TWI666543B - Bridge-variable cooling module and electrical device using the same - Google Patents

Abstract

A variable bridging heat dissipation module includes a first heat dissipation plate and a second heat dissipation plate. The first heat-dissipating plate has a plurality of heat-dissipating fins and a mating surface respectively located on two opposite sides, and a plurality of first bridge grooves are located between the heat-dissipating fins. The second heat-dissipating plate has a plurality of heat-dissipating fins and a bridging surface located on two opposite surfaces, a plurality of second bridging grooves and a plurality of chip bonding plates are located on the bridging surface.

Description

Variable bridge cooling module and applied electronic device

The invention relates to a heat dissipation module, in particular to a variable bridge heat dissipation module.

At present, not only the processor in an electronic device needs to dissipate heat, but also a memory, a battery, a graphics processor, and the like may need to dissipate heat. However, because an electronic device model may use a combination of processors, memory, batteries, and graphics processors with different cooling requirements, multiple cooling module designs are required to meet the demand. As a result, the cost and complexity of the cooling module will increase significantly.

The invention proposes a variable bridge cooling module to solve the problems of the prior art.

In one embodiment of the present invention, a variable-bridging heat dissipation module includes a first heat dissipation plate and a second heat dissipation plate. The first heat-dissipating plate has a plurality of heat-dissipating fins and a bonding surface located on two opposite sides, respectively, and a plurality of first bridge grooves are located between the heat-dissipating fins. The second heat-dissipating plate has a plurality of heat-dissipating fins and a bridging surface located on two opposite surfaces, a plurality of second bridging grooves and a plurality of chip bonding plates are located on the bridging surface.

In an embodiment of the present invention, the heat dissipation fins of the first heat dissipation plate and the second heat dissipation plate all face the same direction.

In an embodiment of the present invention, the heat dissipation module further includes at least one bridge member, a portion of which is located in one of the first bridge trenches and one of the second bridge trenches.

In one embodiment of the present invention, the bridge includes a heat pipe, a copper sheet, or an aluminum sheet.

In an embodiment of the present invention, the heat dissipation module further includes a bridge pressing piece to fix the bridge member to one of the first bridge grooves.

In an embodiment of the present invention, the heat dissipation module further includes a heat sink, which is located between the bridge and the bottom surface of the corresponding first or second bridge groove.

In an embodiment of the present invention, the bonding surface of the wafer bonding board and the bonding surface of the first heat dissipation board face the same direction.

In an embodiment of the present invention, the heat radiating fins of the first heat radiating plate are all elongated, and the heat radiating fins of the second heat radiating plate are all columnar.

In an embodiment of the present invention, a battery-equipped electronic device includes the heat dissipation module according to any one of the above embodiments, wherein a bonding surface of the first heat dissipation plate is thermally coupled to a battery module, the chips The bonding surface of the bonding board is thermally coupled to the corresponding chip.

In one embodiment of the present invention, the heat dissipation module is a passive heat dissipation module.

In summary, the present invention utilizes a detachable bridging heat conduction mechanism to determine whether to bridge or the material and quantity of the bridging according to the heat flow state of the model, so as to achieve the goals of sharing and flexibility of the heat dissipation module. The heat dissipation module and the bridge are designed as a detachable mechanism. The bridge can change the material, quantity and type according to the actual heat dissipation requirements.

The above description will be described in detail in the following embodiments, and further explanation will be provided for the technical solution of the present invention.

In order to make the description of the present invention more detailed and complete, reference may be made to the accompanying drawings and various embodiments described below. The same numbers in the drawings represent the same or similar elements. On the other hand, well-known elements and steps have not been described in the embodiments, so as to avoid unnecessary limitation to the present invention.

Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 shows a perspective view of a variable bridge cooling module according to an embodiment of the present invention. FIG. 2 shows another variable bridge cooling module of FIG. 1. Perspective perspective.

The variable bridging heat dissipation module 100 includes a first heat dissipation plate 140 and a second heat dissipation plate 120. The first heat dissipation plate 140 has a plurality of heat dissipation fins 142 and a mating surface 143 respectively located on two opposite sides, and a plurality of first bridge trenches 144 are located between the heat dissipation fins 142. The second heat dissipation plate 120 has a plurality of heat dissipation fins 122 and a bridging surface 121 located on two opposite surfaces, a plurality of second bridging grooves 128 and a plurality of chip bonding plates 124 are located on the bridging surface 121.

In an embodiment of the present invention, the heat dissipation fins 142 of the first heat dissipation plate 140 and the heat dissipation fins 122 of the second heat dissipation plate 120 face the same direction, so that when applied to electronic devices, all the heat dissipation fins The sheets (122, 142) can face a breathable outer cover or shell, which is good for heat dissipation.

In an embodiment of the present invention, the heat dissipation module 100 further includes at least one bridge member 160, a portion of which is located in one of the first bridge trenches 144 and one of the second bridge trenches 128. Thereby, the first heat dissipation plate 140 and the second heat dissipation plate 120 are bridged. For example, the number of the bridges 160 may be one, two, three, or more, which can change the thermal coupling efficiency of the bridge depending on the heat dissipation requirements and the number of bridge trenches. The purpose of thermal coupling using a bridge between the first heat radiating plate 140 and the second heat radiating plate 120 is to make the two heat radiating plates even, and the more bridges are used, the higher the efficiency of the two heat radiating plates is. However, not all situations require efficient temperature equalization between the two heat sinks, so fewer bridges or no bridges are also the best heat dissipation solution for some applications.

In an embodiment of the present invention, the type of the bridge member 160 may include a heat pipe, a copper sheet, or an aluminum sheet. "Heat pipe" means a hollow metal pipe containing a capillary structure and a working fluid. "Copper sheet" or "aluminum sheet" means a solid metal sheet of copper or aluminum.

In an embodiment of the present invention, the bonding surface 124 a of the wafer bonding plate 124 and the bonding surface 143 of the first heat dissipation plate 140 face the same direction. The bonding surface is basically a flat surface except for the lock hole. For example, the bonding surface 143 of the first heat dissipation plate 140 except for the lock hole 145 or the bridge pressing lock hole is basically a flat surface; The joint surface 124a is substantially a plane.

In an embodiment of the present invention, the heat radiating fins 142 of the first heat radiating plate 140 are all elongated and the heat radiating fins 122 of the second heat radiating plate 120 are columnar, but not limited thereto .

Please refer to FIG. 3, which is a schematic cross-sectional view taken along line 3-3 of FIG. 1. In an embodiment of the present invention, the heat dissipation module 100 further includes a bridge pressing piece 148 to fix the bridge 160 to one of the first bridge grooves 144 and lock through the keyhole by the lock member 150. On the second heat dissipation plate 120, the wafer bonding plate 124 and the locking member 126 are passed through the locking holes to lock the bridge 160 in one of the second bridge grooves 128 (see FIG. 2). Therefore, in addition to being attached to the target to be dissipated, the wafer bonding board 124 also has the aforementioned function of bridging and pressing.

In an embodiment of the present invention, the heat dissipation module further includes a heat dissipation pad 162 located between the bridge member 160 and the bottom surface of the corresponding first or second bridge trench (144, 128), so as to enhance the thermal coupling efficiency. . The heat sink 162 can also be selected according to the heat transfer efficiency requirements.

Please refer to FIGS. 4 and 5 at the same time. FIG. 4 shows an application perspective view of a variable bridge cooling module according to another embodiment of the present invention. FIG. 5 shows a variable bridge according to another embodiment of the present invention. Application perspective view of the bridged cooling module.

In the heat dissipation module of FIG. 4, although the first heat dissipation plate 140 and the second heat dissipation plate 120 each have three bridge grooves, only two bridge members are used, and each of the bridge grooves is inserted without a bridge member. In other embodiments, the first heat dissipation plate 140 and the second heat dissipation plate 120 may each have three bridge grooves, but only one bridge member is used, and each of the two bridge grooves is inserted without a bridge member. In other embodiments, the number of bridging trenches can be increased as required.

In the heat dissipation module of FIG. 5, the first heat dissipation plate 140 and the second heat dissipation plate 120 are applied to an electronic device equipped with a battery. The bonding surface of the first heat dissipation plate 140 is used for thermal coupling to a battery module 170, and the bonding surface 124a (see FIG. 2) of the chip bonding plates 124 of the second heat dissipation plate 120 is used for thermal coupling to the circuit board. The corresponding chip (182, 184, 186) on 180, but the first heat dissipation plate 140 and the second heat dissipation plate 120 do not use bridges for thermal coupling with each other (there are three bridge grooves each without bridges inserted). In other embodiments, the first heat dissipation plate 140 and the second heat dissipation plate 120 may also add a bridge member as required to accelerate the heat conduction between the two heat dissipation plates.

In an embodiment of the present invention, the heat dissipation module is a passive heat dissipation module, that is, no fan is installed in the heat dissipation module to reduce the overall thickness of the heat dissipation module, but it is not limited thereto.

In summary, the present invention utilizes a detachable bridging heat conduction mechanism to determine whether to bridge or the material and quantity of the bridging according to the heat flow state of the model, so as to achieve the goals of sharing and flexibility of the heat dissipation module. The heat dissipation module and the bridge are designed as a detachable mechanism. The bridge can change the material, quantity and type according to the actual heat dissipation requirements.

Although the present invention has been disclosed as above in the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the attached patent application.

In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the attached symbols is as follows:

100‧‧‧ Thermal Module

120‧‧‧Second heat sink

121‧‧‧bridge surface

122‧‧‧Cooling Fin

124‧‧‧ Wafer Bonding Board

124a‧‧‧ Fitting surface

126‧‧‧Lock Firmware

128‧‧‧Second bridge trench

140‧‧‧The first heat sink

142‧‧‧Heat fins

143‧‧‧ Fitting surface

144‧‧‧First bridge trench

145‧‧‧ keyhole

148‧‧‧bridge compression

150‧‧‧lock firmware

160‧‧‧bridge

162‧‧‧Heat sink

170‧‧‧ Battery Module

180‧‧‧Circuit Board

182‧‧‧Chip

184‧‧‧Chip

186‧‧‧Chip

In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the drawings is as follows: FIG. 1 illustrates a variable bridge cooling mode according to an embodiment of the present invention. Group 3; Figure 2 is a perspective view showing the variable bridging heat dissipation module of Figure 1 from another perspective; Figure 3 is a schematic sectional view of Figure 1 along section line 3-3; Figure 4 FIG. 5 is a perspective view of an application of a variable bridge cooling module according to another embodiment of the present invention; and FIG. 5 is a perspective view of an application of a variable bridge cooling module according to another embodiment of the present invention.

Claims (8)

A variable bridging heat dissipation module includes: a first heat dissipation plate having a plurality of heat dissipation fins and a mating surface located on two opposite sides, a plurality of first bridge grooves located between the heat dissipation fins; a second The heat dissipation plate has a plurality of heat dissipation fins and a bridging surface respectively located on two opposite surfaces, a plurality of second bridging grooves and a plurality of chip bonding plates are located on the bridging surface; at least one bridge member is partially accommodated in the first bridging grooves. One of the grooves and one of the second bridge grooves; and a bridge pressing piece for fixing the bridge member to one of the first bridge grooves, the bridge pressing piece is detachably locked to The first heat dissipation plate, and one of the wafer bonding plates is used to fix the bridge member to one of the second bridging grooves, and the wafer bonding plates are removably locked to the second heat dissipation plate . The heat dissipation module according to claim 1, wherein the heat dissipation fins of the first heat dissipation plate and the second heat dissipation plate are directed in the same direction. The heat dissipation module according to claim 1, wherein the bridge comprises a heat pipe, a copper sheet, or an aluminum sheet. The heat dissipation module according to claim 1, further comprising a heat sink, which is located between the bridge and the bottom surface of the corresponding first or second bridge groove. The heat dissipation module according to claim 1, wherein the bonding surfaces of the wafer bonding boards and the bonding surface of the first cooling board face the same direction. The heat dissipation module according to claim 1, wherein the heat dissipation fins of the first heat dissipation plate are all elongated, and the heat dissipation fins of the second heat dissipation plate are columnar. A battery-equipped electronic device includes the heat dissipation module according to any one of claims 1 to 6, wherein the bonding surface of the first heat dissipation plate is thermally coupled to a battery module, and the bonding of the wafer bonding plates is Surfaces are thermally coupled to corresponding wafers. The electronic device according to claim 7, wherein the heat dissipation module is a passive heat dissipation module.