CN218451050U - Cooling system for inner ring temperature - Google Patents
Cooling system for inner ring temperature Download PDFInfo
- Publication number
- CN218451050U CN218451050U CN202222516255.6U CN202222516255U CN218451050U CN 218451050 U CN218451050 U CN 218451050U CN 202222516255 U CN202222516255 U CN 202222516255U CN 218451050 U CN218451050 U CN 218451050U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation module
- power supply
- temperature
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a cooling system with an inner ring temperature, which comprises an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the two sides inside and outside the shell of the power supply equipment; the inner heat dissipation module and the outer heat dissipation module are communicated with each other, so that a heat flow path for heat dissipation is formed between the inside of the shell of the power supply device and the outside. The beneficial effect of this application: the problem of an air temperature field of a closed cavity is solved by arranging the inner heat dissipation module and the outer heat dissipation module which are communicated; by the thermodynamic principle, the air temperature of the closed cavity of the power supply equipment is effectively reduced, so that the reliability of electric devices in the closed cavity of the power supply equipment is improved.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a cooling system with an inner ring temperature.
Background
The internal loop temperature is an internal environment temperature formed by internal circulation of heat generated by a heating device in the closed power supply equipment, namely, a temperature generated by heat accumulation in the power supply equipment. When the existing power supply equipment works, the internal environment temperature of the existing power supply equipment can reach more than 95 ℃, and the upper limit of the working temperature of general electrical elements is about 85 ℃, so that the power supply equipment cannot work normally due to high internal environment temperature. Therefore, a cooling system capable of reducing the internal environment temperature of the power supply equipment is urgently needed.
SUMMERY OF THE UTILITY MODEL
One of the objects of the present application is to provide a cooling system capable of effectively reducing the internal temperature of a power supply apparatus.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: a cooling system with inner ring temperature comprises an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the two sides inside and outside the shell of the power supply equipment; the inner heat dissipation module and the outer heat dissipation module are communicated with each other, so that a heat flow path for heat dissipation is formed between the inside of the shell of the power supply device and the outside.
Preferably, the inner heat dissipation module and the outer heat dissipation module are arranged in an L shape, so that mutually perpendicular heat flow paths are formed inside and outside the housing of the power supply device.
Preferably, the inner heat dissipation module comprises at least one inner cooling fan and at least one inner cooling radiator; the inner cooling radiator is attached to the inner side of the first side wall of the shell of the power supply equipment, the inner cooling fan is installed on one side of the inner cooling radiator, and the wind direction of the inner cooling fan faces the inner side of the first side wall.
Preferably, the external heat dissipation module comprises at least one external cooling fan and at least one external cooling radiator; the external cooling radiator is attached to the outer side of the first side wall; the outer cooling fan is arranged on any side of the outer cooling radiator adjacent to the first side wall, so that the wind direction of the outer cooling fan is perpendicular to the wind direction of the inner cooling fan.
Preferably, the internal cooling heat sink includes a first heat dissipation substrate, the external cooling heat sink includes a second heat dissipation substrate, and the first heat dissipation substrate and the second heat dissipation substrate are two parts of the same heat dissipation substrate.
Preferably, the inner heat dissipation module and the outer heat dissipation module are located above a main power device in the power supply apparatus.
Preferably, the cooling system for the inner ring temperature further comprises a main power radiator; the main power radiator is arranged on the side wall of the shell of the power supply equipment and is opposite to a main power device of the power supply equipment so as to be used for radiating the main power device of the power supply equipment.
Preferably, the main power devices of the power supply equipment are all installed on a main power PCBA, and the main power PCBA is attached to the main power radiator.
Compared with the prior art, the beneficial effect of this application lies in:
this application has improved the problem in airtight cavity air temperature field through setting up interior heat dissipation module and the outer heat dissipation module that are linked together, through the thermodynamics principle, effectively reduces the air temperature of the airtight cavity of power supply unit to improve the reliability of electrical components in its airtight cavity.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is the temperature rise curve of the medium power supply device of the present invention.
In the figure: housing 100, main power device 200, main power PCBA210, internal cooling radiator 31, internal cooling fan 32, external cooling radiator 33, external cooling fan 34, main power radiator 35.
