CN105722371B - Heat transfer assembly and heat abstractor - Google Patents
Heat transfer assembly and heat abstractor Download PDFInfo
- Publication number
- CN105722371B CN105722371B CN201410738217.2A CN201410738217A CN105722371B CN 105722371 B CN105722371 B CN 105722371B CN 201410738217 A CN201410738217 A CN 201410738217A CN 105722371 B CN105722371 B CN 105722371B
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting piece
- radiator
- contact surface
- setting face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention relates to a kind of heat transfer assembly, and it establishes a heat conduction path between one first radiator and one second radiator；Heat transfer assembly includes one first heat-conducting piece and one second heat-conducting piece；First heat-conducting piece is connected to the first radiator, and the first heat-conducting piece has one first contact surface；Second heat-conducting piece is connected to the second radiator, and the second heat-conducting piece has one second contact surface, and it is contacted with the first contact surface.The invention further relates to a kind of heat abstractor, has the first radiator, the second radiator and heat transfer assembly.Heat transfer assembly and heat abstractor provided by the present invention, it is contacted with each other by the first contact surface and the second contact surface, first heat-conducting piece and the second heat-conducting piece establish a heat conduction path, and connect the first radiator and the second radiator so that the second radiator can expand, strengthen the cooling efficiency of the first radiator；And second radiator can close to the first heat sink arrangements, therefore with compactification overall structure without space-consuming the characteristics of.
Description
Technical field
It is total to refer in particular to a kind of heat transfer for being used to expand radiator heat-dissipation efficiency on a kind of heat transfer assembly by the present invention
Into and heat abstractor.
Background technology
In circuit substrate, various forms of radiators are generally set, it is overall to particular electronic component or system to reach
The effect to be radiated.And different fixed structures, fixed column can be generally also set in circuit substrate, for subsequently will be various attached
Structure is added to be installed on circuit substrate.
The hardware unit assembled in general main frame, such as display card or central processing unit etc., above-mentioned hardware unit
Certain heat energy can be also produced while operation.And heat energy caused by the hardware unit in computer must be by dissipating
Thermal radiates to the electronic building brick of higher calorific power.
Traditional heat abstractor is usually radiating fin group, is aided in by free convection, forced convertion even water cooling
Mode, to remove absorbed heat.In the case of radiating fin group heat dissipation deficiency, the Main Means for solving demand are exactly
Strengthen the mode of forced convertion or water cooling efficiency.
However, in part system, due to Jing Yin or other demands, radiating fin group can only be by the way of free convection
To remove absorbed heat.If so, the heat dissipation deficiency of radiating fin group, radiating fin group more renew and larger-sized
To solve.Aforementioned manner, the stock of manufacturer can be caused to complicate, since it is desired that being prepared according to different radiating requirements different
Radiator stock.And for terminal user, if the problem of finding heat dissipation deficiency, it can only directly change heat radiating fin
Piece group.
The content of the invention
In view of this, it is an object of the invention to provide a kind of heat transfer assembly and heat abstractor, and manufacturer is caused
Or user expands, strengthened the heat dissipation of existing radiator on the basis of existing.
In order to reach above-mentioned purpose, the present invention provides a kind of heat transfer assembly, and it is in one first radiator and one second
Being established between radiator has a heat conduction path；The heat transfer assembly includes：
One first heat-conducting piece, it is connected to first radiator, and first heat-conducting piece has one first contact surface；And
One second heat-conducting piece, it is connected to second radiator, and second heat-conducting piece has one second contact surface, and this
Two contact surfaces are contacted with first contact surface.
As a kind of above-mentioned preferred scheme of heat transfer assembly, wherein first heat-conducting piece is arranged at first radiator
One first setting face, and second heat-conducting piece is arranged at one second setting face of second radiator.
As a kind of above-mentioned preferred scheme of heat transfer assembly, wherein the heat transfer assembly further includes a fixing device,
To fix first heat-conducting piece in second heat-conducting piece, and first contact surface is in close contact with second contact surface.
As a kind of above-mentioned preferred scheme of heat transfer assembly, wherein the heat transfer assembly further includes one the 3rd heat conduction
Part, second heat-conducting piece are connected by the 3rd heat-conducting piece with second radiator.
As a kind of above-mentioned preferred scheme of heat transfer assembly, wherein the 3rd heat-conducting piece is a long rod, and its one end connects
Second radiator is connect, and the other end connects second heat-conducting piece.
As a kind of above-mentioned preferred scheme of heat transfer assembly, wherein the 3rd heat-conducting piece extends for bending.
As a kind of above-mentioned preferred scheme of heat transfer assembly, shape wherein between second heat-conducting piece and second radiator
Into a grasping part, and first radiator is located at the grasping part, and the first contact surface of first heat-conducting piece contact this
Second contact surface of two heat-conducting pieces.
As a kind of above-mentioned preferred scheme of heat transfer assembly, the 3rd heat-conducting piece is a metallic rod or a heat pipe.
In order to reach above-mentioned purpose, the present invention also provides a kind of heat abstractor, comprising：
One first radiator, it has one first setting face；
One first heat-conducting piece, it is arranged at first setting face and is connected to first radiator, and first heat-conducting piece
With one first contact surface；
One second radiator, it has one second setting face；And
One second heat-conducting piece, it is connected to the second setting face of second radiator, and second heat-conducting piece has one the
Two contact surfaces, second contact surface are contacted with first contact surface.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein second heat-conducting piece is arranged at second setting face, and
First setting face faces each other with second setting face.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein the heat abstractor further includes a fixing device, to
First heat-conducting piece is fixed in second heat-conducting piece, and first contact surface is in close contact with second contact surface.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein the heat abstractor further includes one the 3rd heat-conducting piece, prolong
Second setting face is stretched in, and connects second setting face of second heat-conducting piece and second radiator.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein the 3rd heat-conducting piece is a long rod, and its one end connects
Second setting face of second heat-conducting piece, and the other end connects the 3rd heat-conducting piece.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein the 3rd heat-conducting piece extends for bending.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein first setting face and second setting face is towards same
Direction, a grasping part is formed between second heat-conducting piece and second radiator, and first radiator is located at clamping sky
Between, and the first contact surface of first heat-conducting piece contacts the second contact surface of second heat-conducting piece.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein second radiator corresponds to the one of first setting face
Side is set.
As a kind of above-mentioned preferred scheme of heat abstractor, wherein the 3rd heat-conducting piece is a metallic rod or a heat pipe.
Heat transfer assembly and heat abstractor provided by the present invention, pass through the mutual of the first contact surface and the second contact surface
Contact, the first heat-conducting piece and the second heat-conducting piece establish a heat conduction path, and connect the first radiator and the second radiator so that
Second radiator can expand, strengthen the cooling efficiency of the first radiator；And second radiator can close to first dissipate
Hot device configuration, therefore there is the characteristics of compactification overall structure is without space-consuming.
Brief description of the drawings
Fig. 1 is one of exploded perspective view of first embodiment of the invention；
Fig. 2 is the two of the exploded perspective view of first embodiment of the invention；
Fig. 3 is the stereogram of first embodiment of the invention；
Fig. 4 is one of exploded perspective view of second embodiment of the invention；
Fig. 5 is the two of the exploded perspective view of second embodiment of the invention；
Fig. 6 is the stereogram of second embodiment of the invention；
Fig. 7 is one of exploded perspective view of third embodiment of the invention；
Fig. 8 is the two of the exploded perspective view of third embodiment of the invention；
Fig. 9 is the stereogram of third embodiment of the invention；
Figure 10 is first, second, third embodiment of the invention while the stereogram implemented.
Critical piece title：
The radiators of 100- first；1000- heat abstractors；The setting faces of 101- first；
The radiators of 200- second；The setting faces of 202- second；
The heat-conducting pieces of 310- first；The contact surfaces of 311- first；The heat-conducting pieces of 320- second；The contact surfaces of 322- second；330- the 3rd
Heat-conducting piece；
400- fixing devices.
Embodiment
It in order to which above and other objects of the present invention, feature and advantage can be become apparent from, will hereafter coordinate accompanying drawing, make detailed
Carefully it is described as follows.
Refer to shown in Fig. 1, Fig. 2 and Fig. 3, be a kind of heat abstractor 1000 disclosed in first embodiment of the invention, wrap
Containing a heat transfer assembly, one first radiator 100 and one second radiator 200.Heat transfer assembly is in the first radiator
100 and second a heat conduction path is established between radiator 200, the first radiator 100 is supplemented to pass through the second radiator 200
The deficiency of heat dissipation.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the first radiator 100 has one first setting face 101, the second radiator 200 has
One second setting face 202.In embodiments of the invention, the first radiator 100 or the second radiator 200 using fin slices radiator as
Example, but is not limited, and radiator also can be the combining of fin and heat pipe, heat sink with the combination of heat pipe or simple heat sink.
As shown in Figure 1, Figure 2 with shown in Fig. 3, heat transfer assembly includes at least one first heat-conducting piece 310 and at least 1 second led
Warmware 320.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the first heat-conducting piece 310 is arranged at the first setting face 101, and is connected to the first radiating
Device 100, and the first heat-conducting piece 310 has one first contact surface 311.
First radiator 100 is usually as electronic component, such as the main heat sink unit of the display chip of a display card, and
It is arranged on the one side of circuit board, to contact display chip.And the first heat-conducting piece 310 is then away from foregoing board side
Face, to further the second radiator 200 of connection, to expand the cooling of the first radiator 100 by the second radiator 200
Efficiency.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the second heat-conducting piece 320 is connected to the second radiator 200, is particularly connected to second
Setting face 202.Second heat-conducting piece 320 has one second contact surface 322, for being contacted with the first contact surface 311.Connect by first
Contacting surface 311 contacts with each other with the second contact surface 322, and the first heat-conducting piece 310 and the second heat-conducting piece 320 establish a heat transfer road
Footpath, and connect the first radiator 100 and the second radiator 200 so that the second radiator 200 can expand, strengthen the first radiating
The cooling efficiency of device 100.
In first embodiment, the first heat-conducting piece 310 is arranged at the first setting face 101 of the first radiator 100, and second leads
Warmware 320 is directly arranged at the second setting face 202 of the second radiator 200, and the first setting face 101 and the second setting face
202 face each other.
First heat-conducting piece 310 is incorporated into the means of the first setting face 101, or the second heat-conducting piece 320 is arranged at the second setting
The mode in face 202, can be bonding, inlay card, welding or in a manner of other fixtures auxiliary is fixed, but not using foregoing approach as
Limit.The present embodiment is disclosed for the first heat-conducting piece 310 is embedded in the groove of the first setting face 101, the second heat-conducting piece 320 is embedded in
Illustrate exemplified by the groove of second setting face 202.
As shown in Figures 1 and 2, heat transfer assembly further includes a fixing device 400, to fix the first heat-conducting piece 310 in
Second heat-conducting piece 320, so that the first contact surface 311 is in close contact with the second contact surface 322.In the present embodiment, made with screw
For the illustration of fixing device 400, but it is not limited, fixing device 400 can also be the combination of other necks and fixture block, or
The higher heat-conducting glue of adhesion.
By the configuration of first embodiment, the first radiator 100 is arranged side by side with the second radiator 200 to be parallel, and shape
Into the arrangement of compactification, without extra space-consuming, and it is combined as a whole, simplifies the framework for expanding heat dissipation.
Refer to shown in Fig. 4, Fig. 5 and Fig. 6, be a kind of heat abstractor 1000 shown in second embodiment of the invention, comprising
One heat transfer assembly, one first radiator 100 and one second radiator 200.
As shown in Fig. 4, Fig. 5 and Fig. 6, the first radiator 100 has one first setting face 101, and the second radiator 200 has
One second setting face 202.
As shown in Fig. 4, Fig. 5 and Fig. 6, heat transfer assembly is led including at least one first heat-conducting piece 310, at least one second
Warmware 320 and at least one 3rd heat-conducting piece 330.
As shown in Fig. 4, Fig. 5 and Fig. 6, the first heat-conducting piece 310 is arranged at the first setting face 101, and is connected to the first radiating
Device 100, and the first heat-conducting piece 310 has one first contact surface 311.3rd heat-conducting piece 330 extends the second setting face 202, and
Connect the second setting face 202 of the second heat-conducting piece 320 and the second radiator 200 so that the second heat-conducting piece 320 is indirectly by
Three heat-conducting pieces 330 are connected to the second radiator 200.Second heat-conducting piece 320 has one second contact surface 322, for being contacted with
One contact surface 311.By contacting with each other for the first contact surface 311 and the second contact surface 322, the first heat-conducting piece 310 is led with second
Warmware 320 establishes a heat conduction path.
In second embodiment, the 3rd heat-conducting piece 330 is a long rod, can be a metallic rod or a heat pipe.3rd heat conduction
One end of part 330 connects the second setting face 202 of the second radiator 200, and the other end connection second of the 3rd heat-conducting piece 330 is led
Warmware 320.Meanwhile the 3rd heat-conducting piece 330 for bending extend, be between the first setting face 101 and the second setting face 202 it is vertical,
So that form a grasping part between the second heat-conducting piece 320 and the second radiator 200.First radiator 100 is positioned in display
In grasping part, and the first contact surface 311 of the first heat-conducting piece 310 is set to contact the second contact surface 322 of the second heat-conducting piece 320.
By the configuration of second embodiment, the first radiator 100 is arranged side by side with the second radiator 200 to be parallel, and shape
Into the arrangement of compactification, without extra space-consuming, and it is combined as a whole, simplifies the framework for expanding heat dissipation.
Refer to shown in Fig. 7, Fig. 8 and Fig. 9, be a kind of heat abstractor 1000 shown in third embodiment of the invention, comprising
One heat transfer assembly, one first radiator 100 and one second radiator 200.
As shown in Fig. 7, Fig. 8 and Fig. 9, heat transfer assembly includes one first heat-conducting piece 310, one second heat-conducting piece 320 and one
3rd heat-conducting piece 330.
3rd embodiment is roughly the same with second embodiment, and its difference is, in 3rd embodiment, and the second radiator
200 sides for corresponding to the first setting face 101 are set, and form the first radiator 100 and the extension arrangement of the second radiator 200
Form.
As shown in Figure 10, it first embodiment, second embodiment and 3rd embodiment, can individually implement, can also appoint
Meaning combination is implemented, or even as Figure 10 implements three embodiments simultaneously, and formed one first radiator 100 by more than two the
Second radiator 200 expands the structure of heat dissipation.And the second radiator 200 is configured close to the first radiator 100, therefore have
There is the characteristics of compactification overall structure is without space-consuming.
It is described above, only presently preferred embodiments of the present invention, the scope of patent protection of the present invention is not thereby limited, therefore
Such as the equivalent changes and modifications made with description of the invention and accompanying drawing, are all that protection scope of the present invention is covered.
Claims (10)
1. a kind of heat transfer assembly, it is established between one first radiator and one second radiator a heat conduction path；Its
It is characterised by, the heat transfer assembly includes：
One first heat-conducting piece, it is connected to first radiator, and first heat-conducting piece has one first contact surface；
One second heat-conducting piece, it is connected to second radiator, and second heat-conducting piece has one second contact surface, and this second connects
Contacting surface is contacted with first contact surface；And
One the 3rd heat-conducting piece, the 3rd heat-conducting piece is a long rod and the 3rd heat-conducting piece extends for bending, the 3rd heat-conducting piece
One end connects second radiator, and the other end connects second heat-conducting piece, between second heat-conducting piece and second radiator
A grasping part is formed, and first radiator is located at the grasping part, and the contact of the first contact surface of first heat-conducting piece should
Second contact surface of the second heat-conducting piece.
2. heat transfer assembly as claimed in claim 1, it is characterised in that first heat-conducting piece is arranged at first radiator
One first setting face, and second heat-conducting piece is arranged at one second setting face of second radiator.
3. heat transfer assembly as claimed in claim 1, it is characterised in that further include a fixing device, to fix this first
Heat-conducting piece is in second heat-conducting piece, and first contact surface is in close contact with second contact surface.
4. heat transfer assembly as claimed in claim 1, it is characterised in that the 3rd heat-conducting piece is a metallic rod or a heat pipe.
5. a kind of heat abstractor, it is characterised in that include：
One first radiator, it has one first setting face；
One first heat-conducting piece, it is arranged at first setting face and is connected to first radiator, and first heat-conducting piece has
One first contact surface；
One second radiator, it has one second setting face；
One second heat-conducting piece, it is connected to the second setting face of second radiator, and second heat-conducting piece has one second to connect
Contacting surface, second contact surface are contacted with first contact surface；And
One the 3rd heat-conducting piece, bending extend second setting face, and the 3rd heat-conducting piece is a long rod, and connect this and second lead
Second setting face of warmware and second radiator.
6. heat abstractor as claimed in claim 5, it is characterised in that second heat-conducting piece is arranged at second setting face, and
First setting face faces each other with second setting face.
7. heat abstractor as claimed in claim 5, it is characterised in that further include a fixing device, first led to fix this
Warmware is in second heat-conducting piece, and first contact surface is in close contact with second contact surface.
8. heat abstractor as claimed in claim 5, it is characterised in that first setting face and second setting face are towards same
Direction, a grasping part is formed between second heat-conducting piece and second radiator, and first radiator is located at clamping sky
Between, and the first contact surface of first heat-conducting piece contacts the second contact surface of second heat-conducting piece.
9. heat abstractor as claimed in claim 6, it is characterised in that second radiator corresponds to the one of first setting face
Side is set.
10. heat abstractor as claimed in claim 5, it is characterised in that the 3rd heat-conducting piece is a metallic rod or a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410738217.2A CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410738217.2A CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105722371A CN105722371A (en) | 2016-06-29 |
| CN105722371B true CN105722371B (en) | 2018-03-09 |
Family
ID=56144334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410738217.2A Active CN105722371B (en) | 2014-12-05 | 2014-12-05 | Heat transfer assembly and heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105722371B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI666543B (en) * | 2018-03-15 | 2019-07-21 | 英研智能移動股份有限公司 | Bridge-variable cooling module and electrical device using the same |
| CN112003487A (en) * | 2020-07-24 | 2020-11-27 | 华为技术有限公司 | Heat dissipation device, inverter and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773902Y (en) * | 2005-03-07 | 2006-04-19 | 达隆科技股份有限公司 | Symmetric radiating module structure with heat collecting tube |
| CN101222836A (en) * | 2007-01-11 | 2008-07-16 | 杨伍民 | Direct conduction-Peltier effect refrigeration mixed cooling method and device |
| CN101316495A (en) * | 2007-06-01 | 2008-12-03 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN202931731U (en) * | 2012-11-07 | 2013-05-08 | 广西嵘光珈程科技发展有限公司 | Composite pipe type heat radiation apparatus |
| CN103140121A (en) * | 2011-12-02 | 2013-06-05 | 技嘉科技股份有限公司 | Heat dissipation device and adapter with same |
| CN202998766U (en) * | 2012-12-03 | 2013-06-12 | 深圳市万景华科技有限公司 | A heat dissipater |
| CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
-
2014
- 2014-12-05 CN CN201410738217.2A patent/CN105722371B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773902Y (en) * | 2005-03-07 | 2006-04-19 | 达隆科技股份有限公司 | Symmetric radiating module structure with heat collecting tube |
| CN101222836A (en) * | 2007-01-11 | 2008-07-16 | 杨伍民 | Direct conduction-Peltier effect refrigeration mixed cooling method and device |
| CN101316495A (en) * | 2007-06-01 | 2008-12-03 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN103140121A (en) * | 2011-12-02 | 2013-06-05 | 技嘉科技股份有限公司 | Heat dissipation device and adapter with same |
| CN202931731U (en) * | 2012-11-07 | 2013-05-08 | 广西嵘光珈程科技发展有限公司 | Composite pipe type heat radiation apparatus |
| CN202998766U (en) * | 2012-12-03 | 2013-06-12 | 深圳市万景华科技有限公司 | A heat dissipater |
| CN104066301A (en) * | 2013-03-22 | 2014-09-24 | 技嘉科技股份有限公司 | Heat pipe type radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105722371A (en) | 2016-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101616565A (en) | Heat abstractor | |
| US20140182817A1 (en) | Low thermal resistance cooler module for embedded system | |
| TWI435423B (en) | Bi-directional heat sink for package element and a method of fabricating the same | |
| TW200945010A (en) | Heat-dissipation module and electronic apparatus having the same | |
| TWI498519B (en) | Heat dissipating module | |
| CN101808490A (en) | Heat dissipating device | |
| TW201143590A (en) | Heat dissipation device | |
| CN105722371B (en) | Heat transfer assembly and heat abstractor | |
| US20050063159A1 (en) | Heat-dissipating fin module | |
| US20130168055A1 (en) | Thermal module | |
| TWI522032B (en) | Heat dissipating module | |
| CN101415312A (en) | Radiating device | |
| CN102891119A (en) | Radiating device | |
| WO2016197789A1 (en) | Liquid-cooled heat sink, and processing and assembly method therefor | |
| CN205566947U (en) | Heat abstractor and function board subassembly | |
| JP7275505B2 (en) | semiconductor equipment | |
| CN104039112A (en) | Heat dissipation module | |
| TW201410127A (en) | Electronic device | |
| CN203708747U (en) | Heat dissipation structure of vehicle-mounted navigation system | |
| CN114356053B (en) | Heat radiation module | |
| CN212484242U (en) | Server case and server | |
| TWI758900B (en) | Cooling module | |
| CN100481408C (en) | Heat radiator | |
| TW201326726A (en) | Heat dissipating device | |
| TW201621257A (en) | Heat transfer assembly and heat dissipating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |