performance without worrying about the shortage of the insulating distance (and the creepage distance).

  Further, the insulating member only needs to have insulating properties, and even if the cost and the increase in the number of steps for attaching the insulating member are taken into consideration, the increase in cost is suppressed. This is because thermal conductivity, flexibility, and thickness are not required in comparison with the heat dissipation sheet, and it is not necessary to strictly manage the position and gaps, and it is simple and does not require man-hours.

  A cooling jacket according to a sixth aspect of the present invention, the cooling jacket according to any one of the first to fifth aspects, further comprising legs formed of a heat transfer member. The leg portion fixes the main plane portion to the substrate. Further, the leg portion is fixed at a position adjacent to the low heat generating component on the substrate.

  In this cooling jacket, high heat-generating parts can be directly cooled by the main plane part of the cooling jacket, and small low heat-generating parts can be cooled by the legs and [the substrate cooled by the legs].

  A cooling jacket according to a seventh aspect of the present invention is the cooling jacket according to the sixth aspect, wherein the leg portion is connected to the conductor pattern on the substrate. The conductor pattern is adjacent to the wiring conductor pattern connected to the low heat-generating component.

  In this cooling jacket, the board is widely cooled by the conductor pattern connected to the legs, and further, the conductor pattern is cooled adjacent to the wiring conductor pattern connected to the low heat-generating component, so that the cooling of the low heat-generating component is promoted. The

  A cooling jacket according to an eighth aspect of the present invention is the cooling jacket according to the first aspect, and the protrusion includes a heat transfer promoting member. The heat transfer promoting member extends from the main plane portion and is fixed to the substrate. The heat transfer promoting member is connected to the conductor pattern on the substrate. The conductor pattern is adjacent to the wiring conductor pattern connected to the low heat-generating component.

  In this cooling jacket, the board is widely cooled by the conductor pattern connected to the heat transfer promoting member, and further, the conductor pattern is cooled adjacent to the wiring conductor pattern connected to the low heat-generating component. Promoted.

  Since the conductor pattern should be as close as possible to the wiring conductor pattern of the low heat-generating component, for example, the wiring conductor pattern of the low heat-generating component is arranged on the front surface side of the board and the conductor pattern of the leg portion is opposed to the back surface side. Is preferred.

A cooling jacket according to a ninth aspect of the present invention is a cooling jacket that receives cold from a cold heat source to cool a high heat-generating component and a low heat-generating component that are mounted on a board, and includes a main plane portion and a protruding portion. It has. The main plane portion is in close contact with the high heat generating component. The protruding portion protrudes from the plane of the main plane portion toward the substrate side. The substrate and the cooling jacket are arranged in a vertical posture, and the high heat generation component is positioned above the low heat generation component. The protrusion includes a heat transfer promoting member. The heat transfer promoting member extends from the main plane portion and is fixed to the substrate. The heat transfer promoting member is fixed with an insulating member between the main flat surface portion and connected to the conductor pattern on the substrate. The conductor pattern is joined to a wiring conductor pattern connected to the low heat generating component.

  In this cooling jacket, the board is widely cooled by the conductor pattern connected to the heat transfer promoting member, and further, the conductor pattern cools the wiring conductor pattern connected to the low heat generating component, so that the cooling of the low heat generating component is promoted. .

  A cooling jacket according to a tenth aspect of the present invention is the cooling jacket according to any one of the first to ninth aspects, wherein the low heat-generating component is adjacent to the high heat-generating component.

  In this cooling jacket, when the high heat generating component is sufficiently cooled by the main plane portion and the temperature is low, the low heat generating component adjacent thereto is cooled by the high heat generating component. As a result, the high heat generating component is used as a cooling member for the low heat generating component, and the cost increase is suppressed.

  A cooling jacket according to an eleventh aspect of the present invention is the cooling jacket according to any one of the first to tenth aspects, wherein the low heat-generating component includes a ceramic capacitor, a resistor, and a microcomputer.

  In this cooling jacket, many ceramic capacitors, resistors, and microcomputers are made into small chips, and a higher cooling effect can be achieved by using them.

  A cooling jacket according to a twelfth aspect of the present invention is the cooling jacket according to the first aspect, and is applied with a high heat dissipation paint.

  In this cooling jacket, the effect of heat radiation is improved and the cooling performance is improved. The same effect can be obtained even when a high heat radiation coating is applied to the low heat generating component side.

  In the cooling jacket according to the first aspect or the second aspect of the present invention, the distance between the low heat generating component and the cooling jacket on the substrate is reduced due to the presence of the protruding portion, so that the cooling performance of the cooling jacket with respect to the low heat generating component is improved. .

  The cooling jacket according to the third aspect of the present invention employs an integral structure in which the protruding portion protrudes directly from the flat plate-shaped main plane portion, so that it can be manufactured by extrusion processing, and an increase in processing cost is suppressed. Is done.

  In the cooling jacket according to the fourth aspect of the present invention, the distance between the low heat generating component and the cooling jacket on the substrate is reduced by the presence of the protruding portion, so that the cooling performance of the cooling jacket for the low heat generating component is improved.

  In the cooling jacket according to the fifth aspect of the present invention, by interposing the insulating member, the cooling performance can be improved while maintaining the insulating performance without worrying about the shortage of the insulating distance (and creepage distance). Further, the insulating member only needs to have insulating properties, and even if the cost and the increase in the number of steps for attaching the insulating member are taken into consideration, the increase in cost is suppressed.

  In the cooling jacket according to the sixth aspect of the present invention, the high heat generating component is directly cooled by the main plane portion of the cooling jacket, and the small low heat generating component is cooled by the leg and [the substrate cooled by the leg]. can do.

  In the cooling jacket according to the seventh aspect of the present invention, the substrate is widely cooled by the conductor pattern connected to the leg portion, and further, the conductor pattern is cooled adjacent to the wiring conductor pattern connected to the low heat generating component. Cooling of the heat generating parts is promoted.

  In the cooling jacket according to the eighth aspect of the present invention, the substrate is widely cooled by the conductor pattern connected to the heat transfer promoting member, and further, the conductor pattern is cooled adjacent to the wiring conductor pattern connected to the low heat generating component. Cooling of low heat-generating parts is promoted.

  In the cooling jacket according to the ninth aspect of the present invention, the board is widely cooled by the conductor pattern connected to the heat transfer promoting member, and further, the conductor pattern cools the wiring conductor pattern connected to the low heat generating component. Cooling of parts is promoted.

  In the cooling jacket according to the tenth aspect of the present invention, when the high heat generating component is sufficiently cooled by the main plane portion and the temperature is low, the low heat generating component adjacent thereto is cooled by the high heat generating component. As a result, the high heat generating component is used as a cooling member for the low heat generating component, and the cost increase is suppressed.

  In the cooling jacket according to the eleventh aspect of the present invention, many ceramic capacitors, resistors, and microcomputers are made into small chips, and a higher cooling effect can be achieved by using them.

  In the cooling jacket according to the twelfth aspect of the present invention, the effect of thermal radiation is improved and the cooling performance is improved. The same effect can be obtained even when a high heat radiation coating is applied to the low heat generating component side.

The refrigerant circuit figure of the freezing apparatus carrying the cooling jacket which concerns on one Embodiment of this invention. The top view of the outdoor unit in FIG. The front view of the electrical component unit assembly in FIG. The side view of the electrical component unit assembly in FIG. Sectional drawing of the electrical equipment unit assembly in the AA line of FIG. Sectional drawing of the electrical equipment unit assembly which has a cooling jacket which concerns on a 1st modification. Sectional drawing of the electrical equipment unit assembly which has the cooling jacket which concerns on a 2nd modification. Sectional drawing of the electrical equipment unit assembly which has the cooling jacket which concerns on other embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments are specific examples of the present invention and do not limit the technical scope of the present invention.

(1) Overall Configuration of Refrigeration Apparatus 1 FIG. 1 is a refrigerant circuit diagram of a refrigeration apparatus 1 equipped with a cooling jacket 60 according to an embodiment of the present invention. In FIG. 1, the refrigeration apparatus 1 has a refrigerant circuit 10 that performs a vapor compression refrigeration cycle. The refrigeration apparatus 1 is applied to an air conditioner and includes an indoor unit 20 and an outdoor unit 30. The refrigerant circuit 10 is formed by connecting the indoor unit 20 and the outdoor unit 30 to each other by two connecting pipes 11 and 12.

(1-1) Indoor unit 20
The indoor unit 20 includes an indoor heat exchanger 21, an indoor fan 22, and an indoor expansion valve 23. The indoor heat exchanger 21 is blown by an indoor fan 22. In the indoor heat exchanger 21, heat is exchanged between the refrigerant flowing inside and the air passing outside. The indoor expansion valve 23 is configured by, for example, an electronic expansion valve.

(1-2) Outdoor unit 30
The outdoor unit 30 includes an outdoor heat exchanger 31, an outdoor fan 32, an outdoor expansion valve 33, a compressor 34, and a four-way switching valve 35. The outdoor heat exchanger 31 is blown by an outdoor fan 32. In the outdoor heat exchanger 31, heat is exchanged between the refrigerant flowing inside and the air passing outside. The outdoor expansion valve 33 is constituted by, for example, an electronic expansion valve. The compressor 34 is configured by a rotary compressor such as a scroll compressor. The four-way switching valve 35 has four ports from first to fourth, and is configured to switch the circulation direction of the refrigerant in the refrigerant circuit 10. In addition, the four-way switching valve 35 is in a state where the first port and the second port are communicated during cooling operation and the third port and the fourth port are communicated (state indicated by a solid line in FIG. 1). And the third port communicate with each other and the second port and the fourth port communicate with each other (state indicated by a broken line in FIG. 1).

  FIG. 2 is a plan view of the outdoor unit 30 in FIG. In FIG. 2, the lower side is “front”, the upper side is “rear”, the left side is “left”, the right side is “right”, the front side in the direction perpendicular to the plane of the paper is “up”, and the rear side in the direction perpendicular to the plane of the page is “lower”. The configuration of the outdoor unit 30 will be described.

  The outdoor unit 30 has a box-shaped casing 40. The casing 40 includes a front panel 41, a rear panel 42, a left side panel 43, and a right side panel 44. The front panel 41 is formed on the front side of the outdoor unit 30. The front panel 41 is formed with an air outlet 41a through which outdoor air is blown out. The front panel 41 is configured to be detachable with respect to the main body of the casing 40. The rear panel 42 is formed on the rear side of the outdoor unit 30. The rear panel 42 is formed with a suction port 42a through which outdoor air is sucked. The left side panel 43 is formed on the left side of the outdoor unit 30. A suction port 43 a is formed in the left side panel 43. The right side panel 44 is formed on the right side of the outdoor unit 30.

  The casing 40 has a vertical partition plate 45 and a horizontal partition plate 46. The internal space of the casing 40 is partitioned into two spaces in the left-right direction by a vertical partition plate 45. The left space of the two spaces arranged in the left and right forms the blower chamber 47. The space on the right side is further divided into two spaces in the front and rear by a horizontal partition plate 46. Of the two spaces arranged in the front-rear direction, the rear space constitutes the machine room 48, and the front space constitutes the electrical component room 49.

  The electrical component chamber 49 accommodates an electrical component unit assembly 50. The electrical component unit assembly 50 includes various electrical components that control various components of the refrigeration apparatus 1, the cooling pipe 15 through which the refrigerant of the refrigerant circuit 10 flows, and the like.

(2) Detailed Configuration of Electrical Component Unit Assembly 50 The electrical component unit assembly 50 includes a cooling pipe 15, a printed circuit board 51, a cooling jacket 60, and a pressing plate 64. The electrical component unit assembly 50 is fixed to the horizontal partition plate 46 via a fixing member 501 (see FIG. 2).

(2-1) Cooling pipe 15
The cooling pipe 15 is a part of the refrigerant piping of the refrigerant circuit 10, and the indoor expansion valve 23 of the refrigerant circuit 10.
And an outdoor expansion valve 33. A high-pressure liquid refrigerant after being condensed in the indoor heat exchanger 21 or the outdoor heat exchanger 31 flows through the cooling pipe 15.

  FIG. 3 is a front view of the electrical component unit assembly 50 in FIG. 4 is a side view of the electrical component unit assembly 50 in FIG. 3 and 4, the cooling pipe 15 is formed in a U shape, and has two straight pipe parts 16 and a curved pipe part 17 that connects the ends of the two straight pipe parts 16. ing. The two straight pipe portions 16 are arranged substantially in parallel.

  The cooling pipe 15 is arranged in a vertical posture in the electrical component chamber 49 so that the curved pipe part 17 is located above the two straight pipe parts 16.

(2-2) Printed circuit board 51
The printed circuit board 51 is mounted with various electronic components including a power module 53 which is a high heat generating component. The power module 53 is a switching element of an inverter circuit, for example, and is cooled by the cooling jacket 60 so as not to exceed a temperature (for example, 90 ° C.) that generates heat during operation and does not exceed an operable temperature.

