WO2021027454A1

WO2021027454A1 - Heat dissipation device, and base station

Info

Publication number: WO2021027454A1
Application number: PCT/CN2020/101151
Authority: WO
Inventors: 李姣枫; 刘志勇
Original assignee: 大唐移动通信设备有限公司
Priority date: 2019-08-15
Filing date: 2020-07-09
Publication date: 2021-02-18
Also published as: CN112399771A

Abstract

The present application provides a heat dissipation device and a base station. The heat dissipation device comprises: a first thermally conductive base board, and a second thermally conductive base board disposed at an interval from the first thermally conductive base board, wherein multiple first heat dissipation fins are disposed between the first thermally conductive base board and the second thermally conductive base board, each of the first heat dissipation fins is separately connected to the first thermally conductive base board and the second thermally conductive base board, the multiple first heat dissipation fins divide a gap between the first thermally conductive base board and the second thermally conductive base board into multiple ventilation channels, and multiple second heat dissipation fins are disposed on a surface of the second thermally conductive base board away from the first thermally conductive base board. The above technical solution uses the first thermally conductive base board, the second thermally conductive base board, and the first heat dissipation fins to form the ventilation channels, and a heat dissipation capability from natural convection of air in the ventilation channels improves heat dissipation performance.

Description

Heat dissipation device and base station

Cross references to related applications

The present disclosure claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 201910753399.3 and an application title of "a heat sink and base station" on August 15, 2019, the entire content of which is incorporated into this disclosure by reference.

Technical field

The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a base station.

Background technique

The thermal design of communication base station products is directly related to the cost, reliability, volume and weight of the product. If the thermal design is not good, the volume and weight of the equipment will be increased to meet the environmental requirements required for equipment operation; otherwise, the environmental temperature will rise too high, and long-term operation under high temperature conditions will reduce the reliability and service life of electronic equipment , And even burn the device in severe cases. How to effectively dissipate heat in a limited space has become a key issue in the design of current communication products. This design is applied to a natural convection heat dissipation module, and its general form is that a certain number of heat dissipation fins are connected to a first thermally conductive substrate, and the heat dissipation fins exchange heat with the air to achieve heat dissipation and cooling of the entire device.

Figure 1 shows the structure of a traditional heat dissipation module, in which 1 is a substrate and 2 is a heat dissipation tooth. The traditional heat dissipating tooth structure mainly obtains better heat dissipation effect by changing the geometric parameters. However, when the height, length, thickness, and pitch of the heat dissipating tooth fins are optimized to a certain degree, the heat dissipation capacity of the heat dissipating tooth will not be affected due to the marginal effect. Significantly improved again.

Summary of the invention

The present disclosure provides a heat dissipation device and a base station to improve the heat dissipation effect.

In a first aspect, a heat dissipation device is provided. The heat dissipation device includes: a first thermally conductive substrate, and a second thermally conductive substrate spaced apart from the first thermally conductive substrate; wherein, the first thermally conductive substrate and the second thermally conductive substrate A plurality of first heat dissipation fins are arranged between the thermally conductive substrates, and each of the first heat dissipation fins is thermally connected to the first thermally conductive substrate and the second thermally conductive substrate; The gap between the first thermally conductive substrate and the second thermally conductive substrate is divided into a plurality of ventilation channels;

A plurality of second heat dissipation fins are provided on the side of the second heat conducting substrate facing away from the first heat conducting substrate.

In the above technical solution, by using the first heat-conducting substrate, the second heat-conducting substrate and the first heat dissipation fins to enclose the ventilation channel, the natural convection and heat exchange ability of the air in the ventilation channel increases the heat dissipation effect.

In a specific implementation, the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set angle. By arranging different angles of heat dissipation fins, the heat dissipation effect is improved.

In a specific implementation, the length direction of the first heat dissipation fin is the same as the length direction of the first heat conducting substrate;

The length direction of the second heat dissipation fin is inclined with respect to the length direction of the first heat conducting substrate. Improve the heat dissipation effect.

In a specific implementation, the vertical projection of the second thermally conductive substrate on the first thermally conductive substrate is located in the first thermally conductive substrate.

In a specific implementation, a plurality of third heat dissipation fins are provided on the part of the first heat-conducting substrate outside the vertical projection of the second heat-conducting substrate.

In a specific implementation, the third heat dissipation fin is parallel to the first heat dissipation fin.

