CN214852491U - Heat radiator for electronic equipment - Google Patents
Heat radiator for electronic equipment Download PDFInfo
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- CN214852491U CN214852491U CN202121251174.7U CN202121251174U CN214852491U CN 214852491 U CN214852491 U CN 214852491U CN 202121251174 U CN202121251174 U CN 202121251174U CN 214852491 U CN214852491 U CN 214852491U
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Abstract
The utility model relates to a heat dissipation technical field especially relates to an electronic equipment heat abstractor. The heat dissipation device comprises a heat dissipation shell, at least one heat dissipation component used for absorbing heat of a chip, a heat dissipation fin array, at least one condensation component and a connecting piece provided with an internal cavity, wherein the heat dissipation shell is connected with one surface of the heat dissipation fin array, the condensation component is connected with the other surface of the heat dissipation fin array, the heat dissipation component is arranged on an inner cavity of the heat dissipation shell, a heat dissipation cavity is arranged inside the heat dissipation component, a condensation cavity is arranged inside the condensation component, the connecting piece penetrates through the heat dissipation shell to be communicated with the heat dissipation cavity and the condensation cavity, and a closed-loop heat dissipation loop is formed. The device can separate the gas and the liquid of the internal refrigerant and circulate the internal refrigerant without arranging a capillary structure, and the heat dissipation efficiency is greatly improved.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to an electronic equipment heat abstractor.
Background
Along with the improvement of the integration level of the product, the heat consumption is higher and higher, if the generated heat is not dissipated in time, the temperature of the chip is increased, the efficiency is reduced, the service life is shortened, and even the device fails. Therefore, a device with better heat transfer performance is needed to solve the heat dissipation problem.
The prior art generally adopts an aluminum alloy shell formed by die casting. However, the thermal conductivity of the aluminum alloy material of the die-casting shell is low, the thermal conductivity of the common die-casting aluminum alloy YL102 is only 121W/m.K, AlSi10Mg generally does not exceed 150W/m.K, and even if a material with high thermal conductivity is adopted, 230W/m.K is difficult to exceed. The heat transfer capacity of the housing is therefore greatly limited.
At present, in order to solve the problem that the heat-conducting property of the shell is poor, the blowing plates are embedded on the shell, the heat is conducted quickly through the phase change of a refrigerant in the blowing plates, the shell is provided with cog grooves, the cog grooves need to protrude out of the shell, the weight of the shell is increased, and meanwhile, each shell needs a plurality of blowing plates to be high in cost and low in efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electronic equipment's heat abstractor aims at solving the poor problem of current chip heat dissipation casing heat conductivity.
The utility model provides a heat abstractor of electronic equipment, including heat dissipation casing, at least one be used for absorbing the thermal radiator unit, fin array, at least one condensation subassembly of chip, be equipped with the connecting piece of inside cavity, the heat dissipation casing is connected to the one side of fin array, condensation subassembly is connected to the another side of fin array, radiator unit sets up on the inner chamber of heat dissipation casing, the inside heat dissipation cavity that is equipped with of radiator unit, the inside condensation cavity that is equipped with of condensation subassembly, the connecting piece runs through heat dissipation casing intercommunication heat dissipation cavity and condensation cavity, forms closed loop's heat dissipation return circuit.
As a further improvement of the present invention, the condensation assembly covers the entire fin array, or covers a portion of the fins in the fin array, or is embedded in the fin array.
As a further improvement, the condensation subassembly is platelike structure, whole platelike the inside condensation cavity that is equipped with the intercommunication of condensation subassembly, condensation cavity intercommunication connecting piece forms return circuit, platelike the condensation subassembly covers the one side at the fin array.
As a further improvement of the present invention, the condensing assembly includes at least one condensing substrate, the condensing chamber is defined by at least one condensing substrate, and at least one condensing substrate is provided with a pipeline for communicating the condensing chamber.