(2-3) Cooling jacket 60
The cooling jacket 60 is formed of a metal material having high thermal conductivity such as aluminum and is processed into a long plate shape. As shown in FIG. 4, the cooling jacket 60 includes a support portion 61, a main plane portion 62, and leg portions 67.

(2-3-1) Support part 61
The support part 61 supports the cooling pipe 15. The support portion 61 has two curved surfaces 61a extending in the longitudinal direction of the cooling jacket 60 and recessed inward, and the curved surface 61a is formed in a cross-sectional shape into which the straight tube portion 16 of the cooling tube 15 is fitted. Has been.

  After the cooling pipe 15 is fitted into the curved surface 61a, it is pressed against the curved surface 61a by the pressing plate 64. A heat transfer sheet 79 (see FIG. 5) is disposed between the cooling pipe 15 and the curved surface 61a. The heat transfer sheet 79 closes both sides between the cooling pipe 15 and the curved surface 61a to fill a minute gap, reduce the contact thermal resistance between the cooling pipe 15 and the curved surface 61a, and reduce the cooling pipe 15 and the curved surface 61a. Heat transfer between the surface 61a is promoted.

(2-3-2) Main plane portion 62
The main plane part 62 is a base part of the cooling jacket 60. The support portion 61 is formed on one surface side of the main plane portion 62, and a cooling plane 62a for cooling the power module 53 and the like is formed on the other surface. The cooling plane 62a is formed flat.

  A screw hole 62b is provided in a predetermined portion of the main plane portion 62 from the cooling plane 62a toward the inside. This is a hole for inserting a screw 92 for fixing the power module 53. The power module 53 is attached to the main plane portion 62 with screws 92 in a state where the heat dissipation surface is in contact with the cooling plane 62a.

(2-3-3) Protruding part 63
As shown in FIG. 4, the protruding portion 63 protrudes in the thickness direction of the main plane portion 62, that is, in the direction of the printed circuit board 51 from the cooling plane 62 a. The protrusion 63 has a tip surface 63a at its tip. The distal end surface 63a is a flat surface and is close to the low heat generating component 55 up to a position where the shortest distance from the low heat generating component 55 is less than 3 mm.

  For example, if the temperature of the protrusion 63 is lower than that of the surroundings, the radiant cooling performance is improved, and a cooling capacity exceeding natural air cooling is obtained. In addition, due to the heat conduction of air, a cooling performance inversely proportional to the distance between the protrusion 63 and the low heat generating component 55 can be obtained. When the distance is short, it is possible to obtain a cooling capacity several times that of natural air cooling. is there. In other words, the power module 53 and the low heat generating component 55 can be simultaneously cooled with a single cooling jacket 60.

  Further, the insulating member 77 is disposed between the low heat generating component 55 and the protruding portion 63. Normally, the shortest distance between the tip surface 63a of the protrusion 63 and the low heat generating component 55 is required to be about 3 to 4 mm in view of the insulation distance, the creepage distance, and the like. Without being concerned about the shortage of the insulation distance (and creepage distance), it is possible to approach the low heat generation component 55 to the position where the shortest distance to the low heat generation component 55 is less than 3 mm, so that the cooling performance is maintained while maintaining the insulation performance. The performance can be improved.

  Further, the insulating member 77 only needs to have insulating properties, and does not require thermal conductivity, flexibility, and a predetermined thickness required for the heat transfer sheet, and it is not necessary to strictly manage the position and gap. In addition, since it is simple and does not require man-hours, an increase in cost can be suppressed even if the cost and the increase in man-hours for attaching it are taken into account.

  The protruding portion 63 is formed integrally with the main plane portion 62 by extrusion processing. Of course, the present invention is not limited to the extrusion process, and may be separately created and combined.

(2-3-4) Leg 67
The leg portion 67 is a member for attaching the main flat surface portion 62 to the printed circuit board 51, and is formed by bending and processing a plated metal plate. The leg portion 67 has a holder 67a that supports an end portion of the main plane portion 62 in the longitudinal direction, and two leads 67b that extend perpendicularly from the holder 67a to the cooling plane 62a. Leads 67b are inserted into holes provided in the printed circuit board 51 in advance.

  The holes into which the leads 67b are inserted are connected to the conductor pattern 511 on the printed circuit board 51, and the leads 67b are connected to the conductor pattern 511 by soldering. As a result, the cooling jacket 60 is positioned on the printed circuit board 51.

  Since the metal plate which is the material of the leg portion 67 is a heat transfer member, the heat transfer between the main plane portion 62 and the conductor pattern 511 is performed via the holder 67a and the lead 67b of the leg portion 67. Further, the conductor pattern 511 is adjacent to the wiring conductor pattern 551 connected to the low heat generating component 55 with the printed board 51 interposed therebetween.

  Therefore, the printed circuit board 51 is widely cooled by the conductor pattern 511 connected to the lead 67b of the leg portion 67, and the conductor pattern 511 is adjacent to the wiring conductor pattern 551 connected to the low heat generating component 55 with the printed circuit board 51 interposed therebetween. Therefore, cooling of the low heat generating component 55 is further promoted.

(2-4) Holding plate 64
FIG. 5 is a cross-sectional view of the electrical component unit assembly 50 taken along line AA of FIG. In FIG. 5, the pressing plate 64 is formed by bending a rectangular metal plate that has been plated. When the holding plate 64 is fixed by the screw 91 from the support portion 61 side, the pressing plate 64 comes into contact with the two straight pipe portions 16 of the cooling pipe 15 and presses the straight pipe portion 16 against the curved surface 61a.

(3) Operation Next, the operation of the refrigeration apparatus 1 will be described with reference to FIG. The refrigeration apparatus 1 is an air conditioner, and performs switching between a cooling operation and a heating operation.

(3-1) Cooling Operation In the cooling operation, the refrigerant compressed by the compressor 34 is condensed by the outdoor heat exchanger 31. The condensed refrigerant passes through, for example, the fully expanded outdoor expansion valve 33 and flows through the cooling pipe 15. During operation of the compressor 34, the power module 53 generates heat. Since the temperature of the refrigerant flowing through the cooling pipe 15 itself is lower than the heat generation temperature of the power module 53, the heat of the power module 53 is generated by the cooling plane 62 a, the main plane section 62, the support section 61, the curved surface 61 a, and the cooling pipe 15. It is transmitted in order and discharged to the refrigerant in the cooling pipe 15. As a result, the power module 53 is cooled and maintained at a predetermined temperature at which the power module 53 can operate.

  The refrigerant flowing through the cooling pipe 15 is depressurized by the indoor expansion valve 23 and then evaporated by the indoor heat exchanger 21. Thereby, indoor air is cooled. The evaporated refrigerant is sucked into the compressor 34 and compressed.

(3-2) Heating Operation In the heating operation, the refrigerant compressed by the compressor 34 is condensed by the indoor heat exchanger 21. Thereby, indoor air is heated. The condensed refrigerant passes through the fully expanded indoor expansion valve 23 and flows through the cooling pipe 15, for example. The refrigerant flowing through the cooling pipe 15 absorbs heat from the power module 53 and cools the power module 53 in the same manner as in the cooling operation. The refrigerant flowing through the cooling pipe 15 is depressurized by the outdoor expansion valve 33 and then evaporated by the outdoor heat exchanger 31. The evaporated refrigerant is sucked into the compressor 34 and compressed.

(4) Features (4-1)
In the cooling jacket 60, the distance from the low heat generating component 55 on the printed circuit board 51 is reduced due to the presence of the protrusion 63, so that the cooling performance of the cooling jacket 60 with respect to the low heat generating component 55 is improved.

(4-2)
Since the cooling jacket 60 employs an integrated structure in which the protruding portion 63 protrudes directly from the main plane portion 62, it can be manufactured by extrusion processing, and an increase in processing cost is suppressed.

(4-3)
In the cooling jacket 60, an insulating member 77 is attached to the tip surface 63a of the protrusion 63, and the tip surface 63a approaches the low heat generating component 55 to a position where the shortest distance from the low heat generating component 55 is less than 3 mm. As a result, the cooling performance can be improved while maintaining the insulation performance without worrying about the shortage of the insulation distance (and creepage distance).

(4-4)
In the cooling jacket 60, the power module 53 is directly cooled by the main plane portion 62 of the cooling jacket 60, and the small low heat generating component 55 is cooled by the leg portion 67 and the printed circuit board 51 cooled by the leg portion 67. Can do.

(4-5)
In the cooling jacket 60, the printed circuit board 51 is widely cooled by the conductor pattern 511 connected to the leg portion 67, and further, the conductor pattern 511 is cooled adjacent to the wiring conductor pattern 551 connected to the low heat generating component 55. Cooling of the heat generating component 55 is promoted.

(5) Modified Examples (5-1) First Modified Example FIG. 6 is a cross-sectional view of an electrical component unit assembly having a cooling jacket 160 according to a first modified example. In FIG. 6, the difference between the cooling jacket 160 and the cooling jacket 60 according to the above embodiment is that a heat transfer promoting member 69 is provided instead of the protruding portion 63. Other than that, since it is the same as the cooling jacket 60 according to the above embodiment, only the heat transfer promoting member 69 and its effects will be described here.

  The heat transfer promoting member 69 is an L-shaped metal member, and has a long portion 69a and a short portion 69b. The long portion 69 a extends in the thickness direction from the cooling plane 62 a of the main plane portion 62, and the tip end portion is fixed to the printed circuit board 51. The short portion 69 b has a hole through which the screw 691 passes, and is screwed to the main plane portion 62 by the screw 691.

  On the surface of the printed circuit board 51 opposite to the cooling flat surface 62a, the long portion 69a of the heat transfer promoting member 69 is connected to a conductor pattern 511 to be soldered. However, the conductor pattern 511 is insulated from the electronic component.

  In order to improve heat dissipation, it is preferable that the conductor pattern 511 and the pattern of the electronic component be as close as possible. )doing.

  Since the heat transfer promoting member 69 cools the printed circuit board 51 widely through the conductor pattern 511, the wiring conductor pattern 551 adjacent to the conductor pattern 511 with the printed circuit board 51 interposed therebetween is also cooled, and the low heat generating component 55 is cooled. Promoted.

  In addition, the cost is increased by adding the heat transfer promoting member 69, but the cooling performance is high, so that it is smaller and less expensive than other methods.

(5-2) Second Modification FIG. 7 is a cross-sectional view of an electrical component unit assembly having a cooling jacket 260 according to a second modification. In FIG. 7, the difference between the cooling jacket 260 and the cooling jacket 60 according to the above embodiment is that a heat transfer promoting member 71 is provided instead of the protrusion 63. Other than that, since it is the same as the cooling jacket 60 according to the above-described embodiment, only the heat transfer promotion member 71 and its effects will be described here.

  The heat transfer promoting member 71 is an L-shaped metal member and has a long portion 71a and a short portion 71b. The long portion 71 a extends in the thickness direction from the cooling plane 62 a of the main plane portion 62, and the tip portion thereof is fixed to the printed circuit board 51.

  The short portion 71 b has a hole through which the screw 711 passes, and is screwed to the main plane portion 62 by the screw 711. Further, in order to ensure the insulation between the heat transfer promoting member 71 and the main plane portion 62, an insulating member 713 is sandwiched between the short portion 71b and the main plane portion 62, and the screw 711 and the short portion 71b An insulating member 715 is also sandwiched between them.

  On the surface of the printed circuit board 51 opposite to the cooling flat surface 62a, the long portion 69a of the heat transfer promoting member 69 is connected to a conductor pattern 511 to be soldered. However, the conductor pattern 511 is insulated from the electronic component. In order to improve heat dissipation, the conductor pattern 511 is connected to a wiring conductor pattern 551 connected to the low heat generating component 55.

  The heat transfer promoting member 71 cools the printed circuit board 51 widely via the conductor pattern 511 and further cools the wiring conductor pattern 551 connected to the low heat generating component 55, so that the low heat generating component 55 is cooled. Promoted.

(6) Other embodiments (6-1)
FIG. 8 is a cross-sectional view of an electrical component unit assembly having a cooling jacket 360 according to another embodiment. In FIG. 8, the difference between the cooling jacket 360 and the cooling jacket 60 according to the above embodiment is that the protruding portion 63 is eliminated and the low heat generating component 55 is adjacent to the power module 53.

  In the cooling jacket 360, when the power module 53 is sufficiently cooled by the main plane portion 62 and the temperature is low, the power module 53 cools the low heat generating component 55 adjacent thereto. As a result, the power module 53 is used as a cooling member for the low heat generating component 55, and an increase in cost is suppressed.

(6-2)
A high heat radiation paint may be applied to the cooling jackets 60, 160, 260, 360 described in FIGS. The high heat radiation paint increases the effect of heat radiation from the cooling plane of each cooling jacket and improves the cooling performance. The same effect can be obtained even if a high heat dissipation paint is applied to the low heat generating component 55 side.

  In the present application, an air conditioner is described as an example of a refrigeration apparatus mounted with a cooling jacket that is mounted on a refrigerant pipe and cools heat-generating components. .

51 Printed circuit board 53 Power module (High heat generation parts)
55 Low heat generating component 60 Cooling jacket 62 Main plane portion 62a Cooling plane 63 Projection portion 63a Tip surface 67 Leg portion 69 Heat transfer promoting member 77 Insulating member 511 Conductive pattern 551 Conductive pattern for wiring

JP 2009-88344 A JP 2008-258495 A JP 05-259370 A

Claims (12)

A cooling jacket that receives cold from a cold source to cool the high heat generating component (53) and the low heat generating component (55) mounted on the substrate (51),
A main plane portion (62) in close contact with the high heat-generating component (53);
Legs (67) which are members for attaching the main plane portion (62) to the substrate (51);
Apart from the leg portion (67), a protruding portion (63) protruding from the plane (62a) of the main plane portion (62) toward the substrate (51),
With
The substrate (51) and the cooling jacket are arranged in a vertical posture, and the high heat generating component (53) is located above the low heat generating component (55).
Cooling jacket (60). The main plane part (62) is flat.
The protruding portion (63) protrudes in the thickness direction of the main plane portion (62).
The cooling jacket (60) according to claim 1. The main plane portion (62) and the protruding portion (63) are formed integrally.
The cooling jacket (60) according to claim 1 or 2. A cooling jacket that receives cold from a cold source to cool the high heat generating component (53) and the low heat generating component (55) mounted on the substrate (51),
A main plane portion (62) in close contact with the high heat-generating component (53);
A projecting portion (63) projecting from the plane (62a) of the main plane portion (62) toward the substrate (51);
With
The substrate (51) and the cooling jacket are arranged in a vertical posture, and the high heat generating component (53) is located above the low heat generating component (55),
The protrusion (63) has a tip surface (63a) which is a flat surface at the tip,
The tip surface (63a) approaches the low heat generation component (55) to a position where the shortest distance between the low heat generation component (55) and the tip surface (63a) is less than 3 mm.
Cooling jacket (60). An insulating member (77) disposed between the low heat generating component (55) and the protrusion (63);
The cooling jacket (60) according to any one of claims 1 to 4. A leg portion (67) which is molded from a heat transfer member and fixes the main plane portion (62) to the substrate (51);
The leg portion (67) is fixed at a position adjacent to the low heat generating component (55) in the substrate (51).
The cooling jacket (60) according to any one of the preceding claims. The leg (67) is connected to the conductor pattern (511) on the substrate (51),
The conductor pattern (511) is adjacent to a wiring conductor pattern (551) connected to the low heat-generating component (55).
The cooling jacket (60) according to claim 6. The protrusion (63) includes a heat transfer promoting member (69) extending from the main plane portion (62) and fixed to the substrate (51),
The heat transfer promoting member (69) is connected to the conductor pattern (511) on the substrate (51),
The conductor pattern (511) is adjacent to a wiring conductor pattern (551) connected to the low heat-generating component (55).
The cooling jacket (60) according to claim 1. A cooling jacket that receives cold from a cold source to cool the high heat generating component (53) and the low heat generating component (55) mounted on the substrate (51),
A main plane portion (62) in close contact with the high heat-generating component (53);
A projecting portion (63) projecting from the plane (62a) of the main plane portion (62) toward the substrate (51);
With
The substrate (51) and the cooling jacket are arranged in a vertical posture, and the high heat generating component (53) is located above the low heat generating component (55),
The protrusion (63) includes a heat transfer promotion member (71) extending from the main plane portion (62) and fixed to the substrate (51),
The heat transfer facilitating member (71) is fixed with an insulating member sandwiched between the main plane portion (62) and connected to the conductor pattern (511) on the substrate (51),
The conductor pattern (511) is joined to a wiring conductor pattern (511) connected to the low heat generating component (55).
Cooling jacket (60). The low heat generating component (55) is adjacent to the high heat generating component (53),
A cooling jacket (60) according to any one of the preceding claims. The low heat generating component (55) includes a ceramic capacitor, a resistor and a microcomputer.
A cooling jacket (60) according to claims 1-10. High heat dissipation paint is applied,
The cooling jacket (60) according to claim 1.

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