CN210349818U

CN210349818U - Low flow resistance fin radiator

Info

Publication number: CN210349818U
Application number: CN201921060804.5U
Authority: CN
Inventors: 林群耀
Original assignee: Guangzhou Longhui Electronic Technology Co ltd
Current assignee: Guangzhou Longhui Electronic Technology Co ltd
Priority date: 2019-07-08
Filing date: 2019-07-08
Publication date: 2020-04-17
Anticipated expiration: 2029-07-08

Abstract

The utility model discloses a low flow resistance fin radiator, which comprises a shell and a bottom plate, wherein a radiating fan is arranged above the shell, a mounting opening is arranged on the bottom plate, a radiating fin group, a heat conducting plate and a plurality of heat conducting pipes are arranged in the shell, and the heat conducting plate and the plurality of heat conducting pipes are arranged on the mounting opening; the heat conduction pipe comprises a first section of heat conduction pipe connected with the radiating fin group through a first heat conduction pipe channel and a second section of heat conduction pipe connected with the heat conduction plate, and the first section of heat conduction pipe is communicated with the second section of heat conduction pipe; the radiating fin group comprises a plurality of radiating fins arranged in parallel at intervals, fin channels are formed between every two adjacent radiating fins, a first notch is arranged at a corresponding position on one side of each radiating fin, the opening of each first notch faces to the upper surface of the base plate, the first notches of the plurality of radiating fins are connected and combined into an airflow channel, and the airflow channel is perpendicular to the fin channels. The low flow resistance fin radiator can reduce the system impedance and improve the radiating effect.

Description

Low flow resistance fin radiator

Technical Field

The utility model relates to a radiator technical field especially relates to a low flow resistance fin radiator.

Background

With the requirement of high-speed data processing, the chip is continuously improved in manufacturing and design, so that the function and speed of the chip are increasingly strong, and meanwhile, the working voltage and the working frequency are relatively increased, so that the heating power of the CPU is greatly improved, and the normal operation of the CPU is influenced by the overhigh working temperature, so that the good heat dissipation device is an indispensable necessary device in a computer system. With the continuous progress of CPU technology, the heat dissipation device needs to be improved continuously to achieve the required heat dissipation effect.

The heat sink comprises a body and a plurality of heat dissipation fins arranged on the body, wherein the body of the heat sink is attached to the CPU, the heat energy of the CPU is transferred to the heat dissipation fins by the body, the heat dissipation area is increased by the design of the heat dissipation fins, the heat dissipation fan is arranged on the heat dissipation fins, and the heat dissipation fan provides wind power to blow to the heat dissipation fins, so that the heat dissipation fins exchange heat with the outside air, and the purpose of heat dissipation is achieved.

The bottom of the traditional radiating fin is completely contacted with the body, when the fan airflow passes through the fin channel, the body below the radiating fin can block the airflow movement, and the airflows of two adjacent fans can interfere with each other at the joint of the fin and the body to form larger system impedance, thereby affecting the radiating effect of the radiator.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a low flow resistance fin radiator which can reduce the system impedance and improve the radiating effect.

The purpose of the utility model is realized by adopting the following technical scheme:

a low flow resistance fin radiator comprises a shell and a bottom plate arranged at the bottom of the shell, wherein a radiating fan used for accelerating air flow is arranged above the shell, a mounting opening is formed in the bottom plate, a radiating fin group, a heat conducting plate and a plurality of heat conducting pipes are arranged in the shell, and the heat conducting plate and the plurality of heat conducting pipes are arranged on the mounting opening; the heat conduction pipe comprises a first section of heat conduction pipe and a second section of heat conduction pipe, wherein the first section of heat conduction pipe is connected with the radiating fin group through a first heat conduction pipe channel; the radiating fin group comprises a plurality of radiating fins arranged in parallel at intervals, fin channels are formed between every two adjacent radiating fins, a first notch is arranged at a position corresponding to one side edge of each radiating fin, the opening of each first notch faces the upper surface of the base plate, the first notches of the plurality of radiating fins are connected and combined to form an airflow channel, and the airflow channel is perpendicular to the fin channels.

