CN216901562U - Water-cooling heat dissipation power supply and computer - Google Patents
Water-cooling heat dissipation power supply and computer Download PDFInfo
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- CN216901562U CN216901562U CN202220528474.3U CN202220528474U CN216901562U CN 216901562 U CN216901562 U CN 216901562U CN 202220528474 U CN202220528474 U CN 202220528474U CN 216901562 U CN216901562 U CN 216901562U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to a water-cooling heat dissipation power supply and a computer. The water-cooling heat dissipation power supply comprises a shell, and a power supply main board, a heat dissipation sheet and a water-cooling pipeline which are arranged in the shell, wherein the power supply main board is attached to one side of the heat dissipation sheet, the other side of the heat dissipation sheet is provided with a mounting groove for placing the water-cooling pipeline, the arrangement of the mounting groove is consistent with the winding path of the water-cooling pipeline, the groove wall of the mounting groove wraps and attaches each section of water-cooling pipeline, and heat in the water-cooling pipeline is transferred to a heat dissipation system outside the shell for cooling treatment. The water-cooling heat dissipation power supply has the advantages of small volume and good heat dissipation effect.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic components, in particular to a water-cooling heat dissipation power supply and a computer.
Background
When the power supply works, the internal power components generate heat, and the conventional power supply dissipates heat, and generally adopts a mode of radiating fins and a fan outside a shell of the power supply to dissipate heat and cool. If the heat dissipation effect needs to be enhanced, the traditional method is to use the increasingly larger heat dissipation fins and the increasing of the rotating speed of the fan to achieve the effect of dissipating heat, but the method brings the disadvantages that the volume of a heat dissipation system is increased, the general space of a product using a power supply is limited, and a large space for placing the power supply and the increasing of the heat dissipation fins and the fan are difficult to provide. Except the air-cooled heat dissipation mode, also there is the water-cooled heat dissipation mode, for traditional air-cooled heat dissipation, the water-cooled heat dissipation is more rapid, and the cooling capacity is stronger, nevertheless because the accessory that the water-cooled heat dissipation system constitutes is numerous, and this has just noted the volume of water-cooled heat dissipation system great, and general power does not have enough space inside can hold huge water-cooled heat dissipation system, so the water-cooled heat dissipation power that a volume is little and the radiating effect is good now urgently needed.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides the water-cooling heat dissipation power supply and the computer which are small in size and good in heat dissipation effect.
In order to achieve the purpose, the utility model can be realized by the following technical scheme:
the utility model provides a water-cooling heat dissipation power, includes casing and power mainboard, fin and the water-cooling pipeline of setting in the casing, the laminating of power mainboard is in one side of fin, the opposite side of fin is provided with the mounting groove of placing the water-cooling pipeline, the arranging of mounting groove is unanimous with water-cooling pipeline's around establishing the route, the mounting groove cell wall is to every section water-cooling pipeline parcel and laminating, heat transfer in the water-cooling pipeline makes cooling treatment to the outer cooling system of casing. The technical scheme has the advantages that: the radiating fins and the water cooling pipeline are arranged in the power supply shell, so that heat in the power supply is taken out of the shell, the size of the power supply is reduced, and meanwhile, the radiating effect can be achieved; and the mounting groove of fin is designed to be the laminating of parcel form to water-cooling pipeline, makes the radiating effect reach the best.
As an improvement of the scheme, the water cooling pipeline is provided with a first water inlet and a first water outlet, and the water cooling pipeline is arranged between the first water inlet and the first water outlet in a Z shape.
As an improvement of the scheme, a water channel is reserved in one surface of the shell corresponding to the power supply main board, and heat in the water channel is transferred to a heat dissipation system outside the shell for cooling treatment. Through the mode that sets up the water course in the casing, cooperation fin and water-cooling pipeline further dispel the heat to the power mainboard.
As an improvement of the scheme, the water channel is provided with a second water inlet and a second water outlet, and the water channel between the second water inlet and the second water outlet is arranged in a Z shape.
As an improvement of the scheme, the two side faces of the shell are uniformly provided with the plurality of heat dissipation holes, and the heat dissipation efficiency inside the power supply is further improved by arranging the heat dissipation holes.
As an improvement of the scheme, the heat dissipation holes are louver type heat dissipation holes, the directions of the heat dissipation holes on the two side faces of the shell are consistent, convection is formed on the two sides of the shell, heat inside the shell is taken away by air, and meanwhile, the louver type heat dissipation holes can prevent dust and other impurities from entering the power supply through the heat dissipation holes to affect the performance of the power supply.
As the improvement of the scheme, the shell is made of aluminum, so that the heat dissipation speed is higher, and the heat dissipation effect is better.
The computer comprises a host and a water-cooling heat dissipation power supply, wherein the water-cooling heat dissipation power supply is arranged in the host, a heat dissipation system is further arranged in the host, and heat in a water-cooling pipeline is transferred to the heat dissipation system for cooling treatment.
As an improvement of the scheme, the heat dissipation system comprises a water pump and a heat exchanger, a water inlet of the water pump is respectively connected with a first water outlet of the water cooling pipeline and a second water outlet of the water channel, a water outlet of the water pump is connected with an inlet of the heat exchanger, an outlet of the heat exchanger is respectively connected with a first water inlet of the water cooling pipeline and a second water inlet of the water channel, and heat in the water cooling pipeline and the water channel is cooled through the water pump and the heat exchanger.
As an improvement of the scheme, the heat dissipation system further comprises a fan, the fan blows air to the heat exchanger for heat dissipation, the heat exchanger is assisted by the fan to accelerate heat dissipation, and cooling efficiency is improved.
Compared with the prior art, the utility model has the following beneficial effects:
according to the water-cooling heat dissipation power supply, the heat dissipation fins and the water-cooling pipeline are arranged inside the power supply, heat inside the power supply is taken out of the power supply to be cooled and dissipated, the space required by the water-cooling heat dissipation system inside the power supply is reduced, meanwhile, the installation grooves of the heat dissipation fins wrap and attach the water-cooling pipeline, the heat dissipation contact surface is enlarged, and the heat dissipation efficiency is improved. The water-cooling heat dissipation power supply has the advantages of small volume and good heat dissipation effect. The computer uses the water-cooling heat dissipation power supply, so that the water-cooling heat dissipation power supply has a water-cooling heat dissipation function inside, and heat dissipation is performed by sharing the same heat dissipation system with the host, so that the volume space of the host is greatly saved, and a better heat dissipation effect is achieved.
Drawings
Fig. 1 is a schematic structural diagram of a water-cooling heat dissipation power supply according to an embodiment;
FIG. 2 is an enlarged schematic view at A in FIG. 1;
fig. 3 is a schematic structural diagram of the water-cooling heat dissipation power supply according to the second embodiment;
FIG. 4 is an enlarged schematic view at B of FIG. 3;
FIG. 5 is a schematic layout diagram of a water cooling pipeline of the water cooling power supply according to the present invention;
FIG. 6 is a schematic layout view of water pipes of the water-cooling power supply according to the present invention;
FIG. 7 is a schematic diagram of an external structure of the water-cooling heat dissipation power supply according to the present invention;
FIG. 8 is a schematic structural diagram of a water-cooling heat dissipation system of a computer according to the present invention;
in the figure: 1. a housing; 11. a water channel; 111. a second water inlet; 112. a second water outlet; 12. heat dissipation holes; 2. a power supply main board; 3. a heat sink; 31. mounting grooves; 4. a water-cooled pipeline; 41. a first water inlet; 42. a first water outlet; 5. a water pump; 6. a heat exchanger; 7. a fan.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and specific embodiments:
example one
As shown in fig. 1, a water-cooling heat dissipation power supply includes a housing 1, a power main board 2, a heat dissipation fin 3, and a water-cooling pipeline 4, wherein the power main board 2, the heat dissipation fin 3, and the water-cooling pipeline 4 are disposed in the housing 1. The laminating of power mainboard 2 is in one side of fin 3, the opposite side of fin 3 is provided with mounting groove 31, mounting groove 31 is used for placing water-cooling pipeline 4, the arranging of mounting groove 31 is unanimous with water-cooling pipeline 4 around establishing the route, mounting groove 31 cell wall wraps up and laminates every section of water-cooling pipeline 4, as shown in fig. 2, the shape of mounting groove 31 wall can be designed for C shape, water-cooling pipeline 4 is in through C shape breach embedding fin 3, C shape mounting groove 31 wall is to every section of water-cooling pipeline 4 parcel and laminating, make the area of contact increase of water-cooling pipeline 4 and fin 3, heat radiating area increases promptly, and the heat radiating efficiency is improved. The water-cooling pipeline 4 is specifically arranged as shown in fig. 5, the water-cooling pipeline 4 is provided with a first water inlet 41 and a first water outlet 42, the water-cooling pipeline 4 is arranged between the first water inlet 41 and the first water outlet 42 in a zigzag manner, and the water-cooling pipeline 4 is uniformly separated in the arrangement manner, so that heat absorption and heat dissipation are facilitated. Only place power mainboard 2, fin 3 and water-cooling pipeline 4 in the power, still have better radiating effect when reducing the overall volume of power, the cooling system outside heat transfer to casing 1 in the water-cooling pipeline 4 is cooled down and is handled, and the heat of absorbing power mainboard 2 in the water-cooling pipeline 4 is got back to again to the liquid of accomplishing the refrigerated.
As shown in fig. 7, a plurality of heat dissipation holes 12 are uniformly formed in two side surfaces of the housing 1, the heat dissipation holes 12 increase the ventilation area, the heat dissipation holes 12 on two sides form convection, air enters from the heat dissipation holes 12 on one side and is discharged from the heat dissipation holes 12 on the other side, a part of heat inside the power supply housing 1 is taken away, the heat dissipation efficiency inside the power supply housing 1 is further improved, and a better heat dissipation effect is achieved. In order to prevent dust and other impurities from entering the power supply through the heat dissipation holes 12 and affecting the performance of the power supply, the heat dissipation holes 12 are designed as louver type heat dissipation holes 12, and the directions of the heat dissipation holes 12 on the two side surfaces of the shell 1 are consistent, so that air inside the power supply can circulate more easily.
In order to achieve a better heat dissipation effect, the shell 1 is made of aluminum, and copper and aluminum have better heat conduction performance.
Example two
As shown in fig. 3, the water-cooling heat dissipation power supply includes a housing 1, a power supply main board 2, a heat dissipation fin 3, and a water-cooling pipeline 4, wherein the power supply main board 2, the heat dissipation fin 3, and the water-cooling pipeline 4 are disposed in the housing 1. The laminating of power mainboard 2 is in one side of fin 3, the opposite side of fin 3 is provided with mounting groove 31, mounting groove 31 is used for placing water-cooling pipeline 4, the route of establishing of arranging with water-cooling pipeline 4 of mounting groove 31 is unanimous, mounting groove 31 cell wall wraps up and laminates every section of water-cooling pipeline 4, as shown in fig. 4, the shape of mounting groove 31 cell wall can be designed into the cylinder, water-cooling pipeline 4 imbeds in the mounting groove 31 wall, cylinder mounting groove 31 wall is to every section of water-cooling pipeline 4 parcel and laminating, make the area of contact increase of water-cooling pipeline 4 and fin 3, heat radiating area increases promptly, and the heat radiating efficiency is improved. The water-cooling pipeline 4 is specifically arranged as shown in fig. 5, the water-cooling pipeline 4 is provided with a first water inlet 41 and a first water outlet 42, the water-cooling pipeline 4 is arranged between the first water inlet 41 and the first water outlet 42 in a zigzag manner, and the water-cooling pipeline 4 is uniformly separated in the arrangement manner, so that heat absorption and heat dissipation are facilitated. Only place power mainboard 2, fin 3 and water-cooling pipeline 4 in the power, still have better radiating effect when reducing the overall volume of power, the cooling system outside heat transfer to casing 1 in the water-cooling pipeline 4 is cooled down and is handled, and the heat of absorbing power mainboard 2 in the water-cooling pipeline 4 is got back to again to the liquid of accomplishing the refrigerated.
As shown in fig. 7, a plurality of heat dissipation holes 12 are uniformly formed in two side surfaces of the housing 1, the heat dissipation holes 12 increase the ventilation area, the heat dissipation holes 12 on two sides form convection, air enters from the heat dissipation holes 12 on one side and is discharged from the heat dissipation holes 12 on the other side, a part of heat inside the power supply housing 1 is taken away, the heat dissipation efficiency inside the power supply housing 1 is further improved, and a better heat dissipation effect is achieved. In order to prevent dust and other impurities from entering the power supply through the heat dissipation holes 12 and affecting the performance of the power supply, the heat dissipation holes 12 are designed as louver type heat dissipation holes 12, and the directions of the heat dissipation holes 12 on the two side surfaces of the shell 1 are consistent, so that air inside the power supply can circulate more easily.
In order to achieve a better heat dissipation effect, the shell 1 is made of aluminum, and copper and aluminum have better heat conduction performance.
EXAMPLE III
A computer comprises a host and the water-cooling heat dissipation power supply in the first embodiment, and further comprises configurations required by computers such as a host mainboard, a CPU, an internal memory, a hard disk and a display card which are arranged in the host. The water-cooling heat dissipation power supply is arranged in the host, the heat dissipation system is arranged in the host and outside the water-cooling heat dissipation power supply, and heat in the water-cooling pipeline 4 is transferred to the heat dissipation system for cooling treatment. Other heating components in the host computer can also cool and radiate through the same cooling system, can set up fin and water-cooling pipeline on one side of heating components, the heat in this water-cooling pipeline is also transmitted to cooling system and is done cooling treatment. As shown in fig. 8, the heat dissipation system includes a water pump 5 and a heat exchanger 6, a water inlet of the water pump 5 is respectively connected to the first water outlet 42 of the water cooling pipeline 4 and the second water outlet 112 of the water channel 11 through pipelines, a water outlet of the water pump 5 is connected to an inlet of the heat exchanger 6, and an outlet of the heat exchanger 6 is respectively connected to the first water inlet 41 of the water cooling pipeline 4 and the second water inlet 111 of the water channel 11 through pipelines. The water pump 5 is used for pushing liquid to flow, so that the liquid absorbing heat of the power supply main board 2 flows out from the water cooling pipeline 4 and the water channel 11, the liquid flows to the heat exchanger 6, the heat exchanger 6 takes away the heat of the liquid, and the new low-temperature liquid continues to enter the power supply to absorb the heat of the power supply main board 2. The heat dissipation system can be provided with a fan beside the heat exchanger 6, the fan blows air to the heat exchanger 6 for heat dissipation, the fan is used for helping the heat exchanger 6 to accelerate heat dissipation, and cooling efficiency is improved. In order to achieve a better heat dissipation effect, the heat exchanger 6 is made of copper or aluminum.
Example four
A computer comprises a host and the water-cooling heat dissipation power supply of the second embodiment, and further comprises configurations required by computers such as a host mainboard, a CPU, a memory, a hard disk and a display card which are arranged in the host. The water-cooling heat dissipation power supply is arranged in the host, the heat dissipation system is arranged in the host and outside the water-cooling heat dissipation power supply, and heat in the water-cooling pipeline 4 is transferred to the heat dissipation system for cooling treatment. Other heating components in the host computer can also cool and radiate through the same cooling system, can set up fin and water-cooling pipeline on one side of heating components, the heat in this water-cooling pipeline is also transmitted to cooling system and is done cooling treatment. As shown in fig. 8, the heat dissipation system includes a water pump 5 and a heat exchanger 6, a water inlet of the water pump 5 is respectively connected to the first water outlet 42 of the water cooling pipeline 4 and the second water outlet 112 of the water channel 11 through pipelines, a water outlet of the water pump 5 is connected to an inlet of the heat exchanger 6, and an outlet of the heat exchanger 6 is respectively connected to the first water inlet 41 of the water cooling pipeline 4 and the second water inlet 111 of the water channel 11 through pipelines. The water pump 5 is used for pushing liquid to flow, so that the liquid absorbing heat of the power supply main board 2 flows out from the water cooling pipeline 4 and the water channel 11, the liquid flows to the heat exchanger 6, the heat exchanger 6 takes away the heat of the liquid, and the new low-temperature liquid continues to enter the power supply to absorb the heat of the power supply main board 2. The heat dissipation system can be provided with a fan beside the heat exchanger 6, the fan blows air to the heat exchanger 6 for heat dissipation, the fan is used for helping the heat exchanger 6 to accelerate heat dissipation, and cooling efficiency is improved. In order to achieve a better heat dissipation effect, the heat exchanger 6 is made of copper or aluminum.
The water-cooling heat dissipation power supply can be applied to computers, and can also be used for power supplies used by beauty instruments, stage lights, power amplifiers and the like, and the water-cooling heat dissipation power supply can be used for realizing heat dissipation from water media to the outside by adopting a scheme of a traditional heat dissipation fin.
Various other changes and modifications to the above embodiments and concepts will become apparent to those skilled in the art, and all such changes and modifications are intended to be included within the scope of the present invention as defined in the appended claims.
Claims (10)
1. The utility model provides a water-cooling heat dissipation power, its characterized in that, includes casing and power mainboard, fin and the water-cooling pipeline of setting in the casing, the laminating of power mainboard is in one side of fin, the opposite side of fin is provided with the mounting groove of placing water-cooling pipeline, the arranging of mounting groove is unanimous with water-cooling pipeline's the route of establishing, the mounting groove cell wall is to every section water-cooling pipeline parcel and laminating, the outer cooling system of heat transfer to the casing in the water-cooling pipeline does cooling treatment.
2. The water-cooled heat dissipation power supply according to claim 1, wherein the water-cooled pipeline has a first water inlet and a first water outlet, and the water-cooled pipeline is arranged in a zigzag manner between the first water inlet and the first water outlet.
3. The water-cooled heat dissipation power supply according to claim 2, wherein a water channel is reserved inside one surface of the housing corresponding to the power supply main board, and heat in the water channel is transferred to a heat dissipation system outside the housing for cooling.
4. The water-cooled heat dissipation power supply according to claim 3, wherein the water channel has a second water inlet and a second water outlet, and the water channel between the second water inlet and the second water outlet is arranged in a zigzag manner.
5. The water-cooled heat dissipation power supply according to claim 1, wherein a plurality of heat dissipation holes are uniformly formed on both side surfaces of the housing.
6. The water-cooled heat dissipation power supply according to claim 5, wherein the heat dissipation holes are louver type heat dissipation holes, and the directions of the heat dissipation holes on the two side surfaces of the housing are consistent.
7. The water-cooled heat dissipation power supply of claim 1, wherein the housing is made of aluminum.
8. A computer comprises a host machine and is characterized by further comprising a water-cooling heat dissipation power supply according to any one of claims 4 to 6, wherein the water-cooling heat dissipation power supply is arranged in the host machine, a heat dissipation system is further arranged in the host machine, and heat in the water-cooling pipeline is transferred to the heat dissipation system for cooling treatment.
9. The computer of claim 8, wherein the heat dissipation system comprises a water pump and a heat exchanger, wherein a water inlet of the water pump is connected to a first water outlet of the water cooling pipeline and a second water outlet of the water channel, respectively, a water outlet of the water pump is connected to an inlet of the heat exchanger, and an outlet of the heat exchanger is connected to a first water inlet of the water cooling pipeline and a second water inlet of the water channel, respectively.
10. The computer of claim 9, wherein the heat dissipation system further comprises a fan that blows air over the heat exchanger to dissipate heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220528474.3U CN216901562U (en) | 2022-03-11 | 2022-03-11 | Water-cooling heat dissipation power supply and computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220528474.3U CN216901562U (en) | 2022-03-11 | 2022-03-11 | Water-cooling heat dissipation power supply and computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216901562U true CN216901562U (en) | 2022-07-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220528474.3U Active CN216901562U (en) | 2022-03-11 | 2022-03-11 | Water-cooling heat dissipation power supply and computer |
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| Country | Link |
|---|---|
| CN (1) | CN216901562U (en) |
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- 2022-03-11 CN CN202220528474.3U patent/CN216901562U/en active Active
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