As a further improvement of the present invention, the condensing assembly includes a condenser tube, the condenser tube is communicated with the connecting member, the condenser tube is embedded in the cooling fins of the cooling fin array, and the condenser tube constitutes a condensing chamber.
As a further improvement, the condenser pipe includes that the condensation is responsible for, condensation branch pipe, the condensation is responsible for and is alternately communicated, every with condensation branch pipe the condensation branch pipe is embedded in the fin of fin array, condensation branch pipe and fin cross connection, the condensation is responsible for and is communicated with the connecting piece.
As a further improvement of the present invention, the connecting member includes a first connecting member and a second connecting member, the first connecting member communicates the upper side of the heat dissipation chamber, the second connecting member communicates the lower side of the heat dissipation chamber.
As a further improvement of the present invention, the upper side of the heat dissipation chamber and the lower side of the heat dissipation chamber form a height difference.
As a further improvement of the present invention, in the gravity axial direction, the highest point of the heat dissipation chamber is lower than the highest point of the condensation chamber.
The utility model has the advantages that:
(1) the cooling medium is changed from the liquid state to the gas state after the heat dissipation assembly of the heat dissipation device absorbs the heat consumption temperature rise of the chip, then the cooling medium upwards enters the condenser through the connecting piece, and the cooling medium is changed from the gas state to the liquid state due to the lower temperature of the condenser, flows to the lower part under the gravity and then returns to the heat dissipation assembly through the connecting piece. The heat dissipation assembly of the heat dissipation device is equivalent to an evaporation cavity, and the condenser is equivalent to a condensation cavity, so that the gas-liquid separation and circulation of the internal refrigerant can be realized without arranging a capillary structure, and the heat dissipation efficiency is greatly improved.
(2) The condenser on the radiating fin is used as an evaporation cavity, so that the size can be saved, the number of parts is reduced compared with the radiating fin which is completely made of a blowing plate with a refrigerant, the cost is reduced, and the efficiency is improved.
(3) The condenser pipe of the condensation component of the heat dissipation device is embedded into the radiating fins, so that heat can be transmitted to the radiating fins of the heat dissipation shell and then radiated out, meanwhile, the turbulent flow effect is achieved on the air flow of the radiating fins, and the heat dissipation effect of the heat dissipation device is further improved.
Drawings
FIG. 1 is a structural diagram of a heat dissipation device of the present invention;
FIG. 2 is a sectional view of the heat dissipation device of the present invention;
fig. 3 is a schematic structural view of a heat dissipation assembly composed of heat dissipation substrates according to the present invention;
fig. 4 is a sectional view of the structure of the heat dissipating assembly of the present invention composed of heat dissipating substrates;
FIG. 5 is a schematic structural view of the heat dissipation assembly and the heat dissipation body according to the present invention;
FIG. 6 is a schematic view of a heat dissipation housing of the present invention with a certain angle between the heat dissipation fins;
FIG. 7 is a back structure view of the heat dissipating device of the present invention comprising two cover plates of the condensing assembly;
FIG. 8 is a structural diagram of the connection between the main condensing pipe and the branch condensing pipe in the condensing assembly of the present invention;
fig. 9 is a sectional view of the position structure of the condensation branch pipe and the heat sink in the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As fig. 1, fig. 2, the utility model discloses a heat abstractor of electronic equipment includes heat dissipation casing 1, at least one is used for absorbing the thermal radiator unit 2 of chip, fin array 3, at least one condensation subassembly 4, be equipped with the connecting piece 5 of inside cavity, heat dissipation casing 1 is connected to fin array 3's one side, condensation subassembly 4 is connected to fin array 3's another side, radiator unit 2 sets up on heat dissipation casing 1's inner chamber, radiator unit 2 is inside to be equipped with heat dissipation cavity 21, the inside condensation cavity 41 that is equipped with of condensation subassembly 4, the connecting piece runs through heat dissipation casing 1 intercommunication heat dissipation cavity 21 and condensation cavity 41, form closed loop's radiating circuit.