Further, the cross section of the first notch is trapezoidal.

Furthermore, a second notch is arranged at a position corresponding to one side of each heat dissipation fin, the second notches of the heat dissipation fins are connected to form a second heat conduction pipe channel, and the second section of heat conduction pipe penetrates through the second heat conduction pipe channel to be connected with the heat conduction plate.

Further, the cross section of the second notch is square.

Furthermore, the number of the first gaps is two, and the two first gaps are respectively arranged on two sides of the second gap.

Further, the heat conduction pipes are provided with four.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a low flow resistance fin radiator is through increasing first breach in heat radiation fin and bottom plate junction for the air current that radiator fan produced can smoothly pass through fin passageway, airflow channel discharge in proper order, and then reduces system impedance, improves the amount of wind that radiator fan changes, so promotes the performance of radiator.

Drawings

Fig. 1 is an overall schematic view of a low flow resistance fin heat sink according to the present invention;

fig. 2 is an exploded schematic view of a low flow resistance fin heat sink according to the present invention;

fig. 3 is a front view of a heat sink fin of a low flow resistance fin heat sink according to the present invention;

fig. 4 is an assembly schematic view of a cooling fin set and a cooling fan of a low flow resistance fin radiator according to the present invention.

In the figure: 1. a housing; 2. a base plate; 20. an installation port; 3. a heat radiation fan; 4. a heat-dissipating fin group; 40. heat dissipation fins; 401. a first notch; 402. a second notch; 41. a first heat-conducting tube channel; 42. an air flow channel; 43. a second heat-conducting tube channel; 5. a heat conducting pipe; 50. a first section of heat conduction pipe; 51. a second section of heat conduction pipe; 6. a heat conducting plate.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "vertical", "top", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "one," "another," and the like are used to distinguish similar elements, and these terms and other similar terms are not intended to limit the scope of the present invention.

In the description of the present invention, it should be noted that unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. Corresponding reference numerals are used throughout the figures to indicate corresponding or corresponding elements (e.g., elements identified as "1 XX" and "2 XX" are structurally identical and functionally similar).

As shown in fig. 1-4, for the present invention provides a low flow resistance fin radiator, which includes a housing 1 and a bottom plate 2 disposed at the bottom of the housing 1, a heat dissipation fan 3 for accelerating air flow is disposed above the housing 1, a mounting opening 20 is disposed on the bottom plate 2, a heat dissipation fin set 4, a heat conduction plate 6 disposed on the mounting opening 20, and a plurality of heat conduction pipes 5 forming a circulation loop are disposed in the housing 1, and a plurality of first heat conduction pipe channels 41 are disposed on the heat dissipation fin set 4; the heat conduction pipe 5 comprises a first section of heat conduction pipe 50 connected with the radiating fin group 4 through a first heat conduction pipe channel 41 and a second section of heat conduction pipe 51 connected with the heat conduction plate 6, and the first section of heat conduction pipe 50 is communicated with the second section of heat conduction pipe 51; the heat dissipation fin group 4 includes a plurality of heat dissipation fins 40 arranged in parallel at intervals, a fin channel is formed between adjacent heat dissipation fins 40, a first notch 401 is arranged at a position corresponding to one side of each heat dissipation fin 40, an opening of the first notch 401 faces the upper surface of the base plate 2, the first notches 401 of the plurality of heat dissipation fins 40 are connected to form an airflow channel 42, and the airflow channel 42 is perpendicular to the fin channel.

In this embodiment, the utility model discloses a low flow resistance fin radiator is through increasing first breach 401 at cooling fin 40 and bottom plate 2 junction for the air current that radiator fan 3 produced can smoothly pass through fin passageway, airflow channel 42 discharge in proper order, and then reduce system impedance, improves the amount of wind of homotypic radiator fan 3 under with the rotational speed, so promotes the performance of radiator.