Detailed Description
The present application is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
In the description of the present application, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate orientations and positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In one preferred embodiment of the present application, as shown in fig. 1, an inner loop temperature cooling system includes an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the inner side and the outer side of the shell 100 of the power supply device; the inner heat dissipation module and the outer heat dissipation module are disposed in communication such that a heat flow path for heat dissipation is formed with the outside inside the housing 100 of the power supply device.
It is understood that, as can be seen from the second law of thermodynamics, in the natural state, heat can only be transferred from hot to cold at all times. The present embodiment provides the inner heat dissipation module and the outer heat dissipation module to be communicated with each other, so that a heat flow path communicated with the external environment is formed inside the housing 100 of the power supply device. Therefore, heat inside the casing 100 of the power supply device can be dissipated to the external environment, and then the temperature inside the casing 100 of the power supply device is reduced, so that the working stability of a power device of the power supply device is ensured.
Specifically, power supply unit is when adopting the tradition heat dissipation, and its interior ring temperature can reach more than 95 ℃, and the temperature of the outside environment of power supply unit generally is below 45 to through being linked together setting of interior heat dissipation module and outer heat dissipation module in this application, can realize cooling down power supply unit's interior ring temperature according to the second law of thermodynamics.
Specifically, as shown in fig. 2, a curve a in the drawing is an internal temperature rise curve of the power supply device when the conventional heat dissipation is adopted, and a curve B in the drawing is an internal temperature rise curve of the power supply device in the present application. Therefore, when the temperature inside the casing 100 of the power supply device is balanced, the internal temperature of the power supply device can be effectively reduced by adopting the heat dissipation mode of the power supply device compared with the traditional heat dissipation mode.
In this embodiment, as shown in fig. 1, the inner heat dissipation module and the outer heat dissipation module are disposed in an L shape, so that heat flow paths perpendicular to each other are formed inside and outside the housing 100 of the power supply device.
Specifically, as shown in fig. 1, the inner heat dissipation module is horizontal to the flow path of heat inside the housing 100 of the power supply device, and the outer heat dissipation module is vertical to the flow path of heat discharged from the inner heat dissipation module. Thereby when heat dissipation module discharges power supply unit's casing 100 inside heat to outer heat dissipation module including, outer heat dissipation module can be effectual arranges the heat to external top to realize that power supply unit's casing 100 is inside to carry out the heat flow that circulates with the external world.
It can be understood that when the power supply device adopts the traditional heat dissipation mode, the temperature of the power supply device can reach more than 95 ℃ when the interior of the power supply device reaches thermal equilibrium; after the heat dissipation mode of the application is adopted, the temperature of the interior of the heat dissipation device can be reduced to below 85 ℃ when the interior of the heat dissipation device reaches thermal equilibrium; i.e. below the limit temperature at which the power devices in the power supply apparatus operate normally.
In the present embodiment, as shown in fig. 1, the inner heat dissipation module and the outer heat dissipation module are both located above the main power device 200 in the power supply apparatus; therefore, heat inside the casing 100 of the power supply device can be discharged more conveniently, and the cooling speed of the inner ring temperature is increased.
It is understood that the heat generated by the main power device 200 inside the casing 100 will rise upwards; thus, the heat can be more conveniently discharged by disposing the inner and outer heat dissipating modules above the main power 200.
In the present embodiment, as shown in fig. 1, the internal heat dissipation module includes at least one internal cooling fan 32 and at least one internal cooling radiator 31; the inner cooling radiator 31 is attached to the inner side of the first side wall of the housing 100 of the power supply apparatus, the inner cooling fan 32 is attached to one side of the inner cooling radiator 31, and the wind direction of the inner cooling fan 32 is directed toward the inner side of the first side wall.
It is understood that the first sidewall of the housing 100 of the power supply apparatus refers to a back sidewall of the housing 100, and is mainly used for heat dissipation of the power device. The specific number of the internal cooling fans 32 and the internal cooling radiators 31 in the internal heat dissipation module can be set according to actual needs, for example, as shown in fig. 1, the number of the internal cooling fans 32 and the internal cooling radiators 31 is at least one.
In the present embodiment, as shown in fig. 1, the external cooling module includes at least one external cooling fan 34 and at least one external cooling radiator 33; the outer radiator is attached to the outer side of the first side wall; the outer cooling fan 34 is installed at either side of the outer cooling radiator 33 adjacent to the first side wall such that the wind direction of the outer cooling fan 34 is perpendicular to the wind direction of the inner cooling fan 32.
