CN113543575A - Radiator and communication equipment - Google Patents
Radiator and communication equipment Download PDFInfo
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- CN113543575A CN113543575A CN202010309564.9A CN202010309564A CN113543575A CN 113543575 A CN113543575 A CN 113543575A CN 202010309564 A CN202010309564 A CN 202010309564A CN 113543575 A CN113543575 A CN 113543575A
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- 238000004891 communication Methods 0.000 title claims abstract description 39
- 239000003507 refrigerant Substances 0.000 claims abstract description 39
- 238000007664 blowing Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 117
- 230000000694 effects Effects 0.000 abstract description 37
- 239000000758 substrate Substances 0.000 abstract description 37
- 238000010438 heat treatment Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 18
- 238000001816 cooling Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 239000011343 solid material Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
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- 230000006872 improvement Effects 0.000 description 4
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- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiator, comprising: the heat dissipation device comprises a heat dissipation substrate and heat dissipation fin groups arranged on the surface of the heat dissipation substrate, wherein heating components are arranged on the inner surface of the heat dissipation substrate, the heat dissipation fin groups are arranged on the outer surface of the heat dissipation substrate and comprise two groups of inclined heat dissipation fin groups which are arranged oppositely and in a staggered mode, a vertical air channel is arranged between the two groups of inclined heat dissipation fin groups, each inclined heat dissipation fin group comprises a plurality of inclined heat dissipation fins, an open V-shaped structure is formed between the heat dissipation fins of the two groups of inclined heat dissipation fin groups, and refrigerant working media are filled in the heat dissipation fins. The radiator provided by the invention has a good heat exchange effect, can meet the heat exchange requirement of novel high-power wireless communication equipment, has a simple structure, is convenient to operate, and can be popularized and used. The invention also provides communication equipment comprising the radiator, and the heating element of the communication equipment has good radiating effect and can effectively prolong the service life and improve the operation effect of the device.
Description
Technical Field
The invention relates to the technical field of passive heat dissipation, in particular to a heat radiator. In addition, still relate to a communications facilities who contains above-mentioned radiator.
Background
The communication equipment can generate larger heat when in work, and particularly the heat productivity of the novel 5G wireless transceiver reaches more than 3 times of the heat productivity of the original 4G equipment. The electronic equipment has high sensitivity to temperature, and if the generated heat cannot be dissipated in time, equipment failure can be caused, and the electronic equipment cannot work normally.
For a radiator installed on communication equipment, air cooling is mostly adopted, and particularly for wireless transceiver equipment, due to the fact that the wireless transceiver equipment is hung on a high tower or a transmitting tower on the top of a building, a passive cooling mode is mostly adopted for a long time without being attended.
In the prior art, a shell of the wireless transceiver is mostly used as a heat dissipation substrate for heat dissipation of the wireless transceiver, and heat dissipation fins are arranged on the outer surface of the shell to increase the heat exchange area and enhance the heat exchange capability. The communication equipment comprises a shell, a plurality of heat dissipation fins and a plurality of heating elements, wherein the heat dissipation fins are vertically parallel, a ventilation channel is formed between every two adjacent heat dissipation fins, and the heating elements generating heat inside the communication equipment are arranged on the inner surface of the shell or transfer the heat to the inner surface of the heat dissipation shell in some heat transfer modes. Therefore, when the heating component inside the communication equipment works to generate heat, the generated heat is transferred to each radiating fin of the radiator through the radiator shell, and then the air between the channels is heated through the heat convection between the radiator and the air. The heated air can generate density change and starts to move upwards along the channel, so that the air is discharged to the outside of the radiator, and the cold air outside is replenished from the bottom of the channel due to the discharge of the hot air inside, so that the radiator can continuously take away the heat generated by the heating components inside the communication equipment through the natural convection heat exchange of the air, and the communication equipment is kept at a good working temperature.
At present, there are two main types of relatively common heat dissipation schemes, the first type is to use the blowing plate to replace the original fin, and the vertical arrangement is on the radiator base plate for heat dissipation. The second is to use a high heat-conducting metal material, and improve the natural convection heat transfer capability and enhance the heat transfer efficiency of the radiator by changing the arrangement angle and the mode of the fins.