It should be noted that the heat sink of the present invention is disposed on the surface of the heat dissipating object through the bottom plate 2, and particularly, the heat conducting plate 6 is connected to the heat dissipating object. The heat-dissipating object transfers its own heat to the heat-conducting plate 6, and the heat-conducting plate 6 transfers the heat to the second section of heat-conducting pipe 51 connected thereto. In the embodiment, the heat pipe 5 is provided with a coolant, the coolant is a copper powder layer sintered on the inner wall of the heat pipe 5 and a cooling liquid filled in the heat pipe 5, when heat is transferred to the second section of heat pipe 51, the cooling liquid in the second section of heat pipe 51 is vaporized into gas, and water vapor attaches to the copper powder layer and moves to the first section of heat pipe 50 with lower temperature. The temperature of the first section of heat pipe 50 is relatively low, at this time, the gas is liquefied and converted into liquid and simultaneously emits heat, the heat is transferred to the heat dissipation fins 40 connected with the first section of heat pipe 50 through the first section of heat pipe 50, the heat dissipation fins 40 quickly dissipate the heat under the action of the heat dissipation fan 3, and the cooling liquid flows back to the second section of heat pipe 51, and the above steps are repeated, so that the effect of dissipating heat for a heat dissipating object is achieved.

In a preferred embodiment, the cross-sectional shape of the first notch 401 is a trapezoid. Of course, the cross-sectional shape of the first notch 401 may also be square or other irregular shapes.

In a preferred embodiment, a second notch 402 is formed at a position corresponding to one side of each radiator fin 40, the second notches 402 of a plurality of radiator fins 40 are connected to form a second heat-conducting pipe channel 43, and the second length of heat-conducting pipe 51 passes through the second heat-conducting pipe channel 43 to be connected with the heat-conducting plate 6.

Specifically, the cross-sectional shape of the second notch 402 is a square.

In a preferred embodiment, two first notches 401 are provided, and the two first notches 401 are provided on both sides of the second notch 402. Therefore, the system impedance can be further reduced, the air quantity of the same type fan at the same rotating speed is improved, and the heat dissipation performance of the radiator is improved.

In a preferred embodiment, four heat transfer pipes 5 are provided. Thus, the heat dissipation effect can be enhanced. The heat pipe 5 is made of copper or aluminum, and the heat dissipation fins 40 are made of copper or aluminum, but not limited thereto. The heat conduction pipe 5, the heat conduction plate 6 and the heat dissipation fins 40 are made of materials with small heat resistance and high heat conductivity, which is beneficial to the rapid heat transfer among the heat conduction pipe 5, the heat conduction plate 6 and the heat dissipation fins, thereby improving the efficiency of the heat sink.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A low flow resistance fin radiator comprises a shell and a bottom plate arranged at the bottom of the shell, wherein a radiating fan used for accelerating air flow is arranged above the shell, a mounting opening is formed in the bottom plate, a radiating fin group, a heat conducting plate and a plurality of heat conducting pipes are arranged in the shell, and the heat conducting plate and the plurality of heat conducting pipes are arranged on the mounting opening; the heat conduction pipe comprises a first section of heat conduction pipe and a second section of heat conduction pipe, wherein the first section of heat conduction pipe is connected with the radiating fin group through a first heat conduction pipe channel; the radiating fin set is characterized by comprising a plurality of radiating fins arranged in parallel at intervals, fin channels are formed between every two adjacent radiating fins, a first notch is arranged at a position corresponding to one side edge of each radiating fin, the opening of each first notch faces to the upper surface of the bottom plate, the first notches of the plurality of radiating fins are connected to form an airflow channel, and the airflow channel is perpendicular to the fin channels.

2. The low flow resistance fin heat sink of claim 1, wherein the cross-sectional shape of said first gap is trapezoidal.

3. The low flow resistance fin radiator of claim 1, wherein each of the heat dissipating fins has a second notch at a corresponding position on one side, the second notches of the heat dissipating fins are connected to form a second heat conducting pipe channel, and the second section of heat conducting pipe passes through the second heat conducting pipe channel to connect with the heat conducting plate.

4. The low flow resistance fin heat sink of claim 3, wherein the cross-sectional shape of said second gap is square.

5. The low flow resistance finned heat sink of claim 3, wherein there are two first notches, and two first notches are respectively disposed on two sides of the second notch.

6. The low flow resistance fin heat sink of claim 1, wherein the heat conducting tubes are provided in four strips.