It is understood that the specific number of the external cooling fans 34 and the external cooling radiators 33 in the external heat dissipation module can be set according to actual needs, for example, as shown in fig. 1, the number of the external cooling fans 34 and the external cooling radiators 33 is at least one.
It will also be understood that there are various mounting orientations of the outer cooling fan 34, wherein it is preferable that the outer cooling fan 34 is mounted to the lower side wall of the outer cooling radiator 33 such that the wind direction of the outer cooling fan 34 is vertically upward to be perpendicular to the horizontal wind direction of the inner cooling fan 32. The cooling effect of the external cooling fan 34 can be further improved by the rising of the heat.
Specifically, the internal cooling heat sink 31 includes a first heat dissipation substrate, and the external cooling heat sink 33 includes a second heat dissipation substrate, and the first heat dissipation substrate and the second heat dissipation substrate are integrally disposed.
It is understood that the inner radiator 31 and the outer radiator 33 share the same heat-dissipating substrate. The heat dissipating substrate may have an L shape such that the inner-cooling heat sink 31 and the outer-cooling heat sink 33 respectively occupy two vertical sections of the heat dissipating substrate, so that the heat dissipating substrate is divided into a first heat dissipating substrate and a second heat dissipating substrate. By using the common heat dissipation substrate of the inner cooling radiator 31 and the outer cooling radiator 33, a stable heat flow path can be effectively ensured, so that the inner environment temperature can be more conveniently reduced.
It will also be appreciated that the inner and outer cold sinks 31, 33 each comprise a plurality of cooling fins. For further convenience of cooling, the radiating fins of the inner and outer cold radiators 31, 33 are arranged parallel to each other.
In this embodiment, as shown in fig. 2, after the power supply device adopts the heat dissipation method of the present application, the peak value of the inner ring temperature may be reduced by Δ T. The Δ T is generally above 10 ℃. The value of Δ T may be adjusted according to the effective heat dissipating areas of the inner and outer cooling radiators 31 and 33 and/or the air volumes of the inner and outer cooling fans 32 and 33.
In this embodiment, as shown in fig. 1, the cooling system with inner loop temperature of the present application further includes a main power radiator 35; the main power heat sink 35 is disposed on a side wall of the housing 100 of the power supply apparatus and directly faces the main power device 200 of the power supply apparatus, so as to dissipate heat of the main power device 200 of the power supply apparatus.
Specifically, as shown in fig. 1, the main power devices 200 of the power supply apparatus are all mounted on the main power PCBA210, and the main power PCBA210 is attached to the main power heat sink 35, so that the main power devices 200 transfer heat to the main power heat sink 35 through the main power PCBA210 for heat dissipation.
It will be appreciated that the conventional way of dissipating heat from the power supply apparatus is to cool the main power device 200 through the main power heat sink 35. However, there are still a lot of secondary heating devices without direct conduction paths to the outside, and the heat can only be dissipated into the sealed casing 100 of the power supply device, so that the enthalpy of the air inside the power supply device increases, and the temperature of the inner ring increases to above 95 ℃. Thereby power supply unit has adopted the cooling system of this application after, can effectually realize that power supply unit's casing 100's inside heat flows the release with the external world for power supply unit's interior ring temperature can effectually keep below 85 ℃.
The foregoing has described the principles, principal features, and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, which are merely illustrative of the principles of the application, but that various changes and modifications may be made without departing from the spirit and scope of the application, and these changes and modifications are intended to be within the scope of the application as claimed. The scope of protection claimed by this application is defined by the following claims and their equivalents.
Claims (8)
1. The utility model provides a cooling system of interior ring temperature which characterized in that includes: an inner heat dissipation module and an outer heat dissipation module; the inner heat dissipation module and the outer heat dissipation module are respectively arranged on the two sides inside and outside the shell of the power supply equipment; the inner heat dissipation module and the outer heat dissipation module are communicated with each other, so that a heat flow path for heat dissipation is formed between the inside of the shell of the power supply device and the outside.
2. The system for reducing the temperature of an inner ring of claim 1, wherein: the inner heat dissipation module and the outer heat dissipation module are arranged in an L shape, so that mutually perpendicular heat flow paths are formed inside and outside a shell of the power supply equipment.
3. The system for reducing temperature of an internal ring temperature of claim 2, wherein: the inner heat dissipation module comprises at least one inner cooling fan and at least one inner cooling radiator; the inner cooling radiator is attached to the inner side of the first side wall of the shell of the power supply equipment, the inner cooling fan is installed on one side of the inner cooling radiator, and the wind direction of the inner cooling fan faces the inner side of the first side wall.
4. The system for reducing the temperature of an inner ring of claim 3, wherein: the outer heat dissipation module comprises at least one outer cooling fan and at least one outer cooling radiator; the external cooling radiator is attached to the outer side of the first side wall; the outer cooling fan is arranged on any side of the outer cooling radiator adjacent to the first side wall, so that the wind direction of the outer cooling fan is perpendicular to the wind direction of the inner cooling fan.
5. The system for reducing the temperature of an inner ring temperature of claim 4, wherein: the inner cooling radiator comprises a first radiating substrate, the outer cooling radiator comprises a second radiating substrate, and the first radiating substrate and the second radiating substrate are two parts of the same radiating substrate.
6. An internal loop temperature reducing system as claimed in any one of claims 1 to 5, wherein: the inner heat dissipation module and the outer heat dissipation module are located above a main power device in the power supply equipment.
7. The system for reducing temperature of an internal ring temperature of claim 1, wherein: the cooling system for the inner ring temperature also comprises a main power radiator; the main power radiator is arranged on the side wall of the shell of the power supply equipment and is right opposite to a main power device of the power supply equipment so as to be used for radiating the main power device of the power supply equipment.
8. The system for reducing the temperature of an inner ring of claim 7, wherein: the main power device of power supply unit all installs in main power PCBA, the laminating of main power PCBA set up in the main power radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222516255.6U CN218451050U (en) | 2022-09-22 | 2022-09-22 | Cooling system for inner ring temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222516255.6U CN218451050U (en) | 2022-09-22 | 2022-09-22 | Cooling system for inner ring temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218451050U true CN218451050U (en) | 2023-02-03 |
Family
ID=85081267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222516255.6U Active CN218451050U (en) | 2022-09-22 | 2022-09-22 | Cooling system for inner ring temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218451050U (en) |
-
2022
- 2022-09-22 CN CN202222516255.6U patent/CN218451050U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109952002B (en) | Cooling and heat dissipation box body and heat dissipation control method | |
| CN105932539B (en) | Has the air-cooled type laser aid of the conducting-heat elements with radiating fin | |
| TW201724959A (en) | Thermoelectric cooling module and heat dissipation apparatus including the same | |
| US20070107441A1 (en) | Heat-dissipating unit and related liquid cooling module | |
| CN112243339B (en) | Double-circulation heat dissipation system | |
| CN207219278U (en) | A kind of electrical equipment and its radiator structure | |
| CN207994912U (en) | Electric and electronic power cabinet | |
| CN207674759U (en) | A kind of semiconductor cooling device | |
| US20110192572A1 (en) | Heat exchanger | |
| CN112286325A (en) | External radiator of notebook computer | |
| WO2023232064A1 (en) | Water-cooled heat radiating device | |
| CN218451050U (en) | Cooling system for inner ring temperature | |
| US20050024824A1 (en) | Arrangement for cooling heat-generating computer components | |
| CN215269268U (en) | Integrated high-power heat dissipation module | |
| TWI772092B (en) | Immersion cooling system | |
| CN211785712U (en) | Bottom shell structure of electric energy meter | |
| CN209929439U (en) | Power battery water-cooling module assembly | |
| CN209857420U (en) | Semiconductor refrigeration equipment | |
| CN210270795U (en) | CPU heat abstractor for computer | |
| CN209299652U (en) | A kind of air-cooled radiator using aluminium extruded Formula V C quick conductive | |
| KR102001029B1 (en) | Dissipation Module Using Peltier Devices With Diode Module On Connection Board For Solar Power Generation In Outer Case | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN207394789U (en) | A kind of high-powered LED lamp housing radiating device | |
| CN212529295U (en) | Power assembly and electric automobile | |
| CN213338634U (en) | External radiator of notebook computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |