CN214891556U - Cooling components, radiators and air conditioner outdoor units - Google Patents
Cooling components, radiators and air conditioner outdoor units Download PDFInfo
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- CN214891556U CN214891556U CN202120485648.8U CN202120485648U CN214891556U CN 214891556 U CN214891556 U CN 214891556U CN 202120485648 U CN202120485648 U CN 202120485648U CN 214891556 U CN214891556 U CN 214891556U
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Abstract
本申请涉及空气调节技术领域，公开一种散热组件，包括翅片和相变传热折弯板，相变传热折弯板包括多个平板段和连接相邻两个平板段的折弯段，其中，相变传热折弯板具有第一平板段，第一平板段为相变传热折弯板的中间平板段，且，第一平板段用于与热源接触；相变传热折弯板内部填充有传热工质，传热工质流通多个平板段；翅片设置于相邻两个平板段之间。本申请的散热组件能够解决散热器的散热效果差的问题。本申请还公开一种含有上述散热组件的散热器和空调室外机。
The application relates to the technical field of air conditioning, and discloses a heat dissipation assembly, which includes fins and a phase-change heat transfer bent plate. The phase-change heat transfer bent plate includes a plurality of flat plate segments and a bent segment connecting two adjacent flat plate segments. , wherein the phase change heat transfer bending plate has a first flat plate section, the first flat plate section is the middle flat plate section of the phase change heat transfer bending plate, and the first flat plate section is used to contact the heat source; the phase change heat transfer bending plate The inside of the bent plate is filled with a heat transfer medium, and the heat transfer medium flows through a plurality of flat plate segments; the fins are arranged between two adjacent flat plate segments. The heat dissipation assembly of the present application can solve the problem of poor heat dissipation effect of the heat sink. The present application also discloses a radiator and an air conditioner outdoor unit comprising the above-mentioned heat dissipation assembly.
Description
Technical Field
The present application relates to the field of air conditioning technologies, and for example, to a heat dissipation assembly, a heat sink, and an outdoor unit of an air conditioner.
Background
The frequency conversion power device is an important component in the frequency conversion air conditioner, and the higher the frequency of the compressor is, the more the heat productivity of the frequency conversion power device is. In addition, as the design of the variable frequency power device is more and more compact, the heat flow and the power density of the variable frequency power device in the working process are continuously increased. Therefore, the heat dissipation problem of the variable frequency power device seriously affects the stable operation of the air conditioner, and particularly affects the refrigeration performance and reliability of the air conditioner under the high ambient temperature working condition.
For a multi-split air conditioner, a frequency conversion power device is mainly packaged by an Insulated Gate Bipolar Transistor (IGBT) array and a rectifier bridge chip, which is called a frequency conversion module for short. The frequency conversion module generally carries out heat dissipation and cooling in an air cooling aluminum fin mode. However, under the working condition of high ambient temperature, the aluminum fin radiator cannot effectively radiate the frequency conversion module with high heat flux density and high power, so that the temperature of the frequency conversion module is rapidly increased. In order to ensure the safety of the frequency conversion module and avoid the frequency conversion module from being burnt out due to overheating, the frequency conversion module is generally prevented from having too high temperature by adopting a compressor frequency reduction mode, but the refrigeration capacity of the air conditioner is greatly attenuated under the high-ambient-temperature working condition due to the frequency reduction.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
the heat dissipation capacity of the existing radiator to the frequency conversion module is insufficient under the high-environment-temperature refrigeration working condition, so that the air conditioner is subjected to frequency reduction greatly, and the refrigeration effect of the air conditioner is poor under the high-environment-temperature working condition.
SUMMERY OF THE UTILITY MODEL
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a heat dissipation assembly, a heat radiator and an air conditioner outdoor unit, so as to solve the problem of poor heat dissipation effect of the heat radiator.
In some embodiments, a heat dissipation assembly, comprising: the phase-change heat transfer bending plate comprises a plurality of flat plate sections and bending sections for connecting two adjacent flat plate sections, wherein the phase-change heat transfer bending plate is provided with a first flat plate section which is a middle flat plate section of the phase-change heat transfer bending plate, and the first flat plate section is used for being in contact with a heat source; the phase-change heat transfer bending plate is internally filled with a heat transfer working medium, and the heat transfer working medium flows through the plurality of flat plate sections; the fins are arranged between two adjacent flat plate sections.
In some embodiments, the fins are folded fins.
In some embodiments, the phase change heat transfer bent plate further comprises a second plate section, the second plate section is adjacent to the first plate section, and the second plate section is an end plate section of the phase change heat transfer bent plate.
In some embodiments, the fins include a first folded fin attached to the first plate segment and a second folded fin attached to the second plate segment.
In some embodiments, the phase change heat transfer bend plate further comprises a distal plate segment, the distal plate segment being adjacent to the second plate segment.
In some embodiments, the phase change heat transfer bending plate is a micro-groove flat plate tube plate or a blowing plate.
In some embodiments, the phase change heat transfer bending plate is a micro-groove flat plate tube circuit plate, wherein a plurality of channels are arranged in the micro-groove flat plate tube circuit plate, and the channels are parallel to each other.
In some embodiments, the heat sink includes a heat dissipating component as previously described and a base in thermally conductive contact with the heat dissipating component.
In some embodiments, the base comprises a first surface and a second surface which are opposite, wherein the first surface is provided with a first groove, and a temperature equalizing plate is arranged in the first groove; the first plate section of the heat dissipation assembly is arranged on the second surface of the base.
In some embodiments, the outdoor unit of the air conditioner includes the heat sink as described above.
The heat dissipation assembly, the radiator and the air conditioner outdoor unit provided by the embodiment of the disclosure can realize the following technical effects:
the heat dissipation assembly provided by the embodiment of the disclosure comprises a phase-change heat transfer bending plate and fins, wherein the phase-change heat transfer bending plate comprises a plurality of flat plate sections, two adjacent bending sections are connected through the bending sections, and the fins are arranged between the two adjacent flat plate sections. The phase-change heat transfer bending plate is filled with heat transfer working media, and the heat transfer working media flow among the plurality of flat plate sections. After the heat dissipation assembly receives heat, the temperature of the heat transfer working medium in the phase-change heat transfer bending plate rises, the heat transfer working medium with the raised temperature flows among the plurality of flat plate sections of the phase-change heat transfer bending plate, the temperature uniformity of the heat dissipation assembly is improved, and meanwhile, the fins arranged between every two adjacent flat plate sections increase the heat dissipation area of the heat dissipation assembly and improve the heat dissipation efficiency of the heat dissipation assembly. Moreover, the middle flat plate section of the phase-change heat transfer bending plate is in contact with a heat source, namely, the evaporation end is arranged at the middle flat plate section of the phase-change heat transfer bending plate, the condensation end is arranged at the end flat plate section of the phase-change heat transfer bending plate, and after the evaporation section positioned at the middle part is heated, the heat transfer working medium with higher temperature can simultaneously flow to the two end flat plate sections, so that the two end flat plate ends simultaneously play a role in heat dissipation, and the heat dissipation efficiency of the heat dissipation assembly is improved. The frequency conversion module of the air conditioner outdoor unit is cooled by the cooling assembly provided by the embodiment of the disclosure, so that the refrigeration effect of the air conditioner under the high-ambient-temperature working condition is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is a schematic structural diagram of a heat dissipation assembly provided in an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a phase change heat transfer bending plate provided by an embodiment of the disclosure;
FIG. 3 is a schematic structural view of a folded fin provided by an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a microchannel flat plate circuit board according to an embodiment of the disclosure;
FIG. 5 is a schematic structural diagram of a microchannel flat plate manifold provided in an embodiment of the present disclosure;
FIG. 6 is a schematic structural view of an inflation panel provided by embodiments of the present disclosure;
FIG. 7 is another schematic structural view of an inflation panel provided by embodiments of the present disclosure;
fig. 8 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;
fig. 9 is another schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;
FIG. 10 is a schematic view of a base structure provided by an embodiment of the present disclosure;
fig. 11 is another schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;
fig. 12 is a schematic partial structure view of an outdoor unit of an air conditioner according to an embodiment of the present disclosure.
Reference numerals:
10: a heat dissipating component; 11: a flat plate section; 1101: a first plate segment; 1102: a second plate section; 1103: a distal plate segment; 12: bending sections; 13: folding the fins; 131: a first folded fin; 132: a second folded fin; 101: the radiator is arranged on the upper side; 102: the radiator is arranged at the lower side; 111: an evaporation end; 112: a condensing end; 1010: a micro-groove flat plate pipe circuit board; 1011: a microchannel flat plate pipe circuit board shell; 1012: a channel; 1013: a heat transfer working medium; 1014: a capillary structure; 1020: rolling a block pipeline expansion plate; 1021: rolling blocks; 1030: a honeycomb pipeline blowing plate; 1031: rolling points; 20: a base; 201: a first groove; 202: a second groove; 21: a heat source chip fixing region; 30: a temperature equalizing plate; 40: a fan; 50: a door body; 60: a frequency conversion module mounting part; 70: a compressor; 800: an air inlet; 900: and (7) air outlet.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.