The heat dissipation component 2 is arranged on the front surface of the heat dissipation shell 1, the condensation component 4 is arranged on the heat dissipation fin array 3, namely, one surface of the heat dissipation fin array 3 is used as a condenser, the heat dissipation chamber 21 and the condensation chamber 41 are communicated through the connecting piece 5 to form a closed loop heat dissipation loop, which is equivalent to the surrounding type heat dissipation from the front surface to the back surface around the heat dissipation shell 1 and the heat dissipation fin array 3; the refrigerant is injected into the cavity, the heat of the chip is absorbed by the heat dissipation cavity 21, the refrigerant is gasified and then is sent into the condensation cavity 41 through the connecting piece 5 for condensation and liquefaction, and meanwhile, the heat of the radiating fins can also be dissipated through the condensation component 4. According to the difference of the heat quantity of the position of the heating source in the inner cavity of the heat dissipation shell 1, the heat dissipation assembly can be arranged at the high-heat source, and the key heat source is guaranteed to be better dissipated.
As shown in fig. 1, the highest point of the heat dissipation chamber 21 is lower than the highest point of the condensation chamber 41 in the gravitational axial direction, and preferably, the height of the heat dissipation assembly 2 is not higher than 80% of the volume height of the condensation chamber 41. Therefore, the gas after the refrigerant is gasified has enough rising space and can smoothly enter the condensation chamber 41 to form circulation between the gaseous state and the liquid state of the refrigerant.
As shown in fig. 7, the condensation member 4 covers the entire heat sink array 3, or covers a portion of the heat sinks in the heat sink array 3, or is embedded in the heat sink array 3. The condensation component 4 can selectively cover the area of the heat sink array 3 as required according to the layout range of the heat sink array 3 to adapt to various deformation of the heat sink housing 1.
Namely, the condensation component 4 covers the radiating fin array 3 completely, so that heat can be transferred out through radiating fins in a large area, and the radiating effect is achieved; or according to the specific structure of the radiating fin array 3, the condensing assembly 4 can be covered above part of the radiating fins by utilizing the space on the radiating fins to perform local radiating function; the notch can be arranged on the radiating fin, the condensing assembly 4 is embedded into the radiating fin through the notch, and the heat of the condensing assembly 4 can be directly transmitted out through the radiating fin.
The condensation component 4 is added in the heat dissipation device, so that heat dissipation of the heating source in the inner cavity of the heat dissipation shell 1 is realized in two ways, and one way is that the heat of the heat dissipation shell 1 is directly dissipated through the heat dissipation fins; the other path is that the refrigerant in the heat dissipation component 2 absorbs heat through evaporation, the heat is dissipated from the other surface to the inner cavity of the heat dissipation shell 1, the evaporated and gasified refrigerant enters the condensation component 4 to be cooled into liquid state and then enters the heat dissipation component 2 to be circularly dissipated, the heat dissipated in the condensation cavity 41 can contact with the connecting structure of the radiating fins, and the radiating fins dissipate heat again, so that the double heat dissipation effect on the inner cavity of the heat dissipation shell 1 is achieved.
The condensing assembly 4 is a plate-shaped structure, a communicated condensing cavity 41 is arranged in the whole plate-shaped condensing assembly 4, the condensing cavity 41 is communicated with the connecting piece 5 to form a loop, and the plate-shaped condensing assembly 4 covers one surface of the radiating fin array 3. The plate-shaped condensation assembly 4 can reduce the volume occupation on the original heat dissipation structure, and the cooling effect can be improved by means of the heat dissipation fins without greatly changing the original heat dissipation structure. The plate-shaped condensing assembly 4 may have an integral condensing chamber 41 therein, or may have a spiral pipe arranged therein to form a space through which the liquid refrigerant can flow in a circuitous manner, but the condensing assembly is not limited to the two internal chamber structures, as long as the condensing chamber 41 can cover each fin.
