CN104039112A - Cooling module - Google Patents

Abstract

A heat dissipation module comprises at least one substrate and a heat dissipation layer. The substrate has a first surface and a second surface. The heat dissipation layer is arranged on the second surface. The at least one heating element is electrically connected to the first surface, and the heat dissipation module is vertically arranged on a mainboard. The invention can save the working hours consumed in the process, improve the efficiency of automatic production, reduce the assembly cost and achieve the effect of high heat dissipation efficiency.

Description

Cooling module

technical field

The present invention relates to a heat dissipation module, in particular to a heat dissipation module which can save assembly space and improve heat dissipation effect.

Background technique

With the development of the electronic industry, the requirements for the operation speed and effect of electronic components are increasing day by day. However, the heat dissipation problems derived from it are becoming more and more serious, which in turn affects the performance and stability during operation, and at least causes the performance of electronic devices to deteriorate. , it will lead to burning of electronic devices. In order to enable the electronic device to operate normally, a heat sink is generally installed on the heat-generating electronic components, and the heat energy is exported through the heat sink.

In recent years, due to the advancement of technology, the volume of electronic devices has gradually shrunk for portability. Due to the continuous shrinking of the area of the microelectronic components contained in it, the heat accumulated per unit area has also increased relatively. Therefore, a heat sink with better heat dissipation efficiency is required. ; On the other hand, due to the small size of the microelectronic components, it is impossible to set a large-scale and high-strength heat dissipation device. In addition, the heat dissipation device will also occupy the space of the electronic device.

Currently, heat sinks used in electronic devices are mainly equipped with heat sinks on power components on motherboards or circuit boards as heat sinks for heat dissipation. However, it is time-consuming to dispose the heat dissipation devices on the motherboard with complex power components or the circuit board with complex circuits, and the heat dissipation effect is limited, especially in devices with a large number of components or more complex devices. The installation space and heat dissipation effect need to be considered at the same time. The design of the heat dissipation device and the overall configuration will be more complicated, which will inevitably increase the time and cost of the overall process. On the other hand, most of the existing connection methods between heating elements and heat sinks are screw locks. However, this connection method will increase the process and work time, and the number of components contained in it is too large, so there is a problem that it is not easy to automate.

Therefore, how to provide a heat dissipation module that can save man-hours and assembly costs through simple design and configuration, and effectively increase heat dissipation speed to increase heat dissipation efficiency has become one of the important issues.

Contents of the invention

In view of the above problems, the purpose of the present invention is to provide a heat dissipation module that can save man-hours and assembly costs and effectively increase heat dissipation speed through simple design and installation, so as to increase heat dissipation efficiency.

To achieve the above purpose, a heat dissipation module according to the present invention includes at least one substrate and a heat dissipation layer. The substrate has a first surface and a second surface. The heat dissipation layer is disposed on the second surface. Wherein, at least one heating element is electrically connected to the first surface, and the heat dissipation module is vertically arranged on a main board.

In an embodiment, the heat dissipation module further includes at least one wire. The wires are disposed on the first surface or the second surface.

In one embodiment, the substrate has at least one pin, and the substrate is inserted into the main board through the pin.

In one embodiment, the wire is electrically connected to the heating element and the pin.

In one embodiment, the substrate is an aluminum substrate.

In one embodiment, the substrate further has at least one copper foil layer.

In one embodiment, the heat dissipation layer has at least one leg portion, and the heat dissipation layer is inserted on the main board through the pin.

In one embodiment, the heat dissipation layer is a metal material.

In one embodiment, the metal material includes copper, aluminum, nickel, gold, silver or alloys thereof.

In one embodiment, the connection method between the substrate and the heat dissipation layer includes clamping, screw locking or rivet riveting, and also includes surface mount technology (Surface Mount Technology, SMT).

In one embodiment, the heating element is a surface mount electronic element.

In one embodiment, the heat dissipation layer has a plurality of fins.

In one embodiment, the heat dissipation module further includes a heat conducting and insulating layer. The heat conduction insulating layer is disposed between the substrate and the heat dissipation layer.

In one embodiment, the thermally conductive insulating layer includes aluminum dioxide, beryllium oxide, silicon carbide, silicon nitride or boron nitride.

Based on the above, the heat dissipation module provided by the present invention is to install electronic components, such as: the heating crystal on the main board or the control unit around it, on the aluminum circuit board, so that the heat dissipation module originally installed on the main board The components are moved to the aluminum circuit board, which can increase the layout space on the motherboard. More importantly, by connecting the heat dissipation metal layer to the circuit board, the installation of the overall heat dissipation device does not need to occupy too much space on the motherboard, and the space utilization rate can be greatly improved. feet, so that it can be directly fixed on the motherboard, which has the effect of stabilizing the heat dissipation device. More importantly, through the connection between the motherboard and the heat dissipation metal layer, the heat dissipation area can be increased to provide better heat dissipation effect.

In addition, the present invention can be equipped with an insulating and heat-conducting material to increase the space for setting components and lines on the circuit board, that is, the heat dissipation module of the present invention can be applied to circuit boards with single-sided wiring or double-sided wiring, thereby increasing Its application range and improve heat dissipation efficiency. Moreover, compared with the prior art, the heat dissipation module design of the present invention can provide more space for components in the electronic device using it, and through the arrangement of the present invention, the heat dissipation speed of the electronic device can be effectively improved.

Description of drawings

FIG. 1A is an exploded schematic diagram of a heat dissipation module according to a preferred embodiment of the present invention.

FIG. 1B is a combined schematic diagram of a cooling module in FIG. 1A .

FIG. 2 is an exploded schematic view of another heat dissipation module in different forms according to a preferred embodiment of the present invention.

FIG. 3 is an exploded schematic diagram of another heat dissipation module with different forms according to a preferred embodiment of the present invention.

FIG. 4 is an exploded schematic diagram of yet another heat dissipation module with different shapes of heat dissipation layers according to a preferred embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1, 2, 3, 4: cooling module

11, 21, 31, 41: substrate

111, 311, 321: first surface

112, 212, 312, 422: the second surface

113, 213: Wire

114, 314: pins

12, 22, 32, 42: heat dissipation layer

123, 223: feet

23: thermal insulation layer

E: heating element

F: cooling fins

T: rivets

Detailed ways

A heat dissipation module according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

FIG. 1A is an exploded schematic view of a heat dissipation module according to a preferred embodiment of the present invention, and FIG. 1B is a combined schematic diagram of a heat dissipation module in FIG. 1A . Please refer to FIG. 1A and FIG. 1B at the same time, the heat dissipation module 1 includes at least one substrate 11 and a heat dissipation layer 12 , wherein the heat dissipation module 1 is vertically arranged on a main board (not shown). In detail, the cooling module 1 is installed on the main board through pin through hole (PTH) or surface mount technology (SMT), and the "main board" referred to here can be a main board. This is not limited. However, the above-mentioned connection methods are understood by those with ordinary knowledge in the technical field of the present invention, and will not be repeated here. The structural features of the heat dissipation module 1 will be described one by one below.

The substrate 11 is an aluminum substrate, and at least one heating element E is electrically connected to the substrate 11 . However, in this embodiment, four heating elements E are represented, but this is not limited. Wherein, the substrate 11 has a first surface 111 and a second surface 112 , and the heating element E is disposed on the first surface 111 of the substrate 11 by surface mount technology. Wherein, the heating element E can be an active element heating crystal or its surrounding control elements, but this is not limited, but the heating element E referred to here is an element that dissipates heat energy in an electronic device, and the heat generation is carried out by surface adhesion technology. The element E disposed on the substrate 11 has the advantages of reducing the number of elements and saving the process, and facilitates automation.

In this embodiment, the substrate 11 is a printed circuit board (Printed Circuit Board), on which a copper foil layer is used for etching to form a circuit pattern of the wire 114, but this is not limited. In practical applications, this The inventive substrate can also be a module board or a package substrate, and the present invention is not limited thereto. In detail, after the first surface 111 and the second surface 112 on the substrate 11 are coated with a copper foil layer, further etching can be performed to form a circuit pattern, so that the heating element E disposed on the substrate 11 can be electrically connected by wires, and then In this embodiment, only the heating element E is arranged on the first surface 111 of the substrate 11, so the wiring pattern of the copper foil layer is at least mainly on the first surface 111, that is, the wire 114 is only arranged on the first surface of the substrate 11. 111. In other embodiments, the arrangement position of the heating element and the wiring position on the substrate may be on both sides, and the present invention is not limited thereto.

The heat dissipation layer 12 is a metal material. Specifically, the material of the heat dissipation layer 12 is an aluminum metal, but this material is not limited. Other metal materials, especially metal materials with high thermal conductivity, such as copper, aluminum, nickel , gold, silver or their alloys can also be used.

In this embodiment, the heat dissipation layer 12 is a substantially rectangular plate-shaped aluminum metal plate, which is disposed on the second surface 112 of the substrate 11, that is, the heat dissipation layer 12 is disposed on the substrate 11 opposite to the above-mentioned heating element E. Two surfaces. Wherein, the heat dissipation layer 12 is connected to the substrate 11 through the rivet T, but this connection method is not limited, and other methods such as clamping or screw locking can also be used, and the present invention is not limited thereto.

The substrate 11 has a pin 113 for fixing the substrate 11 on the main board. In detail, a plurality of pins 113 are fabricated on the substrate 11 first, and a plurality of positioning through holes are fabricated on the corresponding main board, so that they can be penetrated and fixed accordingly. Of course, the substrate 11 and the main board can be further bonded with solder paste later. In this embodiment, the pins 113 of the substrate 11 are electrically connected to the heating element E through wires 114. In addition, the pins 113 are provided with circuits, which connect the substrate 11 and the heating element E on the main board to the main board. achieve electrical connection. The heat dissipation layer 12 also has a foot portion 123 for fixing the heat dissipation layer 12 on the main board. Similarly, there are a plurality of positioning through holes corresponding to the position of the main board where the heat dissipation layer 12 is used to receive the heat dissipation layer 12. 123 feet. Through the connection between the base plate 11 and the heat dissipation layer 12 , and the combination with the main board through their respective pins 113 and feet 123 , the stability of the heat dissipation module 1 on the main board can be enhanced.

The heat dissipation layer 12 is an aluminum metal plate whose size and shape are slightly close to the substrate 11 . In this embodiment, since the pins 113 of the substrate 11 also have the functions of fixing and wire connection, the size of the substrate 11 at the pins 113 will be slightly larger than the heat dissipation layer 12, and the overall volume of the substrate 11 will also be slightly smaller. larger than the heat dissipation layer 12, but the present invention is not limited here.

On the other hand, by setting the feet 123 and pins 113 on the heat dissipation layer 12 and the substrate 11 respectively, the heat dissipation layer 12 and the substrate 11 can be independently fixed on the main board, so that it can adapt to different electronic devices. The configuration of the required heat dissipation elements, and the selection of substrates and heat dissipation plates of different sizes and shapes for matching, that is, the heat dissipation module of the present invention has adjustable elements, which is beneficial to save assembly costs and processes.

In detail, through the above arrangement of components, the substrate 11 can simultaneously perform the functions of carrying the heating element E and deriving the heat energy of the heating element E. Next, the substrate 11 can further transmit heat energy to the heat dissipation layer 12 by connecting the heat dissipation layer 12 to the substrate 11. In particular, in this embodiment, since the substrate 11 and the heat dissipation layer 12 are two structures with slightly similar dimensions and shapes , which is roughly a rectangular plate-shaped structure. Therefore, compared with the tiny heating element E arranged on the circuit board, the substrate 11 and the heating layer 12 have a larger area, and can evenly disperse the heat energy dissipated by the heating element E. effect.

Figure 2 is an exploded schematic view of another heat dissipation module in a preferred embodiment of the present invention with different forms. For the figure, please refer to Figure 2. In this embodiment, the heat dissipation module 2 has the structure and characteristics of the foregoing embodiments, but It also includes a thermally conductive insulating layer 23 . The thermally conductive insulating layer 23 is disposed between the substrate 21 and the heat dissipation layer 22 . Wherein, the material of the thermally conductive insulating layer 23 is aluminum dioxide. Through the above-mentioned embodiment of adding the thermally conductive insulating layer 23, the second surface 212 of the substrate 21 in contact with the thermally conductive insulating layer 23 can also be provided with a heating element E or wiring, thereby increasing the overall temperature. The number of heating elements E provided on the heat dissipation module 2, and because the selected heat conducting insulating layer 23 not only has the function of insulation, but also has high thermal conductivity, it also helps to improve the heat dissipation performance of the heating elements E. However, the material of the thermally conductive insulating layer 23 is not limited, and the material of the thermally conductive insulating layer 23 can also be other high thermally conductive materials, such as but not limited to thermally conductive insulating materials made of beryllium oxide, silicon carbide, silicon nitride or boron nitride. Can be used, the present invention is not limited here.

In addition, special attention should be paid to the fact that when both sides of the substrate of the heat dissipation module 2 are provided with heating elements E, the size of the thermally conductive insulating layer 23 must be the same as that of the substrate 21 to achieve complete thermal conduction and insulation effects.

Figure 3 is an exploded schematic diagram of another heat dissipation module in a preferred embodiment of the present invention with different forms, please refer to Figure 3, in this embodiment, the heat dissipation module 3 has the structure and characteristics of the heat dissipation module 1 of the previous embodiment , but at least the first surface 321 of the heat dissipation layer 32 is further subjected to an insulation treatment. In this embodiment, the first surface 321 of the heat dissipation layer 32 is covered with a ceramic material, which has high heat dissipation and insulation properties, so it is implemented as described above. In the heat dissipation module 2 of the example, both the first surface 311 and the second surface 312 of the substrate 31 can be provided with heating elements or wiring wires 314, which can simplify the components in the process and improve the effect of heat dissipation. More preferably, it can reduce heat dissipation. The volume occupied by the module has the advantage of being light and thin. In particular, ceramic materials have a thermal expansion coefficient close to that of semiconductors and high heat resistance, which can effectively solve thermal skew and high-temperature process problems in practical applications. It should be noted that in this embodiment, the method and material of the insulation treatment are not limited, and other methods that can be applied to the heat dissipation layer and achieve the effects of insulation and heat dissipation can also be used, and the present invention does not here limit.

