CN112286325A - External radiator of notebook computer - Google Patents
External radiator of notebook computer Download PDFInfo
- Publication number
- CN112286325A CN112286325A CN202011313581.6A CN202011313581A CN112286325A CN 112286325 A CN112286325 A CN 112286325A CN 202011313581 A CN202011313581 A CN 202011313581A CN 112286325 A CN112286325 A CN 112286325A
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- cooling
- water
- heat
- fins
- notebook computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an external radiator of a notebook computer, which comprises cold air fins, a fan, a heat conduction pipe, a refrigeration assembly, a temperature-equalizing copper plate and a water cooling assembly, wherein the water cooling assembly is used for cooling and radiating; the water cooling component is structurally composed of water cooling fins, a water pipe and a water cooling fan, the water cooling fan is attached to the surfaces of the water cooling fins, the water pipe is connected with the water cooling fan, and the refrigerating component is attached to the upper portion of the heat dissipation module. When the notebook computer is used, the notebook computer is placed on the external radiator, the water-cooling fins absorb heat of the refrigerating assembly through the water pipes, the water-cooling fan dissipates heat in the water-cooling fins, the refrigerating assembly is dissipated circularly, then the refrigerating surface of the refrigerating assembly absorbs heat of the heat pipes, the heat pipes absorb heat of the cold air fins, and the fan below the cold air fins blows cold air in the cold air fins to the inside of the computer to cool the computer. Through having adopted water cooling assembly to dispel the heat the refrigeration subassembly, promoted the radiating efficiency greatly.
Description
Technical Field
The invention relates to a radiator, in particular to an external radiator of a notebook computer.
Background
With the rapid development of science and technology, notebook computers have become an essential important tool in the work and life of people. However, because the notebook computer has a small volume and a thin thickness, the notebook computer generates a large amount of heat and is difficult to dissipate along with the use time, and the notebook computer is damaged, so that the performance and the service life are influenced.
Most of the existing methods use an air-cooled radiator to radiate the heat of the notebook computer, but the heat radiation effect is not obvious, or use a semiconductor refrigeration structure to radiate the heat inside the notebook computer, but when the environment is at a temperature of 25 ℃ or higher, the heat radiation effect is also poor.
Disclosure of Invention
The invention aims to provide an external radiator of a notebook computer, and aims to solve the problem of low radiating efficiency of the existing notebook computer.
The technical scheme provided by the invention for solving the technical problems is as follows:
the utility model provides an external radiator of notebook computer, arranges the notebook computer bottom in, the external radiator of notebook computer includes a casing, and the casing includes shell and drain pan, be provided with forced air cooling subassembly, refrigeration subassembly and water-cooling subassembly in the casing, the forced air cooling subassembly includes air cooling fan and heat pipe, the water-cooling subassembly includes water-cooling fin, water-cooling fan, radiating module and is used for connecting the water pipe of water-cooling fin and radiating module, radiating module is fixed in on the drain pan, and the laminating has refrigeration subassembly in radiating module top, the air cooling subassembly is connected through the heat pipe to the refrigeration subassembly.
Furthermore, the water-cooling fins are vertically fixed on one side of the refrigeration component, the water-cooling fan is located between the refrigeration component and the water-cooling fins, the water-cooling fan is attached to the water-cooling fins, and the air outlet of the water-cooling fan faces the water-cooling fins.
Furthermore, the air cooling component also comprises a cold air fin which is attached to the upper surface of the cold air fan.
Further, the refrigeration assembly may be a refrigeration assembly.
Furthermore, the water pipe comprises a water inlet pipe and a water outlet pipe, the first ends of the water inlet pipe and the water outlet pipe are respectively connected with the heat dissipation module, the second ends of the water inlet pipe and the water outlet pipe are respectively connected with the water cooling fins, the water inlet pipe transmits cooling water into the heat dissipation module to dissipate heat of the refrigeration assembly, and the water outlet pipe discharges water which absorbs heat of the refrigeration assembly in the heat dissipation module into the water cooling fins.