In a specific implementation, the first heat dissipation fin and the second heat dissipation fin are an integral structure;

The second heat-conducting substrate includes a plurality of connecting plates connecting the adjacent first heat dissipation fins.

In a specific implementation, the first thermally conductive substrate and the second thermally conductive substrate are the same size.

In a specific implementation, the first heat dissipation fin and the second heat dissipation fin are arranged alternately.

In a specific implementation, a plurality of hollow structures are provided on the second thermally conductive substrate, and each hollow structure is in communication with the ventilation channel. Increase the ventilation effect.

In a second aspect, a base station is provided. The base station includes a device, and the heat dissipation device according to any one of the above items arranged on the device. In the above technical solution, by using the first heat-conducting substrate, the second heat-conducting substrate and the first heat dissipation fins to enclose the ventilation channel, the natural convection and heat exchange ability of the air in the ventilation channel increases the heat dissipation effect.

Description of the drawings

Figure 1 is a schematic diagram of the structure of a heat sink in the prior art;

2 is a schematic structural diagram of a first heat dissipation device provided by an embodiment of the disclosure;

FIG. 3 is a schematic diagram of an end surface of a first heat dissipation device provided by an embodiment of the disclosure;

4 is a schematic structural diagram of a second heat dissipation device provided by an embodiment of the disclosure;

FIG. 5 is a schematic view of an end face of a second heat dissipation device provided by an embodiment of the disclosure;

6 is a schematic structural diagram of a third heat dissipation device provided by an embodiment of the disclosure;

FIG. 7 is a schematic diagram of an end surface of a third heat dissipation device provided by an embodiment of the disclosure.

detailed description

In order to facilitate the understanding of the heat dissipation device provided by the embodiments of the present disclosure, the following first describes the application scenarios of the heat dissipation device provided by the embodiments of the present disclosure. The heat dissipation device provided by the embodiments of the present disclosure is applied to a communication base station and is used to dissipate heat for the base station. When in use, the heat dissipation device is fixed on the base station, and the heat generated by the base station is transferred to the heat dissipation device, and the heat is dissipated through the heat dissipation device. However, the heat dissipation effect of the heat dissipation device in the prior art is relatively low, so the embodiments of the present disclosure A heat dissipation device is provided. In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the accompanying drawings.

First, refer to FIGS. 2 and 3. FIG. 2 shows a specific heat dissipation device, and FIG. 3 shows a schematic cross-sectional view of the heat dissipation device. The heat dissipation device includes a first heat-conducting substrate 10, which is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10. Continuing to refer to FIG. 2, in FIG. 2, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiments of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.

Continuing to refer to FIG. 2, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 2, the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. Continuing to refer to FIG. 2, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conducting substrate 10 and the second heat conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 2, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.

The second heat-conducting substrate 30 provided in the embodiments of the present disclosure may adopt an integral plate structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.

Continuing to refer to FIGS. 2 and 3, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 2, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is inclined relative to the length direction of the first heat conducting substrate 10, that is, the The length direction of one heat dissipation fin 20 and the length direction of the second heat dissipation fin 40 form a set angle. In FIG. 2, the included angle between the longitudinal direction of the first heat dissipation fin 20 and the second heat dissipation fin 40 is 45°, so that the flow direction of the air flowing between the first heat dissipation fins 20 is different from that of the first heat dissipation fin 20. The two heat dissipation fins 40 have different air flow directions. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.

It should be understood that the angle between the first heat dissipation fin 20 and the second heat dissipation fin 40 shown in FIG. 2 is only a specific example. The first heat dissipation fin 20 and the second heat dissipation fin provided by the embodiment of the present disclosure The included angle of the fins 40 is not limited to the specific mode shown in FIG. 2, and other included angles can be used. For example, the included angles of the first heat dissipation fin 20 and the second heat dissipation fin 40 are different from 30° to 60°. Angle. Both can achieve improved heat dissipation effect.

Refer to FIGS. 4 and 5 together, wherein FIG. 4 shows a second heat dissipation device provided by an embodiment of the present disclosure, and FIG. 5 shows an end view of the second heat dissipation device. In the heat dissipating device shown in FIG. 4, the heat dissipating device includes a first heat conducting substrate 10, the first heat conducting substrate 10 is used for fixed connection with the base station, and the heat generated by the base station is first transferred to the first heat conducting substrate 10. Continuing to refer to FIG. 4, in FIG. 4, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiment of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.

Continuing to refer to FIG. 4, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 4, the second thermally conductive substrate 30 has the same shape as the first thermally conductive substrate 10 but has a smaller size than the first thermally conductive substrate 10. And when set up, the second thermally conductive substrate 30 is flush with one end of the first thermally conductive substrate 10. As shown in FIG. 5, the vertical projection of the second thermally conductive substrate 30 on the first thermally conductive substrate 10 is located in the first thermally conductive substrate 10. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. 4, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 4, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.

The second heat-conducting substrate 30 provided in the embodiment of the present disclosure may adopt an integral plate-like structure, or it may adopt a plurality of hollow structures on the second heat-conducting substrate, and each hollow structure is connected to the first ventilation channel. For example, each first ventilation channel corresponds to a plurality of hollow structures, and the plurality of hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, the external cold air can be supplemented into the first ventilation channel through the hollow structure, which improves the heat dissipation effect.

Continuing to refer to FIGS. 4 and 5, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 4, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the first heat dissipation fin 20 is the same as the length direction of the first heat conducting substrate 10. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink.

Continuing to refer to FIGS. 4 and 5, in the heat dissipation device provided by the embodiment of the present disclosure, a plurality of third heat dissipation fins 70 are provided on the portion of the first heat conduction substrate 10 outside the vertical projection of the second heat conduction substrate 30. As shown in FIG. 5, a first heat dissipation fin 20 and a third heat dissipation fin 70 are provided on the first heat conducting substrate 10, and the first heat dissipation fin 20 and the third heat dissipation fin 70 are arranged in parallel. In the specific arrangement, the first heat dissipation fin 20 and the second heat dissipation fin 40 are an integral structure. At this time, the second heat conducting substrate 30 can be regarded as a plurality of connecting plates connecting adjacent first heat dissipation fins 20. In the specific connection, the connecting plate and the heat dissipation fin can be fixedly connected by welding.

As shown in Figs. 6 and 7, Fig. 6 shows a third heat dissipation device provided by an embodiment of the present disclosure, and Fig. 7 shows a schematic end view of the third heat dissipation device.

The heat dissipation device includes a first heat-conducting substrate 10, which is used to be fixedly connected to the base station, and the heat generated by the base station is first transferred to the first heat-conducting substrate 10. Continuing to refer to FIG. 6, in FIG. 6, the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is a rectangular substrate, but it should be understood that the first thermally conductive substrate 10 provided by the embodiment of the present disclosure is not limited to the rectangular shape shown in FIG. The substrate, which can use other shapes of substrates, such as elliptical, square, or diamond-shaped substrates of different shapes, only needs to match the area where the base station needs to dissipate heat. For the material of the first thermally conductive substrate 10 provided by the embodiments of the present disclosure, common thermally conductive metals such as copper and aluminum can be selected, which is not limited herein.

Continuing to refer to FIG. 6, the heat dissipation device provided by the embodiment of the present disclosure further includes a second thermally conductive substrate 30. In FIG. 6, the second thermally conductive substrate 30 has exactly the same shape and size as the first thermally conductive substrate 10, but the embodiment of the present disclosure does not The specific shape and size of the second thermally conductive substrate 30 are defined. When the second thermally conductive substrate 30 is specifically set, there is a gap between the second thermally conductive substrate 30 and the first thermally conductive substrate 10, and the first thermally conductive substrate 10 and the second thermally conductive substrate 30 pass through a plurality of first heat dissipation The fins 20 are fixedly connected. Among them, one side of each first heat dissipation fin 20 is fixedly connected to the first heat-conducting substrate 10, and the other side is fixedly connected to the second heat-conducting substrate 30. The specific fixing method can be welding or threaded connectors (bolts or Screw) for connection; and during connection, the first heat dissipation fin 20 is thermally connected to the first thermally conductive substrate 10 and the second thermally conductive substrate 30. 6, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat-conducting substrate 10 and the second heat-conducting substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open. One of the openings is the air inlet and the other is the air outlet. As shown by the arrow in Figure 6, the arrow shows a specific air flow direction. The cold air flows from below. Enter into the ventilation channel, and then flow out from the upper air outlet. Of course, cold air can also enter the ventilation channel from above, and then flow out from the air outlet below. The first heat-conducting substrate 10, the second heat-conducting substrate 30 and the first heat dissipation fins 20 are used to enclose a ventilation channel, which is named the first ventilation channel 50 for the convenience of description. The cold air in the first ventilation passage 50 has the natural convection heat exchange capacity, which increases the heat dissipation effect. And because the first ventilation passage 50 is a cylindrical structure, the cold air will become a high-temperature low-pressure gas after absorbing heat. A siphon effect is formed in a ventilation channel 50 to improve the fluidity of the air, thereby improving the heat dissipation effect.