Fig. 4 is an exploded schematic view of yet another heat dissipation module having different forms of heat dissipation layers according to a preferred embodiment of the present invention. Please refer to Fig. 4. In this embodiment, the heat dissipation module 4 has approximately The same structure and features, but in this embodiment, the heat dissipation layer 42 has a structure of multiple heat dissipation fins F, which has a better heat dissipation effect. The heat dissipation fins F are arranged on the second surface 422 of the heat dissipation layer 42 relative to the substrate 41, wherein the heat dissipation fins F are horizontally spaced and arranged on the heat dissipation layer 42, but the number, size and arrangement of the heat dissipation fins F are not limited. The fins F can also be formed in an obliquely spaced or vertically spaced manner, depending on the structure of the associated electronic device, the layout of other heat dissipation elements, and the overall heat dissipation requirements. In this embodiment, the heat dissipation fins F are integrally formed with the heat dissipation layer 42 , but in other embodiments, the heat dissipation fins F can also be arranged on the heat dissipation surface by fitting, snapping, clamping and sticking. Layer 42, the present invention is not limited here.

It should be noted that the heat dissipation module of the present invention may also include other heat dissipation elements, such as fans, to enhance its overall heat dissipation effect. Designed for overall cooling requirements.

To sum up, the heat dissipation module provided by the present invention is to install electronic components, such as: the heating crystal on the motherboard or the control unit around it on the aluminum circuit board, so that the heat dissipation module originally installed on the motherboard The components are moved to the aluminum circuit board, which can increase the layout space on the motherboard. More importantly, by connecting the cooling plate to the circuit board, the setting of the overall cooling device does not need to occupy too much space on the motherboard, and the space utilization rate can be greatly improved. In addition, the present invention also provides pins on the cooling metal layer , so that it can be directly fixed on the motherboard, and has the effect of stabilizing the heat dissipation device. More importantly, through the connection between the motherboard and the heat dissipation metal, the heat dissipation area can be increased to provide better heat dissipation effect.

In addition, the present invention can be equipped with an insulating and heat-conducting material to increase the space for setting components and lines on the circuit board, that is, the heat dissipation module of the present invention can be applied to circuit boards with single-sided wiring or double-sided wiring, thereby increasing Its application range and improve heat dissipation efficiency. Moreover, compared with the prior art, the heat dissipation module design of the present invention can provide more space for components in the electronic device using it, and through the arrangement of the present invention, the heat dissipation speed of the electronic device can be effectively improved.

The above descriptions are for illustration only, not for limitation. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the scope of the appended claims.

Claims (14)

1. a radiating module, is characterized in that, comprising:

At least one substrate, has a first surface and a second surface;

One heat dissipating layer, is arranged at this second surface;

Wherein, at least one heater element is electrically connected at this first surface, and this radiating module vertical type be arranged on a mainboard.

2. radiating module as claimed in claim 1, is characterized in that, also comprises:

At least one wire, is arranged at this first surface or this second surface.

3. radiating module as claimed in claim 2, is characterized in that, this substrate has at least one pin, and this substrate is inserted on this mainboard by this pin.

4. radiating module as claimed in claim 3, is characterized in that, this wire is electrically connected this heater element and this pin.

5. radiating module as claimed in claim 1, is characterized in that, this substrate is an aluminium base.

6. radiating module as claimed in claim 1, is characterized in that, this substrate also has at least one copper foil layer.

7. radiating module as claimed in claim 1, is characterized in that, this heat dissipating layer has at least one foot, and this heat dissipating layer is inserted on this mainboard by this pin.

8. radiating module as claimed in claim 1, is characterized in that, this heat dissipating layer is a metallic plate.

9. radiating module as claimed in claim 8, is characterized in that, this metallic plate comprises copper, aluminium, nickel, gold, silver or its alloy sheets.

10. radiating module as claimed in claim 1, is characterized in that, the connected mode of this substrate and this heat dissipating layer comprises fixing, screw lock, rivet or surface adhering technical.

11. radiating modules as claimed in claim 1, is characterized in that, this heater element is a surface sticking electronic element.

12. radiating modules as claimed in claim 1, is characterized in that, this heat dissipating layer has a plurality of fins.

13. radiating modules as claimed in claim 1, is characterized in that, also comprise:

One heat conductive insulating layer, is arranged between this substrate and this heat dissipating layer.

14. radiating modules as claimed in claim 13, is characterized in that, this heat conductive insulating layer comprises aluminium dioxide, beryllium oxide, carborundum, silicon nitride or boron nitride.