CN218451050U - Cooling system for inner ring temperature - Google Patents

Abstract

The application discloses a cooling system for inner ambient temperature, which includes an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the inner and outer sides of the housing of the power supply device; the inner heat dissipation module and the outer heat dissipation module are connected It is set so that the inside of the housing of the power supply device and the outside form a heat flow path for heat dissipation. Beneficial effects of the application: the application improves the problem of the air temperature field of the airtight cavity by setting the connected inner heat dissipation module and the outer heat dissipation module; through the principle of thermodynamics, the air temperature of the airtight cavity of the power supply equipment is effectively reduced, thereby improving its Reliability of electrical devices in a closed cavity.

Description

A cooling system for inner ring temperature

technical field

The present application relates to the technical field of heat dissipation, in particular to a cooling system for inner ring temperature.

Background technique

The inner ambient temperature refers to the internal ambient temperature formed by the internal circulation of the heat generated by the heating device in the closed power supply equipment, that is, the temperature generated by the internal heat accumulation of the power supply equipment. When the existing power supply equipment is working, its internal ambient temperature can reach above 95°C, while the upper limit of the operating temperature of general electrical components is about 85°C, so the high internal ambient temperature will cause the power supply equipment to fail to work normally. Therefore, there is an urgent need for a cooling system capable of reducing the inner ring temperature of the power supply equipment.

Utility model content

One of the objectives of the present application is to provide a cooling system capable of effectively reducing the internal temperature of a power supply device.

In order to achieve the above purpose, the technical solution adopted in this application is: a cooling system for the inner ring temperature, including an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the shell The inner and outer sides of the body; the inner heat dissipation module and the outer heat dissipation module are arranged in communication, so that the inside of the housing of the power supply device and the outside form a heat flow path for heat dissipation.

Preferably, the inner heat dissipation module and the outer heat dissipation module are arranged in an L shape, so that heat flow paths perpendicular to each other are formed inside and outside the housing of the power supply device.

Preferably, the internal cooling module includes at least one internal cooling fan and at least one internal cooling radiator; the internal cooling radiator is fitted on the inner side of the first side wall of the housing of the power supply device, and the internal cooling fan is installed On one side of the inner cooling radiator, and the air direction of the inner cooling fan is toward the inner side of the first side wall.

Preferably, the external cooling module includes at least one external cooling fan and at least one external cooling radiator; the external cooling radiator is mounted on the outside of the first side wall; the external cooling fan is installed on the external cooling The radiator is adjacent to any side of the first side wall, so that the wind direction of the external cooling fan is perpendicular to the wind direction of the internal cooling fan.

Preferably, the internal cooling radiator includes a first heat dissipation substrate, the external cooling radiator includes a second heat dissipation substrate, and the first heat dissipation substrate and the second heat dissipation substrate are two parts of the same heat dissipation substrate.

Preferably, the inner heat dissipation module and the outer heat dissipation module are located above the main power devices in the power supply equipment.

Preferably, the cooling system of the inner ambient temperature also includes a main power radiator; the main power radiator is arranged on the side wall of the power supply equipment, and is directly opposite to the main power device of the power supply equipment, so as to control the power supply The main power device of the equipment is used for heat dissipation.

Preferably, the main power components of the power supply equipment are installed on the main power PCBA, and the main power PCBA is attached to the main power radiator.

Compared with the prior art, the beneficial effects of the present application are:

This application improves the problem of the air temperature field of the airtight cavity by setting the connected inner heat dissipation module and the outer heat dissipation module, and effectively reduces the air temperature of the airtight cavity of the power supply equipment through the principle of thermodynamics, thereby improving the electrical components in the airtight cavity. reliability.

Description of drawings

Figure 1 is a schematic diagram of the overall structure of the utility model.

Fig. 2 is the temperature rise curve of the power supply equipment in the utility model.

In the figure: housing 100 , main power device 200 , main power PCBA 210 , internal cooling radiator 31 , internal cooling fan 32 , external cooling radiator 33 , external cooling fan 34 , and main power radiator 35 .

Detailed ways

Hereinafter, the present application will be further described in conjunction with specific implementation methods. It should be noted that, on the premise of not conflicting, the various embodiments or technical features described below can be combined arbitrarily to form new embodiments.

In the description of this application, it should be noted that for orientation words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower" , "Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise ” and other indication orientations and positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, use a specific orientation The structure and operation should not be construed as limiting the specific protection scope of the application.

It should be noted that the terms "first" and "second" in the specification and claims of the present application are used to distinguish similar objects, but not necessarily used to describe a specific order or sequence.

One of the preferred embodiments of the present application, as shown in Figure 1, is a cooling system for the inner ring temperature, including an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged inside and outside the casing 100 of the power supply device The two sides; the inner heat dissipation module and the outer heat dissipation module are arranged in communication, so that the inside of the casing 100 of the power supply device and the outside form a heat flow path for heat dissipation.

It can be understood that, according to the second law of thermodynamics, in a natural state, heat can only be transferred from a hot place to a cold place forever. In this embodiment, the internal heat dissipation module and the external heat dissipation module are arranged in communication, so that the inside of the housing 100 of the power supply device forms a heat flow path that communicates with the external environment. Therefore, the heat inside the casing 100 of the power supply device can be dissipated to the external environment, thereby reducing the temperature inside the casing 100 of the power supply device, so as to ensure the working stability of the power devices of the power supply device.

Specifically, when the power supply equipment adopts traditional heat dissipation, its internal ambient temperature can reach above 95°C, while the temperature of the external environment of the power supply equipment is generally below 45°C. Therefore, through the communication setting of the inner heat dissipation module and the outer heat dissipation module in this application, The cooling of the inner ring temperature of the power supply device can be realized according to the second law of thermodynamics.

Specifically, as shown in FIG. 2 , the curve A in the figure is the internal temperature rise curve of the power supply equipment using traditional heat dissipation, and the curve B in the figure is the internal temperature rise curve of the power supply equipment in this application. Therefore, when the internal temperature of the housing 100 of the power supply device reaches a temperature balance, the internal temperature of the power supply device can be effectively reduced by adopting the heat dissipation method of the present application compared with the traditional heat dissipation method.

In this embodiment, as shown in FIG. 1 , the inner heat dissipation module and the outer heat dissipation module are arranged in an L shape, so that heat flow paths perpendicular to each other are formed inside and outside the housing 100 of the power supply device.

Specifically, as shown in FIG. 1 , the inner heat dissipation module is horizontal to the heat flow path inside the casing 100 of the power device, and the outer heat dissipation module is vertical to the flow path of heat discharged from the inner heat dissipation module. Therefore, when the inner heat dissipation module discharges the heat inside the casing 100 of the power supply device to the outer heat dissipation module, the outer heat dissipation module can effectively discharge the heat to the upper part of the outside world, so as to realize the heat circulation between the inside of the casing 100 of the power supply device and the outside world. flow.

It can be understood that when the power supply equipment adopts the traditional heat dissipation method, its internal temperature can reach above 95°C when it reaches thermal equilibrium; and after adopting the heat dissipation method of this application, its internal temperature can be reduced to below 85°C when it reaches thermal equilibrium; That is, the temperature below the limit temperature for the normal operation of the power devices in the power supply equipment.

In this embodiment, as shown in FIG. 1 , both the inner heat dissipation module and the outer heat dissipation module are located above the main power device 200 in the power supply equipment; thus, the heat inside the housing 100 of the power supply equipment can be discharged more conveniently, thereby speeding up the heat dissipation process. The cooling rate of the inner ring temperature.

It can be understood that the heat generated by the main power device 200 inside the casing 100 will rise upwards; thus, by arranging the inner heat dissipation module and the outer heat dissipation module above the main power 200 , the heat can be discharged more conveniently.

In this embodiment, as shown in FIG. 1 , the internal cooling module includes at least one internal cooling fan 32 and at least one internal cooling radiator 31; the internal cooling radiator 31 is attached to the first side wall of the housing 100 of the power supply device. Inside, the internal cooling fan 32 is installed on one side of the internal cooling radiator 31 , and the airflow direction of the internal cooling fan 32 is toward the inner side of the first side wall.

It can be understood that the first side wall of the housing 100 of the power supply device refers to the back side wall of the housing 100 , which is mainly used for heat dissipation of the power device. The specific number of internal cooling fans 32 and internal cooling radiators 31 in the internal cooling module can be set according to actual needs. For example, as shown in FIG. 1 , the number of internal cooling fans 32 and internal cooling radiators 31 is at least one.

In this embodiment, as shown in FIG. 1 , the external heat dissipation module includes at least one external cooling fan 34 and at least one external cooling radiator 33; the external radiator is mounted on the outside of the first side wall; the external cooling fan 34 is installed on The external cooling radiator 33 is adjacent to any side of the first side wall, so that the wind direction of the external cooling fan 34 is perpendicular to the wind direction of the internal cooling fan 32 .

It can be understood that the specific number of external cooling fans 34 and external cooling radiators 33 in the external cooling module can be set according to actual needs. For example, as shown in FIG. 1 , the number of external cooling fans 34 and external cooling radiators 33 is at least one.

It can also be understood that there are various installation orientations of the external cooling fan 34, wherein, preferably, the external cooling fan 34 is installed on the lower side wall of the external cooling radiator 33, so that the wind direction of the external cooling fan 34 is vertically upward to vertically In the horizontal wind direction of the internal cooling fan 32. Therefore, the cooling effect of the external cooling fan 34 can be further improved by virtue of the rise of heat.

Specifically, the inner cooling radiator 31 includes a first heat dissipation substrate, the outer cooling radiator 33 includes a second heat dissipation substrate, and the first heat dissipation substrate and the second heat dissipation substrate are integrally arranged.

It can be understood that the inner cooling radiator 31 and the outer cooling radiator 33 share the same heat dissipation substrate. The heat dissipation substrate can be L-shaped, so that the inner cooling radiator 31 and the outer cooling radiator 33 respectively occupy two vertical sections of the heat dissipation substrate, so that the heat dissipation substrate is divided into a first heat dissipation substrate and a second heat dissipation substrate. The shared heat dissipation substrate of the inner cooling radiator 31 and the outer cooling radiator 33 can effectively ensure the formation of a stable heat flow path, thereby making it easier to lower the temperature of the inner ring.

It can also be understood that both the internal cooling radiator 31 and the external cooling radiator 33 include several cooling fins. For further convenience in cooling, the cooling fins of the internal cooling radiator 31 and the external cooling radiator 33 are arranged parallel to each other.

In this embodiment, as shown in FIG. 2 , after the power supply device adopts the heat dissipation method of the present application, the peak value of the inner ring temperature can be reduced by ΔT. ΔT is generally above 10°C. The value of ΔT can be adjusted according to the effective heat dissipation area of the internal cooling radiator 31 and the external cooling radiator 33 and/or the air volume of the internal cooling fan 32 and the external cooling fan 33 .

In this embodiment, as shown in Figure 1, the cooling system of the inner ambient temperature of the present application also includes a main power radiator 35; The power device 200 faces directly to dissipate heat from the main power device 200 of the power supply device.

Specifically, as shown in FIG. 1 , the main power device 200 of the power supply equipment is installed on the main power PCBA210, and the main power PCBA210 is attached to the main power radiator 35, so that the main power device 200 transfers heat to the Main power radiator 35 for heat dissipation.

It can be understood that the traditional heat dissipation method of the power supply equipment is to cool the main power device 200 through the main power radiator 35 . However, there are still a large number of secondary heat-generating devices that have no direct conduction path with the outside world, and can only dissipate heat into the sealed casing 100 of the power supply device, causing the enthalpy value of the air inside the power supply device to rise, which in turn causes the inner ring temperature to rise to 95 ℃ or more. Therefore, after the power supply equipment adopts the cooling system of the present application, the internal heat of the casing 100 of the power supply equipment can be effectively released from the outside, so that the inner ring temperature of the power supply equipment can be effectively kept below 85°C.

The basic principles, main features and advantages of the present application have been described above. Those skilled in the art should understand that the present application is not limited by the above-mentioned embodiments, and what is described in the above-mentioned embodiments and description is only the principle of the present application, and there will be various other aspects in the present application without departing from the spirit and scope of the present application. Variations and improvements, which fall within the scope of the claimed application. The scope of protection required in this application is defined by the appended claims and their equivalents.

Claims (8)

1. The utility model provides a cooling system of interior ring temperature which characterized in that includes: an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the two sides inside and outside the shell of the power supply equipment; the inner heat dissipation module and the outer heat dissipation module are communicated with each other, so that a heat flow path for heat dissipation is formed between the inside of the shell of the power supply device and the outside.

2. The system for reducing the temperature of an inner ring of claim 1, wherein: the inner heat dissipation module and the outer heat dissipation module are arranged in an L shape, so that mutually perpendicular heat flow paths are formed inside and outside a shell of the power supply equipment.

3. The system for reducing temperature of an internal ring temperature of claim 2, wherein: the inner heat dissipation module comprises at least one inner cooling fan and at least one inner cooling radiator; the inner cooling radiator is attached to the inner side of the first side wall of the shell of the power supply equipment, the inner cooling fan is installed on one side of the inner cooling radiator, and the wind direction of the inner cooling fan faces the inner side of the first side wall.

4. The system for reducing the temperature of an inner ring of claim 3, wherein: the outer heat dissipation module comprises at least one outer cooling fan and at least one outer cooling radiator; the external cooling radiator is attached to the outer side of the first side wall; the outer cooling fan is arranged on any side of the outer cooling radiator adjacent to the first side wall, so that the wind direction of the outer cooling fan is perpendicular to the wind direction of the inner cooling fan.

5. The system for reducing the temperature of an inner ring temperature of claim 4, wherein: the inner cooling radiator comprises a first radiating substrate, the outer cooling radiator comprises a second radiating substrate, and the first radiating substrate and the second radiating substrate are two parts of the same radiating substrate.

6. An internal loop temperature reducing system as claimed in any one of claims 1 to 5, wherein: the inner heat dissipation module and the outer heat dissipation module are located above a main power device in the power supply equipment.

7. The system for reducing temperature of an internal ring temperature of claim 1, wherein: the cooling system for the inner ring temperature also comprises a main power radiator; the main power radiator is arranged on the side wall of the shell of the power supply equipment and is right opposite to a main power device of the power supply equipment so as to be used for radiating the main power device of the power supply equipment.

8. The system for reducing the temperature of an inner ring of claim 7, wherein: the main power device of power supply unit all installs in main power PCBA, the laminating of main power PCBA set up in the main power radiator.

Images