Continuing to refer to FIGS. 6 and 7, a plurality of second heat dissipation fins 40 are provided on the side of the second heat conducting substrate 30 facing away from the first heat conducting substrate 10. Moreover, the plurality of second heat dissipation fins 40 are arranged at intervals, and the gap between the second heat dissipation fins 40 forms another ventilation channel. In FIG. 6, the first heat dissipation fin 20 and the second heat dissipation fin 40 are both straight heat dissipation fins, and the length direction of the second heat dissipation fin 40 is the same as the length direction of the first heat conducting substrate 10, and When the first heat dissipation fins 20 and the second heat dissipation fins 40 are specifically arranged, as shown in FIG. 7, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately. In the specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, and the heat transferred from the base station is transferred to the first thermally conductive substrate 10, and is transferred to the second thermally conductive substrate through the first heat dissipation fins 20 30. The second heat-conducting substrate 30 then transfers heat to the second heat-radiating fin 40. When the air is circulating, the air circulates in the first ventilation channel 50 and the second ventilation channel 60 respectively, and is connected to the first heat-conducting substrate 10, The second heat conducting substrate 30, the first heat dissipation fin 20 and the second heat dissipation fin 40 are in contact, thereby increasing the contact area between the air and the heat dissipation device, thereby improving the heat dissipation effect. In addition, the second heat-conducting substrate 30 and the second heat-dissipating fins 40 are added to form the upper and lower layers of ventilation effect, which strengthens the convective heat exchange capacity of the heat sink and improves the heat dissipation efficiency of the heat sink. In addition, since the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged alternately, the effect of heat transfer can be increased.

The embodiment of the present disclosure also provides a base station, which includes a device and any one of the above-mentioned heat dissipation devices provided on the device. In the above technical solution, by using the first heat-conducting substrate 10, the second heat-conducting substrate 30, and the first heat dissipation fins 20 to enclose the ventilation channel, the air in the ventilation channel has a natural convection heat exchange capacity, which increases the heat dissipation effect. In a specific setting, the first heat-conducting substrate 10 may be a housing of a device.

The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope disclosed in the present disclosure, which shall cover Within the protection scope of this disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

A heat dissipation device, comprising: a first heat-conducting substrate, and a second heat-conducting substrate spaced apart from the first heat-conducting substrate; wherein a plurality of heat-conducting substrates are arranged between the first heat-conducting substrate and the second heat-conducting substrate. First heat dissipation fins, and each first heat dissipation fin is thermally connected to the first heat conducting substrate and the second heat conducting substrate; the plurality of first heat dissipation fins connect the first heat conducting substrate to The gap between the second thermally conductive substrates is divided into a plurality of ventilation channels;

A plurality of second heat dissipation fins are provided on the side of the second heat conducting substrate facing away from the first heat conducting substrate.
The heat dissipation device according to claim 1, wherein the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set angle.
3. The heat dissipation device according to claim 2, wherein the length direction of the first heat dissipation fin is the same as the length direction of the first heat conducting substrate;

The length direction of the second heat dissipation fin is inclined with respect to the length direction of the first heat conducting substrate.
The heat dissipation device according to claim 1, wherein the vertical projection of the second thermally conductive substrate on the first thermally conductive substrate is located in the first thermally conductive substrate.
4. The heat dissipation device according to claim 4, wherein a portion of the first heat conduction substrate outside the vertical projection of the second heat conduction substrate is provided with a plurality of third heat dissipation fins.
The heat dissipation device of claim 4, wherein the third heat dissipation fin is parallel to the first heat dissipation fin.
The heat dissipation device according to claim 4, wherein the first heat dissipation fin and the second heat dissipation fin are an integral structure;

The second heat-conducting substrate includes a plurality of connecting plates connecting the adjacent first heat dissipation fins.
5. The heat dissipation device of claim 1, wherein the first heat-conducting substrate and the second heat-conducting substrate are the same size.
8. The heat dissipation device according to claim 8, wherein the first heat dissipation fins and the second heat dissipation fins are staggered.
The heat dissipation device according to any one of claims 1-9, wherein a plurality of hollow structures are provided on the second heat conducting substrate, and each hollow structure is in communication with the ventilation channel.
A base station, which includes equipment, and the heat dissipation device according to any one of claims 1 to 10 arranged on the equipment.