Further, the water-cooling fan comprises a plurality of fans which are attached to the surfaces of the water-cooling fins side by side.
Furthermore, the external radiator of the notebook computer further comprises a temperature-equalizing copper plate, the temperature-equalizing copper plate is located between the refrigeration assembly and the heat conduction pipe, the first end of the heat conduction pipe is inserted with the super-cooling fins, the second end of the heat conduction pipe is attached to the upper surface of the temperature-equalizing copper plate, and the lower surface of the temperature-equalizing copper plate is attached to the upper surface of the refrigeration assembly.
Further, the first end of the heat conduction pipe is a cylinder, and the second end of the heat conduction pipe is a flat cylinder.
Furthermore, the cold air fan comprises at least two cold air fans, at least two cold air fins are arranged and correspond to the cold air fans one by one, and the at least two cold air fans are arranged between the cold air fins and the heat conducting pipe side by side.
Furthermore, the refrigeration assembly comprises a refrigeration surface and a heating surface opposite to the refrigeration surface, the refrigeration surface is attached to the uniform-temperature copper plate, and the heating surface is attached to the heat dissipation module.
The invention also discloses the following technical scheme:
an external radiator of a notebook computer is arranged at the bottom of the notebook computer and is characterized in that the external radiator of the notebook computer comprises a shell, an air cooling component, a refrigerating component and a water cooling component are arranged in the shell, the air cooling component comprises a cold air fan and cold air fins matched with the cold air fan, the water cooling component comprises water cooling fins, the water cooling fan matched with the water cooling fins, a radiating module and a water pipe used for connecting the water cooling fins and the radiating module, the water pipe forms a circulating water path between the inner part of the water cooling fins and the inner part of the radiating module, the radiating module is matched with the refrigerating component to realize heat transfer, the cold air fins are matched with the refrigerating component to realize heat transfer, the water cooling component radiates the refrigerating component through the circulating water path, the refrigerating component radiates the cold air fins, and the cold air cooled by the cold air fins is blown out of the shell to cool electronic, the water-cooling fan blows heat on the water-cooling fins out of the shell.
The invention has the beneficial effects that:
compared with the prior art, the external radiator for the notebook computer comprises the air cooling component and the water cooling component, the air cooling component directly radiates the bottom of the notebook computer, and the water cooling component radiates the high-temperature side of the refrigeration component, so that the refrigeration component can work continuously and efficiently, the heat radiation efficiency of the notebook computer is improved, and the service life of the notebook computer is prolonged.
Drawings
The invention will be further elucidated with reference to the drawing and an embodiment, in which
Fig. 1 is a schematic structural diagram of an external heat sink of a notebook computer according to the present invention in a working state;
FIG. 2 is an exploded view of the external heat sink of the notebook computer shown in FIG. 1;
FIG. 3 is an enlarged partial schematic view of A in FIG. 2;
FIG. 4 is a top view of the present invention from the base portion.
Description of reference numerals: 1-shell, 11-bottom shell, 12-shell, 21-cold air fan, 22-heat conducting pipe, 23-cold air fin, 3-refrigeration component, 41-water cooling fin, 42-water cooling fan, 43-heat dissipation module, 44-water pipe, 5-air vent, 6-air inlet through hole, 7-temperature-equalizing copper plate, upper end-8, side-9, 20-notebook computer, 30-external radiator
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
Referring to fig. 1, in a preferred embodiment of the present invention, the notebook computer 20 and the external heat sink 30 are located on the upper end surface 8 of the external heat sink 30 in a triangular prism shape, the external heat sink 30 is horizontally placed on a desktop, the bottom of the external heat sink 30 is rectangular, and two sides of the heat sink in a right triangle shape are the left and right sides of the heat sink.
Referring to fig. 2, in this embodiment, the external heat sink 30 includes a casing 1, the casing 1 includes a housing 12 and a bottom shell 11, an air cooling assembly, a refrigeration assembly and a water cooling assembly are provided in the casing 1, the air cooling assembly includes a cold air fan 21 and a heat pipe 22, the water cooling assembly includes a water cooling fin 41, a water cooling fan 42, a heat dissipation module 43 and a water pipe 44 for connecting the water cooling fin 41 and the heat dissipation module 43, the heat dissipation module 43 is fixed on the bottom shell 11, the refrigeration assembly 3 is attached above the heat dissipation module 43, and the refrigeration assembly 3 is connected to the air cooling assembly through the heat pipe 22.
Specifically, the casing 12 of the housing 1 is triangular prism-shaped, and includes an upper end surface 8 for placing the notebook computer, side surfaces 9 perpendicular to the upper end surface 8 and symmetrically disposed at both sides of the upper end surface 8, and a front end surface for connecting the side surfaces 9 at both sides and the upper end surface 8, wherein the upper end surface 8 is preferably rectangular, the side surfaces 9 at both sides are preferably right-angled triangles, and a portion of the two side surfaces 9 connected to the front end surface and the upper end surface 8 forms a receiving cavity.
This embodiment is to dispel the heat to notebook computer through air-cooled radiating air-cooled subassembly and through water-cooled radiating water-cooling subassembly both combination, and the key is dispelled the heat to refrigeration subassembly 3 through adopting water-cooling subassembly, ensures that refrigeration subassembly keeps lower temperature always to the radiating efficiency has been promoted.
In one embodiment, the water-cooling fins 41 are disposed in the accommodating cavity of the housing 1, as shown in fig. 3, the water-cooling fins 41 are vertically disposed at a position close to the front end surface, the air-cooling component is disposed at an end away from the front end surface, the refrigerating component is disposed between the air-cooling component and the water-cooling component, the water-cooling fan 42 is disposed between the refrigerating component 3 and the water-cooling fins 41, the water-cooling fan 42 is attached to the water-cooling fins 41, and an air outlet of the water-cooling fan 42 faces the water-cooling fins.
The water-cooling fins 41 absorb heat of the refrigeration unit 3 through the water pipes 44, and the water-cooling fan 42 blows air to the inside of the water-cooling fins 41 to dissipate heat, thereby performing circulation heat dissipation.
In one embodiment, the air cooling assembly further includes a cooling fin 23, the cooling fan 21 is attached to a lower surface of the cooling fin 23, the cooling fin 23 is located below the upper end surface 8 of the housing 12, and the first end 221 of the heat pipe can absorb heat from the bottom of the notebook computer and transmit the heat to the second end 222 of the heat pipe.
The cold air fan 21 dissipates heat from the heat pipe 22, and the cold air fins 23 absorb cold air transferred by the heat pipe 22 to dissipate heat from the bottom of the notebook computer 20.
In one embodiment, the first end 221 of the heat pipe 22 is a cylinder, the second end 222 is a flat cylinder, the first end 221 can better penetrate through the water cooling fins 41, and the second end 222 is a flat cylinder, so that the heat pipe 22 can be better attached to the lower surface of the cooling fan 21 and the upper surface of the uniform temperature copper plate 7.
In one embodiment, the cooling-air fan 21 includes at least two cooling-air fans 21, at least two cooling-air fins 23 are provided and correspond to the cooling-air fans 21 one by one, and the at least two cooling-air fans 21 are disposed between the cooling-air fins 23 and the heat pipe 22 side by side, so that the at least two cooling-air fans 21 can simultaneously dissipate heat from the cooling-air fins 23, thereby enhancing the heat dissipation effect.
In one embodiment, the cooling module 3 may be a semiconductor cooling chip, which is formed by arranging a plurality of N-type semiconductors and P-type semiconductors, the N-type semiconductors and the P-type semiconductors are usually connected by metal conductors such as copper and aluminum to form a complete circuit, and finally, the circuit is sandwiched by two ceramic sheets with good heat conduction and insulation properties.
In one embodiment, the water pipe 44 includes a water inlet pipe and a water outlet pipe, the first ends of the water inlet pipe and the water outlet pipe are respectively connected to the heat dissipation module 43, the second ends of the water inlet pipe and the water outlet pipe are respectively connected to the water cooling fins 41, the water inlet pipe transmits cooling water to the heat dissipation module 43 to dissipate heat of the refrigeration component 3, the water outlet pipe discharges water, which has absorbed heat of the refrigeration component 3 in the heat dissipation module 43, into the water cooling fins 41, and thus the water cooling component 4 dissipates heat of the refrigeration component 3.
In one embodiment, the water-cooling fan 42 includes a plurality of fans, the plurality of fans are attached to the surface of the water-cooling fins 41 side by side, the air outlet of the water-cooling fan 42 faces the water-cooling fins 41, and the plurality of fans blow air to the water-cooling fins 41 to dissipate heat.
In one embodiment, the external heat sink for the notebook computer further includes a temperature-equalizing copper plate 7, the temperature-equalizing copper plate 7 can equalize the heat transferred by the heat pipe 22, so that the heat sink does not overheat, the temperature-equalizing copper plate 7 is located between the refrigeration component 3 and the heat pipe 22, the lower surface of the temperature-equalizing copper plate 7 is attached to the upper surface of the refrigeration component 3, the first end 221 of the heat pipe 22 penetrates through the cold air fin 23, and the second end 222 of the heat pipe 22 is attached to the upper surface of the temperature-equalizing copper plate 7.
In one embodiment, the cooling assembly 3 comprises a cooling surface and a heating surface opposite to the cooling surface. The refrigerating surface of the refrigerating assembly is attached to the lower surface of the temperature-equalizing copper plate 7, the heating surface is attached to the upper surface of the heat dissipation module 43, and the temperature of the refrigerating surface of the refrigerating assembly can be reduced when the refrigerating assembly 3 refrigerates, so that the temperature of the temperature-equalizing copper plate 7 is reduced.
In one embodiment, a plurality of ventilation holes 5 are formed on both side surfaces of the housing 12, so that the air flow blown out from the water-cooled fins 41 can be discharged to the outside of the housing 12 through the ventilation holes 5, thereby keeping the ambient temperature in the housing 12 at a low state.
In one embodiment, the bottom case 11 of the housing 1 is further provided with a plurality of air inlet holes 6 corresponding to the air inlets of the cooling fan 21, and the air flow in the external space can flow into the air inlets of the cooling fan 21 through the air inlet holes 6.
Compared with the prior art, when the external radiator for the notebook computer is used, the notebook computer is placed on the external radiator, the water-cooling fins absorb heat of the refrigeration component through the water pipes, the water-cooling fins are cooled by the water-cooling fan, so that the refrigeration component is circularly cooled, then the refrigeration surface of the refrigeration component absorbs heat of the heat pipes, the heat pipes absorb heat of the cold air fins, and the fan below the cold air fins blows cold air in the cold air fins to the inside of the computer, so that the computer is cooled. Through having adopted water cooling assembly to dispel the heat the refrigeration subassembly, promoted the radiating efficiency greatly.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (11)
1. The utility model provides an external radiator of notebook computer, arranges the notebook computer bottom in, a serial communication port, external radiator of notebook computer includes a casing, and the casing includes shell and drain pan, be provided with forced air cooling subassembly, refrigeration subassembly and water-cooling subassembly in the casing, the forced air cooling subassembly includes air cooling fan and heat pipe, the water-cooling subassembly includes water-cooling fin, water-cooling fan, radiating module and is used for connecting the water pipe of water-cooling fin and radiating module, radiating module is fixed in on the drain pan, and the laminating has refrigeration subassembly in radiating module top, the air-cooling subassembly is connected through the heat pipe to the refrigeration subassembly.
2. The external radiator of the notebook computer as recited in claim 1, wherein the water-cooling fins are vertically fixed on one side of the cooling component, the water-cooling fan is located between the cooling component and the water-cooling fins, the water-cooling fan is attached to the water-cooling fins, and the air outlet of the water-cooling fan faces the water-cooling fins.
3. The external radiator of the notebook computer as recited in claim 1, wherein the air-cooling assembly further comprises a cooling air fin attached to an upper surface of the cooling air fan.
4. The external radiator of the notebook computer as claimed in claim 1, wherein the cooling component is a cooling chip.
5. The external radiator of the notebook computer as claimed in claim 2, wherein the water pipe comprises a water inlet pipe and a water outlet pipe, the first ends of the water inlet pipe and the water outlet pipe are respectively connected with the heat dissipation module, the second ends of the water inlet pipe and the water outlet pipe are respectively connected with the water cooling fins, the water inlet pipe transmits cooling water into the heat dissipation module to dissipate heat of the refrigeration component, and the water outlet pipe discharges water which absorbs heat of the refrigeration component in the heat dissipation module into the water cooling fins.
6. The external radiator of the notebook computer as recited in claim 2, wherein the water-cooling fan comprises a plurality of fans attached to the surfaces of the water-cooling fins side by side.
7. The external radiator of the notebook computer according to claim 3, further comprising a temperature-equalizing copper plate, wherein the temperature-equalizing copper plate is located between the cooling module and the heat pipe, the first end of the heat pipe is inserted into the cooling fins, the second end of the heat pipe is attached to the upper surface of the temperature-equalizing copper plate, and the lower surface of the temperature-equalizing copper plate is attached to the upper surface of the cooling module.
8. The external heat sink for notebook computer as recited in claim 7, wherein the first end of the heat conducting pipe is a cylinder and the second end is a flat cylinder.
9. The external heat sink for the notebook computer as recited in claim 3, wherein the cooling fan comprises at least two cooling fans, at least two cooling fins are provided corresponding to the cooling fans one by one, and the at least two cooling fans are disposed side by side between the cooling fins and the heat conducting tube.
10. The external radiator of the notebook computer as recited in claim 7, wherein the cooling component comprises a cooling surface and a heating surface opposite to the cooling surface, the cooling surface is attached to the temperature-equalizing copper plate, and the heating surface is attached to the radiating module.
11. An external radiator of a notebook computer is arranged at the bottom of the notebook computer and is characterized by comprising a shell, wherein an air cooling component, a refrigerating component and a water cooling component are arranged in the shell,
the air cooling component comprises a cold air fan and a cold air fin matched with the cold air fan,
the water cooling component comprises water cooling fins, a water cooling fan matched with the water cooling fins, a heat dissipation module and a water pipe used for connecting the water cooling fins and the heat dissipation module, wherein a circulating water path is formed between the interior of the water cooling fins and the interior of the heat dissipation module by the water pipe,
the heat dissipation module is matched with the refrigeration component to realize heat transfer,
the cold air fins are matched with the refrigeration component to realize heat transfer,
the water cooling assembly dissipates heat to the refrigeration assembly through a circulating water path, the refrigeration assembly dissipates heat to the cold air fins, the cold air fan blows cold air cooled by the cold air fins out of the shell to cool the electronic equipment, and the water cooling fan blows heat on the water cooling fins out of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011313581.6A CN112286325A (en) | 2020-11-20 | 2020-11-20 | External radiator of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011313581.6A CN112286325A (en) | 2020-11-20 | 2020-11-20 | External radiator of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112286325A true CN112286325A (en) | 2021-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011313581.6A Pending CN112286325A (en) | 2020-11-20 | 2020-11-20 | External radiator of notebook computer |
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| CN (1) | CN112286325A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985995A (en) * | 2021-11-02 | 2022-01-28 | 袁桂华 | External radiator of notebook computer |
| TWI825429B (en) * | 2021-06-11 | 2023-12-11 | 宏碁股份有限公司 | Heat dissipation structure and electronic device |
-
2020
- 2020-11-20 CN CN202011313581.6A patent/CN112286325A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI825429B (en) * | 2021-06-11 | 2023-12-11 | 宏碁股份有限公司 | Heat dissipation structure and electronic device |
| CN113985995A (en) * | 2021-11-02 | 2022-01-28 | 袁桂华 | External radiator of notebook computer |
| CN113985995B (en) * | 2021-11-02 | 2024-05-17 | 北京神州数码云科信息技术有限公司 | External radiator of notebook computer |
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