To the problem that the heat productivity of the existing wireless communication equipment is larger and larger, the main heat dissipation mode of the wireless transceiver equipment is to replace the original metal fin with high heat conductivity coefficient by adopting a blowing plate mode. However, since the evaporation and reflux of the working medium inside the inflation plate can only be performed in a gravity manner, a good evaporation process cannot be formed on the upper portion of the substrate, so that the heat dissipation capability of the upper portion of the substrate is poor, that is, the thermal conductivity of the inflation plate along the height direction is different, and the best heat exchange performance cannot be fully exerted.
In addition, the mode of enhancing natural convection heat transfer by changing the arrangement of the fins can cause the problem of low fin efficiency because the heat conductivity coefficient of the fins is not high. Generally, the adopted fins are made of solid materials such as copper, aluminum alloy and the like, the heat conductivity coefficient of the metal materials is only 400 (W/m.K) at present, the heat exchange efficiency of the fins is not high finally, and the difference between the temperature of the fins at the position of the base plate and the temperature of the top ends of the fins is large, so that the heat dissipation efficiency of the heat sink is seriously influenced. The existing heat exchange mode can not meet the heat exchange requirement of the novel high-power wireless communication equipment.
In summary, how to provide a device with a good heat exchange effect and capable of better meeting the heat exchange requirement of a novel high-power wireless communication device is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a heat sink, which has a good heat exchange effect and can better meet the heat exchange requirement of a novel high-power wireless communication device.
Another object of the present invention is to provide a communication device including the heat sink, in which the heat dissipation effect of the heat generating component of the communication device is good, and the service life and the operation effect of the device can be effectively improved.
In order to achieve the above purpose, the invention provides the following technical scheme:
a heat sink, comprising: the heat dissipation device comprises a heat dissipation substrate and heat dissipation fin groups arranged on the surface of the heat dissipation substrate, wherein heating components are arranged on the inner surface of the heat dissipation substrate, the heat dissipation fin groups are arranged on the outer surface of the heat dissipation substrate and comprise two groups of inclined heat dissipation fin groups which are oppositely arranged, a vertical air channel is arranged in the middle of each two groups of inclined heat dissipation fin groups, each inclined heat dissipation fin group comprises a plurality of inclined heat dissipation fins, an open V shape is formed between each two groups of inclined heat dissipation fins, and refrigerant working media are filled in each heat dissipation fin.
In one embodiment, the two sets of inclined heat dissipation fin sets are arranged in a staggered manner so as to mix the ascending air flow in the vertical air channel.
In one embodiment, the two groups of oblique radiating fin groups have the same structure, and the radiating fins are soaking plates, blowing plates or thermosyphon plates.
In one embodiment, adjacent fins in the same diagonal fin group are parallel to each other and are arranged at equal intervals.
In one embodiment, the heat dissipation fins are provided with space channels for filling the refrigerant working medium, and the space channels comprise passages formed by brazing metal plates or by blowing.
In one embodiment, the housing of the heat sink fin comprises a piece of highly thermally conductive material.
In one embodiment, the heat dissipation fins are smooth-surfaced sheet fins or corrugated fins or grooved fins.
In one embodiment, the inclined angle between the heat dissipation fins and the horizontal plane is 30-60 °.
A heat sink, comprising: the radiating base plate with locate radiating fin group on radiating base plate surface, radiating fin group includes: the first fin group is obliquely arranged at a first preset angle with the surface of the radiating substrate and comprises a plurality of first radiating fins; the second fin group is obliquely arranged at a second preset angle with the surface of the radiating substrate and comprises a plurality of second radiating fins, and the first fin group and the second fin group are oppositely arranged; refrigerant working media are filled in the first radiating fins and the second radiating fins; and a vertical air channel is arranged between the first fin group and the second fin group, and the bottoms of the first radiating fins and the corresponding bottoms of the second radiating fins are not on the same horizontal line.
A communication device, comprising: heating element and above-mentioned any radiator, the radiator with heating element is connected to heating element dispels the heat.
When the radiator provided by the invention is used, firstly, the radiator is arranged on the outer surface of the heating component of the wireless communication equipment, namely, the heating component can be arranged on the inner surface of the radiating substrate, the heat of the heating component is transferred from the inner surface of the radiating substrate to the outer surface of the radiating substrate through heat conduction on the radiating substrate, then, the heat is transferred to the radiating fin group, and the fins of the radiating fin group are contacted with air in each air channel to radiate the heat into the natural environment.
And because the radiating fins of the two groups of radiating fin groups form an open V shape, namely the radiating fins on two sides are not closed, and form a structure with an upward opening, and a vertical air channel is reserved between the radiating fins and the structure, cold air in the environment can enter the vertical air channel and move upwards along the vertical air channel. The interval between the adjacent radiating fin in every slant radiating fin group is slant air passage, when cold air upwards moves in vertical air passage, because slant air passage and vertical air passage communicate each other, consequently, cold air can be followed to the motion of slant air passage in the vertical air passage, and the air flow in the slant air passage can take away the heat of each radiating fin, and through the gaseous flow of above-mentioned each air passage, the gas that is heated can flow into the environment again, and then dispels the heat for wireless communication equipment. And the air that is heated can be higher inclined upward movement under the effect of natural convection to improve gaseous flow velocity, makeed more heat by the gaseous area of flow to the environment, further improved the radiating effect of radiator, accelerated the heat dissipation for communication equipment.
Because the cooling fin is internally filled with the refrigerant working medium, when the cooling fin is obliquely arranged on the cooling substrate at a certain angle, the refrigerant working medium can flow and extend along the cooling fin, so that the range of the phase change reaction of the cooling fin is enlarged, namely, the cooling fin can be enabled to have the same refrigerant working medium filling amount, even if the top end of the cooling fin can also have a two-phase heat exchange process, the completely immersed part at the bottom of the cooling fin is also reduced, and then the heat exchange capacity of a single cooling fin at each position can be well improved, so that the heat exchange efficiency of the cooling fin group is improved. Moreover, the radiator provided by the invention has the advantages of simple structure and convenience in operation, and can be popularized and used.
In conclusion, the radiator provided by the invention has a good heat exchange effect, can meet the heat exchange requirement of novel high-power wireless communication equipment, is simple in structure and convenient to operate, and can be popularized and used.
In addition, the invention also provides communication equipment comprising the radiator, and the heat dissipation effect of the heating element of the communication equipment is good, so that the service life and the operation effect of the device can be effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic three-dimensional structure diagram of a heat sink according to the present invention;
FIG. 2 is a front view of the heat sink;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a schematic structural diagram of a heat dissipation fin;
FIG. 5 is a schematic diagram of an internal cavity structure of a heat sink fin;
FIG. 6 is a schematic diagram of another internal cavity configuration of a heat sink fin;
fig. 7 is a schematic view of another internal cavity structure of the heat dissipation fin.
In FIGS. 1-7:
the heat dissipation structure comprises a heat dissipation substrate 1, a heating element 2, a heat dissipation fin group 3, an oblique air channel 4, a heat dissipation fin 5, an oblique heat dissipation fin group 6, a vertical air channel 7, a shell 8, a space channel 9 and a refrigerant working medium 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a radiator which has good heat exchange effect, can meet the heat exchange requirement of novel high-power wireless communication equipment, has simple structure and convenient operation, and can be popularized and used.
The other core of the invention is to provide the communication equipment comprising the radiator, and the heat dissipation effect of the heating element of the communication equipment is good, so that the service life and the operation effect of the device can be effectively improved.
Referring to fig. 1 to 7, fig. 1 is a schematic three-dimensional structure diagram of a heat sink according to the present invention; FIG. 2 is a front view of the heat sink; FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2; FIG. 4 is a schematic structural diagram of a heat dissipation fin; FIG. 5 is a schematic diagram of an internal cavity structure of a heat sink fin; FIG. 6 is a schematic diagram of another internal cavity configuration of a heat sink fin; fig. 7 is a schematic view of another internal cavity structure of the heat dissipation fin.
This embodiment provides a radiator, includes: the heat radiating base plate comprises a heat radiating base plate 1 and heat radiating fin groups 3 arranged on the surface of the heat radiating base plate 1, wherein the inner surface of the heat radiating base plate 1 is used for mounting a heating element 2, the heat radiating fin groups 3 are arranged on the outer surface of the heat radiating base plate 1, each heat radiating fin group 3 comprises two groups of inclined heat radiating fin groups 6 which are oppositely arranged, a vertical air channel 7 is arranged between the two groups of inclined heat radiating fin groups 6, each inclined heat radiating fin group 6 comprises a plurality of inclined heat radiating fins 5, an open V shape is formed between the heat radiating fins 5 of the two groups of inclined heat radiating fin groups 6, and refrigerant working media 10 are filled in the heat radiating fins 5.
It should be noted that the heat dissipation substrate 1 may be a back plate of a wireless communication device, and the heating component 2 of the wireless communication device should be in close contact with the inner surface of the heat dissipation substrate 1, for example, the heating component 2 may be attached to the inner surface of the heat dissipation substrate 1 or the heating component 2 may be directly mounted on the inner surface of the heat dissipation substrate 1, so that heat can be rapidly transferred to the heat dissipation substrate and the heat dissipation fin group 3.
It should be further noted that, because the oblique air channels 4 are left between adjacent heat dissipation fins 5 of the same group, that is, the cold air can pass through the oblique air channels 4 to dissipate the heat of the heat dissipation fins 5. In an embodiment, the two sets of diagonal fin groups 6 disposed opposite to each other here may be completely symmetrical and opposite to each other, so as to facilitate the mounting operation. Or the two groups of oblique radiating fin groups 6 are arranged oppositely in a staggered mode, so that ascending air flow in the vertical air channel 7 can be stirred and mixed better, and then the heat exchange efficiency can be improved. Moreover, the two sets of diagonal fin groups 6 may have the same or different structures.
In other embodiments, the heat dissipation fins 5 of the same group of diagonal heat dissipation fin groups 6 may be set to different inclination angles, or the heat dissipation fins 5 of different groups of diagonal heat dissipation fin groups 6 may be set to different inclination angles, as required.
In addition, it should be noted that the open V shape here means that two sets of oblique fin groups 6 form a structure with an upward opening, and the adjacent fins 5 are not closed or connected, but are provided with vertical air channels 7 to facilitate the flow of air. The open V-shape may also include a structure with two sets of oblique fins 6 arranged in a staggered manner, that is, the fins 5 on both sides are arranged in a staggered manner, one end (point) of each of the two fins 5 corresponding to different fins 6, which is close to the vertical air channel 7, is not on a horizontal line, and the two fins 5 are not closed or connected, that is, arranged in a staggered manner.
In other embodiments, the two sets of oblique fins 6 and the fins 5 thereof are arranged at different angles, the open V shape here may be in other forms, and the fins 5 may have other structures, that is, may be determined according to actual structures.
For example, vertical fin groups can be arranged at two ends of the vertical air channel 7 respectively, oblique fin groups 6 are arranged on two sides of the vertical air channel 7 respectively, the distance between the vertical fins of the vertical fin groups is larger than the size of the vertical air channel 7, so that the air circulation effect is not influenced, the fin positions of the oblique fin groups 6 are staggered, cold air can be accelerated to enter the oblique air channels 4 on two sides from the vertical air channel 7, and then the heat dissipation effect of the heat sink can be improved. Moreover, the diagonal fin group 6 located on the same side of the vertical air passage 7 may further include two or more diagonal fin groups 6 having different inclination angles.
In one possible implementation, the shape of the vertical fins in the two vertical fin groups and the shape of the diagonal fins in the at least two diagonal fin groups 6 may be any one of a sheet shape, a columnar shape, and a tubular shape. That is, the shape of the heat dissipation fins 5 may be any shape, and the heat dissipation area of the heat sink may be increased, for example, the shape may be any one of a sheet shape, a column shape and a tubular shape, and the common shape is a sheet-shaped heat dissipation tooth, and the sheet-shaped heat dissipation tooth is easy to process, has a large surface area, and has a large heat dissipation area.
In the actual application process, the structure, material, shape, position, size, etc. of the heat dissipation substrate 1 and the heat dissipation fin group 3 can be determined according to the actual situation and the actual requirements.
When the radiator provided by the invention is used, firstly, the radiator is arranged on the outer surface of the heating component 2 of the wireless communication equipment, namely, the heating component 2 can be arranged on the inner surface of the radiating substrate 1, the heat of the heating component 2 is transferred from the inner surface of the radiating substrate 1 to the outer surface of the radiating substrate 1 through heat conduction on the radiating substrate 1, then, the heat is transferred to the radiating fin group 3, and the fins of the radiating fin group 3 are contacted with air in each air channel so as to radiate the heat into the natural environment.
In addition, because the two groups of radiating fins 3 form an open V shape between the radiating fins 5, that is, the radiating fins 5 on the two sides are not closed, and form a structure with an upward opening, a vertical air channel 7 is left between the radiating fins 5 and the open V shape, so that cold air in the environment can enter the vertical air channel 7 and move upwards along the vertical air channel 7. The interval between the adjacent radiating fins 5 in each oblique radiating fin group 6 is oblique air channel 4, when cold air moves upwards in vertical air channel 7, because oblique air channel 4 communicates with vertical air channel 7 each other, therefore, cold air can move to oblique air channel 4 from vertical air channel 7, the heat of each radiating fin 5 can be taken away in the air flow in oblique air channel 4, through the gas flow of each above-mentioned air channel, the gas that is heated can flow into the environment again, and then dispels the heat for wireless communication equipment. And the air that is heated can be higher inclined upward movement under the effect of natural convection to improve gaseous flow velocity, makeed more heat by the gaseous area of flow to the environment, further improved the radiating effect of radiator, accelerated the heat dissipation for communication equipment.
Because radiating fin 5 is inside to be filled with refrigerant working medium 10, when radiating fin 5 locates radiating base plate 1 with certain angle slope as above-mentioned embodiment, can make refrigerant working medium 10 extend along the flow in radiating fin 5, make its scope increase that carries out the phase transition reaction, also can make radiating fin 5 under same refrigerant working medium 10 volume of filling, have bigger internal surface to be covered by refrigerant working medium, take place double-phase heat transfer process, then can be fine improvement single radiating fin 5 at the heat transfer ability of each position, thereby improve radiating fin group 3's heat exchange efficiency. Moreover, the radiator provided by the invention has the advantages of simple structure and convenience in operation, and can be popularized and used.
In conclusion, the radiator provided by the invention has a good heat exchange effect, can meet the heat exchange requirement of novel high-power wireless communication equipment, is simple in structure and convenient to operate, and can be popularized and used.
In one embodiment, the two sets of diagonal fin elements 6 are staggered to mix the updraft in the vertical air channels 7.
In this embodiment, the two sets of oblique heat dissipation fin sets 6 are arranged in a staggered manner, so that the vertical air channels 7 and the oblique air channels 4 are communicated more sufficiently, cold air can be promoted to enter the radiator, hot air can flow out of the radiator, a chimney effect is formed, and the influence caused by the fact that the vertical channels of the air channels are changed into the oblique channels is reduced.
In one embodiment, the two sets of diagonal fins 6 have the same structure, and the fins 5 are vapor chamber plates, expansion plates, or siphon plates.
Here, the two oblique fin groups 6 have the same structure, which means that the inclination angle, the size, and the like of the fins 5 of each oblique fin group 6 are the same. The heat dissipating fins 5 are made of a soaking plate, an inflation plate, a thermosyphon plate, or the like, and are used for effectively improving the heat dissipating efficiency of the heat dissipating fins 5. The shell 8 of the soaking plate, the blowing plate or the thermosyphon plate is generally made of solid materials, the refrigerant working medium 10 is filled in the shell, and the inside of the shell can generate a phase change process in the working and using process, so that the heat conduction and heat dissipation capacity of the shell is effectively improved.
It should be further noted that, the heat dissipation substrate 1 and the heat dissipation fins 5 of the heat sink may be both made of two-phase heat exchange units such as a soaking plate, an inflation plate, a thermosyphon plate, and the like, and of course, after the heat dissipation substrate 1 is made of a solid material, the heat dissipation fins 5 may be fixed on the heat dissipation substrate 1 by welding, pressing, and the like.
The material, structure, position, number and the like of the radiating fins 5 can be determined according to actual conditions and actual requirements in the actual application process.
In one embodiment, adjacent fins 5 in the same diagonal fin group 6 are parallel to each other and equally spaced. The size of the oblique air channel 4 between the adjacent radiating fins 5 is ensured to be the same, the amount of cold air flowing through the channel can be ensured to be the same, and the radiating effect of each radiating fin 5 is also ensured to be equivalent, so that the situations that some radiating fins 5 have good radiating effect and some radiating fins 5 have poor radiating effect are avoided. Moreover, the heat dissipation fins 5 are uniformly arranged on the heat dissipation substrate 1 in parallel and at equal intervals, which is beneficial to ensuring that the inclination angles of the heat dissipation fins 5 are the same, ensuring that the heat dissipation effects of the refrigerant working medium 10 in the heat dissipation substrate are the same, being beneficial to improving the overall heat dissipation effect of the device, and being convenient for carrying out uniform installation operation and the like.
In the actual application process, parameters such as the inclination angle of the radiating fins 5 and the interval between the adjacent radiating fins 5 can be determined according to actual conditions and actual requirements.
In one embodiment, the heat dissipating fins 5 are provided with a space channel 9 for filling with a refrigerant working medium 10, and the space channel 9 comprises a passage formed by brazing a metal plate or by blowing.
In this embodiment, the space channel 9 is disposed in the heat dissipating fin 5, and the refrigerant working medium 10 can be filled into the space channel 9, so as to improve the backflow effect of the space channel 9, improve the internal circulation of the refrigerant working medium 10, and further improve the heat dissipating effect of the heat dissipating fin 5. As shown in fig. 5 to 7, there are three other cases of the space passage 9 provided in the heat dissipating fin 5, which are a communicating large passage, a mutually parallel passage, and a plurality of passages communicating with each other. The space channel 9 in the figure is used for filling the refrigerant working medium 10, and the cavity is internally provided with a metal plate structure to form different channels, so that the backflow effect of the refrigerant working medium 10 can be improved.
In the actual application process, the space channel 9 in the heat dissipation fin 5 can be designed into other shapes according to the actual situation and the actual requirement.
It should be further noted that, when the refrigerant working medium 10 is filled, the space channel 9 of the heat dissipation fin 5 needs to be vacuumized first, and then a certain amount of refrigerant working medium 10 is filled again, so that the liquid and gaseous refrigerant working media 10 exist in the space channel 9 at the same time, thereby ensuring the heat transfer and dissipation effects of the refrigerant working medium 10.
In addition, the charging amount of the refrigerant working medium 10 needs to be determined by the heat quantity to be dissipated by the single heat dissipation fin 5, the characteristics of the refrigerant working medium 10 and the characteristics of the space channel 9 of the heat dissipation fin 5. Therefore, the concrete charging amount of the refrigerant working medium 10 can be determined according to the actual situation and the actual requirement in the actual application process,
in an embodiment, the housing 8 of the heat sink fin 5 comprises a piece of highly thermally conductive material.
It should be noted that the top of the heat dissipating fin 5 generally has no refrigerant working medium 10, and the heat is dissipated mainly through the high thermal conductive material, so that the heat conducting and dissipating efficiency of the heat dissipating fin 5 can be ensured and effectively improved by setting the housing 8 of the heat dissipating fin 5 as the high thermal conductive material. The high thermal conductive material here may be copper or aluminum alloy or a high thermal conductive composite material.
In the actual application process, the shape, material, size and the like of the shell 8 of the radiating fin 5 can be determined according to the actual situation and the actual requirement.
In one embodiment, the heat dissipation fins 5 are sheet fins or corrugated fins or grooved fins with smooth surfaces.
It should be noted that, if the heat dissipation fins 5 are sheet fins with smooth surfaces, the outer surfaces thereof are smooth, so that the air disturbance is not large, and the heat dissipation effect is poor. If the radiating fins 5 are corrugated or grooved fins, the surface radiating area is larger, the air disturbance is larger, and the heat exchange and radiating effect is better. In the actual application process, the shape, the heat dissipation area and the like of the heat dissipation fins 5 can be determined according to the actual situation and the actual requirement.
In one embodiment, the inclined angle between the heat dissipating fins 5 and the horizontal plane is 30 ° to 60 °.
It should be noted that, the heat dissipation effect can be improved by the inclined arrangement of the heat dissipation fins 5, the inclination angle between the heat dissipation fins 5 and the horizontal plane can be 0 ° to 90 °, and when the inclination angle is 30 ° to 60 °, the heat dissipation effect is better.
It should be added that the inclination angle affects the heat exchange and dissipation efficiency of the heat sink, and the setting of the inclination angle is affected by the magnitude of the required heat dissipation amount and the size of the heat dissipation substrate 1, so that in the actual application process, a technician can obtain a proper value based on theoretical calculation and multiple orthogonal tests, so as to optimize the heat exchange and dissipation effect of the heat dissipation fins 5.
The present invention provides a heat sink, comprising: radiating basal plate 1 and locate radiating fin group 3 on radiating basal plate 1 surface, radiating fin group 3 includes: the first fin group is obliquely arranged at a first preset angle with the surface of the radiating base plate 1 and comprises a plurality of first radiating fins; the second fin group is obliquely arranged at a second preset angle with the surface of the radiating base plate 1 and comprises a plurality of second radiating fins, and the first fin group and the second fin group are oppositely arranged; refrigerant working media 10 are filled in the first radiating fins and the second radiating fins; a vertical air channel 7 is arranged between the first fin group and the second fin group, and the bottoms of the first radiating fins and the bottoms of the corresponding second radiating fins are not on the same horizontal line.
In one embodiment, the first fin group and the second fin group may be configured as a same device for easy manufacturing. Therefore, the first preset angle and the second preset angle are the same, the interval between the adjacent first radiating fins is the same as the interval between the adjacent second radiating fins, and the shape and the structure of the first radiating fins are the same as those of the second radiating fins.
It should be noted that, here, the first fin group and the second fin group are arranged oppositely, the first preset angle and the second preset angle are the same, the interval between the adjacent first fins is the same as the interval between the adjacent second fins, the first fins and the second fins are the same in shape and structure, and the refrigerant working medium 10 is filled in both the first fins and the second fins, which means that the shape, structure and size of the first fin group and the second fins are completely the same, and the first fins and the second fins are arranged correspondingly to the vertical air channel 7, however, the bottoms of the first fins and the bottoms of the corresponding second fins are not on the same horizontal line, which means that the first fin group and the second fins are arranged alternately, that is, the first fin group can be moved upward partially relative to the second fin group, so that the first fins and the corresponding second fins are dislocated, and finally, the cold air can be effectively promoted to enter the radiator and the hot air flows out of the radiator, and a chimney effect is formed, so that the integral heat exchange efficiency of the radiator is effectively improved.
In the actual application process, the shapes, sizes, structures, positions, materials and the like of the heat dissipation substrate 1, the preset angle, the first fin group, the second fin group and the like can be determined according to actual conditions and actual requirements.
It should be noted that, in this document, the first fin group and the first fin group, and the first heat dissipation fin and the second heat dissipation fin are mentioned, where the first and the second are only for distinguishing the difference of the positions, and are not in sequence.
In addition, it should be further explained that, in the heat sink provided by the present invention, the solid heat dissipation fin 5 formed by combining the original single solid material or multiple solid materials such as metal, alloy, and graphene replaces a high thermal conductivity heat dissipation unit which is composed of a solid material and a refrigerant working medium 10 and has a phase change process inside, such as a soaking plate, an inflation plate, and a thermosyphon plate. This device is through improving radiating fin 5's heat conductivility, and the better heat with heating element 2 is transmitted to whole radiating fin group 3 from radiating substrate 1 to improve the whole heat exchange efficiency of radiator.
In addition, the refrigerant working medium 10 inside the high heat conduction radiating unit in the radiating fin 5 is condensed, refluxed and evaporated by means of gravity. However, if the heat dissipation fins 5 are vertically installed according to the conventional heat sink, the upper half fins of the heat dissipation fins 5 cannot contact the refrigerant working medium 10, and the phase change process of the refrigerant working medium 10 cannot be utilized to improve the heat conductivity coefficient, so that the temperature distribution of the whole heat dissipation fins 5 is very uneven, the upper half fins can only conduct heat conduction and exchange through the solid material of the shell 8, and the bottom fins are immersed by the refrigerant working medium 10 all the time, only the liquid refrigerant working medium 10 exists, and the phase change reaction heat exchange cannot be conducted, and finally the heat exchange efficiency of the heat dissipation fins 5 is also seriously affected.
However, according to the radiator provided by the invention, the radiating fins 5 are obliquely arranged on the radiating base plate 1 at a certain angle, so that the effective length of the wetting area inside each radiating fin 5 is effectively increased, the two-phase heat exchange process can be carried out even on the upper half part of each fin under the same filling amount of the refrigerant working medium 10, the part with the bottom completely immersed is reduced, and the heat exchange capacity of each position of each radiating fin 5 can be well improved through the improvement, so that the heat exchange efficiency of each radiating fin 5 is improved.
In addition, the two groups of staggered oblique radiating fin groups 6 and various air channels between the two groups of oblique radiating fin groups 6 can effectively promote cold air to enter the radiator and hot air to flow out of the radiator, and a chimney effect is formed, so that the overall heat exchange efficiency of the radiator is effectively improved.
The present invention also provides a communication device, comprising: heating element 2 and the radiator of any preceding item, the radiator is connected with heating element 2 to heat dissipation to heating element 2. For the structure of other parts of the communication device, please refer to the prior art, which is not described herein again.
In addition, it should be noted that the directions or positional relationships indicated by "vertical", "oblique", "up", and the like in the present application are based on the directions or positional relationships shown in the drawings, and are only for the convenience of simplifying the description and facilitating the understanding, but do not indicate or imply that the indicated device or element must have a specific direction, be configured and operated in a specific direction, and thus, should not be construed as limiting the present invention.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. Any combination of all embodiments provided by the present invention is within the scope of the present invention, and will not be described herein.
The heat sink and the communication device provided by the present invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A heat sink, comprising: the heat radiating base plate (1) and locate radiating fin group (3) on radiating base plate (1) surface, its characterized in that, radiating fin group (3) are including two sets of relative slant radiating fin group (6) that set up, and are two sets of be equipped with vertical air channel (7) in the middle of slant radiating fin group (6), every slant radiating fin group (6) all include radiating fin (5) of a plurality of slopes, and are two sets of slant radiating fin group (6) form open V-arrangement between radiating fin (5), radiating fin (5) inside packing has refrigerant working medium (10).
2. A radiator according to claim 1, characterised in that the two sets of diagonal fin elements (6) are staggered with respect to each other so as to agitate the updraft in the vertical air channels (7).
3. The heat sink according to claim 2, wherein the two sets of diagonal fins (6) are identical in structure, and the fins (5) are heat spreader plates, or air-blown plates, or thermosyphon plates.
4. A radiator according to claim 3, wherein adjacent fins (5) in the same diagonal fin group (6) are parallel to each other and equally spaced.
5. Radiator according to any one of claims 1 to 4, characterised in that a space channel (9) for filling said coolant medium (10) is provided in said fin (5), said space channel (9) comprising a passage formed by sheet metal brazing or by means of blowing.
6. A heat sink according to claim 5, characterised in that the casing (8) of the heat dissipating fins (5) comprises a piece of a highly heat conducting material.
7. Heat sink according to any of claims 1 to 4, characterised in that the heat sink fins (5) are smooth surfaced sheet fins or corrugated fins or grooved fins.
8. A heat sink according to any one of claims 1 to 4, characterised in that the fins (5) are inclined at an angle of 30 ° to 60 ° to the horizontal.
9. A heat sink, comprising: radiating basal plate (1) with locate radiating fin group (3) on radiating basal plate (1) surface, its characterized in that, radiating fin group (3) include:
the first fin group is obliquely arranged at a first preset angle with the surface of the radiating base plate (1) and comprises a plurality of first radiating fins; the second fin group is obliquely arranged at a second preset angle with the surface of the radiating base plate (1), the second fin group comprises a plurality of second radiating fins, and the first fin group and the second fin group are oppositely arranged;
refrigerant working media (10) are filled in the first radiating fins and the second radiating fins;
a vertical air channel (7) is arranged between the first fin group and the second fin group, and the bottoms of the first radiating fins and the bottoms of the corresponding second radiating fins are not on the same horizontal line.
10. A communication device, comprising: a heat sink as claimed in any one of the preceding claims 1 to 9 and a heat generating component (2), the heat sink being connected to the heat generating component (2) for dissipating heat from the heat generating component (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010309564.9A CN113543575A (en) | 2020-04-21 | 2020-04-21 | Radiator and communication equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010309564.9A CN113543575A (en) | 2020-04-21 | 2020-04-21 | Radiator and communication equipment |
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| CN113543575A true CN113543575A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010309564.9A Pending CN113543575A (en) | 2020-04-21 | 2020-04-21 | Radiator and communication equipment |
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| CN114383216A (en) * | 2022-01-14 | 2022-04-22 | 珠海格力电器股份有限公司 | Radiating assembly, heating device and air conditioner |
| WO2023226445A1 (en) * | 2022-05-27 | 2023-11-30 | 中兴通讯股份有限公司 | Heat dissipator and communication device |
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