The plate-shaped condensing assembly 4 includes at least one condensing substrate, and the condensing chamber 41 is composed of at least one condensing substrate, wherein at least one condensing substrate is provided with a pipeline communicated with the condensing chamber 41. The condensation chamber 41 may be formed by hollowing out an inner portion of a condensation substrate; or the two condensation substrates can be connected, the two ends of the two condensation substrates are connected, and the middle part of the two condensation substrates is bulged to be used as a cavity for the circulation of a cooling medium; more preferably, three condensation substrates can be spliced, and the condensation substrate arrangement slot position of the middle layer forms a condensation chamber 41, so that the form does not need to adopt a bulging form, and the structure is firmer and more stable; of course, four, five or even more condensing substrates may be used, and one or more condensing substrates may be connected to the condensing chamber 41 through a pipeline. As shown in fig. 5, the condensation unit 4 can be made as a cover plate and riveted on the heat sink array 3, so that the heat can be further conducted to the heat sink through the condensation unit 4, thereby further improving the heat dissipation.
The condensation assembly 4 comprises a condensation pipe which is communicated with the connecting piece 5 and is embedded in the radiating fins of the radiating fin array 3, and the condensation pipe forms a condensation chamber 41. The condenser pipe is a structural style of condensing assembly 4, and can the greatly reduced occupy the heat radiation structure volume in embedding the fin with condensing assembly 4, can divide into following two kinds of forms:
as shown in fig. 8 and 9, the condensation pipe includes a condensation main pipe 42 and a condensation branch pipe 43, the condensation main pipe 42 is in cross communication with a plurality of condensation branch pipes 43, each condensation branch pipe 43 is embedded in a cooling fin of the cooling fin array 3, the condensation branch pipes 43 and the cooling fins are in cross connection to form a grid structure, and the condensation main pipe 42 is in communication with the connecting piece 5. The main condensing pipe 42 receives the gasified refrigerant sent by the connecting piece 5, condenses the gasified refrigerant into a liquid state, and transmits the liquid refrigerant to each branch condensing pipe 43, and each branch condensing pipe 43 transmits heat out by virtue of the connected radiating fins, so that the condensing point is more accurate and has pertinence. Preferably, can set up two condensation in the fin array 3 and be responsible for 42, the both ends of every condensation branch pipe all communicate a condensation and are responsible for, do not increase under the condition of whole volume even, can be responsible for two condensation width designs between 42 for being less than fin array 3, make condensation subassembly 4 can also guarantee sufficient radiating effect under the prerequisite that does not influence original volumetric structure.
The heat dissipation assembly 2 comprises at least one heat dissipation substrate 22, the heat dissipation chamber is composed of at least one heat dissipation substrate 22, and a pipeline communicated with the heat dissipation chamber 21 is arranged on at least one heat dissipation substrate 22. Similarly, the heat dissipation chamber 21 may be formed by hollowing out the interior of a heat dissipation substrate 22; or two heat dissipation substrates 22 can be connected, two ends of the two heat dissipation substrates 22 are connected, and the middle part of the two heat dissipation substrates 22 is bulged to be used as a cavity for the circulation of cooling media; preferably, three radiating substrates 22 can be spliced, and the radiating substrate 22 in the middle layer is provided with a slot to form a radiating chamber 21, so that the form of bulging is not needed, and the structure is firmer and more stable; of course, four, five or even more heat dissipation substrates 22 may be used, and one or more of the heat dissipation substrates 22 may be provided with a pipeline to communicate with the heat dissipation chamber 21.
The utility model discloses a heat abstractor can divide into following three kinds of embodiments and carry out the structure to found:
the first embodiment is as follows:
referring to fig. 3 and 4, in the heat dissipation device, a groove is formed in an inner cavity of a heat dissipation housing 1, a heat dissipation assembly 2 is connected in the groove in the inner cavity of the heat dissipation housing 1, the heat dissipation assembly 2 is composed of two heat dissipation substrates 22, and a heat dissipation chamber 21 is defined by the two heat dissipation substrates 22. The heat dissipation assembly 2 is attached to the groove of the inner cavity of the heat dissipation housing 1 through an interface material such as heat conductive silicone grease.
As shown in fig. 6, the heat sink array 3 is disposed on the back surface of the heat sink housing 1, and the left and right heat sinks form a certain angle therebetween. The fin array 3 is manufactured by die casting together with the heat radiating case 1. The cooling fin array 3 on the back of the heat dissipation shell 1 is provided with a condensation component 4, the condensation component 4 is composed of two condensation substrates, at least one condensation substrate is provided with a pipeline, and two plate bodies define a condensation chamber 41.
The connecting piece 5 penetrates through the heat dissipation shell 1 to communicate the condensation chamber 41 of the condensation assembly 4 with the heat dissipation chamber 21 of the heat dissipation assembly 2 on the inner cavity of the heat dissipation shell 1. The connecting piece 5 consists of a first connecting piece and a second connecting piece, the connecting point of the first connecting piece and the heat dissipation component 2 is arranged on the upper side of the heat dissipation component 2, and the connecting point of the second connecting piece and the heat dissipation component 2 is arranged on the lower side of the heat dissipation component 2; the condensation components 4 of the two plate bodies are riveted on the radiating fin array 3. The height difference is formed between the upper side of the heat dissipation chamber 21 and the lower side of the heat dissipation chamber 21, after the refrigerant absorbs heat, evaporates and gasifies, a rising channel is needed to transmit the gaseous refrigerant to the condensation cavity 41, the upper end of the heat dissipation chamber 21 is higher than the lower end of the heat dissipation chamber 21 in the gravity direction, so that the gaseous refrigerant can move to the upper end of the heat dissipation chamber 21, and the refrigerant can flow and circulate in the heat dissipation chamber 21 to a greater degree.
Example two:
on the basis of the embodiment, like fig. 8, fig. 9, condensation assembly 4 is the condenser pipe structure, and the condenser pipe divide into condensation person in charge 42 and condensation branch pipe 43, and condensation person in charge 42 can be for the pipe, condensation branch pipe 43 can be flat pipe, and condensation assembly 4 is that the interior hollow flat pipe of pipe and section bar is whole to be brazed and is formed, and the cavity of cavity and flat pipe in the pipe communicates each other, has defined condensation chamber 41. The two sides of the condensation component 4 are also respectively connected with a first connecting piece and a second connecting piece, the second connecting piece is communicated with the first connecting piece, and the heat dissipation chamber 21 of the heat dissipation component 2 is communicated with the condensation chamber 41 of the condensation component 4; the flat tubes of the condensation assembly 4 are embedded in the heat sink.
Example three:
as shown in fig. 4 and 7, a groove is provided on the inner cavity of the heat dissipation housing 1, two heat dissipation assemblies 2 are provided on the inner cavity of the heat dissipation housing 1, the heat dissipation assemblies 2 may also be composed of three heat dissipation substrates 22, and the heat dissipation chamber 21 of the heat dissipation assembly 2 is provided on the middle heat dissipation substrate 22. The heat dissipation component 2 is attached to the groove of the inner cavity of the heat dissipation shell 1 through interface materials such as heat-conducting silicone grease;
the back of the heat dissipation shell 1 is provided with a heat dissipation fin array 3, and the left and right heat dissipation fins form a certain angle. The radiating fin array and the shell are manufactured in a die casting mode.
The cooling fin array 3 on the back of the shell is provided with two condensation components 4, each condensation component 4 is composed of two condensation substrates, at least one condensation substrate is provided with a pipeline, and the two condensation substrates define a condensation chamber 41. The condensation member 4 is riveted to the fin array 3.
The two connectors 5 communicate the heat dissipation chamber 21 of each heat dissipation assembly 2 with the condensation chamber 41 of the condensation assembly 4. The connecting piece 5 is composed of a first connecting piece and a second connecting piece, the connecting point of the first connecting piece and the heat dissipation assembly 2 is arranged on the upper side of the heat dissipation assembly 2, and the connecting point of the second connecting piece and the heat dissipation assembly 2 is arranged on the lower side of the heat dissipation assembly 2.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (9)
1. The utility model provides an electronic equipment's heat abstractor, its characterized in that, is used for absorbing the thermal radiator unit, fin array, at least one condensation subassembly of chip, the connecting piece that is equipped with inside cavity including radiating shell, at least one, the radiating shell is connected to the one side of fin array, condensation subassembly is connected to the another side of fin array, radiator unit sets up on radiating shell's inner chamber, the inside heat dissipation cavity that is equipped with of radiator unit, the inside condensation cavity that is equipped with of condensation subassembly, the connecting piece runs through radiating shell intercommunication heat dissipation cavity and condensation cavity, forms closed loop's heat dissipation return circuit.
2. The heat dissipation device of claim 1, wherein the condensation component covers the entire heat sink array, or covers a portion of the heat sinks in the heat sink array, or is embedded in the heat sink array.
3. The heat dissipating device of an electronic device according to claim 1, wherein the condensing assembly is a plate-shaped structure, a communicating condensing cavity is disposed inside the entire plate-shaped condensing assembly, the condensing cavity communicates with the connecting member to form a loop, and the plate-shaped condensing assembly covers one surface of the heat dissipating fin array.
4. The heat dissipating device of claim 3, wherein the plate-shaped condensing assembly comprises at least one condensing substrate, the condensing chamber is defined by the at least one condensing substrate, and a pipe is disposed on the at least one condensing substrate and connected to the condensing chamber.
5. The heat dissipating device of an electronic device of claim 1, wherein the condensing assembly comprises a condenser tube in communication with the connector, the condenser tube embedded in the fins of the array of fins, the condenser tube forming a condensing chamber.
6. The heat dissipating device for electronic equipment according to claim 5, wherein the condensation pipe comprises a main condensation pipe and branch condensation pipes, the main condensation pipe is in cross communication with the branch condensation pipes, each branch condensation pipe is embedded in a heat sink of the heat sink array, the branch condensation pipe is in cross connection with the heat sink, and the main condensation pipe is in communication with the connecting member.
7. The heat dissipating device of an electronic apparatus according to claim 1, wherein the connecting member comprises a first connecting member and a second connecting member, the first connecting member communicates with an upper side of the heat dissipating chamber, and the second connecting member communicates with a lower side of the heat dissipating chamber.
8. The heat dissipating device for electronic equipment according to claim 7, wherein the upper side of the heat dissipating chamber and the lower side of the heat dissipating chamber form a height difference.
9. The heat dissipating device of an electronic apparatus according to claim 1, wherein a highest point of the heat dissipating chamber is lower than a highest point of the condensing chamber in a gravitational axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121251174.7U CN214852491U (en) | 2021-06-04 | 2021-06-04 | Heat radiator for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121251174.7U CN214852491U (en) | 2021-06-04 | 2021-06-04 | Heat radiator for electronic equipment |
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| Publication Number | Publication Date |
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| CN214852491U true CN214852491U (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121251174.7U Active CN214852491U (en) | 2021-06-04 | 2021-06-04 | Heat radiator for electronic equipment |
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| CN (1) | CN214852491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347856A (en) * | 2021-06-04 | 2021-09-03 | 深圳市纵鑫热传科技有限公司 | Heat radiator for electronic equipment |
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2021
- 2021-06-04 CN CN202121251174.7U patent/CN214852491U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347856A (en) * | 2021-06-04 | 2021-09-03 | 深圳市纵鑫热传科技有限公司 | Heat radiator for electronic equipment |
| CN113347856B (en) * | 2021-06-04 | 2022-12-13 | 深圳市纵鑫热传科技有限公司 | Heat radiator for electronic equipment |
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