CN218770826U - Cooling system for internal ring temperature of power supply equipment - Google Patents
Cooling system for internal ring temperature of power supply equipment Download PDFInfo
- Publication number
- CN218770826U CN218770826U CN202222515933.7U CN202222515933U CN218770826U CN 218770826 U CN218770826 U CN 218770826U CN 202222515933 U CN202222515933 U CN 202222515933U CN 218770826 U CN218770826 U CN 218770826U
- Authority
- CN
- China
- Prior art keywords
- power supply
- heat dissipation
- cooling
- supply equipment
- dissipation module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a cooling system for the internal environment temperature of power supply equipment, which comprises an internal heat dissipation module and at least one refrigeration module; the inner heat dissipation module is arranged on the inner side of the shell of the power supply equipment and used for dissipating heat inside the power supply equipment to the outside; the refrigeration module is arranged on the inner side of the shell of the power supply equipment and connected with the inner heat dissipation module, and the refrigeration module is suitable for refrigerating the inner heat dissipation module. The beneficial effect of this application: the heat dissipation device is arranged in the power supply equipment, and the inner heat dissipation module is communicated with the outside to dissipate heat; meanwhile, the refrigeration module is arranged in the power supply equipment to refrigerate the internal heat dissipation module, so that the heat dissipation efficiency of the internal heat dissipation module can be improved, and the temperature in the power supply equipment is reduced to meet the normal work of an electrical element.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a cooling system for the internal ring temperature of power supply equipment.
Background
The internal loop temperature is an internal environment temperature formed by internal circulation of heat generated by a heating device in the closed power supply equipment, namely, a temperature generated by heat accumulation in the power supply equipment. When the existing power supply equipment works, internal and external heat exchange is generally carried out by arranging 1 or N internal circulation fans inside the power supply equipment, which can only improve the uniformity of the internal ring temperature of the closed power supply equipment, but the internal temperature of the power supply equipment can still reach over 95 ℃, and the upper limit of the working temperature of general electrical elements is about 85 ℃, so that the power supply equipment cannot work normally due to high internal ring temperature. Therefore, a cooling system capable of reducing the internal environment temperature of the power supply equipment is urgently needed.
SUMMERY OF THE UTILITY MODEL
One of the objects of the present application is to provide a cooling system capable of effectively reducing the internal temperature of a power supply device.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: a cooling system for the internal environment temperature of power equipment comprises an internal heat dissipation module and at least one refrigeration module; the inner heat dissipation module is arranged on the inner side of the shell of the power supply equipment and used for dissipating heat inside the power supply equipment to the outside; the refrigeration module is arranged on the inner side of the shell of the power supply equipment and connected with the inner heat dissipation module, and the refrigeration module is suitable for refrigerating the inner heat dissipation module, so that the cooling efficiency of the inner heat dissipation module can be further improved, and the temperature inside the power supply equipment is reduced to meet the normal work of an electrical element.
Preferably, the refrigeration module comprises at least one TEC chip; the TEC chip is attached to the inner heat dissipation module through a refrigerating surface, and the heating surface of the TEC chip is communicated with the outside to dissipate heat.
Preferably, the cooling system for the internal environment temperature of the power supply equipment further comprises an external heat dissipation module; the outer heat dissipation module is arranged on the outer side of the shell of the power supply equipment and is in fit connection with the heating surface of the TEC chip; so that the inner heat dissipation module and the outer heat dissipation module form a heat dissipation cycle through the refrigeration module.
Preferably, the inner heat dissipation module comprises at least one inner cooling fan and at least one inner cooling radiator; the inner cooling radiator is arranged on the inner side of the first side wall of the shell of the power supply equipment, and the inner cooling fan is arranged on one side of the inner cooling radiator and attached to the refrigerating surface of the TEC chip.
Preferably, the external heat dissipation module comprises at least one external cooling fan and at least one external cooling radiator; the external cooling radiator is arranged on the outer side of the first side wall and attached to the heating surface of the TEC chip; the external cooling fan is arranged on any side of the external cooling radiator adjacent to the first side wall.
Preferably, the internal cooling radiator comprises a first radiating substrate, and the external cooling radiator comprises a second radiating substrate; the refrigeration surface of the TEC chip is attached to the first heat dissipation substrate through a heat conduction material, and the heating surface of the TEC chip is attached to the second heat dissipation substrate through a heat conduction material.
Preferably, the inner heat dissipation module and the outer heat dissipation module are located above a main power device in the power supply apparatus.
