CN207674759U - A kind of semiconductor cooling device - Google Patents
A kind of semiconductor cooling device Download PDFInfo
- Publication number
- CN207674759U CN207674759U CN201721868716.9U CN201721868716U CN207674759U CN 207674759 U CN207674759 U CN 207674759U CN 201721868716 U CN201721868716 U CN 201721868716U CN 207674759 U CN207674759 U CN 207674759U
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- heat
- sink unit
- radiating fin
- cooling device
- semiconductor
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of semiconductor cooling device, including cooling assembly, the cooling assembly includes semiconductor chilling plate, and the heat-sink unit for exchanging heat to semiconductor chilling plate and heat absorbing units, and the heat-sink unit includes radiating fin, it is characterised in that：The radiating fin surrounds annular, and accommodating cavity is formed among the annular region that the radiating fin surrounds, and the heat-sink unit further includes that wind turbine in accommodating cavity, exchanging heat for active is arranged.By using accommodating cavity is formed in heat-sink unit, wind turbine is arranged among the radiating fin of heat-sink unit, the space availability ratio of refrigerating plant can be improved, is conducive to Miniaturization Design；Active heat removal is carried out using wind turbine, coordinates the design of radiating fin, heat exchange efficiency and refrigerating efficiency can be improved, and be conducive to noise control.
Description
Technical field
The utility model is related to refrigerating plant, especially a kind of semiconductor cooling device.
Background technology
Semiconductor refrigerating technology refers to：When one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple pair
When, after connecting DC current in this circuit, the transfer of energy can be generated, electric current flows to connecing for p-type element by N-type element
Head absorbs heat, becomes cold end；The connector that N-type element is flowed to by p-type element discharges heat, becomes hot junction.Energy transfer size
It is to be determined by the element logarithm of the size of electric current and semi-conducting material N, P.
Since there are resistance for semiconductor itself, heat is just will produce when electric current passes through semiconductor, to which hot biography can be influenced
It passs.Only hot face heat is efficiently dissipated in time, can just obtain the efficient refrigerating capacity of huyashi-chuuka (cold chinese-style noodles).Common Wind-cooling type semiconductor
Refrigerating plant, a kind of air-cooled electronics system of naphthaometer as disclosed in the Chinese patent application No. is 200820063836.6
Cooler, including semiconductor electronic refrigerating module, be close to semiconductor electronic refrigerating module fever end face metal heat sink, and
Mounted on the fan of metal heat sink another side, fan carries out wind-cooling heat dissipating to metal heat sink, and metal heat sink can be aluminium
The gilled radiator of system；A kind of for another example high-precision Wind-cooling type disclosed in the Chinese patent application No. is 201610173776.2
Semiconductor refrigerating thermostatic equipment, including heat exchanger, cooling piece component, the first speed-regulating fan, the second speed-regulating fan, the first plate-fin
Radiator, the second plate fin type radiator, heat exchanger, cooling piece component and the first plate fin type radiator, the second plate fin type radiator
Between be fixedly connected, the first speed-regulating fan, the second speed-regulating fan are installed in the first plate fin type radiator, the second plate fin type radiator
Outside form forced convection heat transfer in plate fin type radiator when first and second speed-regulating fan is operated, take away by freezing
The heat that piece component generates, the first plate fin type radiator and the second plate fin type radiator include bottom plate and are fixedly connected on bottom plate
Radiating fin.
Above-mentioned existing semiconductor cooling device, radiator mostly use the flat aluminum plate with fin and are pasted onto
Hot junction, then add wind turbine to radiate in aluminum plate.So that heat dissipation is effective, larger radiator is generally taken to increase heat exchange
Area or the rotating speed for improving wind turbine, this makes refrigerating plant volume larger, and the noise of cooling fan is higher.
Utility model content
Technical problem to be solved in the utility model is in view of the above-mentioned problems of the prior art, providing a kind of raising
Refrigerating efficiency, the semiconductor cooling device conducive to miniaturization.
Technical solution is used by the utility model solves above-mentioned technical problem：A kind of semiconductor cooling device, including
Cooling assembly, the cooling assembly include semiconductor chilling plate, and the heat-sink unit for exchanging heat to semiconductor chilling plate and
Heat absorbing units, the heat-sink unit include radiating fin, it is characterised in that：The radiating fin surrounds annular, in the heat dissipation
Be formed with accommodating cavity among the annular region that fin surrounds, the heat-sink unit further include be arranged it is in accommodating cavity, for leading
Move the wind turbine of heat.
Further, to realize wide range, equably radiating, the radiating fin has multiple, the radiating fin
It is radial to be arranged in around wind turbine.
Further, it is preferably flowed for ease of air draught, each radiating fin is in aerofoil profile, waveform or three Yuan songs
Face.
Preferably, for ease of preferably guiding air-flow to blow to radiating fin, the wind turbine is centrifugal blower.
Further, for ease of with semiconductor chilling plate heat exchange, the heat-sink unit further includes heat dissipation base, described
The hot face of heat dissipation base and semiconductor chilling plate is affixed, and one far from heat absorbing units in heat dissipation base is arranged in the radiating fin
Face.
Further, for ease of with semiconductor chilling plate Cooling capacity exchanging, the heat absorbing units include heat absorption matrix and heat absorption
Fin, the heat absorption matrix and heat dissipation base are oppositely arranged and are affixed with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the heat absorption fin
It is arranged in heat absorption one side of the matrix far from heat-sink unit.
Preferably, the heat dissipation base and heat absorption matrix are in the tabular for being made of aluminum or copper annular respectively.
Further, for ease of the installation of wind turbine, the centre of the heat dissipation base, position corresponding with accommodating cavity are provided with
Mounting hole, the wind turbine are arranged on fan supporter, and the fan supporter is located at side of the heat absorbing units far from heat-sink unit, institute
Wind turbine is stated to pass through and be arranged in heat-sink unit from the mounting hole in heat absorbing units and heat dissipation base.
Further, for ease of protecting cooling assembly, the cooling assembly periphery to be provided with shell, the shell includes bottom
Seat and upper cover, the heat absorbing units are arranged in pedestal, and the heat-sink unit is arranged in upper cover.
Further, it exchanges with extraneous for ease of heat in cooling assembly and cold, is opened up on the side wall of the pedestal
It is useful for the first ventilation hole of heat absorption, the second ventilation hole for heat dissipation is offered on the side wall of the upper cover.
Compared with prior art, the utility model has the advantage of：It, will by using accommodating cavity is formed in heat-sink unit
Wind turbine is arranged among the radiating fin of heat-sink unit, can improve the space availability ratio of refrigerating plant, is conducive to Miniaturization Design；
Active heat removal is carried out using wind turbine, coordinates the design of radiating fin, heat exchange efficiency and refrigerating efficiency can be improved, and be conducive to noise
Control.
Description of the drawings
Fig. 1 is the schematic diagram of the refrigerating plant of the utility model embodiment；
Fig. 2 is the decomposition texture schematic diagram of the refrigerating plant of the utility model embodiment；
Fig. 3 is the decomposition texture schematic diagram of the cooling assembly of the refrigerating plant of the utility model embodiment.
Specific implementation mode
The utility model is described in further detail below in conjunction with attached drawing embodiment.
Referring to Fig. 1 and Fig. 2, a kind of semiconductor cooling device, including shell 1 and the cooling assembly 2 that is arranged in shell 1,
Cooling assembly 2 includes semiconductor chilling plate 21, heat-sink unit 22 and heat absorbing units 23.
Referring to Fig. 3, heat-sink unit 22 includes heat dissipation base 221, radiating fin 222 and wind turbine 223, wherein heat dissipation base
221 tabular in a ring, it is preferred that be in circular ring shape tabular, can by aluminium, copper or other have high thermal conductivity can material
Material is made.Radiating fin 222 have it is multiple, be distributed in one side of the heat dissipation base 221 far from heat absorbing units 23.Above-mentioned radiating fin
222 surround annular, among the annular region that radiating fin 222 surrounds formed accommodating cavity 225, the centre of heat dissipation base 221, with
225 corresponding position of accommodating cavity is provided with mounting hole 226.Preferably, accommodating cavity 225 is cylinder.
It is provided with above-mentioned wind turbine 223 in the accommodating cavity 225 among above-mentioned radiating fin 222, it is preferred that wind turbine 223
Using centrifugal blower, radiating fin 222 is radial to be arranged in around wind turbine 223, it is preferred that each radiating fin 222
In aerofoil profile, in order to which air draught preferably flows.The shape of radiating fin 222 and the outlet air shape adaptation of wind turbine 223, can be with
It is required to be designed to different forms according to different performances such as heat dissipation, windage, noises.Such as the higher occasion of cooling requirements, dissipate
222 undulate of hot fin, so as to increase contact area；Such as the occasion for needing reduction windage and noise, then radiate
Fin 222 is in ternary curved surface, to realize the fluency of outlet air.
When refrigerating plant is run, wind turbine 223 starts, and air is actively blown on the radiating fin 222 of surrounding and is dissipated
Heat.
Heat absorbing units 23 include heat absorption matrix 231 and heat absorption fin 232, wherein the tablet of heat absorption matrix 231 in a ring
Shape, it is preferred that be in circular ring shape tabular, can by aluminium, copper or other have high thermal conductivity can material be made.Absorb heat matrix
231 are oppositely arranged with the heat dissipation base 221 of heat-sink unit 22, and the setting of above-mentioned semiconductor chilling plate 21 is in heat absorption 231 He of matrix
Between heat dissipation base 221, also, heat dissipation base 221 and the hot face of semiconductor chilling plate 21 are affixed, heat absorption matrix 231 with partly lead
The huyashi-chuuka (cold chinese-style noodles) of body cooling piece 21 is affixed.
Absorb heat fin 232 have it is multiple, be distributed in heat absorption one side of the matrix 231 far from heat-sink unit 22, it is preferred that heat absorption
Fin 232 radially distributes, and each heat absorption fin 232 is in aerofoil profile, in order to which air draught preferably flows.
For ease of the installation of wind turbine 223, wind turbine 223 is arranged on fan supporter 224, and it is single that fan supporter 224 is located at heat absorption
First 23 sides far from heat-sink unit 22.Wind turbine 223 passes through from heat absorbing units 23 and is arranged in heat-sink unit 22.
Shell 1 includes pedestal 11 and upper cover 12, and heat absorbing units 23 are arranged in pedestal 11, and heat-sink unit 22 is arranged upper
In lid 12.Multiple first ventilation holes 111 corresponding with heat absorption fin 232, the side wall of upper cover 12 are offered on the side wall of pedestal 11
On offer multiple second ventilation holes 121 corresponding with radiating fin 222, so as to realize respectively ventilation absorption refrigeration and ventilation dissipate
Heat.Preferably, in the present embodiment, the shape adaptation of pedestal 11 and fan supporter 224, the shape of upper cover 12 and heat-sink unit 22
Adaptation.
Claims (10)
1. a kind of semiconductor cooling device, including cooling assembly (2), the cooling assembly (2) includes semiconductor chilling plate (21),
And the heat-sink unit (22) for exchanging heat to semiconductor chilling plate (21) and heat absorbing units (23), the heat-sink unit (22) are wrapped
Include radiating fin (222), it is characterised in that：The radiating fin (222) surrounds annular, is surrounded in the radiating fin (222)
Annular region among be formed with accommodating cavity (225), the heat-sink unit (22) further include be arranged in accommodating cavity (225),
The wind turbine (223) to exchange heat for active.
2. semiconductor cooling device according to claim 1, it is characterised in that：The radiating fin (222) have it is multiple,
The radiating fin (222) is radial to be arranged in around wind turbine (223).
3. semiconductor cooling device according to claim 2, it is characterised in that：Each radiating fin (222) is in aerofoil profile, wave
Shape wave or ternary curved surface.
4. semiconductor cooling device according to claim 2, it is characterised in that：The wind turbine (223) is centrifugal blower.
5. semiconductor cooling device according to claim 1, it is characterised in that：The heat-sink unit (22) further includes heat dissipation
Matrix (221), the heat dissipation base (221) and the hot face of semiconductor chilling plate (21) are affixed, radiating fin (222) setting
In one side of the heat dissipation base (221) far from heat absorbing units (23).
6. semiconductor cooling device according to claim 5, it is characterised in that：The heat absorbing units (23) include heat absorption base
Body (231) and heat absorption fin (232), the heat absorption matrix (231) and heat dissipation base (221) is oppositely arranged and and semiconductor
The huyashi-chuuka (cold chinese-style noodles) of cooling piece (21) is affixed, and one far from heat-sink unit (22) in heat absorption matrix (231) is arranged in the heat absorption fin (232)
Face.
7. semiconductor cooling device according to claim 6, it is characterised in that：The heat dissipation base (221) and heat absorption base
Body (231) is in the tabular for being made of aluminum or copper annular respectively.
8. semiconductor cooling device according to claim 7, it is characterised in that：The centre of the heat dissipation base (221), with
The corresponding position of accommodating cavity (225) is provided with mounting hole (226), and the wind turbine (223) is arranged on fan supporter (224), institute
Fan supporter (224) side far from heat-sink unit (22) that is located at heat absorbing units (23) is stated, the wind turbine (223) is from heat absorbing units
(23) mounting hole (226) and on heat dissipation base (221) passes through and is arranged in heat-sink unit (22).
9. semiconductor cooling device according to any one of claims 1 to 4, it is characterised in that：The cooling assembly (2)
Periphery is provided with shell (1), and the shell (1) includes pedestal (11) and upper cover (12), and the heat absorbing units (23) are arranged the bottom of at
In seat (11), heat-sink unit (22) setting is in upper cover (12).
10. semiconductor cooling device according to claim 9, it is characterised in that：It is opened up on the side wall of the pedestal (11)
It is useful for the first ventilation hole (111) of heat absorption, the second ventilation hole for heat dissipation is offered on the side wall of the upper cover (12)
(121)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721868716.9U CN207674759U (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721868716.9U CN207674759U (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207674759U true CN207674759U (en) | 2018-07-31 |
Family
ID=62971602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721868716.9U Active CN207674759U (en) | 2017-12-27 | 2017-12-27 | A kind of semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207674759U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108679876A (en) * | 2018-08-31 | 2018-10-19 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor cooling device |
| CN109974331A (en) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | A kind of semiconductor cooling device |
| CN112030494A (en) * | 2019-06-03 | 2020-12-04 | 青岛海尔智能技术研发有限公司 | Automatic ironing and drying equipment |
-
2017
- 2017-12-27 CN CN201721868716.9U patent/CN207674759U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109974331A (en) * | 2017-12-27 | 2019-07-05 | 宁波方太厨具有限公司 | A kind of semiconductor cooling device |
| CN109974331B (en) * | 2017-12-27 | 2024-01-16 | 宁波方太厨具有限公司 | Semiconductor refrigerating device |
| CN108679876A (en) * | 2018-08-31 | 2018-10-19 | 厦门帕尔帖电子科技有限公司 | A kind of semiconductor cooling device |
| CN112030494A (en) * | 2019-06-03 | 2020-12-04 | 青岛海尔智能技术研发有限公司 | Automatic ironing and drying equipment |
| CN112030494B (en) * | 2019-06-03 | 2023-02-17 | 青岛海尔智能技术研发有限公司 | Automatic ironing and drying equipment |
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