CN210900093U

CN210900093U - Fin radiator

Info

Publication number: CN210900093U
Application number: CN201921061132.XU
Authority: CN
Inventors: 林群耀
Original assignee: Guangzhou Longhui Electronic Technology Co ltd
Current assignee: Guangzhou Longhui Electronic Technology Co ltd
Priority date: 2019-07-08
Filing date: 2019-07-08
Publication date: 2020-06-30
Anticipated expiration: 2029-07-08

Abstract

The utility model discloses a fin radiator, which comprises a shell and a bottom plate, wherein the shell is provided with a cooling fan, the bottom plate is provided with a mounting port, the shell is internally provided with a cooling fin group, a heat conducting plate and a plurality of heat conducting pipes, the heat conducting plate is arranged on the mounting port, and the cooling fin group is provided with a plurality of heat conducting pipe channels; the heat conduction pipe comprises a first section of heat conduction pipe and a second section of heat conduction pipe, wherein the first section of heat conduction pipe is connected with the radiating fin group through a heat conduction pipe channel, and the second section of heat conduction pipe is connected with the heat conduction plate; the radiating fin group comprises a plurality of radiating fins which are arranged in parallel at intervals, vertical fin channels are formed between every two adjacent radiating fins, the radiating fins are provided with a plurality of air holes communicated with the vertical fin channels, the air holes of the radiating fins are connected to form a transverse air flow channel, and the transverse air flow channel is perpendicular to the vertical fin channels. The fin heat sink can maintain the heat transfer rate between the heat dissipating fins and the air at a high level.

Description

Fin radiator

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a fin radiator.

Background

With the requirement of high-speed data processing, the chip is continuously improved in manufacturing and design, so that the function and speed of the chip are increasingly strong, and meanwhile, the working voltage and the working frequency are relatively increased, so that the heating power of the CPU is greatly improved, and the normal operation of the CPU is influenced by the overhigh working temperature, so that the good heat dissipation device is an indispensable necessary device in a computer system. With the continuous progress of CPU technology, the heat dissipation device needs to be improved continuously to achieve the required heat dissipation effect.

The heat sink comprises a body and a plurality of heat dissipation fins arranged on the body, wherein the body of the heat sink is attached to the CPU, the heat energy of the CPU is transferred to the heat dissipation fins by the body, the heat dissipation area is increased by the design of the heat dissipation fins, the heat dissipation fan is arranged on the heat dissipation fins, and the heat dissipation fan provides wind power to blow to the heat dissipation fins, so that the heat dissipation fins exchange heat with the outside air, and the purpose of heat dissipation is achieved.

When fan airflow of a traditional radiator is stably developed in a straight vertical fin channel, the temperature gradient is reduced along with the increase of the traveling distance of the airflow, the smaller temperature gradient represents that a thermal boundary layer is thicker, namely the thermal boundary layer of air is gradually thickened, the efficiency of heat transferred from a radiating fin to the air is reduced, namely the efficiency of heat transferred from the radiating fin to the air is gradually reduced, and the radiating effect is not obvious.

SUMMERY OF THE UTILITY MODEL

In order to overcome the deficiencies of the prior art, the present invention provides a fin heat sink which can maintain the heat transfer rate between the heat sink fins and the air at a high level.

The purpose of the utility model is realized by adopting the following technical scheme:

the fin radiator comprises a shell and a bottom plate arranged at the bottom of the shell, wherein a radiating fan used for accelerating air flow is arranged on the shell, an installation opening is formed in the bottom plate, a radiating fin group, a heat conducting plate and a plurality of heat conducting pipes are arranged in the shell, and the heat conducting pipe channels are arranged on the radiating fin group; the heat conduction pipe comprises a first section of heat conduction pipe and a second section of heat conduction pipe, wherein the first section of heat conduction pipe is connected with the radiating fin group through a heat conduction pipe channel, the second section of heat conduction pipe is connected with the heat conduction plate, and the first section of heat conduction pipe is communicated with the second section of heat conduction pipe; the radiating fin group comprises a plurality of radiating fins arranged in parallel at intervals, vertical fin channels are formed between every two adjacent radiating fins, the radiating fins are provided with a plurality of air holes communicated with the vertical fin channels, the air holes of the radiating fins are connected to form a transverse air flow channel, and the transverse air flow channel is perpendicular to the vertical fin channels.

Further, the transverse airflow passage is disposed adjacent to the heat-conducting tube passage.

Further, the cross section of the air hole is in a parallelogram shape or a rectangle shape.

Further, a plurality of the air holes are arranged in a rectangular array.

Further, the sizes of the air holes are the same or different.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a fin radiator is through increasing behind the horizontal airflow channel on cooling fin group, and the air current as radiator fan follows vertical fin passageway through horizontal airflow channel, and the stable development condition of air current is destroyed, and the thermal boundary layer of air can be destroyed, and the thermal boundary layer can attenuation gradually promptly for the heat is easier by cooling fin transmission to air, makes cooling fin and external air's heat transfer rate maintain at higher level like this, so can promote the radiating effect of radiator.

Drawings

Fig. 1 is an overall schematic view of a fin radiator according to the present invention;

fig. 2 is an exploded schematic view of a fin radiator according to the present invention;

fig. 3 is a schematic view of a heat pipe and a heat dissipating fin set of a fin heat sink according to the present invention;

fig. 4 is a schematic view of a heat dissipation fin of a fin heat sink according to the present invention.

In the figure: 1. a housing; 2. a base plate; 20. an installation port; 3. a heat radiation fan; 4. a heat-dissipating fin group; 40. heat dissipation fins; 401. air holes; 402. a heat conduction pipe through hole; 41. a transverse airflow channel; 5. a heat conducting pipe; 6. a heat conducting plate.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "vertical", "top", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "one," "another," and the like are used to distinguish similar elements, and these terms and other similar terms are not intended to limit the scope of the present invention.

In the description of the present invention, it should be noted that unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. Corresponding reference numerals are used throughout the figures to indicate corresponding or corresponding elements (e.g., elements identified as "1 XX" and "2 XX" are structurally identical and functionally similar).

As shown in fig. 1-4, for the present invention, the fin radiator includes a housing 1 and a bottom plate 2 disposed at the bottom of the housing 1, a heat dissipation fan 3 for accelerating air flow is disposed on the housing 1, a mounting opening 20 is disposed on the bottom plate 2, a heat dissipation fin set 4, a heat conduction plate 6 disposed on the mounting opening 20, and a plurality of heat conduction pipes 5 are disposed in the housing 1, and a plurality of heat conduction pipe channels are disposed on the heat dissipation fin set 4; the heat conduction pipe 5 comprises a first section of heat conduction pipe connected with the radiating fin group 4 through a heat conduction pipe channel and a second section of heat conduction pipe connected with the heat conduction plate 6, and the first section of heat conduction pipe is communicated with the second section of heat conduction pipe; the heat dissipation fin group 4 includes a plurality of heat dissipation fins 40 arranged in parallel at intervals, a vertical fin channel is formed between adjacent heat dissipation fins 40, the heat dissipation fins 40 are provided with a plurality of air holes 401 communicated with the vertical fin channel, the air holes 401 of the plurality of heat dissipation fins 40 are connected to form a transverse air flow channel 41, and the transverse air flow channel 41 is perpendicular to the vertical fin channel.

In this embodiment, the utility model discloses a radiator is through increasing behind the horizontal airflow channel 41 on cooling fin group 4, when cooling fan 3's air current from vertical fin passageway through horizontal airflow channel 41, the steady development condition of air current is destroyed, the thermal boundary layer that becomes thick gradually like this can be destroyed by horizontal airflow channel 41, the thermal boundary layer can become thin gradually promptly, make the heat transmit to the air by cooling fin 40 more easily, make cooling fin 40 and external air's heat transfer rate maintain at higher level like this, so can promote the radiating effect of radiator.

It should be noted that the heat dissipating fin has a plurality of heat conducting pipe through holes 402, and the plurality of heat conducting pipe through holes 402 are connected to form a heat conducting pipe channel. The fin radiator of the utility model is arranged on the surface of a heat radiating object through the bottom plate 2, and particularly the heat conducting plate 6 is connected with the heat radiating object. The heat-dissipating object transfers its own heat to the heat-conducting plate 6, and the heat-conducting plate 6 transfers the heat to the second section of heat-conducting pipe connected thereto. In the embodiment, the inside of the heat pipe 5 is provided with a coolant, the coolant is a copper powder layer sintered on the inner wall of the heat pipe 5 and a cooling liquid filled in the heat pipe 5, when heat is transferred to the second section of heat pipe, the cooling liquid in the second section of heat pipe is vaporized into gas, and water vapor attaches to the copper powder layer and moves to the first section of heat pipe with lower temperature. The temperature of the first section of heat conduction pipe is relatively low, at this time, the gas is liquefied and converted into liquid and simultaneously emits heat, the heat is transferred to the heat dissipation fins 40 connected with the first section of heat conduction pipe through the first section of heat conduction pipe, the heat dissipation fins 40 rapidly dissipate the heat under the action of the heat dissipation fan 3, the cooling liquid flows back to the second section of heat conduction pipe again, and the steps are repeated, so that the effect of dissipating the heat of a heat dissipation object is achieved.

In a preferred embodiment, the transverse air flow channel 41 is arranged adjacent to the heat conducting tube channel. Thus, the heat dissipation effect can be further improved.

In a preferred embodiment, the cross-sectional shape of the air hole 401 is a parallelogram or a rectangle. Of course, the shape of the air hole 401 may be other shapes, such as a hexagon, an octagon, etc., but not limited thereto.

In a preferred embodiment, the plurality of air holes 401 are arranged in a rectangular array. Of course, the plurality of air holes 401 may also be arranged in a circular array, but not limited thereto.

In a preferred embodiment, the pores 401 are the same size or different sizes. The size of the air holes 401 is set according to actual needs.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. The fin radiator comprises a shell and a bottom plate arranged at the bottom of the shell, wherein a radiating fan used for accelerating air flow is arranged on the shell, an installation opening is formed in the bottom plate, a radiating fin group, a heat conducting plate and a plurality of heat conducting pipes are arranged in the shell, and the heat conducting pipe channels are arranged on the radiating fin group; the heat conduction pipe comprises a first section of heat conduction pipe and a second section of heat conduction pipe, wherein the first section of heat conduction pipe is connected with the radiating fin group through a heat conduction pipe channel, the second section of heat conduction pipe is connected with the heat conduction plate, and the first section of heat conduction pipe is communicated with the second section of heat conduction pipe; the heat dissipation structure is characterized in that the heat dissipation fin group comprises a plurality of heat dissipation fins arranged in parallel at intervals, vertical fin channels are formed between every two adjacent heat dissipation fins, the heat dissipation fins are provided with a plurality of air holes communicated with the vertical fin channels, the air holes of the heat dissipation fins are connected to form a transverse air flow channel, and the transverse air flow channel is perpendicular to the vertical fin channels.

2. The finned heat sink of claim 1, wherein said transverse air flow passages are disposed adjacent said heat conducting tube passages.

3. The finned heat sink of claim 1, wherein the cross-sectional shape of said air holes is a parallelogram or a rectangle.

4. The finned heat sink of claim 1, wherein a plurality of said air holes are arranged in a rectangular array.

5. The finned heat sink of claim 1, wherein each of said air holes is the same or different size.