Preferably, the cooling system for the internal ring temperature of the power supply equipment further comprises a main power radiator; the main power radiator is arranged on the side wall of the shell of the power supply equipment and is right opposite to a main power device of the power supply equipment so as to be used for radiating the main power device of the power supply equipment.
Preferably, main power devices of the power supply equipment are all installed on a main power PCBA, and the main power PCBA is attached to the main power radiator.
Compared with the prior art, the beneficial effect of this application lies in:
the heat dissipation device is arranged in the power supply equipment, and the inner heat dissipation module is communicated with the outside to dissipate heat; meanwhile, the refrigeration module is arranged in the power supply equipment to refrigerate the internal heat dissipation module, so that the heat dissipation efficiency of the internal heat dissipation module can be improved, and the temperature in the power supply equipment is reduced to meet the normal work of an electrical element.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural view of the middle TEC chip of the present invention.
Fig. 3 is a schematic view illustrating the connection between the first heat dissipating substrate and the second heat dissipating substrate of the present invention.
In the figure: the main power device comprises a shell 100, a main power device 200, a main power PCBA210, an internal cooling radiator 31, a first heat dissipation substrate 310, an internal cooling fan 32, an external cooling radiator 33, a second heat dissipation substrate 330, heat dissipation fins 300, an external cooling fan 34, a main power radiator 35, a TEC chip 400, a cooling surface 410, a heating surface 420 and a heat conduction material 500.
Detailed Description
The present application is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
In the description of the present application, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be construed as limiting the specific scope of protection of the present application.
It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In one preferred embodiment of the present application, as shown in fig. 1 to fig. 3, a cooling system for internal environment temperature of a power supply device includes an internal heat dissipation module and a refrigeration module; the internal heat dissipation module is disposed inside the casing 100 of the power device, and is used for dissipating heat inside the power device to the outside. The refrigeration module is arranged on the inner side of the shell 100 of the power supply equipment and is connected with the inner heat dissipation module, and the refrigeration module can refrigerate the inner heat dissipation module, so that the cooling efficiency of the inner heat dissipation module can be further improved, and the temperature inside the power supply equipment is reduced to meet the normal work of an electrical element.
In this embodiment, as shown in fig. 1 and 2, for the refrigeration in a narrow space, a semiconductor refrigerator is generally used as the refrigeration module; i.e., the refrigeration module includes at least one TEC chip 400. Each TEC chip 400 is attached to the internal heat dissipation module through the refrigeration surface 410 to refrigerate the internal heat dissipation module; the heating surface 420 of each TEC chip 400 communicates with the outside to dissipate heat, so that heat generated from the TEC chip 400 can be prevented from flowing into the case 100 of the power supply apparatus.
It is understood that the number of TEC chips 400 may be set according to actual needs. Generally, a plurality of TEC chips 400 can be used to attach the inner heat dissipation module, so as to ensure that the refrigeration efficiency of the refrigeration module meets the power requirement of the inner heat dissipation module.
It should be noted that as shown in fig. 2, the TEC chip 400 is a prior art chip made using the peltier effect of semiconductor materials. The peltier effect means that when a current passes through a circuit composed of different conductors, irreversible joule heat is generated, and heat absorption and heat release phenomena occur at joints of the different conductors respectively along with the difference of current directions. That is, when a dc current is input to the TEC chip 400, one surface of the TEC chip 400 cools and the other surface heats, thereby forming the cooling surface 410 and the heating surface 420. Moreover, the positions of the cooling surface 410 and the heating surface 420 of the TEC chip 400 may be interchanged according to the direction of current flowing through the TEC chip 400. And the cooling capacity and the heating capacity of the cooling surface 410 and the heating surface 420 may be adjusted according to the magnitude of the current flowing into the TEC chip 400. Meanwhile, the TEC chip 400 has a cubic structure, and the cooling surface 410 and the heating surface 420 thereof are two opposite end surfaces; in order to improve the working efficiency of the TEC chip 400, when the TEC chip 400 is disposed, the other four surfaces of the TEC chip 400 except the cooling surface 410 and the heating surface 420 may be coated with a heat insulating material; common heat insulation materials include heat insulation cotton and the like.
In this embodiment, as shown in fig. 1, the cooling system for the internal environment temperature of the power supply device further includes an external heat dissipation module; the outer heat dissipation module is arranged on the outer side of the shell 100 of the power supply device and is attached to and connected with the heating surface 420 of the TEC chip 400; so that the inner and outer heat dissipation modules form a heat dissipation cycle through the refrigeration module.
