CN112399771A - Heat dissipation device and base station - Google Patents
Heat dissipation device and base station Download PDFInfo
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- CN112399771A CN112399771A CN201910753399.3A CN201910753399A CN112399771A CN 112399771 A CN112399771 A CN 112399771A CN 201910753399 A CN201910753399 A CN 201910753399A CN 112399771 A CN112399771 A CN 112399771A
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- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
The application provides a heat abstractor and basic station, this heat abstractor includes: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels; and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins. In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
Description
Technical Field
The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation apparatus and a base station.
Background
The quality of the thermal design of a communication base station product is directly related to the cost, reliability, volume and weight of the product. If the thermal design is not good, the volume and weight of the equipment can be increased to meet the environmental requirements for the operation of the equipment; otherwise, the temperature rise of the environment is high, the reliability and the service life of the electronic equipment can be reduced when the electronic equipment works under the high-temperature condition for a long time, and even devices can be burnt when the electronic equipment works seriously. How to effectively dissipate heat in a limited space becomes a key problem of the design of the current communication products. The design is applied to a natural convection heat dissipation module, and the general form of the natural convection heat dissipation module is that a certain number of heat dissipation toothed sheets are connected to a first heat conduction substrate, and the heat dissipation toothed sheets and air convection heat exchange realize heat dissipation and cooling of the whole equipment.
Fig. 1 shows a conventional heat dissipation module, wherein 1 is a substrate and 2 is a heat dissipation tooth. The traditional heat dissipation tooth structure obtains a better heat dissipation effect mainly by changing geometric parameters, but after the parameters such as the height, the length, the thickness, the tooth piece spacing and the like of the heat dissipation tooth pieces reach a certain degree of optimization, the heat dissipation capacity of the heat dissipation tooth cannot be obviously improved due to marginal effect.
Disclosure of Invention
The application provides a heat dissipation device and a base station, which are used for improving the heat dissipation effect.
In a first aspect, a heat dissipation device is provided, the heat dissipation device comprising: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels;
and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins.
In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
In a specific possible implementation manner, the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set included angle. Through the radiating fins with different angles, the radiating effect is improved.
In a specific embodiment, the length direction of the first heat dissipation fin is the same as the length direction of the first heat conduction substrate;
the length direction of the second heat dissipation fins is inclined relative to the length direction of the first heat conduction substrate. The heat dissipation effect is improved.
In a specific embodiment, the perpendicular projection of the second heat-conducting substrate on the first heat-conducting substrate is located within the first heat-conducting substrate.
In a specific possible embodiment, a plurality of third heat dissipation fins are arranged on a portion of the first heat conduction substrate, which is located outside the perpendicular projection of the second heat conduction substrate.
In a specific embodiment, the third heat dissipating fin is parallel to the first heat dissipating fin.
In a specific possible embodiment, the first heat dissipation fin and the second heat dissipation fin are of a unitary structure;
the second heat conductive substrate includes a plurality of connection plates connecting adjacent ones of the first heat dissipation fins.
In a specific embodiment, the first thermally conductive substrate is the same size as the second thermally conductive substrate.
In a specific embodiment, the first heat dissipation fins and the second heat dissipation fins are arranged in a staggered manner.
In a specific embodiment, a plurality of hollow structures are disposed on the second heat conductive substrate, and each hollow structure is communicated with the ventilation channel. The ventilation effect is increased.
In a second aspect, there is provided a base station comprising an apparatus, and the heat sink of any one of the above arranged on the apparatus. In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation device in the prior art;
fig. 2 is a schematic structural diagram of a first heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a schematic end view of a first heat dissipation device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a second heat dissipation device according to an embodiment of the present disclosure;
fig. 5 is a schematic end view of a second heat dissipation device according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a third heat dissipation device according to an embodiment of the present application;
fig. 7 is an end view of a third heat dissipation device according to an embodiment of the present application.
Detailed Description
For convenience of understanding the heat dissipation device provided in the embodiment of the present application, an application scenario of the heat dissipation device provided in the embodiment of the present application is first described below. When the base station heat dissipation device is used, the heat dissipation device is fixed on the base station, heat generated by the base station is transferred to the heat dissipation device, and the heat is dissipated through the heat dissipation device. In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
Referring first to fig. 2 and 3, fig. 2 shows a specific heat sink, and fig. 3 shows a schematic cross-sectional view of the heat sink. The heat dissipation device comprises a first heat conduction substrate 10, wherein the first heat conduction substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is firstly transferred to the first heat conduction substrate 10. With continued reference to fig. 2, in fig. 2, the first thermal conductive substrate 10 provided in the embodiment of the present application is a rectangular substrate, but it should be understood that the first thermal conductive substrate 10 provided in the embodiment of the present application is not limited to the rectangular substrate shown in fig. 2, and it may be a substrate with other shapes, such as substrates with different shapes, such as an oval shape, a square shape, or a diamond shape, and it only needs to match with an area of the base station where heat dissipation is needed. The material of the first heat conductive substrate 10 provided in the embodiment of the present application may be selected from common heat conductive metals such as copper and aluminum, which is not limited herein.
With continued reference to fig. 2, the heat dissipation device provided in the embodiment of the present application further includes a second heat conduction substrate 30, in fig. 2, the second heat conduction substrate 30 is identical to the first heat conduction substrate 10 in shape and size, but the embodiment of the present application does not limit the specific shape and size of the second heat conduction substrate 30. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 2, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 2, which shows a specific air flow direction, cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The second heat conducting substrate 30 provided in the embodiment of the present application may adopt an integral plate-shaped structure, and also may adopt a plurality of hollow structures disposed on the second heat conducting substrate, and each hollow structure is communicated with the first ventilation channel. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 2 and 3, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 2, straight fins are used for the first heat dissipation fins 20 and the second heat dissipation fins 40, and the length direction of the second heat dissipation fins 40 is inclined with respect to the length direction of the first heat conduction substrate 10, that is, the length direction of the first heat dissipation fins 20 and the length direction of the second heat dissipation fins 40 form a set included angle. In fig. 2, the angle between the first heat dissipating fins 20 and the second heat dissipating fins 40 in the longitudinal direction is 45 °, so that the flow direction of the air flowing between the first heat dissipating fins 20 is different from the flow direction of the air flowing through the second heat dissipating fins 40. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved.
It should be understood that the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 shown in fig. 2 is only a specific example, and the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 provided in the embodiment of the present application is not limited to the specific mode in fig. 2, and other included angles may also be used, for example, the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 is different from 30 °, 60 °, and the like. Can achieve the effect of improving heat dissipation.
Reference is also made to fig. 4 and 5, where fig. 4 shows a second heat dissipation device provided in the embodiment of the present application, and fig. 5 shows an end view of the second heat dissipation device. In the heat dissipating device shown in fig. 4, the heat dissipating device includes a first heat conductive substrate 10, the first heat conductive substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is first transferred to the first heat conductive substrate 10. With continued reference to fig. 4, in fig. 4, the first thermal conductive substrate 10 provided in the embodiment of the present application is a rectangular substrate, but it should be understood that the first thermal conductive substrate 10 provided in the embodiment of the present application is not limited to the rectangular substrate shown in fig. 4, and it may be a substrate with other shapes, such as substrates with different shapes, such as an oval shape, a square shape, or a diamond shape, and it only needs to match with the area of the base station where heat dissipation is needed. The material of the first heat conductive substrate 10 provided in the embodiment of the present application may be selected from common heat conductive metals such as copper and aluminum, which is not limited herein.
With continued reference to fig. 4, the heat dissipation device provided in the embodiment of the present application further includes a second heat conductive substrate 30, and in fig. 4, the second heat conductive substrate 30 has the same shape as the first heat conductive substrate 10, but is smaller in size than the first heat conductive substrate 10. And when the second heat conducting substrate 30 is disposed, the second heat conducting substrate 30 is flush with one end of the first heat conducting substrate 10, as shown in fig. 5, a vertical projection of the second heat conducting substrate 30 on the first heat conducting substrate 10 is located in the first heat conducting substrate 10. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 4, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 4, which shows a specific air flow direction, cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The second heat conducting substrate 30 provided in the embodiment of the present application may adopt an integral plate-shaped structure, and also may adopt a plurality of hollow structures disposed on the second heat conducting substrate, and each hollow structure is communicated with the first ventilation channel. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 4 and 5, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 4, straight fins are used as the first heat dissipation fins 20 and the second heat dissipation fins 40, and the length direction of the first heat dissipation fins 20 is the same as the length direction of the first heat conductive substrate 10. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved.
With continued reference to fig. 4 and 5, in the heat dissipation device provided in the embodiment of the present application, a plurality of third heat dissipation fins 70 are disposed on a portion of the first heat conduction substrate 10, which is located outside the perpendicular projection of the second heat conduction substrate 30. As shown in fig. 5, the first heat conductive substrate 10 is provided with first and third heat dissipation fins 20 and 70, and the first and third heat dissipation fins 20 and 70 are disposed in parallel. In a specific arrangement, the first heat dissipating fins 20 and the second heat dissipating fins 40 are integrated, and the second heat conducting substrate 30 can be regarded as a plurality of connecting plates connecting the adjacent first heat dissipating fins 20. When the heat dissipation fin is connected specifically, the connecting plate and the heat dissipation fin can be fixedly connected in a welding mode.
As shown in fig. 6 and 7, fig. 6 shows a third heat dissipation device provided in the embodiment of the present application, and fig. 7 shows an end view of the third heat dissipation device.
The heat dissipation device comprises a first heat conduction substrate 10, wherein the first heat conduction substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is firstly transferred to the first heat conduction substrate 10. With continued reference to fig. 6, in fig. 6, the first thermal conductive substrate 10 provided in the embodiment of the present application is a rectangular substrate, but it should be understood that the first thermal conductive substrate 10 provided in the embodiment of the present application is not limited to the rectangular substrate shown in fig. 6, and it may be a substrate with other shapes, such as substrates with different shapes, such as an oval shape, a square shape, or a diamond shape, and it only needs to match with the area of the base station where heat dissipation is needed. The material of the first heat conductive substrate 10 provided in the embodiment of the present application may be selected from common heat conductive metals such as copper and aluminum, which is not limited herein.
With continued reference to fig. 6, the heat dissipation device provided in the embodiments of the present application further includes a second heat conduction substrate 30, in fig. 6, the second heat conduction substrate 30 is identical to the first heat conduction substrate 10 in shape and size, but the specific shape and size of the second heat conduction substrate 30 is not limited in the embodiments of the present application. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 6, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 6, which shows a specific air flow direction, and cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The second heat conducting substrate 30 provided in the embodiment of the present application may adopt an integral plate-shaped structure, and also may adopt a plurality of hollow structures disposed on the second heat conducting substrate, and each hollow structure is communicated with the first ventilation channel. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 6 and 7, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 6, straight fins are used for the first heat dissipation fins 20 and the second heat dissipation fins 40, the length direction of the second heat dissipation fins 40 is the same with respect to the length direction of the first heat conduction substrate 10, and when the first heat dissipation fins 20 and the second heat dissipation fins 40 are specifically arranged, as shown in fig. 7, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged in a staggered manner. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved. In addition, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged in a staggered manner, so that the heat transfer effect can be increased.
The embodiment of the application also provides a base station, which comprises equipment and the heat dissipation device arranged on the equipment. In the above technical scheme, a ventilation channel is defined by the first heat conduction substrate 10, the second heat conduction substrate 30 and the first heat dissipation fins 20, and the natural convection heat exchange capability of air in the ventilation channel increases the heat dissipation effect. When specifically arranged, the first heat conductive substrate 10 may be a casing of the apparatus.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (11)
1. A heat dissipating device, comprising: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels;
and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins.
2. The heat dissipating device of claim 1, wherein the length direction of the first heat dissipating fins and the length direction of the second heat dissipating fins form a predetermined angle.
3. The heat dissipating device of claim 2, wherein the first heat dissipating fin has a longitudinal direction that is the same as a longitudinal direction of the first heat conductive substrate;
the length direction of the second heat dissipation fins is inclined relative to the length direction of the first heat conduction substrate.
4. The heat dissipation device of claim 1, wherein a perpendicular projection of the second thermally conductive substrate onto the first thermally conductive substrate is located within the first thermally conductive substrate.
5. The heat dissipating device as claimed in claim 4, wherein a portion of the first heat conducting substrate located outside a vertical projection of the second heat conducting substrate is provided with a plurality of third heat dissipating fins.
6. The heat dissipating device of claim 4, wherein the third heat dissipating fin is parallel to the first heat dissipating fin.
7. The heat dissipating device of claim 4, wherein the first heat dissipating fin and the second heat dissipating fin are of a unitary structure;
the second heat conductive substrate includes a plurality of connection plates connecting adjacent ones of the first heat dissipation fins.
8. The heat dissipating device of claim 1, wherein the first thermally conductive substrate is the same size as the second thermally conductive substrate.
9. The heat dissipating device of claim 8, wherein the first heat dissipating fins are staggered from the second heat dissipating fins.
10. The heat dissipation device as claimed in any one of claims 1 to 9, wherein a plurality of hollow structures are disposed on the second heat conductive substrate, and each hollow structure is communicated with the ventilation channel.
11. A base station, comprising equipment, and the heat sink device according to any one of claims 1 to 10 provided on the equipment.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910753399.3A CN112399771A (en) | 2019-08-15 | 2019-08-15 | Heat dissipation device and base station |
| PCT/CN2020/101151 WO2021027454A1 (en) | 2019-08-15 | 2020-07-09 | Heat dissipation device, and base station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910753399.3A CN112399771A (en) | 2019-08-15 | 2019-08-15 | Heat dissipation device and base station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112399771A true CN112399771A (en) | 2021-02-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910753399.3A Pending CN112399771A (en) | 2019-08-15 | 2019-08-15 | Heat dissipation device and base station |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112399771A (en) |
| WO (1) | WO2021027454A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768355B (en) * | 2015-03-24 | 2017-11-17 | 华为技术有限公司 | Heat abstractor, radio frequency remoto module, base station module, communication base station and system |
| CN205030024U (en) * | 2015-08-12 | 2016-02-10 | 中兴通讯股份有限公司 | Cooling fin |
| CN105722379B (en) * | 2016-04-29 | 2019-04-19 | 华为技术有限公司 | Cooling system and communication apparatus with the cooling system |
| CN208333161U (en) * | 2018-03-23 | 2019-01-04 | 中兴通讯股份有限公司 | A kind of radiating fin and radiator |
-
2019
- 2019-08-15 CN CN201910753399.3A patent/CN112399771A/en active Pending
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2020
- 2020-07-09 WO PCT/CN2020/101151 patent/WO2021027454A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2021027454A1 (en) | 2021-02-18 |
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