The term "plurality" means two or more unless otherwise specified.
In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
The disclosed embodiment provides a heat sink assembly 10, as shown in fig. 1-7.
The heat dissipation assembly 10 provided by the embodiment of the present disclosure includes a phase change heat transfer bending plate and fins 13. The phase change heat transfer bending plate comprises a plurality of flat plate sections 11 and bending sections 12 connecting two adjacent flat plate sections 11, the phase change heat transfer bending plate is provided with a first flat plate section 1101, the first flat plate section 1101 is a middle flat plate section of the phase change heat transfer bending plate, and the first flat plate section 1101 is used for being in contact with a heat source; the phase-change heat transfer bending plate is internally filled with a heat transfer working medium 1013, and the heat transfer working medium 1013 circulates the plurality of flat plate sections 11. The fins 13 are disposed between the adjacent two flat plate segments 11.
Optionally, the plurality of flat plate sections 11 and the bending section 12 are integrally formed, and after bending, the phase change heat transfer bending plate is obtained. Alternatively, heat transfer medium 1013 may be a medium, such as a refrigerant, that may undergo phase changes in gaseous and liquid states. Phase change heat transfer is bent inside packing of board and is had heat transfer working medium 1013, and heat transfer working medium 1013 can be in a plurality of flat plate section 11 flows of phase change heat transfer board of bending, with heat transfer to a plurality of flat plate section 11, has improved radiator unit 10's temperature uniformity nature, makes a plurality of flat plate section 11 dispel the heat simultaneously, has improved radiator unit 10's heat radiating area, and then has improved radiator unit 10's radiating efficiency. It will be appreciated that the interior of the bend 12 is in communication with the interior of the slab 11.
In the embodiment of the present application, as shown in fig. 1, the phase change heat transfer bending plate has a first plate segment 1101, and the first plate segment 1101 is a middle plate segment of the phase change heat transfer bending plate. Alternatively, the first flat plate segment 1101 and the heat source may be in direct contact, for example, the first flat plate segment 1101 and the heat source chip are in direct contact, so as to conduct heat conduction and dissipation; alternatively, the first plate segment 1101 may also be in indirect contact with a heat source through the susceptor 20, for example, the first plate segment 1101 is disposed on one surface of the susceptor 20, a heat source chip is disposed on the other surface of the susceptor 20, and the first plate segment 1101 is fixed by the connection of the susceptor 20 and in indirect contact with the heat source chip. As shown in fig. 11, the first plate segment 1101 is defined as an evaporation end 111, and the other plate segments of the phase change heat transfer bending plate are condensation ends 112, that is, the evaporation end 111 is in a middle plate segment of the phase change heat transfer bending plate, in the embodiment shown in fig. 1, the first plate segment 1101 is the first plate segment 1101, and after the first plate segment 1101 located in the middle is heated as the evaporation end 111, the heat transfer medium 1013 with higher temperature can simultaneously flow to the two end plate segments, that is, in the implementation shown in fig. 1, the second plate segment 1102 and the far end plate segment 1103 make the two end plate segments simultaneously exert heat dissipation effects, so that the heat dissipation efficiency of the heat dissipation assembly 10 is improved.
And bending the phase change heat transfer plates formed by integrally forming the flat plate sections 11 and the bending sections 12 to obtain the phase change heat transfer bending plate. The intermediate plate section may be understood as being located in the middle of the phase change heat transfer plate, where the middle is not necessarily limited to an absolutely central position as long as it is not both end portions of the phase change heat transfer plate. The evaporation end 111 located in the middle of the phase change heat transfer plate directly contacts with the heat source chip, and after being heated, the heat transfer working medium 1013 with higher temperature can simultaneously flow to the two end portions, so that the two end portions of the phase change heat transfer plate can simultaneously dissipate heat, and the heat dissipation efficiency of the heat dissipation assembly 10 is improved. The heat dissipation assembly 10 provided by the embodiment of the present disclosure includes a phase change heat transfer bending plate and fins 13, after the heat dissipation assembly 10 receives heat, the temperature of the heat transfer working medium 1013 in the first plate section 1101 rises, after the temperature of the heat transfer working medium 1013 rises, the liquid state changes into the gas state, the heat transfer working medium 1013 flows between the plurality of plate sections 11 of the phase change heat transfer bending plate, the temperature uniformity of the heat dissipation assembly 10 is improved, meanwhile, the fins 13 arranged between two adjacent plate sections 11 increase the heat dissipation area of the heat dissipation assembly 10, and the heat dissipation efficiency of the heat dissipation assembly 10 is improved. In the embodiment shown in fig. 1, the first flat plate segment 1101 is a middle flat plate segment of the phase change heat transfer bending plate, and after the evaporation end 111 located in the middle is heated, the heat transfer working medium 1013 with a higher temperature can flow to the two end flat plate segments at the same time, so that the two end flat plate segments exert the heat dissipation effect at the same time, and the heat dissipation efficiency of the heat dissipation assembly 10 is further improved. The heat dissipation assembly 10 provided by the embodiment of the disclosure is adopted to dissipate heat of the frequency conversion module of the air conditioner outdoor unit, so that the refrigeration effect of the air conditioner under the high-ambient-temperature working condition is improved.
Optionally, the fins 13 are folded fins.
As shown in fig. 3, the folding fins are arranged between the adjacent flat plate sections of the phase change heat transfer bending plate, and the surface area of the folding fins is large, so that the heat dissipation area of the heat dissipation assembly 10 is increased, and the heat dissipation efficiency of the heat dissipation assembly 10 is improved.
Optionally, the phase change heat transfer bending plate further includes a second plate segment 1102, the second plate segment 1102 is adjacent to the first plate segment 1101, and the second plate segment 1102 is an end plate segment of the phase change heat transfer bending plate.
As shown in fig. 1, a first plate section 1101 is a middle plate section of the phase-change heat transfer bending plate, a second plate section 1102 is an end plate section of the phase-change heat transfer bending plate and is adjacent to the first plate section 1101, wherein the first plate section 1101 is in contact with a heat source, so that an evaporation end 111 located in the middle is heated, and a heat transfer medium 1013 with a raised temperature can flow to the two end plate sections after being gasified, so that the two end plate sections can exert a heat dissipation effect at the same time, thereby improving the heat dissipation efficiency of the heat dissipation assembly 10, and the heat transfer medium 1013 after being dissipated is liquefied and then flows back to the first plate section 1101 from the two end plate sections.
Optionally, the fins 13 comprise a first folded fin 131 and a second folded fin 132, wherein the first folded fin 131 is attached to the first plate segment 1101, and the second folded fin 132 is attached to the second plate segment 1102.
As shown in fig. 1, the phase change heat transfer bending plate includes a first plate segment 1101 and a second plate segment 1102 which are adjacent to each other, a first folding fin 131 and a second folding fin 132 are disposed between the first plate segment 1101 and the second plate segment 1102, that is, two sets of folding fins are disposed between the first plate segment 1101 and the second plate segment 1102, wherein a first end of the first folding fin 131 is attached to the first plate segment 1101, a first end of the second folding fin 132 is attached to the second plate segment 1102, and a second end of the first folding fin 131 and a second end of the second folding fin 132 are attached to each other. Alternatively, the second end of the first folding fin 131 and the second end of the second folding fin 132 may not contact each other.
The phase change heat transfer that this application embodiment provided is inside to be filled with heat transfer working medium 1013, and, heat transfer working medium 1013 circulates between first flat section 1101 and second flat section 1102, the temperature uniformity of phase change heat transfer bending plate has been improved, and simultaneously, first flat section 1101 laminates with first folding fin 131 mutually, second flat section 1102 laminates with second folding fin 132 mutually, the heat radiating area of radiator unit 10 has been increased, the combination of phase change heat transfer bending plate and folding fin, the radiating efficiency of radiator unit 10 has been improved. Alternatively, the fixing manner between the folded fin and the plurality of flat plate segments 11 may be soldering, heat conductive silicone adhesive, or bolt fixing, etc.
Optionally, the phase change heat transfer bending plate further comprises a distal flat plate section 1103, and the distal flat plate section 1103 is adjacent to the second flat plate section 1102.
In the embodiment of the present application, a plate segment far from the first plate segment 1101 and adjacent to the second plate segment 1102 is defined as a distal plate segment 1103, and it is understood that the second plate segment 1102 and the distal plate segment 1103 are the condensation end 112.
Alternatively, the number of the distal flat plate segments 1103 of the phase change heat transfer bending plate may be 1. As shown in fig. 1, the phase change heat transfer bending plate has 1 far-end flat plate segment 1103, and the far-end flat plate segment 1103 is disposed adjacent to a second flat plate segment 1102, where the second flat plate segment 1102 is an end flat plate segment of the phase change heat transfer bending plate, and 2 groups of folding fins are disposed between the first flat plate segment 1101 and the second flat plate segment 1102, that is, one end of the first folding fin 131 is attached to the first flat plate segment 1101, and one end of the second folding fin 132 is attached to the second flat plate segment 1102; 1 set of folding fins is arranged between the second flat plate section 1102 and the far-end flat plate section 1103, that is, one folding end of each folding fin is attached to the second flat plate section 1102, and the other folding end of each folding fin is attached to the far-end flat plate section 1103. It can be understood that the first plate section 1101 is an evaporation end 111, the second plate section 1102 and the far-end plate section 1103 are condensation ends 112, that is, the evaporation end 111 is disposed in the middle of the phase-change heat transfer bending plate, and the condensation ends 112 are disposed at two ends of the phase-change heat transfer bending plate, so that the evaporation end 111 located in the middle is heated, and the heat transfer working medium 1013 with a higher temperature is gasified and then can flow to the two end plate sections at the same time, so that the two end plate sections exert the heat dissipation effect at the same time, and the heat dissipation efficiency of the heat dissipation assembly 10 is improved. Optionally, 2 groups of folding fins may be further disposed between the second flat plate section 1102 and the far-end flat plate section 1103, and a folding end of each group of folding fins is attached to the second flat plate section 1102 and the far-end flat plate section 1103 respectively, so that the heat dissipation area of the heat dissipation assembly 10 is increased, and the heat dissipation efficiency of the heat dissipation assembly 10 is further improved.
Optionally, the number of the distal flat plate segments 1103 of the phase change heat transfer bending plate may also be multiple, that is, the phase change heat transfer bending plate may include multiple distal flat plate segments 1103, and 1 set of folding fins may be disposed between adjacent distal flat plate segments 1103. Optionally, two sets of folded fins may be disposed between adjacent distal flat plate segments 1103, and the two sets of folded fins may be disposed as described above.
Optionally, the phase change heat transfer bending plate is a micro-groove flat plate tube plate 1010 or an inflation plate, as shown in fig. 4-7.
Optionally, the phase change heat transfer bending plate is a micro-groove flat plate tube plate 1010, wherein a plurality of channels 1012 are provided in the micro-groove flat plate tube plate 1010, and the channels 1012 are parallel to each other.
As shown in fig. 4 and 5, the micro-groove flat circuit board 1010 includes a micro-groove flat circuit board housing 1011, a plurality of channels 1012 are disposed inside the housing, the channels 1012 are not communicated with each other, a heat transfer medium 1013 is filled in the channels 1012, and a plurality of capillary structures 1014 are disposed on the side walls of the channels 1012. Capillary structure 1014 increases the contact area of channel 1012 and heat transfer medium 1013, increasing the heat dissipation efficiency of the micro-groove flat plate tube plate, and at the same time, capillary structure 1014 plays a role in antigravity, increasing the horizontal heat transfer efficiency of heat transfer medium 1013 in channel 1012. Optionally, the flat-plate-shaped micro-groove flat tube plate 1010 is bent to obtain the phase-change heat transfer bending plate. Optionally, the thickness of the micro-groove flat plate tube plate 1010 is 2-5mm, and the thermal conductivity is greater than 10000W/m.k.
In the usage state of the micro-grooved flat plate tube plate 1010, a plurality of inner grooves 1012 are parallel to each other and are arranged in sequence in the vertical direction, as shown in fig. 4. The micro-groove flat plate tube plate 1010 comprises a plurality of flat plate sections 11, wherein after one middle flat plate section 11 close to a heat source receives heat of the heat source, liquid working media in a plurality of grooves 1012 are heated and changed into gas state, gas state heat transfer working media 1013 flow in the grooves 1012, after other flat plate sections 11 dissipate heat, the liquid working media are changed into liquid state and flow back to one middle flat plate section close to the heat source, and therefore a heat dissipation cycle is completed.
Optionally, the channels 1012 inside the micro-fluted flat tube sheet 1010 are disposed obliquely.
The two ends of the micro-fluted plate manifold 1010 include a first end plate segment that is proximate to the heat source and a second end plate segment that is distal from the heat source, wherein the channels 1012 inside the micro-fluted plate manifold 1010 slope downwardly along the second end plate segment toward the first end plate segment. After the first end plate section close to the heat source receives the heat of the heat source, the liquid working medium in the plurality of channels 1012 is heated and changed into a gas state, the gas heat transfer working medium 1013 flows upwards in the channels 1012, and after the heat is dissipated by other plate sections 11 and changed into the liquid state, the gas heat transfer working medium 1013 flows back to the first end plate section under the action of gravity, so that the self-circulation efficiency of the heat transfer working medium 1013 inside the micro-groove flat plate circuit board 1010 is improved.
Optionally, the phase change heat transfer bending plate is an inflation plate, wherein the inflation plate comprises a plurality of rows of rolling blocks 1021, and the rolling blocks 1021 in two adjacent rows are arranged in a staggered manner.
The phase change heat transfer bending plate can also be an inflation plate, as shown in fig. 6 and 7. And after the interior of the blowing plate is vacuumized, a heat transfer working medium 1013 is poured. Optionally, the flat-plate-shaped blowing plate is bent to obtain the phase-change heat transfer bent plate. Optionally, the plurality of flat plate segments 11 of the blow plate communicate in the vertical direction.
As shown in fig. 6, the phase change heat transfer bending plate is a rolling block pipeline inflation plate 1020. The outer surface of the roll block pipeline inflation plate 1020 is provided with a plurality of roll blocks 1021 which are concave inwards, and optionally, the roll blocks 1021 are in the shape of round-corner rectangles. And bending the rolled block pipeline inflation plate 1020 to obtain the phase-change heat transfer bending plate. The interiors of the plurality of flat plate sections 11 of the rolling block pipeline inflation plate 1020 are communicated with each other, in a use state, the liquid heat transfer working medium 1013 is deposited on the lower portions of the plurality of flat plate sections 11 under the action of gravity, after being heated, the liquid heat transfer working medium 1013 becomes gaseous, rises in the flat plate sections 11, and flows back to the lower portions after heat is dissipated from the upper portions of the flat plate sections 11, so that a heat dissipation cycle is completed.
Optionally, the rolled block pipeline inflation plate 1020 includes a plurality of rows of rolled blocks 1021, and the rolled blocks 1021 in two adjacent rows are staggered, so that the inflation plate forms turbulent flow in the vertical direction, the length of the flow path of the heat transfer working medium 1013 in the vertical direction is increased, the contact area between the fin 13 and the heat transfer working medium 1013 in the rolled block pipeline inflation plate 1020 is increased, and the heat dissipation efficiency of the rolled block pipeline inflation plate 1020 is improved.
Alternatively, the rolls 1021 of the roll block tunnel inflation plate 1020 are arranged obliquely so that the flow path in the roll block tunnel inflation plate 1020 is cut obliquely upwards, as shown in fig. 6. After being heated, the heat transfer working medium 1013 in the rolling block pipeline inflation plate 1020 becomes gaseous, and the gaseous working medium carries part of the liquid working medium to move upwards in the inclined flow path, so that the retention height of the liquid working medium in the rolling block pipeline inflation plate 1020 is increased, the gaseous heat transfer working medium 1013 flows to the higher part of the flow path, and the overall utilization rate of the rolling block pipeline inflation plate 1020 is increased.
Optionally, the phase change heat transfer bending plate is a honeycomb pipeline inflation plate 1030.
As shown in fig. 7, the phase change heat transfer bending plate is a honeycomb pipeline blowing plate 1030. Honeycomb pipeline inflation board 1030 includes multirow nip 1031, and nip 1031 staggered arrangement in two adjacent lines makes the inflation board form the vortex in vertical direction, has improved heat transfer working medium 1013 length of flow path in vertical direction, and then has improved the area of contact of heat transfer working medium 1013 in fin 13 and honeycomb pipeline inflation board 1030, has improved honeycomb pipeline inflation board 1030's radiating efficiency.
The embodiment of the disclosure also provides a radiator.
The heat sink provided by the embodiment of the present disclosure includes the heat dissipation assembly 10 and the base 20 in thermal conductive contact with the heat dissipation assembly 10. As shown in fig. 8-11.
Alternatively, in the case that the area of the base 20 is smaller than the area of the end surface of the heat dissipation assembly 10, the base 20 is disposed inside or outside the end portion of the heat dissipation assembly 10, the heat source is fixed on the base 20, and the end portion of the heat dissipation assembly 10 conducts heat with the heat source through the base 20. Alternatively, in the case that the area of the base 20 is larger than the area of the end surface of the heat dissipation assembly 10, one end of the heat dissipation assembly 10 is disposed on one surface of the base 20, the heat source is fixed on the other surface of the base 20, and the heat dissipation assembly 10 conducts heat with the heat source through the base 20.
Optionally, the base 20 includes a first surface and a second surface opposite to each other, the first surface is provided with a first groove 201, the temperature equalizing plate 30 is disposed in the first groove 201, and the first plate segment 1101 of the heat dissipating assembly 10 is disposed on the second surface of the base 20.
As shown in fig. 9 and 10, the dotted line frame shown in fig. 9 and 10 is a fixing region of the heat source chip of the inverter module on the first surface of the base 20.
The base 20 directly contacts with a heat source chip of the frequency conversion module to transfer heat to the heat dissipation assembly 10, and the temperature equalization plate 30 is arranged in the first groove 201 on the first surface of the base 20, so that the heat transfer and temperature equalization effects of the base 20 are improved. Optionally, as shown in fig. 9, the base 20 is a large base, and the size of the base 20 is much larger than the contact area with the heat source chip of the frequency conversion module, and optionally, the base 20 may also be a small base, and the distance from the edge of the first surface of the base 20 to the edge corresponding to the heat source chip of the frequency conversion module is greater than or equal to 10mm, or the distance from the edge of the first surface of the base 20 to the edge corresponding to the heat source chip of the frequency conversion module is less than or equal to 15-30 mm.
As shown in fig. 11, the phase change heat transfer bending plate includes a first flat plate segment 1101 directly attached to the base 20, the flat plate segment 11 is defined as an evaporation end 111, and the other flat plate segments 11 of the phase change heat transfer bending plate are defined as a condensation end 112. Alternatively, when the base 20 is a small base, the base 20 can be disposed outside the evaporation end 111, or can be disposed inside the evaporation end 111. When the base 20 is disposed inside the evaporation end 111, the outer side surface of the evaporation end 111 directly contacts with the heat conducting chip of the frequency conversion module for heat transfer.
Optionally, the base 20 may be a plate made of copper or aluminum, the temperature-uniforming plate 30 may be a micro-groove flat plate tube plate 1010, a copper plate, a phase-change heat pipe, a graphite aluminum plate, a graphite copper plate, or a graphene heat-conducting film, and the angle at which the temperature-uniforming plate 30 is embedded in the first groove 201 may be horizontal, vertical, or any other angle. The temperature equalizing plate 30 arranged in the first groove 201 improves the temperature equalizing performance of the radiator. Alternatively, the evaporation end 111 and the second surface of the base 20 may be fixed by soldering, gluing or bolting with a heat conducting structure.
Optionally, the second surface of the base 20 is provided with a second groove 202, wherein the first flat plate section 1101 of the heat dissipation assembly 10 is disposed in the second groove 202. The evaporation end 111 of the phase change heat transfer bending plate is embedded in the second groove 202 of the base 20, so that the heat transfer efficiency between the base 20 and the phase change heat transfer bending plate is improved.
The embodiment of the disclosure also provides an air conditioner outdoor unit comprising the radiator.
Optionally, the outdoor unit of an air conditioner further includes: set up in the fan 40 at air condensing units top, and, the frequency conversion module of vertical installation, wherein, the first surface and the frequency conversion module heat conduction of the base 20 of radiator are connected, the frequency conversion module carries out the heat exchange with the base 20 of radiator, the heat of frequency conversion module transmits the radiator 10 to the radiator through base 20, radiator 10 is located the air inlet wind path of fan 40, the air current acts on radiator 10, carry out the forced air cooling heat dissipation to a plurality of flat sections 11 of radiator 10, the air current blows off the radiator with the heat that flat section 11 carried, the radiating efficiency of radiator has been improved, and then the radiating effect of radiator to frequency conversion module has been promoted, simultaneously, the air current can also blow off frequency conversion module with the partial heat that frequency conversion module work generated heat, play and carry out the mesh of heat dissipation cooling to frequency conversion module.
Fig. 12 is a vertical cross-sectional view of the micro-grooved flat tube substrate 1010 in the installed state of the heat sink in the outdoor unit of the air conditioner, in the installed state of the base 20. Optionally, the outdoor unit of the air conditioner includes an air outlet 900 at the top and an air inlet 800 arranged in the circumferential direction. In practical application, air is discharged from the top of the air conditioner outdoor unit, and air is circumferentially supplied. As shown in fig. 12, the air inlet 800 is disposed on a side wall of a casing of the outdoor unit, and an air flow enters from a side of the outdoor unit under a suction action of the fan 40, then flows upward, passes through the fan 40, and is discharged from the air outlet 900. Wherein, the air inlet direction of the air inlet 800 is crossed or vertical to the air outlet direction of the air outlet 900.
In practical application, the base 20 and the heat source chip of the frequency conversion module can be connected through screws or bolts, and can be welded or bonded through heat-conducting silica gel. Thus, the base 20 is favorably and closely attached to the heat source chip of the frequency conversion module, and the heat exchange efficiency is improved.
Optionally, the fins of the folded fins are perpendicular to the top of the outdoor unit of the air conditioner. The air inlet flow of the air conditioner outdoor unit enters from the bottom of the gap of the folding fin, flows out from the top of the gap after flowing through the surface of the folding fin, blows heat away from the folding fin, and performs air cooling on the folding fin. The fins in the folding fins are perpendicular to the top of the air conditioner outdoor unit, namely the fins in the folding fins are perpendicular to the plane where the fan 40 is located, so that air flows through the folding fins of the radiator under the action of the fan 40 and fully contacts the surface of each fin in the folding fins, and the heat dissipation efficiency of the folding fins is improved. Similarly, the flat plate section 11 of the phase change heat transfer bending plate is perpendicular to the top of the air conditioner outdoor unit.
Optionally, the heat sink assembly 10 is located directly below the fan 40. Therefore, the air-cooled radiating effect of the airflow on the radiating component 10 can be improved, the radiating efficiency of the radiator is improved, and the radiating effect of the radiator on the frequency conversion module is further improved.
Optionally, as shown in fig. 12, the outdoor unit of an air conditioner is a multi-split outdoor unit of an air conditioner, the multi-split outdoor unit of an air conditioner includes a door body 50, a frequency conversion module mounting portion 60 is disposed on a front surface of the door body 50, a frequency conversion module is vertically mounted inside the frequency conversion module mounting portion 60, and a first surface of the base 20 of the heat sink is in heat conduction connection with a heat source chip of the frequency conversion module.
Fig. 12 shows a partial structure in a rear view projection of the outdoor unit of the air conditioner. Here, the "front surface of the door body 50" may be understood as a surface facing a user. The top of the air conditioner outdoor unit is used for air outlet, and the circumferential direction of the air conditioner outdoor unit is used for air inlet. Airflow entering from the circumferential direction of the air conditioner outdoor unit flows through the frequency conversion module mounting portion 60, so that the frequency conversion module mounted in the frequency conversion module mounting portion 60 and the radiator in heat conduction contact with the heat source chip of the frequency conversion module are cooled. The frequency conversion module mounting portion 60 is fixedly connected to the front surface of the door body 50.
Optionally, two heat sinks are laterally disposed side-by-side at the back of the inverter module mounting portion 60.
Through setting up two radiators, be favorable to further improvement to frequency conversion module's radiating efficiency. The high-efficiency phase change heat transfer of the heat dissipation assembly 10 of the heat sink improves the temperature uniformity and heat dissipation efficiency of the heat sink as a whole. Under the high-temperature working condition, the frequency conversion module is efficiently radiated, and the problems of the reduction of the refrigerating capacity of the air conditioner and the shutdown of the compressor 70 under the high-temperature environment are solved.
In addition, two radiators that transversely set up side by side are mutually noninterfered at the radiating process, cool down the frequency conversion module that dispels the heat simultaneously, have improved the radiating efficiency to frequency conversion module once more, have promoted frequency conversion module's radiating effect.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120485648.8U CN214891556U (en) | 2021-03-05 | 2021-03-05 | Cooling components, radiators and air conditioner outdoor units |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120485648.8U CN214891556U (en) | 2021-03-05 | 2021-03-05 | Cooling components, radiators and air conditioner outdoor units |
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| CN214891556U true CN214891556U (en) | 2021-11-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025076145A1 (en) * | 2023-10-02 | 2025-04-10 | Nakagawa Jon Y | Portable air conditioner using an array of phase change materials |
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- 2021-03-05 CN CN202120485648.8U patent/CN214891556U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025076145A1 (en) * | 2023-10-02 | 2025-04-10 | Nakagawa Jon Y | Portable air conditioner using an array of phase change materials |
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Effective date of registration: 20250325 Address after: 266101 Haier Road, Laoshan District, Qingdao, Qingdao, Shandong Province, No. 1 Patentee after: QINGDAO HAIER SMART TECHNOLOGY R&D Co.,Ltd. Country or region after: China Address before: 266101 Haier Road, Laoshan District, Qingdao, Qingdao, Shandong Province, No. 1 Patentee before: QINGDAO HAIER SMART TECHNOLOGY R&D Co.,Ltd. Country or region before: China Patentee before: Haier Smart Home Co., Ltd. |
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