It can be understood that, when the heat dissipation requirement of the internal environment temperature of the housing 100 of the power supply device is not high, the heat dissipation of the heating surface 420 of the TEC chip 400 may be directly performed to the outside. If the heat dissipation requirement of the internal environment temperature of the casing 100 of the power supply device is high, the natural cooling cannot meet the heat dissipation requirement of the heat dissipation surface 420 of the TEC chip 400, and at this time, the heat generated by the heating surface 420 of the TEC chip 400 is dissipated through the external heat dissipation module, so that the TEC chip 400 can be ensured to be cooled through the cooling surface 410 normally, and the heat dissipation efficiency of the internal heat dissipation module is improved.
It should be understood that there are many specific ways to mount the inner and outer heat dissipation modules, and those skilled in the art can select them according to actual needs. For convenience of subsequent description, as shown in fig. 1, the preferred installation method adopted in this embodiment is as follows: the heat dissipation direction of the inner heat dissipation module is perpendicular to the inner wall of the casing 100 of the power supply device, and the heat dissipation direction of the outer heat dissipation module is parallel to the outer wall of the casing 100 of the power supply device.
In the present embodiment, as shown in fig. 1, the inner heat dissipation module and the outer heat dissipation module are both located above the main power device 200 in the power supply apparatus; therefore, heat inside the casing 100 of the power supply device can be discharged more conveniently, and the cooling speed of the inner ring temperature is increased.
It is understood that the heat generated by the main power device 200 inside the casing 100 will rise upwards; thus, the heat can be more conveniently discharged by disposing the inner and outer heat dissipating modules above the main power 200.
In this embodiment, as shown in fig. 1, the internal heat dissipation module includes at least one internal cooling fan 32 and at least one internal cooling radiator 31; the inner cooling heat sink 31 is mounted on the inner side of the first side wall of the housing 100 of the power supply device and attached to the cooling surface 410 of the TEC chip 400, so that the TEC chip 410 can cool the inner cooling heat sink 31. The internal cooling fan 32 is installed on one side of the internal cooling heat sink 31, and the wind direction of the internal cooling fan 32 faces the inner side of the first side wall, so that the internal cooling fan 32 can blow the hot air in the housing 100 of the power supply device to the internal cooling heat sink 31 for cooling, thereby reducing the internal ambient temperature of the housing 100 of the power supply device.
It is understood that the first sidewall of the housing 100 of the power supply apparatus refers to a back sidewall of the housing 100, and is mainly used for heat dissipation of the power device. The specific number of the internal cooling fans 32 and the internal cooling radiators 31 in the internal heat dissipation module can be set according to actual needs, for example, as shown in fig. 1, the number of the internal cooling fans 32 and the internal cooling radiators 31 is at least one.
In the present embodiment, as shown in fig. 1, the outer heat dissipation module includes at least one outer cooling fan 34 and at least one outer cooling radiator 33; the external cooling heat sink 33 is mounted on the outer side of the first sidewall and attached to the heating surface 420 of the TEC chip 400, so that the TEC chip 400 transfers heat generated by operation to the external cooling heat sink 33. The external cooling fan 34 is installed at any side of the external cooling heat sink 33 adjacent to the first side wall, so that the cold air of the external cooling fan 34 blows towards the external cooling heat sink 33, thereby improving the heat dissipation efficiency of the external cooling heat sink 33 and ensuring the normal operation of the TEC chip 400.
It is understood that the specific number of the external cooling fans 34 and the external cooling radiators 33 in the external heat dissipation module can be set according to actual needs, for example, as shown in fig. 1, the number of the external cooling fans 34 and the external cooling radiators 33 is at least one.
It will also be understood that there are various mounting orientations of the outer cooling fan 34, and a preferred embodiment is that the outer cooling fan 34 is mounted to the lower side wall of the outer cooling radiator 33 such that the wind direction of the outer cooling fan 34 is vertically upward to be perpendicular to the horizontal wind direction of the inner cooling fan 32. Thereby further improving the cooling effect of the outside cooling fan 34 by the rising of the heat.
In this embodiment, as shown in fig. 3, the internal cooling heat sink 31 includes a first heat dissipation substrate 310, and the external cooling heat sink 33 includes a second heat dissipation substrate 330. The cooling surface 410 of the TEC chip 400 is attached to the first heat sink substrate 310 through the heat conductive material 500, and the heating surface 420 of the TEC chip 400 is attached to the second heat sink substrate 330 through the heat conductive material 500. Therefore, when the hot air of the internal cooling fan 32 blows to the first heat dissipation substrate 310, the first heat dissipation substrate 310 is refrigerated through the refrigeration surface 410, so that the hot air blown by the internal cooling fan 32 at a lower temperature can be rapidly cooled, and the heat dissipation efficiency of the internal heat dissipation module can be effectively improved. Meanwhile, the external cooling fan 34 blows cold air to the second heat dissipation substrate 320, so that the cold air flow generated by the external cooling fan 34 blows away the hot air flow generated by the internal cooling fan 32 and lowers the temperature; meanwhile, when the cold air of the external cooling fan 34 passes through the second heat dissipation substrate 320, the heat of the heating surface 420 absorbed by the second heat dissipation substrate 320 can be dissipated, so as to ensure that the TEC chip 400 can normally operate.
It can be understood that, under normal conditions, when the inner loop temperature of the closed power supply device exceeds the normal operating temperature of the components, the inner cooling radiator 31 can be cooled and the outer cooling radiator 33 can be heated by inputting forward direct current to the TEC chip 400, and the cooling capacity is in direct proportion to the input current of the TEC chip. Therefore, the temperature of the closed power supply can be reduced to be within the specification range of all components by adjusting the input current of the TEC chip 400.
In addition, under the extreme low temperature working condition, the inner cooling radiator 31 is heated and the outer cooling radiator 33 is cooled by switching the current direction of the TEC chip 400, and the heating amount can be adjusted by inputting current. Thus, the power supply equipment can be smoothly started at extremely low temperature by heating the inner ring temperature.
It can also be understood that the heat conducting material 500 is the prior art, and the commonly used heat conducting material 500 comprises a heat conducting silica gel sheet, a heat conducting insulating sheet, heat conducting silicone grease and the like; the skilled person can select the desired one according to the actual need.
Specifically, as shown in fig. 3, each of the inner cooling radiator 31 and the outer cooling radiator 33 includes a plurality of cooling fins 300. For further convenience of cooling, the planes formed by the cooling fins 300 corresponding to the inner cooling radiator 31 and the outer cooling radiator 33 are parallel to each other. Thus, the hot air blown by the inner cooling fan 32 can be brought into good contact with the cold air blown by the outer cooling fan 34.
In this embodiment, as shown in fig. 1, the cooling system for the internal ring temperature of the power supply device further includes a main power radiator 35; the main power heat sink 35 is disposed on a side wall of the housing 100 of the power supply apparatus and directly faces the main power device 200 of the power supply apparatus, so as to dissipate heat of the main power device 200 of the power supply apparatus.
Specifically, as shown in fig. 1, the main power devices 200 of the power supply apparatus are all mounted on the main power PCBA210, and the main power PCBA210 is attached to the main power heat sink 35, so that the main power devices 200 transfer heat to the main power heat sink 35 through the main power PCBA210 to dissipate the heat.
It will be appreciated that the conventional way of dissipating heat from the power supply apparatus is to cool the main power device 200 through the main power heat sink 35. However, there are still a lot of secondary heating devices without direct conduction paths to the outside, and the heat can only be dissipated into the sealed casing 100 of the power supply device, so that the enthalpy of the air inside the power supply device increases, and the temperature of the inner ring increases to above 95 ℃. Therefore, after the cooling system of the application is adopted by the power supply equipment, the internal heat of the shell 100 of the power supply equipment can be effectively released in a flowing manner with the outside, and the internal ring temperature of the power supply equipment can be effectively kept below 85 ℃.
The foregoing has described the general principles, essential features, and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, which are merely illustrative of the principles of the application, but that various changes and modifications may be made without departing from the spirit and scope of the application, and these changes and modifications are intended to be within the scope of the application as claimed. The scope of protection claimed by this application is defined by the following claims and their equivalents.
Claims (9)
1. A cooling system of power supply unit inner ring temperature, its characterized in that includes:
the inner heat dissipation module is arranged on the inner side of the shell of the power supply equipment and is used for dissipating heat inside the power supply equipment to the outside; and
the refrigeration module is arranged on the inner side of the shell of the power supply equipment and connected with the inner heat dissipation module, and the refrigeration module is suitable for refrigerating the inner heat dissipation module.
2. The system for cooling an internal ring temperature of a power supply apparatus according to claim 1, wherein: the refrigeration module comprises at least one TEC chip; the TEC chip is attached to the inner heat dissipation module through a refrigerating surface, and the heating surface of the TEC chip is communicated with the outside to dissipate heat.
