CN104039112A - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
CN104039112A
CN104039112A CN201310072537.4A CN201310072537A CN104039112A CN 104039112 A CN104039112 A CN 104039112A CN 201310072537 A CN201310072537 A CN 201310072537A CN 104039112 A CN104039112 A CN 104039112A
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CN
China
Prior art keywords
substrate
radiating module
radiating
heat dissipating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310072537.4A
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Chinese (zh)
Inventor
陈鸿川
许正纬
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Delta Optoelectronics Inc
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Delta Optoelectronics Inc
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Publication date
Application filed by Delta Optoelectronics Inc filed Critical Delta Optoelectronics Inc
Priority to CN201310072537.4A priority Critical patent/CN104039112A/en
Publication of CN104039112A publication Critical patent/CN104039112A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation module comprises a substrate and a heat dissipation layer. The substrate has a first surface and a second surface. The heat dissipation layer is arranged on the second surface. At least one heating element is electrically connected to the first surface, and the heat dissipation module is vertically arranged on a motherboard. By adopting the heat dissipation module of the invention, hours required in the heat dissipation process can be saved, the efficiency of automated production can be improved, the assembly cost can be reduced, and an effect of high heat dissipation efficiency can be achieved.

Description

Radiating module
Technical field
The present invention is about a kind of radiating module, especially in regard to a kind of have can save assembling space improving radiating effect radiating module.
Background technology
Development along with electronic industry, make the running speed of electronic component and the requirement of effect day by day promote, so its derivative heat dissipation problem is also further serious, and then has influence on performance and stability while moving, gently cause electronic installation usefulness variation, heavy cause burning of electronic installation.For making the electronic installation can normal operation, generally additional radiator can be installed on heat-generating electronic elements, by heat energy being derived via radiator.
And in recent years due to the progress of technology, the volume of electronic installation dwindles gradually so that carry, its microelectronic element comprising is because area constantly dwindles, and the heat that unit are is accumulated also increases relatively, therefore needs preferably heat abstractor of radiating efficiency; On the other hand, due to the small volume of microelectronic element, heat abstractor large-scale and that intensity is higher cannot be set, in addition, heat abstractor also can occupy the space of electronic installation.
Being applied at present the radiator of electronic installation, is mainly that power component finned on motherboard or circuit board is as heat abstractor, with the action of dispelling the heat.Yet heat abstractor is arranged at respectively to the motherboard with complicated power component or the circuit board with complicated circuit, not only consuming time in process, and its radiating effect is limited, especially at component number in more or comparatively complicated device, if need consider simultaneously, space and radiating effect are set, can be comparatively complicated on the design of heat abstractor and whole installation, will certainly increase time and cost on overall process.On the other hand, the connected mode of existing heater element and heat abstractor is main mainly with screw lock, and so this connected mode can increase process and activity duration, and the quantity of its element comprising is many, has the problem existence that is difficult for automation.
Therefore, how to provide a kind of by Simple Design and set-up mode, can reach and save man-hour and assembly cost, and the radiating module of effective heat radiation speed, to increase radiating efficiency, become one of important topic.
Summary of the invention
Because above-mentioned problem, object of the present invention, for providing a kind of by Simple Design and set-up mode, can reach and save man-hour and assembly cost, and the radiating module of effective heat radiation speed, to increase radiating efficiency.
For reaching above-mentioned purpose, according to a kind of radiating module of the present invention, comprise at least one substrate and a heat dissipating layer.Substrate has a first surface and a second surface.Heat dissipating layer is arranged at second surface.Wherein, at least one heater element is electrically connected at first surface, and radiating module vertical type be arranged on a mainboard.
In one embodiment, radiating module also comprises at least one wire.Wire is arranged at first surface or second surface.
In one embodiment, substrate has at least one pin, and substrate is inserted on mainboard by pin.
In one embodiment, wire is electrically connected heater element and pin.
In one embodiment, substrate is an aluminium base.
In one embodiment, substrate has more at least one copper foil layer.
In one embodiment, heat dissipating layer has at least one foot, and heat dissipating layer is inserted on mainboard by pin.
In one embodiment, heat dissipating layer is a metal material.
In one embodiment, metal material comprises copper, aluminium, nickel, gold, silver or its alloy.
In one embodiment, the connected mode of substrate and heat dissipating layer comprises fixing, screw lock or rivet, also comprises surface adhering technical (Surface Mount Technology, SMT).
In one embodiment, heater element is a surface sticking electronic element.
In one embodiment, heat dissipating layer has a plurality of fins.
In one embodiment, radiating module also comprises a heat conductive insulating layer.Heat conductive insulating layer be arranged at substrate and heat dissipating layer between.
In one embodiment, heat conductive insulating layer comprises aluminium dioxide, beryllium oxide, carborundum, silicon nitride or boron nitride.
From the above, a kind of radiating module provided by the present invention, is by electronic component, as: the heating crystal on motherboard or its control unit are around arranged on aluminum circuit board, so that the element being originally arranged on motherboard is moved on on aluminum circuit board, can increase arrangement space on motherboard.The more important thing is, by heat radiating metallic layer is connected in to circuit board, the setting of integral heat dissipation means need not take the too much space of motherboard, space availability ratio can significantly promote, in addition, the present invention by pin is set on heat radiating metallic layer, can directly be fastened on motherboard it, has the effect of firm heat abstractor.More importantly, by being connected of motherboard and heat radiating metallic layer, can promote the area of heat energy loss, so that better radiating effect to be provided.
In addition, more can the arrange in pairs or groups setting of an insulating heat-conduction material of the present invention, increases the space that arranges of elements on circuit board and circuit, also be, circuit board by radiating module of the present invention applicable to one side wiring or double-sided wiring, and then increase its range of application, and improving heat radiation efficiency.And compared to prior art, radiating module of the present invention design can make to use in its electronic installation provides more element that space is set, and by arrangement of the present invention, can effectively promote the speed of electronic installation heat radiation.
Accompanying drawing explanation
Figure 1A is the decomposing schematic representation of a kind of radiating module of preferred embodiment of the present invention.
Figure 1B is the combination schematic diagram of a kind of radiating module of Figure 1A.
Fig. 2 is the decomposing schematic representation that the another kind of radiating module of preferred embodiment of the present invention has different shape.
Fig. 3 is the decomposing schematic representation that another radiating module of preferred embodiment of the present invention has different shape.
Fig. 4 is the decomposing schematic representation that another radiating module of preferred embodiment of the present invention has the heat dissipating layer of different shape.
Wherein, description of reference numerals is as follows:
1,2,3,4: radiating module
11,21,31,41: substrate
111,311,321: first surface
112,212,312,, 422: second surface
113,213: wire
114,314: pin
12,22,32,42: heat dissipating layer
123,223: foot
23: heat conductive insulating layer
E: heater element
F: radiating fin
T: rivet
Embodiment
Hereinafter with reference to relevant drawings, a kind of radiating module according to preferred embodiment of the present invention is described, wherein identical element is illustrated the reference marks with identical.
Figure 1A is the decomposing schematic representation of a kind of radiating module of preferred embodiment of the present invention, the combination schematic diagram of a kind of radiating module that Figure 1B is Figure 1A.Please also refer to shown in Figure 1A and Figure 1B, radiating module 1 comprises at least one substrate 11 and a heat dissipating layer 12, wherein, and being arranged in a mainboard (not shown) of radiating module 1 vertical type.Specifically, radiating module 1 inserts (pin through hole, PTH) by pin or surface adhering technical (surface mount technology, SMT) is arranged on mainboard, alleged " mainboard " can be a motherboard herein, and the present invention does not limit in this.But above-mentioned connected mode is in institute of the present invention technical field, to have conventionally to know that the knowledgeable can the person of understanding, in this, repeats no more.Below first each architectural feature for radiating module 1 is illustrated one by one.
Substrate 11 is an aluminium base, and at least one heater element E is electrically connected at substrate 11, however the present embodiment with totally four heater element E, represent, but this non-restriction.Wherein, substrate 11 has a first surface 111 and a second surface 112, and heater element E is arranged at the first surface 111 of substrate 11 by surface adhering technical.Wherein, heater element E can be active element heating crystal or control element around it, right this non-restriction, but the heater element E of indication is the element that in electronic installation, meeting dissipation goes out heat energy herein, by surface adhering technical, heater element E is arranged to substrate 11 and there is the component number of minimizing and saving process, and be beneficial to the advantage of automation.
In the present embodiment, substrate 11 is a printed circuit board (PCB) (Printed Circuit Board), on it, be furnished with copper foil layer forms wire 114 line pattern use for etching, right this non-restriction, in practical application, substrate of the present invention also can be module board (module board) or base plate for packaging (package substrate), and the present invention does not limit in this.Specifically, after first surface 111 on substrate 11 and second surface 112 coated copper foil layers, can further carry out etching and form line pattern, for being arranged at heater element E on substrate 11, by wire, be electrically connected, so in the present embodiment, only the first surface 111 in substrate 11 is provided with heater element E, therefore the wiring pattern of copper foil layer at least be take first surface 111 as main, also be, wire 114 is only arranged at the first surface 111 of substrate 11, in other embodiment, the position of connecting up on the installation position of heater element and substrate can be two-sidedly all to be had, the present invention does not limit in this.
Heat dissipating layer 12 is a metal material, and specifically, the material of heat dissipating layer 12 is an aluminum metal, right non-limiting person of this material, and other metal materials, refer in particular to the metal material with high-termal conductivity, as copper, aluminium, nickel, gold, silver or its alloy also can be used.
In the present embodiment, heat dissipating layer 12 is the tabular aluminium metal sheet that is rectangle haply, and the second surface 112 that it is arranged at substrate 11 is also two surfaces that heat dissipating layer 12 and above-mentioned heater element E are relatively arranged on substrate 11.Wherein, heat dissipating layer 12 is connected with substrate 11 by rivet T, and so this connected mode is not in a limitative way, and other modes as fixing or screw lock also can be used, and the present invention does not limit in this.
Substrate 11 has a pin 113, and pin 113 is fixed on substrate 11 on mainboard.Specifically, on substrate 11, first make a plurality of pins 113, and on corresponding mainboard, make a plurality of location perforation, can run through accordingly and fix.Certainly, follow-up can be further with tin cream (solder paste) bonded substrate 11 and mainboard.In the present embodiment, the pin of substrate 11 113 is electrically connected heater element E by wire 114, and in addition, pin 113 is laid with circuit, its by with the engaging of mainboard, make substrate 11 and on heater element E and mainboard reach electric connection.And heat dissipating layer 12 has one equally for heat dissipating layer 12 being fixedly arranged on to the foot 123 of mainboard, similarly, thering is a plurality of location perforation to being applied to arrange on the mainboard position of heat dissipating layer 12, accepted the foot 123 of heat dissipating layer 12.By the combination between substrate 11 and heat dissipating layer 12, and be combined with mainboard with its pin 113Ji foot 123 separately, have and strengthen the stability of radiating module 1 on mainboard.
Heat dissipating layer 12 is the aluminium metal sheet that a size and shape slightly approach substrate 11.In the present embodiment, because the pin 113 of substrate 11 is simultaneously with function fixing and that wire connects, therefore in substrate 11 sizes, in pin 113 places, can slightly be greater than heat dissipating layer 12, and the overall volume of substrate 11 also can slightly be greater than heat dissipating layer 12, so the present invention does not limit at this.
On the other hand, by foot 123 and pin 113 are set respectively on heat dissipating layer 12 and substrate 11, can make heat dissipating layer 12 and substrate 11 there is respectively the function being independently fixed on mainboard, therefore having can be in response to cartridge element configuration required in different electronic installations, and select substrate and the heating panel of different size shape to arrange in pairs or groups, also, radiating module of the present invention has the element of adjustable, is conducive to save assembly cost and process.
The function that substrate 11 can have carrying heater element E simultaneously concurrently and the heat energy of heater element E is derived specifically, is set by above-mentioned element.Then, by heat dissipating layer 12, be connected with substrate 11, substrate 11 can be further by thermal energy transfer to heat dissipating layer 12, it should be noted that especially, in the present embodiment, because substrate 11 is the structure that two size shapes are slightly close with heat dissipating layer 12, its large slightly structure of rectangular slab shape, therefore, compared to the small heater element E being arranged on circuit board, substrate 11 and heating layer 12 have larger area, and have can be by the homodisperse effect of heat energy of heater element E dissipation.
Fig. 2 is the decomposing schematic representation that the another kind of radiating module of preferred embodiment of the present invention has different shape, and figure, please refer to shown in Fig. 2, and in the present embodiment, radiating module 2 has the Structure and characteristics of previous embodiment, but also comprises a heat conductive insulating layer 23.Heat conductive insulating layer 23 is arranged between substrate 21 and heat dissipating layer 22.Wherein, the material of heat conductive insulating layer 23 is aluminium dioxide, by the execution mode of above-mentioned increase heat conductive insulating layer 23, the second surface 212 that substrate 21 contacts with heat conductive insulating layer 23 also can arrange heater element E or wiring, and then increases the whole heater element E number arranging on radiating module 2, and, because the heat conductive insulating layer 23 of selecting is except having the effect of insulation, it has high-termal conductivity in addition, therefore, also contributes to promote the heat dissipation to heater element E.So the material of heat conductive insulating layer 23 is not in a limitative way, the material of heat conductive insulating layer 23 also can be other High heat conduction materials, the heat-conducting insulation material made such as but not limited to beryllium oxide, carborundum, silicon nitride or boron nitride also can be used, and the present invention does not limit in this.
In addition, should be noted especially, when the substrate of radiating module 2 is two-sided while being all provided with heater element E, the size of heat conductive insulating layer 23 must be identical with substrate 21 to reach complete heat conduction and insulation effect.
Fig. 3 is the decomposing schematic representation that another radiating module of preferred embodiment of the present invention has different shape, please refer to shown in Fig. 3, in the present embodiment, radiating module 3 has the Structure and characteristics of the radiating module 1 of previous embodiment, but at least the first surface 321 of its heat dissipating layer 32 more carries out an insulation processing, in the present embodiment, the first surface 321 of heat dissipating layer 32 is coated with ceramic material, there is high-cooling property and insulating property (properties), therefore as the radiating module 2 of previous embodiment, the first surface 311 of substrate 31 and second surface 312 all can arrange heater element or lay wire 314, in process, there is simplification element, and the effect of improving radiating effect, better, there is the shared volume of the radiating module of minimizing, have can frivolous utilization advantage, especially ceramic material has the thermal coefficient of expansion approaching with semiconductor and high temperature capacity, in practical application, can effectively solve the crooked and pyroprocess problem of heat.It should be noted that especially, in the present embodiment, mode and the material of insulation processing are not in a limitative way, and other have can coat heat dissipating layer and its mode that reaches the effect of insulation and heat radiation also can be used, and the present invention does not limit in this.
Fig. 4 is the decomposing schematic representation that another radiating module of preferred embodiment of the present invention has the heat dissipating layer of different shape, please refer to shown in Fig. 4, in the present embodiment, radiating module 4 has the roughly the same Structure and characteristics of radiating module 1 of previous embodiment, but in the present embodiment, heat dissipating layer 42 has more the structure of a plurality of radiating fin F, and it has better radiating effect.The relative substrate 41 of radiating fin F is arranged at the second surface 422 of heat dissipating layer 42, wherein, radiating fin F is that horizontal interval distribution is arranged at heat dissipating layer 42, so number, the size of radiating fin F and arrange non-restriction, radiating fin F also can be the modes such as oblique spaced apart or perpendicular separation distribution and forms, depending on the structure of electronic installation of cooperation, the laying mode of other heat dissipation elements and integral heat sink demand and design.In the present embodiment, radiating fin F is by forming with the integrally formed mode of heat dissipating layer 42, and so, in other embodiment, radiating fin F also can be arranged at heat dissipating layer 42 by modes such as chimeric, engaging, fixing and adhesions, and the present invention does not limit in this.
It should be noted that especially, radiating module of the present invention can also comprise other heat dissipation elements, as the setting of fan, to strengthen its integral heat sink effect, so in practice, depending on the electronic installation structure of cooperation, the laying mode of other heat dissipation elements and integral heat sink demand and design.
In sum, a kind of radiating module provided by the present invention, is by electronic component, as: the heating crystal on motherboard or its control unit are around arranged on aluminum circuit board, so that the element being originally arranged on motherboard is moved on on aluminum circuit board, can increase arrangement space on motherboard.The more important thing is, by heating panel is connected in to circuit board, the setting of integral heat dissipation means is without taking the too much space of motherboard, space availability ratio can significantly promote, in addition, the present invention by pin is set on heat radiating metallic layer, can directly be fastened on motherboard it, has the effect of firm heat abstractor.More importantly, by being connected of motherboard and heat radiating metal, can promote the area of heat energy loss, so that better radiating effect to be provided.
In addition, more can the arrange in pairs or groups setting of an insulating heat-conduction material of the present invention, increases the space that arranges of elements on circuit board and circuit, also be, circuit board by radiating module of the present invention applicable to one side wiring or double-sided wiring, and then increase its range of application, and improving heat radiation efficiency.And compared to prior art, radiating module of the present invention design can make to use in its electronic installation provides more element that space is set, and by arrangement of the present invention, can effectively promote the speed of electronic installation heat radiation.
The foregoing is only illustrative, but not in order to restriction.Anyly do not depart from spirit of the present invention and category, and the equivalent modifications that it is carried out or change all should be contained in accompanying claim scope.

Claims (14)

1. a radiating module, is characterized in that, comprising:
At least one substrate, has a first surface and a second surface;
One heat dissipating layer, is arranged at this second surface;
Wherein, at least one heater element is electrically connected at this first surface, and this radiating module vertical type be arranged on a mainboard.
2. radiating module as claimed in claim 1, is characterized in that, also comprises:
At least one wire, is arranged at this first surface or this second surface.
3. radiating module as claimed in claim 2, is characterized in that, this substrate has at least one pin, and this substrate is inserted on this mainboard by this pin.
4. radiating module as claimed in claim 3, is characterized in that, this wire is electrically connected this heater element and this pin.
5. radiating module as claimed in claim 1, is characterized in that, this substrate is an aluminium base.
6. radiating module as claimed in claim 1, is characterized in that, this substrate also has at least one copper foil layer.
7. radiating module as claimed in claim 1, is characterized in that, this heat dissipating layer has at least one foot, and this heat dissipating layer is inserted on this mainboard by this pin.
8. radiating module as claimed in claim 1, is characterized in that, this heat dissipating layer is a metallic plate.
9. radiating module as claimed in claim 8, is characterized in that, this metallic plate comprises copper, aluminium, nickel, gold, silver or its alloy sheets.
10. radiating module as claimed in claim 1, is characterized in that, the connected mode of this substrate and this heat dissipating layer comprises fixing, screw lock, rivet or surface adhering technical.
11. radiating modules as claimed in claim 1, is characterized in that, this heater element is a surface sticking electronic element.
12. radiating modules as claimed in claim 1, is characterized in that, this heat dissipating layer has a plurality of fins.
13. radiating modules as claimed in claim 1, is characterized in that, also comprise:
One heat conductive insulating layer, is arranged between this substrate and this heat dissipating layer.
14. radiating modules as claimed in claim 13, is characterized in that, this heat conductive insulating layer comprises aluminium dioxide, beryllium oxide, carborundum, silicon nitride or boron nitride.
CN201310072537.4A 2013-03-07 2013-03-07 Heat dissipation module Pending CN104039112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310072537.4A CN104039112A (en) 2013-03-07 2013-03-07 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310072537.4A CN104039112A (en) 2013-03-07 2013-03-07 Heat dissipation module

Publications (1)

Publication Number Publication Date
CN104039112A true CN104039112A (en) 2014-09-10

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109861555A (en) * 2018-02-06 2019-06-07 台达电子企业管理(上海)有限公司 Power supply change-over device
CN110785001A (en) * 2019-10-30 2020-02-11 新鸿电子有限公司 Multi-channel high-voltage power circuit board for distributed X-ray source and distributed X-ray source
CN110831321A (en) * 2019-10-30 2020-02-21 新鸿电子有限公司 Multi-channel high-voltage power circuit and distributed X-ray source comprising same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1353570A (en) * 2000-11-13 2002-06-12 台达电子工业股份有限公司 Fine-shaped heat radiator of electronic element
CN2603595Y (en) * 2003-01-29 2004-02-11 博大科技股份有限公司 Heat conduction structure for circuit board
CN1764356A (en) * 2004-10-18 2006-04-26 台达电子工业股份有限公司 Radiating fin fixing device
CN1787209A (en) * 2004-12-10 2006-06-14 台达电子工业股份有限公司 Combined structure of electronic assembly with radiating apparatus
CN101155498A (en) * 2006-09-29 2008-04-02 台达电子工业股份有限公司 Combination structure of electronic component and heat radiating device
TWM382513U (en) * 2009-12-02 2010-06-11 Brimo Technology Inc Heat dissipating apparatus
CN202285477U (en) * 2011-07-19 2012-06-27 台达电子企业管理(上海)有限公司 Electronic component bearing component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1353570A (en) * 2000-11-13 2002-06-12 台达电子工业股份有限公司 Fine-shaped heat radiator of electronic element
CN2603595Y (en) * 2003-01-29 2004-02-11 博大科技股份有限公司 Heat conduction structure for circuit board
CN1764356A (en) * 2004-10-18 2006-04-26 台达电子工业股份有限公司 Radiating fin fixing device
CN1787209A (en) * 2004-12-10 2006-06-14 台达电子工业股份有限公司 Combined structure of electronic assembly with radiating apparatus
CN101155498A (en) * 2006-09-29 2008-04-02 台达电子工业股份有限公司 Combination structure of electronic component and heat radiating device
TWM382513U (en) * 2009-12-02 2010-06-11 Brimo Technology Inc Heat dissipating apparatus
CN202285477U (en) * 2011-07-19 2012-06-27 台达电子企业管理(上海)有限公司 Electronic component bearing component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109861555A (en) * 2018-02-06 2019-06-07 台达电子企业管理(上海)有限公司 Power supply change-over device
CN110785001A (en) * 2019-10-30 2020-02-11 新鸿电子有限公司 Multi-channel high-voltage power circuit board for distributed X-ray source and distributed X-ray source
CN110831321A (en) * 2019-10-30 2020-02-21 新鸿电子有限公司 Multi-channel high-voltage power circuit and distributed X-ray source comprising same

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