3. The system for cooling an internal ring temperature of a power supply apparatus according to claim 2, wherein: the cooling system for the internal ring temperature of the power supply equipment also comprises an external heat dissipation module; the outer heat dissipation module is arranged on the outer side of the shell of the power supply equipment and is in fit connection with the heating surface of the TEC chip; so that the inner heat dissipation module and the outer heat dissipation module form a heat dissipation cycle through the refrigeration module.
4. The system for cooling an internal ring temperature of a power supply apparatus according to claim 3, wherein: the inner heat dissipation module comprises at least one inner cooling fan and at least one inner cooling radiator; the inner cooling radiator is arranged on the inner side of the first side wall of the shell of the power supply equipment and attached to the refrigerating surface of the TEC chip, and the inner cooling fan is arranged on one side of the inner cooling radiator.
5. The system for cooling an internal ring temperature of a power supply apparatus according to claim 4, wherein: the outer heat dissipation module comprises at least one outer cooling fan and at least one outer cooling radiator; the external cooling radiator is arranged on the outer side of the first side wall and attached to the heating surface of the TEC chip; the external cooling fan is arranged on any side of the external cooling radiator adjacent to the first side wall.
6. The system for reducing temperature of an internal ring temperature of a power supply apparatus according to claim 5, wherein: the inner cooling radiator comprises a first radiating substrate, and the outer cooling radiator comprises a second radiating substrate; the refrigeration surface of the TEC chip is attached to the first heat dissipation substrate through a heat conduction material, and the heating surface of the TEC chip is attached to the second heat dissipation substrate through a heat conduction material.
7. The system for reducing temperature of an internal ring temperature of a power supply apparatus according to any one of claims 3 to 6, wherein: the inner heat dissipation module and the outer heat dissipation module are located above a main power device in the power supply equipment.
8. The system for cooling an internal ring temperature of a power supply apparatus according to claim 1, wherein: the cooling system for the internal ring temperature of the power supply equipment also comprises a main power radiator; the main power radiator is arranged on the side wall of the shell of the power supply equipment and is right opposite to a main power device of the power supply equipment so as to be used for radiating the main power device of the power supply equipment.
9. The system for cooling an internal ring temperature of a power supply apparatus according to claim 8, wherein: the main power device of the power supply equipment is installed on a main power PCBA, and the main power PCBA is attached to the main power radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222515933.7U CN218770826U (en) | 2022-09-22 | 2022-09-22 | Cooling system for internal ring temperature of power supply equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222515933.7U CN218770826U (en) | 2022-09-22 | 2022-09-22 | Cooling system for internal ring temperature of power supply equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218770826U true CN218770826U (en) | 2023-03-28 |
Family
ID=85695587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222515933.7U Active CN218770826U (en) | 2022-09-22 | 2022-09-22 | Cooling system for internal ring temperature of power supply equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218770826U (en) |
-
2022
- 2022-09-22 CN CN202222515933.7U patent/CN218770826U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108807313B (en) | Microelectronic device heat dissipation device | |
| TW201724959A (en) | Thermoelectric cooling module and heat dissipation apparatus including the same | |
| WO2011150798A1 (en) | Tec refrigerating installation and electrical apparatus using same | |
| CN113793837A (en) | Self-sensing temperature control system of chip | |
| CN112286325A (en) | External radiator of notebook computer | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| KR20100060756A (en) | A thermoelectric cooling device for liqiid type | |
| CN218385194U (en) | Chip packaging heat dissipation mechanism | |
| CN113677159B (en) | Water-cooling and air-cooling compatible heat dissipation device | |
| CN103138183A (en) | Semiconductor refrigeration radiator for sealed power distribution cabinet | |
| CN214581475U (en) | Air conditioner outdoor unit and air conditioner | |
| EP3927127B1 (en) | Electrical device using cooling device | |
| KR20040061286A (en) | Hybrid heat exchanger having tec and heat pipe | |
| US20050047085A1 (en) | High performance cooling systems | |
| CN108630640B (en) | Integrated radiator with temperature gradient | |
| CN112130644A (en) | Optical module heat dissipation equipment and server | |
| CN206531339U (en) | A kind of refrigerator | |
| CN218451050U (en) | Cooling system for inner ring temperature | |
| CN217685509U (en) | Radiator and air condensing units | |
| CN219303715U (en) | Controller of hydrogen fuel cell system | |
| CN209842547U (en) | High-efficiency energy-saving combined radiator | |
| CN213338634U (en) | External radiator of notebook computer | |
| CN219761793U (en) | Electric cabinet equipment, temperature control system and injection molding machine | |
| CN214891556U (en) | Radiating assembly, radiator and air conditioner outdoor unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |